JPH0416472Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an electronic circuit device used in an electronic device, such as a wireless device, in which electronic circuits of different frequency bands coexist.

[Technical background of the invention and its problems] For example, in electronic devices such as small wireless devices that have broadband frequency characteristics ranging from several 100 MHz to several GHz, the electronic circuits that make up this electronic device are mounted on a single substrate. Due to its broadband frequency characteristics, it is extremely difficult to integrate

Therefore, in the past, as shown in FIG. 2, for example, a first electronic circuit 1 that shares the transmission signal with frequency characteristics of 100MHz to 300MHz is incorporated on the first substrate 3, and a transmission signal with frequency characteristics of 300MHz to 1GHz is installed. A second electronic circuit 2 that shares the above is assembled on a second substrate 4, and spacers 5a, 5b are interposed between these substrates 3, 4, and both substrates 3, 4 are fixed with fixing members 6a, such as bolts and nuts. 6b is known in which they are stacked integrally.

In addition, in FIG. 2, 7a is a circuit pattern provided on the first substrate 3;
Chip components 8a and 9a constituting the first electronic circuit 1 are connected to the chip a, and chip components constituting the second electronic circuit 2 are connected to the circuit pattern 7b provided on the second substrate 4. Components 8a and 9b are connected.

Then, the first electronic circuit 1 and the second electronic circuit 2
By connecting the connecting wire 11 between the through hole 10 provided on the first substrate 3 and the circuit pattern 7b on the second substrate 4, they are electrically connected and function as a whole. It's getting old. However, in the conventional electronic circuit device described above, the first substrate 3 and the second substrate 4 are stacked with spacers 5a and 5b in between, so the overall thickness _H2 of this device is 1. The problem is that the thickness of the second substrates 3 and 4 plus the thicknesses of the chip components 8a and 9a and the chip components 8b and 9b become considerably large, making it impossible to miniaturize the device. It was hot.

[Purpose of the invention] The present invention was created in view of the above circumstances, and is intended to significantly reduce the overall thickness even when electronic circuits with wide frequency characteristics ranging from low frequency bands to high frequency bands are mixed. It is an object of the present invention to provide an electronic circuit device that can be made thinner and thinner.

[Summary of the invention] The outline of the invention for achieving the above object is to form concave portions correspondingly arranged in at least two substrates having different dielectric constants, and to form each of the substrates with these concave portions facing each other. In addition to laminated bonding, electronic circuits having frequency bands that are inversely related to the difference in permittivity of these substrates are built into the recessed portions of each of the substrates, and these electronic circuits are electrically connected to each other. It is.

[Embodiment of the invention] An embodiment of the invention will be described below in detail with reference to FIG.

In the apparatus shown in FIG. 1, parts having the same functions as those shown in FIG. 2 are given the same reference numerals, and detailed explanation thereof will be omitted.

The difference between the device shown in FIG. 1 and the device shown in FIG. 2 is that the first substrate 13 is made of ceramics having a high dielectric constant ε _H and is formed to be slightly thicker than the first substrate 3. The second substrate 14 is made of ceramics or Teflon (registered trademark) having a low dielectric constant ε _L ;
The first and second substrates 13 and 14 are formed using epoxy resin to have the same thickness as the first substrate 13.
Recesses 15 and 16 having corresponding positional relationships are formed at approximately the center of each recess 1.
Circuit patterns 17a and 1 on the bottom surfaces of 5 and 16, respectively.
7b, and chip components 8a and 9a constituting the first electronic circuit 1 are provided on the circuit pattern 17a.
The second electronic circuit 2 is placed on the circuit pattern 17b.
The first and second substrates 13 and 14 are laminated and bonded with the recesses 15 and 16 facing each other, and the first and second substrates are connected in the recesses 15 and 16, respectively. 2 electronic circuits 1, 2
and circuit patterns 17a, 17b.
The connection line 11 is used to electrically connect the two terminals.

Note that when the first substrate 13 and the second substrate 14 are laminated and bonded, the chip components 8a, 9a, 8b, 9b are bonded in advance so that the chip components 8a, 9a and the chip components 8b, 9b do not come into contact with each other. It is assumed that the connection positions for the circuit patterns 17a and 17b are set in advance. In addition, although the input terminal and output terminal of this device are not shown, they are connected to the first substrate 13 in advance.
Alternatively, the second substrate 14 may be formed with a through hole or the like.

Next, the operation frequency of the first electronic circuit 1 incorporated on the first substrate 13 and the operating frequency of the second electronic circuit 2 incorporated on the second substrate 14 are determined to be 400 MHz. The case will be explained using 900MHz as an example.

When the first electronic circuit 1 housed in the space formed by the recesses 15 and 16 operates at a frequency of 400 MHz, the dielectric constant ε _H of the first substrate 13 is equal to that of the second substrate 14 as described above. Since the dielectric constant ε of is higher than _L ,
Compared to the case where a substrate with a dielectric constant ε _L is used, the overall dimensions of the first substrate 13 can be equivalently reduced. In this case, since the operating frequency is relatively low at 400 MHz, The stray capacitance between the circuit pattern 17a formed in the concave portion 15 of the substrate 13 of No. 1 and the ground of this device can be increased, and accordingly, the input impedance and output impedance of this electronic circuit are also reduced.

On the other hand, when the second electronic circuit 2 housed in the recess 16 of the second substrate 14 operates at a frequency of 900MHz, the dielectric constant ε _L of the second substrate 14 is equal to that of the first substrate 1.
Since the dielectric constant ε _H of 3 is smaller than the second substrate 14
The stray capacitance between the circuit pattern 17b and the ground can be made approximately equal to that of the first substrate 13,
Accordingly, the input impedance and output impedance of the second electronic circuit 2 can be made substantially the same as those of the first electronic circuit 1 housed in the recessed portion 15 of the first substrate 13.

As a result, impedance matching between both electronic circuits 1 and 2 can be easily achieved.

Additionally, if the dielectric constant of the substrate is increased in order to reduce the size of the substrate, the precision of the circuit pattern becomes a problem.
In the electronic circuit device of this embodiment, since the first electronic circuit 1 that operates at a low frequency is incorporated in the first substrate 13 having a high dielectric constant ε _H , the first substrate 1
The accuracy of the circuit pattern 17a of No. 3 is not a particular problem.

In this way, according to this electronic circuit device, the first and second substrates 13,
14, and the first
Since the dielectric constant ε _H of the substrate 13 is higher than that of the second substrate 14, the dimensions of the circuit pattern 17a provided in the recess 15 are made equal to the dimensions of the circuit pattern 17b provided in the recess 16. Moreover, each chip component 8a, 9a, 8 can be
Since the substrates b and 9b are accommodated, the thickness _H1 of this device can be reduced to a value determined only by the sum of the thicknesses of both substrates 13 and 14.

It goes without saying that the present invention is not limited to the embodiments described above, and that various modifications can be made within the scope of the invention.

For example, in the above-mentioned embodiment, when recesses are formed in two substrates, and the first and second electronic circuits are incorporated into these recesses, respectively, the overall thickness of the two substrates is laminated and bonded. However, it is also possible to construct an electronic circuit device with a four-layer structure by laminating another electronic circuit device configured in the same manner as in the above-mentioned embodiment on two laminated and bonded substrates. It is possible to provide one that allows the overall thickness to be reduced.

[Effects of the invention] According to the invention described in detail above, electronic Since the circuit is housed therein, it is possible to provide an electronic circuit device that can have a wide frequency band and can have a thin overall electronic circuit, thereby contributing to miniaturization of electronic equipment.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional electronic circuit device. 1... First electronic circuit, 2... Second electronic circuit, 13... First substrate, 14... Second substrate,
15, 16... Concave portion.

Claims (1)

[Scope of utility model registration request] At least two substrates with different dielectric constants are formed with correspondingly arranged recesses, and the respective substrates are laminated and bonded with the recesses facing each other, and the recesses of the respective substrates are provided with dielectrics of these substrates. What is claimed is: 1. An electronic circuit device characterized in that electronic circuits each having a different rate and a reciprocal frequency band are incorporated, and these electronic circuits are electrically connected to each other.