JPH04162543A - Tool for bonding inner lead - Google Patents

Abstract

PURPOSE:To correspond to the variation of the kinds of IC chips by composing the title tools of tool assemblies, in which a plurality of tools corresponding to the IC chips having different size are brought independently to a displaceable state in the axial direction and assembled in a coaxial manner, and a mechanism selecting the tool to be operated in the tool assemblies. CONSTITUTION:A tool 20 is installed to a device bonding the inner lead sections of leads on tape carriers 5, 12 with pads on IC chips 1A, 1B through thermocompression bonding, and consists of a tool assembly 25, in which a plurality of tools 22, 24, in which each thermocompression bonding section 22a, 24b is formed in mutually different dimensional shapes corresponding to one IC chip in the IC chips 1A, 1B having different size, are brought independently displaceable manner in the axial 23 direction and assembled in a coaxial shape, and mechanisms 26, 26d, 22d, 24c, 27, etc., selecting the tool to be operated in the tool assemblies 25. Accordingly, the inner lead sections can be bonded with two kinds or more of the IC chips having different size through thermocompression bonding by one tool.

Description

[Detailed Description of the Invention] [Summary] The present invention relates to a tool for a device for bonding the inner lead part of a lead on a tape carrier to a pad on an IC chip by thermocompression bonding, and is capable of adapting to changes in the type of IC chip. This tool is attached to a device for bonding inner lead parts of leads on a tape carrier to pads on an IC chip by thermocompression bonding, and the tool is attached to a device for bonding inner lead parts of leads on a tape carrier to pads on an IC chip by thermocompression bonding. A tool assembly in which a plurality of tools having dimensions and shapes corresponding to the IC chip of the first embodiment are movable independently in the axial direction and are coaxially combined, and a tool to be operated among the tool assemblies. Configure it to match the selected mechanism.

[Industrial application field]

The present invention relates to a tool for an apparatus for bonding an inner lead portion of a tape carrier to a pad on an IC chip by thermocompression bonding.

As IC chips themselves become more highly integrated, the pitch of the bats becomes narrower, and the tape carrier method (TAB method) replaces wire bonding as the bonding method.
It has been adopted.

When the tape carrier method is adopted, the inner reel part of the reel is integrated into the semiconductor device production line at the factory.
An inner lead pounding device is installed that connects to the C-tip bat.

On the other hand, the type of IC chip may be changed on the production line.

It is desirable that the inner lead bonding device has a structure that can accommodate such changes in IC chips.

[Conventional technology]

The conventional inner lead honding tool is the 16th
As shown in Figures (A) and (B), the structure is dedicated to one type of IC chip.

FIG. 2A shows a state when the inner lead of the IC chip IA is bonded.

An inner lead bonding tool 3 of a size corresponding to the IC chip IA is attached to the inner lead bonding device main body 2.

With the IC chip IA fixed on the table 4 and the tape carrier 5 positioned, the tool 3 is pushed down in the direction of the arrow 7 by the drive mechanism 6.

As a result, the bumps 9 of the leads 8 are attached to the IC by thermocompression bonding.
It is connected to the pad IO on the chip IA, and the inner lead portion 8a of the lead 8 is bonded to the IC chip IA.

When honding is performed on a larger IC chip IB instead of the IC chip IA, remove the tool 3 from the device body 2 and attach it to the IC chip IB as shown in Figure 16 (B). Attach the inner lead honing tool 11 of the specified size.

As the tape carrier, a tape carrier 12 compatible with the IC chip IB is used.

[Invention or problem to be solved]

In order for inner lead bonding to be performed normally, it is necessary that the thermocompression bonding surface 11a at the lower end of the tool 11 be parallel to the upper surface of the table 4 within an error range of the micron order.

Therefore, when the tool is replaced, fine adjustments such as parallelism are required.

This fine adjustment involves actually performing bonding, understanding the error in parallelism from the bonded state, making fine adjustments, and repeating the process of test bonding again, which is extremely time-consuming. .

This adversely affects the productivity of semiconductor devices.

As described above, it is difficult for the tape carrier method to support a wide variety of IC chips.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inner lead honding tool that can accommodate changes in the type of IC chip.

[Means to solve the problem]

The present invention is a tool that is attached to a device for bonding inner lead portions of leads on a tape carrier to batts on IC chips by thermocompression bonding, in which each thermocompression bonding portion is attached to a batt on an IC chip of different sizes. A tool assembly in which a plurality of tools having dimensions and shapes corresponding to one mutually different IC chip are combined coaxially so that they can be independently displaced in the axial direction; The configuration consists of a mechanism for selecting tools.

[Effect]

The tool assembly and selection mechanism operate a tool having a thermocompression bonding portion corresponding to the size of the IC chip to be bonded, among the plurality of tools constituting the tool assembly.

〔Example〕

FIG. 1 shows a tool 20 for inner lead bonding according to an embodiment of the present invention in a partially cut-away manner, FIG. 2 shows an exploded view, and FIGS. 3 and 4 show a cross-section.

21 is a casing, which is a cylindrical body with a bottom.

A guide hole 21b is formed in the center of the bottom portion 21a.

22 is a first tool, and the IC chip IB is attached to the lower end of the first tool.
It has a frame-shaped thermocompression bonding part 22a with a size corresponding to , and has a cylindrical body 22b with a diameter corresponding to the guide hole 21b on the upper end side. 22c is a center hole.

The cylindrical body 22b has flanges 22d on both sides in the upper diameter direction.
, 22e are formed, and slits 22f, 22g extending in the direction of the axis 23 are also formed.

A second tool 24 has a substantially rectangular thermocompression bonding part 24b having a size corresponding to the IC chip IA at the lower end of the cylindrical body 24a.

The cylindrical body 24a has flanges 24 on both sides in the diametrical direction.
c, 24d or formed.

The second tool 24 is fitted into the center hole 22c of the first tool 22 with its flanges 24C224d engaged with the slits 22f and 22g of the first tool 22, respectively. An assembly 25 is constructed.

The thermocompression bonding portion 24b is fitted into the thermocompression bonding portion 22a.

The slits 22f and 22g are for allowing the second tool 24 and the first tool 22 to slide in the direction of the axis 23 independently of each other.

Therefore, as shown in FIGS. 5 to 8, the tool assembly 25 includes a first tool 22 and a second tool 24 that are coaxially assembled so that they can slide independently in the direction of the axis 23. It is a combined structure.

As shown in FIGS. 1 and 3, this tool assembly 25 has a cylindrical body 22b slidably fitted into a center hole 22c, so that the cylindrical body 22b protrudes into the casing 21, and as appropriate. It is attached to the casing 21 with rotation restricted by a mechanism (not shown).

In FIGS. 1 to 3, reference numeral 26 denotes a selection member, which consists of a cylindrical portion 26a that fits into the casing 21, and locking arms 26b and 26c that protrude from both radial upper ends of the bottom surface. - The locking arm portion 26b is formed with an engagement groove 26d that selectively engages with the flange 22d or 24c. Another locking arm portion 26c has the flange 22e or 2
An engagement groove 26e that selectively engages with the groove 4d is formed therein.

Reference numerals 27 and 28 denote locking members, which have a substantially semi-cylindrical shape and are fitted between the tool assembly 25 protruding into the casing 21 and the casing 21.

The locking arms 26b and 26c are interposed between the locking members 27 and 28 in the circumferential direction.

The locking arms 26b and 26c of the selection member 26, the engagement grooves 26d and 26e, and the flange 22d of the tool assembly 25
, 22e, 24c, 24d and the locking members 27.28,
The first one constituting the tool assembly 25. Second tool 22.
Selection mechanism 2 for selecting a tool to operate from among 24 tools
9.

Next, the operation of the tool 20 having the above configuration will be explained.

It is assumed that the tool 20 is attached with the casing 21 fixed to the device main body 2 and the parallelism adjusted.

First, a case will be described in which a large-sized ICIB is bonded.

In this case, the selection member 26 is rotated in the force direction of arrow A and set to a rotation position P1 that matches the scale 30 or the reference scale 31.

The selection member 26 is rotated, for example, by operating an operation knob 32, and is positioned at a position P by a stopper 33.

Note that when the selection member 26 is rotated, the pair of locking members 2
7.28 is also pushed by the locking arms 26b, 26c and moved in the circumferential direction within the casing 21.

With the selection member 26 set at position P, as shown in FIGS. 1, 3, and 4, the locking arms 26b, 26c
or reach positions facing the flanges 22d and 22e, respectively,
The engagement ff126d engages with the flange 22d, and the engagement groove 2
6c or flange 22e.

The locking member 27 locks the flange 24c as shown in FIGS. 1 and 9, and the locking member 28 locks the flange 24d as shown in FIG.

When the drive mechanism 9 is driven in this state, as shown in FIG.
2d and 22e, push the first tool 22 on both sides in the radial direction, and push it down in the direction of arrow B1.

The second tool 24 has its flange 24C124d locked by a locking member 27.28, and its displacement in the direction of arrow B1 is restricted.

As a result, the first tool 22 slides independently of the second tool 24 while being guided by the guide hole 21b and the inner peripheral surface of the locking member 27, 28, and is pushed out in the direction of arrow B1. The inner reel of the tape carrier 12 is bonded to the IC chip IB by the thermocompression bonding part 22a.

When the drive mechanism 9 is driven in the opposite direction, the selection member 26 is displaced in the direction of arrow B2, and the first tool 22 engages its flanges 22d and 22e in the locking groove 26d.

It is locked to the lower end surface of 26e and pulled up in the direction of arrow B2.

Next, a case will be described in which a small-sized ICIA is bonded.

In this case, the tool 20 is not removed from the device main body 2, but is left attached to the device main body 2, and the selection member 26 is moved in the direction of arrow A2 by operating the operation knob 32 and its position is regulated by another stopper 34. The scale 35 is aligned with the scale 31.

Thereby, the tool 20 is in the state shown in FIGS. 11 to 13.

That is, the engagement r126d, 26e is connected to the flange 22d, respectively.
, 22e, and engages with other flanges 24c, 24d lined up with this, and the locking members 27.28 rotate from the portions facing the flanges 24c, 24d to engage the other flanges 22d, 22e. to lock.

When the drive mechanism 9 is driven in this state, the selection member 26 is pushed down as shown by arrow B1, as shown in FIG.
c, press 24d, push the second tool 24 on both sides in the radial direction of the first tool, and push down in the force direction of arrow B.

The first tool 22 has a flange 22d thereof.

22e is locked by the locking members 27 and 28, and arrow B,
Displacement in the force direction is limited.

As a result, the second tool 24 or the first tool 22 slides while being guided by the center hole 22c, and the arrow B
, is pushed out in the force direction, and is bonded to the inner lead of the tape carrier 5 or the IC chip IA by its thermocompression bonding portion 24a.

In addition, flanges 24c, 24d or slits 22f, 22
By moving in g, the second tool 24 is displaced independently of the first tool 22.

When the drive mechanism 9 is driven in the opposite direction, the selection member 26 is displaced in the direction of arrow B2, and the second tool 24 locks its flanges 24d and 24e into the locking groove 26d.

It is locked to the lower end surface of 26e and pulled up in the force direction of arrow B.

As described above, the tool 20 of the above embodiment can easily support two types of ICs: small-sized TCIA and large-sized ICIB.

FIG. 15 shows a modification of the tool assembly.

This tool assembly 40 includes a first tool 42 corresponding to the IC chip 41A, a second tool 43 corresponding to the IC chip 41B, a third tool 44 corresponding to the IC chip 41C, and a third tool 44 corresponding to the IC chip 41D. It has a structure in which four tools 45 are coaxially combined so that they can independently slide in the direction of an axis 46.

According to this tool assembly 40, one tool can handle four types of IC chips 41A to 41D.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to bond two or more types of IC chips of different sizes by thermocompression bonding of the inner lead part using one tool, and the type of IC chip to be bonded can be changed. This eliminates the need to replace tools even if the

This makes it possible to improve productivity in producing semiconductor devices.

[Brief explanation of drawings]

Fig. 1 is a partially cutaway perspective view of a tool for inner lead bonding according to an embodiment of the present invention, Fig. 2 is an exploded perspective view of the tool shown in Fig. 1, and Fig. 3 is an exploded perspective view of the tool shown in Fig. 4. FIG. 4 is a cross-sectional view of the tool along the line; FIG. 4 is a transverse cross-sectional view of FIG. 1; FIG. 5 is a front view of the tool assembly; FIG. 6 is a plan view of the tool assembly; FIG. is a bottom view of the tool assembly, Figure 8 is a sectional view taken along line ■-■ in Figure 6, and Figure 9 is a sectional view of the
A sectional view taken along the line IX-IX in the figure, FIG. 10 is a diagram showing the state when the first tool of the tool assembly is operated, and FIG. 11 is a diagram showing the selected member to operate the second tool. Figure 12 is a cross-sectional view of the tool when operated, Figure 12 is a cross-sectional view along the line ■-■ in Figure 11, and Figure 13 is a cross-sectional view along the line ■-■ in Figure 11.
14 is a diagram showing the state when the second tool of the tool assembly is operated, FIG. 15 is a diagram showing a modified example of the tool assembly, and FIG. 16 is a diagram showing the conventional one. It is a figure showing an example. In the figure, IA is a small IC chip, 1B is a large IC chip, 2 is the inner lead bonding device body, 5, I2 is a tape carrier, 8 is a lead, 8a is an inner lead part, 9 is a bump, 10 is a pad, 20 is an inner lead bonding tool, 21 is a casing, 21a is an arm, 21b is a guide hole, 22 is a first tool, 22a is a thermocompression bonding part, 22c is a cylinder, 22d and 22e are flanges , 22f and 22g are slits, 23.46 is an axis, 24 is a second tool, 24a is a cylindrical body, 24b is a thermocompression bonding part, 24c and 24d are flanges, 25 is a tool assembly, 26 is a selection member, 26a is a Cylindrical part, 26b and 26c are locking arms, 26d and 26e are engagement grooves, 27.28 are locking members, 29 is a selection mechanism, 32 is an operation knob, 33.34 is a stopper, 40 is a tool assembly, 4] A, 41B, 41C, and 41D are IC chips, 42 is a first tool, 43 is a second tool, 44 is a third tool, and 45 is a fourth tool. 1st Figure 4 I [Longitudinal cross-sectional view of the sole along line 1-111 No. 1
Cross-sectional view of the tool in Figure 4 Sword Front view of the subnorm assembly Top view of the tool assembly Figure 6 Cross-sectional view taken along the line ■-IX in Figure 6 Figure 8 Line ■-IX in Figure 4 Fig. 9 A cross-sectional view of the knoll when operating the first knoll of the tool assembly Fig. 11 Fig. 11 A cross-section along the cutting line Fig. 12 Fig. 26 (] Fig. 11 - Cross-sectional view taken along the ■-state line Fig. 13 Fig. 15 A diagram showing a modified example of the knoll assembly

Claims (1)

[Claims] Attached to a device for bonding the inner lead portion (8a) of the lead (8) on the tape carrier (5, 12) to the pad (10) on the IC chip (1A, 1B) by thermocompression bonding. The tool includes respective thermocompression bonding parts (22a,
24b) is a plurality of tools (22, 24, 42 to 45) each having a size and shape corresponding to one of the IC chips (1A, 1B) having different sizes;
A tool assembly (25) that can be independently displaced in the axis (23, 46) direction and is coaxially combined, and a mechanism (26, 26d, 26e, 22d, 22
An inner lead bonding tool comprising: e, 24c, 24d, 27, 28).