JPH04164400A - Electronic parts mounting method - Google Patents

Electronic parts mounting method

Info

Publication number
JPH04164400A
JPH04164400A JP2292405A JP29240590A JPH04164400A JP H04164400 A JPH04164400 A JP H04164400A JP 2292405 A JP2292405 A JP 2292405A JP 29240590 A JP29240590 A JP 29240590A JP H04164400 A JPH04164400 A JP H04164400A
Authority
JP
Japan
Prior art keywords
component
mounting
data
parts
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2292405A
Other languages
Japanese (ja)
Inventor
Masatoshi Yanagawa
柳川 雅敏
Noriaki Yoshida
典晃 吉田
Masao Iritani
入谷 正夫
Takashi Noyama
野山 孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2292405A priority Critical patent/JPH04164400A/en
Publication of JPH04164400A publication Critical patent/JPH04164400A/en
Priority to US08/072,872 priority patent/US5400497A/en
Priority to US08/368,616 priority patent/US5713125A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the data preparing burden of an operator so as to improve the working rate of the operator due to the reduction of the data preparing time by storing beforehand the names and sizes of electronic parts mounted on a parts supplying device in the device and automatically preparing the data required for mounting the parts. CONSTITUTION:After parts supplying devices 5 are set on a mounting machine, a reading-out section 1 reads out the names and sizes of the electronic parts mounted on all parts mounting device 5. Then a controlling section 4 prepares a parts supplying/arranging program for indicating the parts supplying device of each kind of parts to be mounted from the parts names read out in the preceding process and positional information of the devices 5 and stores the prepared program in a storing section 2. The section 4 also calculates the volume of the parts from the names and sizes of the parts read-out in the preceding process, reads out the mounting data corresponding to the volume from a data base section 3, and stores the volume and mounting data in the storing section as parts data. Then the section 4 reads out the parts supplying/arranging program and parts data from the storing section 2 and mounts the parts.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品実装機において部品実装を行うのに
必要なデータを自動的に作成する方法に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for automatically creating data necessary for mounting components in an electronic component mounting machine.

従来の技術 従来の電子部品実装機における部品実装を行うのに必要
なデータの作成方法の一例について図面を参照しながら
説明する。
2. Description of the Related Art An example of a method for creating data necessary for mounting components using a conventional electronic component mounting machine will be described with reference to the drawings.

第6図は、電子部品装着機の斜視図である。FIG. 6 is a perspective view of the electronic component mounting machine.

101は電子部品実装機、102は実装機操作パネル、
103は実装機モニター画面である。
101 is an electronic component mounting machine, 102 is a mounting machine operation panel,
103 is a mounting machine monitor screen.

従来は、電子部品実装機1o1で部品を実装するときに
必要な情報の作成は、機種切り替え等が発生した時等に
実装機の作業者が、実装機操作パネル102及び実装機
モニター画面103を利用して人手で電子部品実装機1
01の部品供給装置104の配列を確認したり、部品の
実装条件を確認したりして行っていた。
Conventionally, the information required when mounting components on the electronic component mounter 1o1 was created by a mounter operator using the mounter operation panel 102 and the mounter monitor screen 103 when switching models, etc. Manual electronic component mounting machine 1
This was done by checking the arrangement of the 01 component supply device 104 and the component mounting conditions.

発明が解決しようとする課題 しかしながら上記のような電子部品実装機1o1の部品
実装を行うのに必要なデータの作成方法では、 (1)  電子部品実装機101におけるすべての部品
供給装置104と部品の位置関係を作業者が実装機操作
パネル102と実装機モニター画面103によって人手
で入力しなければならないが、近年の電子部品実装機1
01には、数十〜数百の部品供給装置104がセットさ
れるようになっており、大変な手間がかかると共に誤入
力の恐れがある。
Problems to be Solved by the Invention However, in the above-described method of creating data necessary for mounting components on the electronic component mounter 1o1, (1) all the component supply devices 104 and components in the electronic component mounter 101 are The operator must manually input the positional relationship using the mounter operation panel 102 and the mounter monitor screen 103, but recent electronic component mounters 1
01, tens to hundreds of component supply devices 104 are set, which requires a lot of time and effort, and there is a risk of erroneous input.

(2)電子部品実装機101における実装する部品の実
装条件を作業者が実装機操作パネル102と実装機モニ
ター画面1o3によって人手で入力しなければならない
が、近年の電子部品実装機101の高機能化に伴い、部
品の部品認識データの作成等の実装条件の複雑化が進み
作業者の負荷が増大している。
(2) Although the operator must manually input the mounting conditions for components to be mounted on the electronic component mounter 101 using the mounter operation panel 102 and the mounter monitor screen 1o3, recent electronic component mounters 101 have high functionality. As technology advances, mounting conditions such as creation of component recognition data for components are becoming more complex, increasing the burden on workers.

という問題点を有している。There is a problem with this.

本発明は、上記問題点に鑑み電子部品実装機1o1の部
品実装時に必要なデータを部品供給装置104のセット
完了時に自動的に作成することにより、作業者のデータ
作成による負荷の軽減、データ作成時間の短縮化による
稼働率の向上、データ作成ミスの防止による部品実装品
質の向上を実現する電子部品実装機101の部品実装に
必要なデータの自動作成方法を提供することを目的とす
る。
In view of the above-mentioned problems, the present invention automatically creates the data necessary for mounting components on the electronic component mounting machine 1o1 when the setting of the component supply device 104 is completed, thereby reducing the burden of data creation on the worker. It is an object of the present invention to provide a method for automatically creating data necessary for component mounting by an electronic component mounting machine 101, which improves operating efficiency by reducing time and improves component mounting quality by preventing data creation errors.

課題を解決するための手段 上記問題点を解決するために本発明の電子部品実装方法
では、 (1)  電子部品を複数有した部品供給装置を複数設
け、この部品供給装置より前記部品を部品実装する方法
であって、各部品供給装置に設けられた記憶部に部品を
識別するためのデータと実装機が部品実装するために必
要な実装条件に関するデータとを記憶する記憶工程と、
実装機に設けられた制御部により前記各部品供給装置の
部品識別のデータと実装条件のデータを読み出す読み出
し工程により、電子部品実装機が部品実装を行うのに必
要なデータを自動的に作成する。
Means for Solving the Problems In order to solve the above problems, the electronic component mounting method of the present invention includes: (1) A plurality of component supply devices having a plurality of electronic components are provided, and the components are mounted by the component supply devices. A storage step of storing data for identifying the component and data regarding mounting conditions necessary for the mounting machine to mount the component in a storage section provided in each component supply device;
A reading process in which a control unit provided in the mounting machine reads component identification data and mounting condition data from each of the component supply devices, automatically creates data necessary for the electronic component mounting machine to perform component mounting. .

(2)  電子部品を複数有した部品供給装置を複数設
け、この部品供給装置より前記部品を部品実装する方法
であって、各部品供給装置に設けられた記憶部に部品を
識別するためのデータを記憶する記憶工程と、実装機に
設けられた記憶部に部品を識別するためのデータと部品
実装するために必要な実装条件に関するデータを記憶す
る記憶工程と、実装機に設けられた制御部により前記各
部品供給装置の部品識別のデータ読み出す読み出し工程
により、電子部品実装機が部品実装を行うのに必要なデ
ータを自動的に作成する。
(2) A method in which a plurality of component supply devices each having a plurality of electronic components are provided, and the components are mounted by the component supply devices, wherein data for identifying the components is stored in a storage section provided in each component supply device. a storage process for storing data for identifying the component and data regarding mounting conditions necessary for mounting the component in a storage section provided in the mounting machine; and a control section provided for the mounting machine. Accordingly, data necessary for the electronic component mounting machine to perform component mounting is automatically created by the reading step of reading component identification data from each of the component supply devices.

という構成を備えたものである。It has the following configuration.

作   用 本発明は上記した構成によって、電子部品実装機におい
て部品実装を行うのに必要なデータを自動作成すること
が可能となる。
Operation The present invention, with the above-described configuration, makes it possible to automatically create data necessary for mounting components in an electronic component mounting machine.

実施例 以下本発明の一実施例の部品実装に必要なデータの自動
作成方法について、図面を参照しながら説明する。
Embodiment Below, a method for automatically creating data necessary for component mounting according to an embodiment of the present invention will be described with reference to the drawings.

第1図は、本発明の実施例における電子部品実装機の電
子部品実装に必要なデータの自動作成方法のブロック図
である。第1図において電子部品実装機は、部品供給装
置に格納されている部品名称と部品形状についてのデー
タを読み出すための送受信部である読み出し部1と、N
Cプログラムや部品データ等を格納するための記憶部2
と、電子部品形状により決まる実装速度、部品吸着条件
、塗布条件、使用ノズルなどの部品実装する実装条件の
データを登録しであるデータベース部3と、部品実装に
必要なデータを部品供給装置6より読み出す読み出し部
1と記憶部2とデータベース部3より作成し、部品実装
を行う制御部4とを備えている。
FIG. 1 is a block diagram of a method for automatically creating data necessary for electronic component mounting by an electronic component mounting machine according to an embodiment of the present invention. In FIG. 1, the electronic component mounting machine includes a reading unit 1, which is a transmitting/receiving unit for reading data about component names and component shapes stored in a component supply device, and N
Storage unit 2 for storing C programs, parts data, etc.
The database section 3 registers data on mounting conditions for mounting components, such as the mounting speed determined by the electronic component shape, component suction conditions, application conditions, and nozzles used, and the component supply device 6 receives data necessary for component mounting. It is provided with a readout section 1 for reading data, a control section 4 that is created from a storage section 2 and a database section 3, and performs component mounting.

以上の構成における部品実装に必要なデータの自動作成
の流れを第2図のフローチャートに沿って説明する。
The flow of automatic creation of data necessary for component mounting in the above configuration will be explained with reference to the flowchart in FIG. 2.

ステップ#1で読み出し部1は実装機に部品供給装置5
がセットされた後、全ての部品供給装置6より搭載され
である電子部品の部品名称と部品寸法を読みだしておく
。ステップ#2で制御部4は、ステップ#1で読みだし
た部品名称とその部品供給装置5の位置情報(Z番号)
により実装される部品がどの部品供給装置から供給され
るかを示す部品供給配列プログラムを作成し記憶部2に
記憶しておく。ステップ#3で、制御部4はステップ#
1で読みだした部品名称と部品寸法により部品の体積を
演算し、もしくは予め演算し、データベース部3よりそ
れに相当する実装データ(実装速度、吸着条件、塗布条
件、使用ノズル等)を読みだし、部品データとして記憶
部2に記憶しておく。ステップ#4で制御部4は記憶部
2より前記部品供給配列プログラムと部品データを読み
だして部品実装を行う。
In step #1, the reading unit 1 supplies the component supply device 5 to the mounting machine.
After the electronic components are set, the component names and component dimensions of the mounted electronic components are read out from all component supply devices 6. In step #2, the control unit 4 reads the component name read in step #1 and the position information (Z number) of the component supply device 5.
A component supply arrangement program indicating from which component supply device the components to be mounted are supplied is created and stored in the storage unit 2. In step #3, the control unit 4
The volume of the component is calculated or pre-calculated based on the component name and component dimensions read in step 1, and the corresponding mounting data (mounting speed, suction conditions, coating conditions, nozzle used, etc.) is read out from the database section 3. It is stored in the storage unit 2 as part data. In step #4, the control unit 4 reads the component supply arrangement program and component data from the storage unit 2 and performs component mounting.

本実施例によれば、部品供給装置に搭載されである電子
部品の部品名称と部品寸法を部品供給装置に記憶させて
おき、部品実装に必要なデータを自動的に作成すること
により、作業者のデータ作成による負荷の軽減、データ
作成時間の短縮による稼働率の向上、データの作成ミス
の防止による部品実装品質の向上を実現することができ
る。
According to this embodiment, the component name and component dimensions of the electronic components mounted on the component supply device are stored in the component supply device, and the data necessary for component mounting is automatically created. It is possible to reduce the load due to data creation, improve operating rates by shortening data creation time, and improve component mounting quality by preventing data creation errors.

以下本発明の第二の実施例について、図面を参照しなが
ら説明する。
A second embodiment of the present invention will be described below with reference to the drawings.

第13図は、本発明の他の実施例における電子部品実装
機の電子部品実装に必要なデータの自動作成方法のブロ
ック図である。第3図において電子部品実装機は、部品
供給装置6に格納されている部品名称と部品形状により
決まる実装速度、部品吸着条件、塗布条件等のデータを
読み出すだめの送受信部である読み出し部7と、NCプ
ログラムや部品データ等を格納するための記憶部8と、
部品実装に必要なデータを読み出し部7と記憶部8より
作成し、部品実装を行う制御部9とを備えている。第1
図と異なるのはデータベース部3のデータを部品供給装
置6に設けた点である。
FIG. 13 is a block diagram of a method for automatically creating data necessary for electronic component mounting by an electronic component mounting machine in another embodiment of the present invention. In FIG. 3, the electronic component mounting machine includes a reading unit 7, which is a transmitting/receiving unit for reading out data such as mounting speed, component suction conditions, coating conditions, etc. determined by the component name and component shape stored in the component supply device 6. , a storage section 8 for storing NC programs, parts data, etc.;
It includes a control section 9 that creates data necessary for component mounting from a reading section 7 and a storage section 8 and performs component mounting. 1st
The difference from the figure is that the data in the database section 3 is provided in the parts supply device 6.

以上の構成における部品実装に必要なデータの自動作成
の流れを第4図のフローチャートに沿って説明する。
The flow of automatic creation of data necessary for component mounting in the above configuration will be explained along the flowchart of FIG. 4.

ステップ#1で送受信部である読み出し部7は実装機に
部品供給装置6がセットされた後、全ての部品供給装置
6よシ搭載されである電子部品め部品名称と実装データ
(実装速度、吸着条件、塗布条件、使用ノズル等)を読
みだし部品データとして記憶部8に記憶しておく。ステ
ップ#2で制御部9は、ステップ#1で読みだした部品
名称とその部品供給装置6の位置情報(2番号)により
実装される部品がどの部品供給装置6から供給されるか
を示す部品供給配列プログラムを作成し記憶部8に記憶
しておく。ステップ#3で制御部9は記憶部8より前記
部品供給配列プログラムと部品データを読みだして部品
実装を行う。
In step #1, after the component supply device 6 is set in the mounting machine, the readout section 7, which is a transmitting and receiving section, reads all the mounted electronic components from the component supply device 6, component names and mounting data (mounting speed, suction conditions, application conditions, nozzles used, etc.) are read out and stored in the storage unit 8 as part data. In step #2, the control unit 9 determines which component supply device 6 the component to be mounted is supplied from, based on the component name read in step #1 and the position information (number 2) of the component supply device 6. A supply arrangement program is created and stored in the storage unit 8. In step #3, the control unit 9 reads the component supply arrangement program and component data from the storage unit 8 and performs component mounting.

本実施例によれば、部品供給装置に搭載されである電子
部品の部品名称と部品寸法を部品供給装置に記憶させて
おき、部品実装に必要なデータを自動的に作成すること
により、作業者のデータ作成による負荷の軽減、データ
作成時間の短縮による稼働率の向上、データの作成ミス
の防止による部品実装品質の向上を実現することができ
る。
According to this embodiment, the component name and component dimensions of the electronic components mounted on the component supply device are stored in the component supply device, and the data necessary for component mounting is automatically created. It is possible to reduce the load due to data creation, improve operating rates by shortening data creation time, and improve component mounting quality by preventing data creation errors.

発明の効果 以上のように本発明は、部品実装に必要なデータを自動
的に作成することによシ、作業者のデータ作成による負
荷の軽減、データ作成時間の短縮による稼働率の向上、
データの作成ミスの防止による部品実装品質の向上を実
現することができる。
Effects of the Invention As described above, the present invention automatically creates the data necessary for component mounting, reduces the burden of data creation on the worker, and improves the operating rate by shortening the data creation time.
It is possible to improve component mounting quality by preventing data creation errors.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の第一の実施例における部品実装に必要
なデータの自動作成方法のブロック図、第2図は第一の
実施例における部品実装に必要なデータの自動作成の流
れのフローチャート図、第3図は本発明の第二の実施例
における部品実装に必要なデータの自動作成方法のブロ
ック図、第4図は第二の実施例における部品実装に必要
なデータの自動作成の流れのフローチャート図、第6図
は電子部品実装機の斜視図である。 代理人の氏名 弁理士 小鍜治  明 ほか2名第 2
 図 第3図      G−・−斃侠輸茫見第 4 図 第 5 図 +01        103
FIG. 1 is a block diagram of a method for automatically creating data necessary for component mounting in the first embodiment of the present invention, and FIG. 2 is a flowchart of the flow of automatically creating data necessary for component mounting in the first embodiment. 3 is a block diagram of a method for automatically creating data necessary for component mounting in the second embodiment of the present invention, and FIG. 4 is a flowchart of automatically creating data necessary for component mounting in the second embodiment. FIG. 6 is a perspective view of the electronic component mounting machine. Name of agent: Patent attorney Akira Okaji and 2 others
Figure 3 G-・-Kyakuyoshi Transport Figure 4 Figure 5 +01 103

Claims (2)

【特許請求の範囲】[Claims] (1)電子部品を複数有した部品供給装置を複数設け、
この部品供給装置より前記部品を部品実装する方法であ
って、各部品供給装置に設けられた記憶部に、部品を識
別するためのデータ及びこのデータに対応して実装機が
部品実装するために必要な実装条件に関するデータを記
憶する記憶工程と、実装機に設けられた制御部により前
記各部品供給装置の部品識別のデータと実装条件のデー
タを読み出す読み出し工程と、この読み出し工程により
、電子部品実装機が部品実装を行うのに必要なデータを
自動的に作成する作成工程とからなる電子部品実装方法
(1) Provide multiple component supply devices with multiple electronic components,
A method of mounting the above-mentioned components from this component supply device, wherein data for identifying the component is stored in a storage section provided in each component supply device, and the mounting machine mounts the component in accordance with this data. A storage step for storing data related to necessary mounting conditions, a reading step for reading component identification data and mounting condition data from each component supply device by a control unit provided in the mounting machine, and a reading step for reading electronic component An electronic component mounting method that includes a creation process that automatically creates data necessary for a mounting machine to perform component mounting.
(2)電子部品を複数有した部品供給装置を複数設け、
この部品供給装置より前記部品を部品実装する方法であ
って、各部品供給装置に設けられた記憶部に部品を識別
するためのデータを記憶する記憶工程と、実装機に設け
られた記憶部に、部品を識別するためのデータ及びこの
データに対応して部品実装するために必要な実装条件に
関するデータを記憶する記憶工程と、実装機に設けられ
た制御部により前記各部品供給装置の部品識別のデータ
読み出す読み出し工程と、この読み出し工程により、電
子部品実装機が部品実装を行うのに必要なデータを自動
的に作成する作成工程からなる電子部品実装方法。
(2) Provide multiple component supply devices with multiple electronic components,
This method of mounting the component from this component supply device includes a storage step of storing data for identifying the component in a storage section provided in each component supply device, and a storage step of storing data for identifying the component in a storage section provided in the mounting machine. , a storage step for storing data for identifying the component and data regarding mounting conditions necessary for mounting the component corresponding to this data; and a component identification process for each of the component supply devices by a control unit provided in the mounting machine. An electronic component mounting method comprising a reading step of reading out data, and a creation step of automatically creating data necessary for an electronic component mounting machine to perform component mounting through this reading step.
JP2292405A 1990-10-29 1990-10-29 Electronic parts mounting method Pending JPH04164400A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2292405A JPH04164400A (en) 1990-10-29 1990-10-29 Electronic parts mounting method
US08/072,872 US5400497A (en) 1990-10-29 1993-06-04 Electronic parts mounting apparatus having memory equipped parts supply device
US08/368,616 US5713125A (en) 1990-10-29 1995-01-04 Electronic parts mounting method employing memory equipped parts supply devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2292405A JPH04164400A (en) 1990-10-29 1990-10-29 Electronic parts mounting method

Publications (1)

Publication Number Publication Date
JPH04164400A true JPH04164400A (en) 1992-06-10

Family

ID=17781361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2292405A Pending JPH04164400A (en) 1990-10-29 1990-10-29 Electronic parts mounting method

Country Status (1)

Country Link
JP (1) JPH04164400A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06348717A (en) * 1993-06-03 1994-12-22 Nec Corp Method for designing process of printed circuit board assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06348717A (en) * 1993-06-03 1994-12-22 Nec Corp Method for designing process of printed circuit board assembly

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