JPH04162732A - Bonding apparatus - Google Patents
Bonding apparatusInfo
- Publication number
- JPH04162732A JPH04162732A JP2288970A JP28897090A JPH04162732A JP H04162732 A JPH04162732 A JP H04162732A JP 2288970 A JP2288970 A JP 2288970A JP 28897090 A JP28897090 A JP 28897090A JP H04162732 A JPH04162732 A JP H04162732A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- length
- loop shape
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 230000007257 malfunction Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000005856 abnormality Effects 0.000 description 5
- 238000007665 sagging Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000013480 data collection Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置の製造に使用するワイヤーボンデ
ィング法を用いたボンディング装置に関し、特にＩＣ電
極パッドとリードフレームのインナーリードとを電気的
に接続する際の、ボンティングワイヤーのループ形状の
異常発生を検知てきるボンディング装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a bonding device using a wire bonding method used in the manufacture of semiconductor devices, and in particular, the present invention relates to a bonding device using a wire bonding method used in the manufacture of semiconductor devices. The present invention relates to a bonding device that can detect abnormalities in the loop shape of bonding wires during connection.
従来、ワイヤーボンディング法を用いたボンディング装
置は、ＩＣ電極パッドとリードフレームのインナーリー
ドとをボンディングワイヤーによって電気的接続を行う
際、接続に使用された分の長さのみ、自動的にボンディ
ングワイヤーをキャピラリーの方向に供給する様になっ
ていた。第４図（ａ）に従来のボンディング装置のワイ
ヤー供給部の側面図を、又第４図（ｂ）、（ｃ）に第４
図（ａ）のＡ部拡大図であるワイヤー状態検出部を示す
。Conventionally, bonding equipment that uses the wire bonding method, when electrically connecting an IC electrode pad and an inner lead of a lead frame with a bonding wire, automatically shortens the bonding wire only for the length used for the connection. It was designed to be supplied in the direction of the capillary. Fig. 4(a) shows a side view of the wire supply section of the conventional bonding device, and Fig. 4(b) and (c) show the
The wire condition detection section is shown as an enlarged view of part A in FIG. 3(a).
従来の装置は、１対のパッドとインナーリードとを接続
する際、接続に使用した分だけキャピラリー９とワイヤ
ースプール１間のボンディングワイヤー４は短くなり、
ボンディング装置本体のワイヤー状態検出部は第４図（
ｂ）に示す状態となり、フォトセンサー７かＯＮ状態と
なる。すると、第４図（ｄ）のブロック図に示す様に、
パルス発生器がＯＮ状態となり、ワイヤースプール１に
つながれたパルスモータ−２にパルスを送る。In the conventional device, when connecting a pair of pads and an inner lead, the bonding wire 4 between the capillary 9 and the wire spool 1 is shortened by the amount used for the connection.
The wire condition detection section of the bonding device main body is shown in Figure 4 (
The state shown in b) is reached, and the photo sensor 7 is turned on. Then, as shown in the block diagram of FIG. 4(d),
The pulse generator is turned on and sends pulses to the pulse motor 2 connected to the wire spool 1.
すると、パルスモータ−２はパルスか与えられている閣
は回転し続け、ワイヤースプール１が回転しガイド棒６
及びワイヤーガイド５を介してキャピラリー９の方向に
ボンディングワイヤー４を供給する。一定長さのボンデ
ィングワイヤー４を供給すると、ボンディングワイヤー
４はワイヤーテンション用エア８によって吹き上げられ
、第４図（ｃ）に示す状態となり、フォトセンサー７が
ＯＦＦ状態となる。すると、第４図（ｄ）に示す様にパ
ルス発生器がＯＦＦ状態となり、パルスモータ−２の回
転か停止しワイヤースプール１の回転も停止し、ボンデ
ィングワイヤー４の供給を停止する。Then, the pulse motor 2 continues to rotate, and the wire spool 1 rotates, causing the guide rod 6 to rotate.
And the bonding wire 4 is supplied in the direction of the capillary 9 via the wire guide 5. When a fixed length of the bonding wire 4 is supplied, the bonding wire 4 is blown up by the wire tensioning air 8, resulting in the state shown in FIG. 4(c), and the photosensor 7 is turned off. Then, as shown in FIG. 4(d), the pulse generator is turned off, the rotation of the pulse motor 2 is stopped, the rotation of the wire spool 1 is also stopped, and the supply of the bonding wire 4 is stopped.
上述した様に、従来のワイヤーボンディング法を用いた
ボンディング装置は、ＩＣ電極パッドとリードフレーム
のインナーリードとの接続に使用された長さのワイヤー
を、キャピラリーの方向に自動的に供給し、その供給す
るワイヤーの長さについては、特に監視する手段は設け
られていなかった。As mentioned above, bonding equipment using the conventional wire bonding method automatically supplies the length of wire used to connect the IC electrode pad and the inner lead of the lead frame in the direction of the capillary. No means were provided to specifically monitor the length of the supplied wire.
ワイヤーボンディング法を用いた従来のボンディング装
置は、ＩＣ電極パッドとリードフレームインナーリード
とを接続するのに用いた長さだけ、ワイヤーをキャピラ
リ一部へ自動的に供給し、供給するワイヤーの長さにつ
いては、特に監視する手段は設けられていなかった。Conventional bonding equipment using the wire bonding method automatically supplies wire to a part of the capillary by the length used to connect the IC electrode pad and the lead frame inner lead, and the length of the wire to be supplied is There were no particular means of monitoring this.
すなわち、第３図＜ａ）の斜視図及び第３図（ｂ）の側
面図に示すように、アイランド１３上のＩＣチップ１０
のＩＣ電極パッド１１とリードフレームインナーリード
１２とを接続するのに、必要以上の長さのボンディング
ワイヤー４を要し、そのため、例えば、第３図（ａ）の
ワイヤーたるみ、又、第３図（ｂ）のワイヤー垂れ等の
ボンディングワイヤー４のループ形状の異常が発生して
も、それを検知する事ができず、作業者が監視していな
いと、ループ形状が不良のＩＣを大量に製造してしまう
欠点かあった。That is, as shown in the perspective view of FIG. 3<a) and the side view of FIG. 3(b), the IC chip 10 on the island 13
In order to connect the IC electrode pad 11 and the lead frame inner lead 12, a longer bonding wire 4 than necessary is required, and as a result, for example, wire sagging as shown in FIG. 3(a) or Even if an abnormality in the loop shape of the bonding wire 4 occurs, such as wire sag in (b), it cannot be detected, and if the operator does not monitor it, a large number of ICs with defective loop shapes will be manufactured. There was a drawback to it.
上述したワイヤーボンディング法を用いた従来のボンデ
ィング装置に対し、本発明のボンディング装置は、ＩＣ
電極パッドとリードフレームインナーリード間をボンデ
ィングワイヤーで接続するごとに、ワイヤースプールか
らキャピラリ一方向に供給するワイヤーの長さを監視す
る手段を設けることによって、ワイヤー垂れ、ワイヤー
たるみ等のボンディングワイヤーのループ形状の異常の
発生を検知し、ループ形状が異常のＩＣを製造する事を
防止できるという相違点を有する。In contrast to the conventional bonding apparatus using the wire bonding method described above, the bonding apparatus of the present invention
By providing a means to monitor the length of the wire fed from the wire spool to the capillary in one direction each time the bonding wire is connected between the electrode pad and the lead frame inner lead, bonding wire loops such as wire droop and wire slack can be prevented. The difference is that it is possible to detect the occurrence of an abnormal shape and prevent the manufacture of ICs with abnormal loop shapes.
本発明のボンディング装置は、ボンディング毎に使用さ
れるワイヤー長を検出するためのワイヤー供給長さ検出
手段と、前もって複数のワイヤー長をデータ処理しワイ
ヤー長の設定値を算出するデータ処理手段と、検出され
たワイヤー長が設定値を越えた場合ボンディング動作を
停止させる手段とを有する。The bonding apparatus of the present invention includes a wire supply length detection means for detecting the wire length used for each bonding, a data processing means for processing data of a plurality of wire lengths in advance to calculate a set value of the wire length, and means for stopping the bonding operation when the detected wire length exceeds a set value.
次に本発明について、図面を参照して説明する。第１図
（ａ）は本発明の第１の実施例を示すボンディング装置
のワイヤー供給部の側面図で、Ａ部はワイヤー供給長さ
検出部を示している。本発明のボンディングＲｙｔは、
まず、１対のＩＣ電極パッドとリードフレームインナー
リードとの接続のため、ボンデインクワイヤーが接続に
必要な長さだけ使われると、従来のポンチインク装置と
同様に、フォトセンサー７がＯＮ状態からＯＦＦ状態に
なるまでく第４図（ｂ）、第４図（ｃ）参照）パルスモ
ータ−２が回転し、ワイヤースプール１を回転させ、ボ
ンディングワイヤー４を力゛イド棒６及びワイヤーガイ
ド５を介してキャピラリー９方向に供給し続ける。Next, the present invention will be explained with reference to the drawings. FIG. 1(a) is a side view of a wire supply section of a bonding apparatus showing a first embodiment of the present invention, and section A shows a wire supply length detection section. The bonding Ryt of the present invention is
First, when the bonding ink wire is used for the length required for connection between a pair of IC electrode pads and the lead frame inner lead, the photo sensor 7 changes from the ON state, similar to the conventional punch ink device. The pulse motor 2 (see FIGS. 4(b) and 4(c)) rotates until the OFF state is reached, rotates the wire spool 1, and connects the bonding wire 4 to the force-id rod 6 and wire guide 5. Continue feeding in the direction of the capillary 9 through the capillary.
本実施例では、ワイヤースプール１の回転中心軸にエン
コーダー３の回転中心軸を接続する。エンコーダー３に
よってワイヤースプール１の回転角度を検出し、回転角
度から、１対のＩＣ電極バラドとリードフレームのイン
ナーリードとの接続に使用したボンティングワイヤーの
長さを検出する。すなわち第１図（ｂ）に示すプロ・ツ
ク図の様なシステムにより、エンコーダ３の回転角度を
カウンタ回路で検出し、１対の電極パッドとインナーリ
ードとの接続で使用したワイヤーの使用長さをデータ比
較回路によって前もって決めておいたデータと比較し、
使用長さが決められたデータより大きい場合は警報器を
鳴らし、ボンディングヘッドが止まる様にする。In this embodiment, the rotation center axis of the encoder 3 is connected to the rotation center axis of the wire spool 1. The encoder 3 detects the rotation angle of the wire spool 1, and from the rotation angle, the length of the bonding wire used to connect the pair of IC electrode pads and the inner lead of the lead frame is detected. In other words, using a system like the one shown in Figure 1(b), the rotation angle of the encoder 3 is detected by a counter circuit, and the length of the wire used to connect the pair of electrode pads and the inner lead is calculated. is compared with predetermined data by a data comparison circuit,
If the length to be used is larger than the predetermined data, an alarm will sound and the bonding head will stop.
前もって決めておくデーターは、例えば、ＩＣのボンデ
ィングワイヤーのループ形状が正常な時に、ペレット電
極とリードフレームのインナーリード間のボンディング
時の各ワイヤー使用料を５０データ収集し、その最大値
に０．２〜０．３ｍｍを加え多少余裕を持たせた数値と
して設定するものとする。この前もって決めておくデー
ターの収集及び算出システムのブロック図を第１図（Ｃ
）に示す。すなわち、エンコーダの回転角度をカウンタ
回路で検出し、収集したデータによりデータ処理回路で
設定値を算呂し、表示器にその数値を表示する。The data to be determined in advance is, for example, when the loop shape of the bonding wire of the IC is normal, collect 50 data points for each wire used during bonding between the pellet electrode and the inner lead of the lead frame, and set the maximum value to 0. The value shall be set with some margin by adding 2 to 0.3 mm. A block diagram of this predetermined data collection and calculation system is shown in Figure 1 (C
). That is, the rotation angle of the encoder is detected by a counter circuit, a set value is determined by a data processing circuit based on the collected data, and the value is displayed on a display.
第２図（ａ）は、本発明の第２の実施例のボンディング
装置のワイヤー供給部の側面図で、Ａ部はワイヤー供給
長さ検出部を示している。第２の実施例では、キャピラ
リ一方向へのワイヤーの供給システムは、第１の実施例
と同様に、ワイヤーボ゛ンディング時にフォトセンサー
７かＯＮになるとワイヤースプール１に連結されている
パルスモータ２が回転し、キャピラリ一方向にワイヤー
を供給するシステムになっている。しかしこの実施例で
はＩＣ電極パッドとリードフレームインナーリード部間
接続時のワイヤー使用長さの検出を、フォトセンサーが
○Ｎ状態の時間の長さで検出する様にする。FIG. 2(a) is a side view of a wire supply section of a bonding apparatus according to a second embodiment of the present invention, and section A shows a wire supply length detection section. In the second embodiment, the wire supply system to the capillary in one direction is similar to the first embodiment, and when the photo sensor 7 is turned ON during wire bonding, the pulse motor 2 connected to the wire spool 1 is activated. The system rotates and feeds the wire in one direction to the capillary. However, in this embodiment, the length of the wire used for connection between the IC electrode pad and the inner lead portion of the lead frame is detected based on the length of time that the photosensor is in the ○N state.
ＩＣ電極パッドとリードフレームインナーリード間の接
続の際、ワイヤーループ形状の不良（ワイヤーたるみ、
垂れ等）により、通常より長く使用した場合は、通常よ
り、第４図（ｂ）の状態。When connecting between the IC electrode pad and the lead frame inner lead, the shape of the wire loop may be defective (sagging wire,
If the product is used for a longer time than usual due to dripping, etc., the condition shown in Fig. 4(b) may occur.
すなわちキャピラリとワイヤースプール間のワイヤー長
さが短くなり、フォトセンサー７のＯＮ状態か長いので
、１対のＩＣ電極パッドとリードフレームインナーリー
ド間の接続の際のフォトセンサー７のＯＮ時間の検出を
カウンタ回路で行い、データ比較回路で前もって設定し
ておいたデータと比較し、設定データより長い場合は、
警報器を鳴らす様にする。上述のシステムのブロック図
を第２図（ｂ）に示す。In other words, the length of the wire between the capillary and the wire spool is shortened, and the ON state of the photosensor 7 is long, so it is difficult to detect the ON time of the photosensor 7 when connecting between a pair of IC electrode pads and the lead frame inner lead. This is done using a counter circuit and compared with the data set in advance using a data comparison circuit.If the data is longer than the set data,
Make the alarm sound. A block diagram of the above system is shown in FIG. 2(b).
又、前もって設定するデータについては、データ処理回
路において、正常なボンディング状態で１対のＩＣ電極
パッドとリードフレームインナーリード間ボンディング
時のフォトセンサーのＯＮ時闇を複数データ収集し、そ
のＯＮ時間の最大値に多少の余裕を持たせるために適当
な値を加えたものを設定値とし表示器に表示する。設定
値を決定するデータの収集及び設定値の算出システムの
ブロック図を第２図＜ｃンに示す。この実施例では、前
述の実施例の様にワイヤースプール部にエンコーダーを
取りつける必要がないので、前述の実施例に比べ簡単に
実施でき、コスト面でも安いという利点がある。In addition, regarding the data to be set in advance, the data processing circuit collects multiple data on when the photosensor is ON during bonding between a pair of IC electrode pads and the lead frame inner lead in a normal bonding state, and calculates the ON time. An appropriate value is added to the maximum value to provide some margin, and the set value is displayed on the display. A block diagram of a data collection and setting value calculation system for determining setting values is shown in FIG. In this embodiment, there is no need to attach an encoder to the wire spool portion as in the previous embodiment, so it has the advantage of being easier to implement and cheaper than the previous embodiment.
以上説明した本発明のボンディング装置では、ＩＣ電極
パッドとリードフレームインナーリード間の１対ごとの
接続に使用したボンディングワイヤーの長さを監視する
システムを有することにより、電極パッドとインナーリ
ード間を電気的に接続するボンディングワイヤーのルー
プ形状の異常（ワイヤーなるみ、垂れ等）の発生を、早
急に検知する事ができる。The bonding apparatus of the present invention described above has a system that monitors the length of the bonding wire used for each pair of connections between the IC electrode pad and the lead frame inner lead, thereby making it possible to electrically connect the electrode pad and the inner lead. It is possible to quickly detect the occurrence of an abnormality in the loop shape of the bonding wire that is connected (wire curling, sagging, etc.).
そのため、ボンディングワイヤーのループ形状の不良の
ＩＣを大量に生産する事が防止できるなめ、ボンディン
グ工程におけるロスコストを減少でき、又ループ形状修
正作業のコストも減少できる効果がある。又、ボンディ
ング工程における歩留りも向上できる効果がある。Therefore, it is possible to prevent the mass production of ICs with defective bonding wire loop shapes, thereby reducing loss costs in the bonding process and reducing costs for loop shape correction work. Moreover, the yield in the bonding process can also be improved.
第１図（ａ）は本発明の第１の実施例を示すボンディン
グ装置のワイヤー供給部の側面図、第１図（ｂ）は第１
の実施例においてワイヤーループ形状の異常を検知する
システムのブロック図、第１図（ｃ）は第１の実施例に
おいてワイヤー長を設定値と比較するシステムのブロッ
ク図、第２図（ａ）は本発明の第２の実施例を示すボン
ディング装置のワイヤー供給部の側面図、第２図（ｂ）
は第２の実施例においてワイヤーループ形状の異常を検
知するシステムのブロック図、第２図（ｃ）は第２の実
施例においてワイヤー長を設定値と比較するシステムの
ブロック図、第３図（ａ）はワイヤーたるみを示す斜視
図、第３［］（ｂ）はワイヤー垂れを示す側面図、第４
図（ａ）は従来のボンティング装置のワイヤー供給部の
側面図、第４図（ｂ）はフォトセンサーＯＮ状態を示す
第４図（ａ）のＡ部拡大図、第４図（ｃ）はフォトセン
サーＯＦＦ状態を示す第４図（ａ＞のＡ部拡大図、第４
図＜ｄ）は従来のボンディング装置のワイヤー供給シス
テムのブロック図である。
１・・・ワイヤースプール、２・・・パルスモータ−５
３・・・エンコーダー、４・・・ボンデインクワイヤー
、５・・・ワイヤーカイト、６・・・カイト棒、７・・
・フォトセンサー、８・・・ワイヤーテンション用エア
ー、９・・・キャピラリー、１０・・・ＩＣチップ、１
１・・・ＩＣ電極パッド、１２・・・リードフレームイ
ンナーリード、１３・・アイランド。FIG. 1(a) is a side view of a wire supply section of a bonding apparatus showing a first embodiment of the present invention, and FIG.
FIG. 1(c) is a block diagram of a system for detecting an abnormality in wire loop shape in the first embodiment. FIG. 2(a) is a block diagram of a system for comparing the wire length with a set value in the first embodiment. A side view of the wire supply section of the bonding device showing the second embodiment of the present invention, FIG. 2(b)
2(c) is a block diagram of a system for detecting an abnormality in the wire loop shape in the second embodiment, FIG. 2(c) is a block diagram of a system for comparing the wire length with a set value in the second embodiment, and FIG. a) is a perspective view showing wire slack, 3rd [ ] (b) is a side view showing wire sagging, and 4th
Figure (a) is a side view of the wire supply section of a conventional bonding device, Figure 4 (b) is an enlarged view of section A in Figure 4 (a) showing the photosensor ON state, and Figure 4 (c) is Fig. 4 (enlarged view of part A of a) showing the photosensor OFF state, Fig. 4
Figure <d) is a block diagram of a wire supply system of a conventional bonding apparatus. 1...Wire spool, 2...Pulse motor-5
3...Encoder, 4...Bonde ink wire, 5...Wire kite, 6...Kite stick, 7...
・Photo sensor, 8...Air for wire tension, 9...Capillary, 10...IC chip, 1
1... IC electrode pad, 12... Lead frame inner lead, 13... Island.
Claims (1)
をボンディングワイヤーによって電気的接続を行なうボ
ンディング装置において、ボンデイング毎に使用される
ワイヤー長を検出するためのワイヤー供給長さ検出手段
と、前もって複数のワイヤー長をデータ処理しワイヤー
長の設定値を算出するデータ処理手段と、検出されたワ
イヤー長が設定値を越えた場合ボンディング動作を停止
させる手段とを備えたことを特徴とするボンディング装
置。A bonding device that electrically connects an electrode of an IC chip and a lead frame inner lead with a bonding wire includes a wire supply length detection means for detecting the wire length used for each bonding, and a wire supply length detection means for detecting the wire length used for each bonding, and a wire supply length detection means for detecting the wire length used for each bonding. A bonding apparatus comprising: data processing means for processing data and calculating a set value of wire length; and means for stopping a bonding operation when the detected wire length exceeds the set value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2288970A JPH04162732A (en) | 1990-10-26 | 1990-10-26 | Bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2288970A JPH04162732A (en) | 1990-10-26 | 1990-10-26 | Bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04162732A true JPH04162732A (en) | 1992-06-08 |
Family
ID=17737159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2288970A Pending JPH04162732A (en) | 1990-10-26 | 1990-10-26 | Bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04162732A (en) |
-
1990
- 1990-10-26 JP JP2288970A patent/JPH04162732A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5526975A (en) | Method and apparatus for detecting the amount of wire remaining in a wire bonder | |
| JPH07106365A (en) | Apparatus and method for monitoring wire tail length for wire bonder | |
| US4558596A (en) | Apparatus for detecting missing wires | |
| CA1215443A (en) | Apparatus for maintaining reserve bonding wire | |
| JP3635168B2 (en) | Lead frame taping device | |
| JPH04162732A (en) | Bonding apparatus | |
| JPH07204942A (en) | Monitoring device for electric discharge machine | |
| US4685631A (en) | Apparatus for feeding bonding wire | |
| TW200413584A (en) | A device for contactless measurement of the properties of a moving yarn or of a yarn-like textile formation | |
| US20010002031A1 (en) | Wire bonding apparatus | |
| JP3019821B2 (en) | Semiconductor device | |
| JP2683424B2 (en) | Needle breakage detector for sewing machine | |
| JPS60262777A (en) | Detection device for solder feeding | |
| JP2500642B2 (en) | Wire bonding apparatus and wire bonding method | |
| JPH0629344A (en) | Wire feeding device | |
| JPH07112328A (en) | Automatic connection state display device for wire electric discharge machine | |
| JPS62194632A (en) | Manufacturing equipment | |
| JPH06297247A (en) | Wire electric discharge machine | |
| JP2904707B2 (en) | Wire feed amount detection method and wire bonding apparatus using the same | |
| JP3865155B2 (en) | Electrolytic capacitor manufacturing method | |
| JPH1022319A (en) | Wire bonding method | |
| JP3201371B2 (en) | Wire bonding equipment | |
| KR100296134B1 (en) | image cognizance method for detecting the dual wirebonding | |
| JPH1158209A (en) | Winding method of wire in wire saw | |
| JPS6127644A (en) | Bonding device |