JPH0416460Y2 - - Google Patents
Info
- Publication number
- JPH0416460Y2 JPH0416460Y2 JP1986094123U JP9412386U JPH0416460Y2 JP H0416460 Y2 JPH0416460 Y2 JP H0416460Y2 JP 1986094123 U JP1986094123 U JP 1986094123U JP 9412386 U JP9412386 U JP 9412386U JP H0416460 Y2 JPH0416460 Y2 JP H0416460Y2
- Authority
- JP
- Japan
- Prior art keywords
- led
- series
- resistor
- led lamp
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000012778 molding material Substances 0.000 claims 1
- 238000005266 casting Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986094123U JPH0416460Y2 (fr) | 1986-06-20 | 1986-06-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986094123U JPH0416460Y2 (fr) | 1986-06-20 | 1986-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS631362U JPS631362U (fr) | 1988-01-07 |
JPH0416460Y2 true JPH0416460Y2 (fr) | 1992-04-13 |
Family
ID=30957278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986094123U Expired JPH0416460Y2 (fr) | 1986-06-20 | 1986-06-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0416460Y2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6897486B2 (en) * | 2002-12-06 | 2005-05-24 | Ban P. Loh | LED package die having a small footprint |
WO2004100213A2 (fr) * | 2003-05-05 | 2004-11-18 | Gelcore Llc | Ampoule electrique a del |
JP5193728B2 (ja) * | 2008-08-04 | 2013-05-08 | Piaa株式会社 | 車両用バルブ |
JP5450707B2 (ja) * | 2012-04-27 | 2014-03-26 | フューチャー ライト リミテッド ライアビリティ カンパニー | 照明装置 |
-
1986
- 1986-06-20 JP JP1986094123U patent/JPH0416460Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS631362U (fr) | 1988-01-07 |
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