JPH04167527A - Bump transfer device and its transfer method - Google Patents

Abstract

PURPOSE:To enable a semiconductor chip to be pressed against a glass substrate while constantly monitoring the bump transfer surface and keeping the parallelism by a method wherein the title bump transfer device is provided with an X table for mounting a bump feeder part and a bump transfer part so as to shift either one of them to the position beneath a substrate holding part. CONSTITUTION:The title bump transfer device is composed of the bump transfer part 7 for pressing a semiconductor chip 2 mounted on a heater block 71 against a glass substrate 1 held by a substrate holder part 5 and of an X table 8 on which a bump feeder part 6 and the bump transfer part 7 are mounted move either one of them to the position beneath the substrate holding part 5. On the other hand, a television camera 9 for monitoring the bump transfer part 7 through an observation window 53 is disposed above the substrate holder 5. Through these procedures, the semiconductor chip 2 can be pressed against the glass substrate 1 while monitoring the bump transfer surface and keeping the parallelism.

Description

[Detailed Description of the Invention] [Summary] Regarding the manufacture of semiconductor integrated circuits that are mounted in a face-down method, particularly regarding an apparatus and method for transferring Au bumps onto a semiconductor chip, the bump transfer surface of the semiconductor chip is constantly touched during bump transfer. The purpose of the present invention is to provide a bump transfer device and its transfer method that can press a semiconductor chip onto a glass substrate while monitoring and maintaining parallelism. It consists of a substrate holder that vacuum-chucks the glass substrate, a holder for the glass substrate, and an XYθZ table, a bump supply unit that sets the glass substrate on the substrate holder, a heater block, a pressure cylinder, and an XYθ table. , a bump transfer unit that presses the semiconductor chip placed on the heater block onto the glass substrate vacuum-adsorbed by the substrate holder, a bump supply unit, and a bump transfer unit, one of which is moved below the substrate holder. The device is configured such that a television camera for monitoring the bump transfer portion through an observation window is installed above the substrate holder.

[Industrial application field]

The present invention relates to the manufacture of semiconductor integrated circuits mounted in a face-down manner, and more particularly to an apparatus and method for transferring gold (Au) bumps onto a semiconductor chip.

Semiconductor integrated circuits that are mounted directly on the conductor pattern of a substrate using the face-down method are manufactured by applying Au to the electrodes of the semiconductor chip in advance.
During mounting, the semiconductor chip is pressed against the conductor pattern of the substrate, and the Au of the bumps is diffused into the conductor pattern of the substrate and the electrodes of the semiconductor chip.

However, if there are variations in the height of the bumps attached to the electrodes of the semiconductor chip, when the semiconductor chip is pressed against the conductor pattern on the substrate, the bumps or the conductor pattern may not come into contact with each other.
There is also the problem that the diffusion into the conductor pattern is not carried out, resulting in poor connections.

Therefore, there is a need to develop an apparatus and method for attaching bumps to semiconductor chips at different heights.

[Conventional technology]

FIG. 3 is a diagram showing the principle of a method for transferring bumps, and FIG. 4 is a side view showing a conventional bump transfer device.

As shown in FIG. 3 (al), the glass substrate l on which the bumps are formed consists of a transparent electrode layer 12 covering the entire surface of the glass plate 11 and a mask layer 13 formed on top of the transparent electrode layer 12. By applying Au plating to the transparent electrode layer 12, bumps 14 are formed in the openings of the mask layer 13, as shown in FIG. 3(b).

When the semiconductor chip 2 is pressed onto the glass substrate 1 and heated, the bumps 14 on the glass substrate 1 are diffused into the electrodes 21 of the semiconductor chip 2, and the semiconductor chip 2 is separated from the glass substrate 1 as shown in FIG. 3 (C1). Then, the bonding force between the bumps 14 and the electrodes 21 is stronger than the bonding force between the bumps 14 and the transparent electrode layer 12, and the bumps 14 on the glass substrate 1 are transferred to the electrodes 21 of the semiconductor chip 2. As shown in FIG. 4, the bump transfer device includes a glass substrate holding section 3 and a semiconductor chip holding section 4 that holds and moves the semiconductor chip 2. The glass substrate holding section 3 includes a heater that vacuum-chucks and heats the glass substrate 1. The block 31, the XYθ table 32 which can move in the X-axis direction and the Y-axis direction and can rotate horizontally, and the semiconductor chip holder 4 has a moving arm 42 which rotates around the support shaft 41, and an elevating mechanism 43. The semiconductor chip 2 is held by the heater block 44 and heated at the same time.

By operating the XYθ table 32 of the glass substrate holder 3, the bumps formed on the glass substrate l are positioned at predetermined positions. On the other hand, by rotating the moving arm 42, the semiconductor chip 2 is positioned at a predetermined position. When the semiconductor chip 2 is positioned at a predetermined position, the heater block 44 descends, presses the semiconductor chip 2 against the glass substrate l vacuum-adsorbed by the heater block 31, and transfers the bumps formed on the glass substrate 1 to the semiconductor chip. Transfer to 2.

[Problem to be solved by the invention]

However, in the conventional bump transfer device, the surface on which the bumps are transferred is on the lower surface of the semiconductor chip, and therefore it is not possible to detect, for example, a shift in the relative position of the bumps formed on the semiconductor chip and the glass substrate. In addition, a heater block that holds the semiconductor chip is attached to the tip of the moving arm, and when the semiconductor chip is pressed against the glass substrate for transfer, the moving arm lifts up, and in extreme cases, the semiconductor chip may move against the surface of the glass substrate. There is a problem in that the bump transfer surface is inclined and the heights of the bumps transferred to the semiconductor chip are not uniform.

An object of the present invention is to provide a bump transfer device and a transfer method thereof, which can constantly monitor the bump transfer surface of a semiconductor chip during bump transfer and press the semiconductor chip onto a glass substrate while maintaining parallelism. There is a particular thing.

[Means to solve the problem]

FIG. 1 is a side view showing a bump transfer device according to the present invention. The same objects are represented by the same symbols throughout the figures.

The above-mentioned problem consists of a heater block 51 with an observation window 53 and a reinforced glass plate 52, a substrate holder 5 for vacuum suctioning the glass substrate l on which bumps are formed, a pedestal 61 for the glass substrate 1, and an XYθZ table 62. The bump supply section 6 sets the glass substrate l on the substrate holding section 5.
and a bump transfer section 7, which is composed of a heater block 71, a pressure cylinder 72, and an XYθ table 73, and presses the semiconductor chip 2 placed on the heater block 71 onto the glass substrate l vacuum-adsorbed by the substrate holding section 5. and,
An X table 8 on which the bump supply section 6 and the bump transfer section 7 are mounted and one of which is moved under the substrate holding section 5
The bump transfer apparatus of the present invention is configured such that a television camera 9 for monitoring the bump transfer portion through an observation window 53 is installed above the substrate holding section 5.

Then, while monitoring with the TV camera 9, operate the XYθZ table 62 of the bump supply section 6, position the glass substrate l on the holder 61 at a predetermined position, and vacuum-adsorb the glass substrate l onto the substrate holding section 5. a supply step, and a moving step of operating the X table 8 to move the bump transfer section 7 below the substrate holding section 5.

The XYθ of the bump transfer section 7 is monitored by the TV camera 9.
A semiconductor chip positioning step in which the table 73 is operated to position the semiconductor chip 2 placed on the heater block 71 at a predetermined position, and the pressure cylinder 72 is raised to place the semiconductor chip 2 on the substrate holder 5. A transfer process of pressing onto the vacuum-adsorbed glass substrate 1 and an X table 8
The bump transfer method of the present invention includes a moving step of moving the bump supply section 6 under the substrate holding section 5 by operating the substrate holding section 5, and a restoring step of returning the glass substrate l that was vacuum-adsorbed to the substrate holding section 5 to the holder 61. achieved by the method.

[For production]

As shown in Fig. 1, the substrate holder consists of a heater block with an observation window and a reinforced glass plate, which vacuum-chucks the glass substrate on which bumps are formed, and a holder for the glass substrate and an XYθZ table. A hump transfer system consists of a bump supply section that sets a glass substrate on a substrate, a heater block, a pressure cylinder, and an XYθ table, and that presses a semiconductor chip mounted on the heater block onto a glass substrate that is vacuum-adsorbed on a substrate holder. Department and
The bump supply section and the bump transfer section are mounted on an X table that moves one of them below the substrate holder, and a television camera that monitors the bump transfer section through an observation window is mounted above the substrate holder. The bump transfer device of the present invention, which is installed at It is possible to realize an apparatus and a transfer method thereof.

〔Example〕

Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that FIG. 2 is a flowchart for explaining the bump transfer method according to the present invention.

As shown in FIG. 1, the bump transfer device according to the present invention includes a substrate holding section 5, a bump supply section 6 and a bump transfer section 7 mounted on an X table 8, and a television set above the substrate holding section 5. A substrate holder 5 configured as a camera 9 and consisting of a heater block 51 with an observation window 53 and a reinforced glass plate 52 vacuum-chucks the glass substrate 1 on which bumps have been formed, and The vacuum-adsorbed glass substrate l is heated.

In addition, the bump supply section 6 is composed of an XYθZ table 62 that can move in the X-axis direction, the Y-axis direction, and the X-axis direction and can rotate horizontally, and a pedestal 61 mounted on the XYθZ table 62. The glass substrate 1 thus prepared is positioned at a predetermined position and supplied to the substrate holder 5.

Furthermore, a bump transfer section includes a heater block 71 that heats the mounted semiconductor chip 2, an XYθ table 73 that moves in the X- and Y-axis directions and rotates horizontally, and a pressure cylinder 72 that pushes up the heater block 71. At step 7, the semiconductor chip 2 is positioned on the glass substrate 1 which is vacuum-adsorbed by the substrate holder 5, and the semiconductor chip 2 is pressed against the glass substrate 1 to transfer bumps.

The bump transfer device according to the present invention is provided on the bump transfer surface or the upper surface of the semiconductor chip 2, and is used not only during positioning of the semiconductor chip 2 to the bumps but also during transfer, using the observation window 53 of the substrate holder 5.
A TV camera 9 is used to monitor the bump transfer surface through the TV camera 9.

The bump transfer method according to the present invention will be explained in detail below with reference to FIG.

■ Moving process: Operate the X table 8 to move the bump supply section 6
is moved below the substrate holder 5.

(2) Bump supply process: While monitoring with the television camera 9, the XYθZ table 62 of the bump supply section 6 is operated to vacuum-adsorb the glass substrate l on the pedestal 61 to a predetermined position on the substrate holding section 5.

(2) Moving process: The bump transfer section 7 is moved below the substrate holding section 5 by operating the X table 8. The semiconductor chip 2 is placed on the heater block 71 before the bump transfer section 7 is moved.

■ Semiconductor chip positioning process: While monitoring with the television camera 9, operate the XYθ table 73 of the bump transfer unit 7 to position the semiconductor chip 2 at a predetermined position on the glass substrate l vacuum-adsorbed to the substrate holding unit 5. .

■ Transfer process: The pressure cylinder 72 is raised while being monitored by the television camera 9, and the semiconductor chip 2 is transferred to the glass substrate l.
After the bumps are transferred by pressing the cylinder 72, the pressure cylinder 72 is lowered.

■ Moving process: Operate the X table 8 to move the bump supply section 6
is moved below the substrate holder 5.

(2) Restoration process - The XYθZ table 62 is operated to bring the pedestal 61 closer to the glass substrate 1, and the glass substrate 1 separated from the substrate holder 5 is placed on the pedestal 61 again. In the meantime, the semiconductor chip 2 on which the bumps have been transferred is taken out from the heater block 71, and a new semiconductor chip 2 is placed on the heater block 71.

Humps to be transferred to a plurality of semiconductor chips 2 are formed on the glass substrate 1, and the steps from the bump supply process to the recovery process are repeated until all the bumps are transferred.

As described above, it consists of a heater block with an observation window and a reinforced glass plate, and includes a substrate holder that vacuum sucks the glass substrate on which bumps have been formed, a holder for the glass substrate, and an XY
Consisting of a 19Z table, it consists of a bump supply unit that sets the glass substrate on the substrate holder, a heater block, a pressure cylinder, and an XYθ table, which vacuum suctions the semiconductor chip placed on the heater block onto the substrate holder. The bump transfer unit is equipped with a bump transfer unit that presses against the glass substrate, a bump supply unit, and a bump transfer unit. During bump transfer, the bump transfer surface of the semiconductor chip is constantly monitored by a monitoring television camera or by the bump transfer device of the present invention installed above the substrate holder, and the semiconductor chip is transferred while maintaining parallelism. It is possible to realize a bump transfer device and a transfer method thereof that can be pressed onto a glass substrate.

〔Effect of the invention〕

As described above, the present invention provides a bump transfer device and a transfer method thereof, which constantly monitors the bump transfer surface of a semiconductor chip during bump transfer and can press the semiconductor chip onto a glass substrate while maintaining parallelism. can be provided.

[Brief explanation of drawings]

FIG. 1 is a side view showing a bump transfer device according to the present invention, FIG. 2 is a flowchart explaining the bump transfer method according to the present invention, FIG. 3 is a diagram showing the principle of the bump transfer method, and FIG. 1 is a side view showing a conventional bump transfer device. In the figure, l is a glass substrate, 2 is a semiconductor chip, 5 is a substrate holding part, 6 is a bump supply part, 7 is a hump transfer part,
8 is an X table, 9 is a TV camera, 51 is a heater block, 52 is a reinforced glass plate, 53 is an observation window, 6
1 is a cradle, 62 is an XYθZ table, 71
is the heater block, 72 is the pressure cylinder, 73 is the XY
θ table, respectively represent. Fig. 1: Flowchart explaining the bump transfer method according to the present invention Fig. 2 (a) (b) Diagram showing the principle of the bump transfer method

Claims (1)

[Claims] 1) A substrate holder (5) consisting of a heater block (51) with an observation window (53) and a reinforced glass plate (52), which vacuum-adsorbs the glass substrate (1) on which bumps are formed. and,
A pedestal (61) for the glass substrate (1) and XYθZ
It consists of a table (62), a bump supply section (6) for setting the glass substrate (1) on the substrate holding section (5), a heater block (71), a pressure cylinder (72), and an XYθ table (73). ), and a bump transfer unit (7) that presses the semiconductor chip (2) placed on the heater block (71) onto the glass substrate (1) vacuum-adsorbed by the substrate holding unit (5); , the bump supply section (6
) and the bump transfer section (7), and an X table (
8), and a television camera (9) for monitoring the bump transfer portion through the observation window (53) is installed above the substrate holding portion (5). Device. 2) Monitor the bump supply section (with a TV camera (9)).
6), operate the XYθZ table (62) and
1) Position the upper glass substrate (1) in a predetermined position,
A bump supply step in which the glass substrate (1) is vacuum-adsorbed onto the substrate holding part (5), and a movement in which the bump transfer part (7) is moved below the substrate holding part (5) by operating the X table (8). The process and the XYθ of the bump transfer part (7) are monitored with a television camera (9).
Operate the table (73) and move the heater block (71)
A semiconductor chip positioning step of positioning the semiconductor chip (2) placed on top at a predetermined position; and a step of raising the pressure cylinder (72) to remove the semiconductor chip (2).
2) onto the glass substrate (1) vacuum-adsorbed by the substrate holder (5);
) to move the bump supply section (6) to the substrate holding section (5).
The glass substrate (1), which had been vacuum-adsorbed to the substrate holder (5), is moved to the bottom of the holder (6).
A bump transfer method characterized by including a restoration step of returning to step 1).