JPH04161323A - Portable memory medium issuing device - Google Patents

Abstract

PURPOSE:To prevent swarfs to be generated in emboss forming from scattering over the surface of a medium and a carrier device and laminating thereon by retaining the medium in the standing state on a position of cutting an emboss section and carrying the same. CONSTITUTION:An IC card 20 is stored in a stacker in the standing state, and a part of the upper end of IC card 20 is retained by a card pickup section 31 of a carrier device 30 and carried, and emboss pattern forming for the card in the standing state is carried out in a cutting device 40. At that time, swarfs are generated, and as the IC card 20 is in the standing state, the swarfs are dropped and not remaining on the IC card 20. Also, the mechanism of the carrier device 30 is located more upper than the IC card 20, and the swarfs generated during the emboss pattern forming are not dropped onto the carrier device 30, which prevents fine powder of swarfs from entering the mechanism of the carrier device.

Description

[Detailed Description of the Invention] [Purpose of the Invention (Industrial Application Field) The present invention relates to an issuance box, and particularly to a portable storage medium such as an IC card having a built-in IC chip equipped with a CPU, data memory, etc. The present invention relates to a portable storage medium issuing device for issuing a portable storage medium by creating an embossed pattern such as the owner's name on the surface.

(Prior Art) Conventionally, a portable storage medium such as an IC card is usually delivered from a card manufacturer to a card issuer in an unwritten state. Then, the card issuer writes predetermined data such as personal information, issuer information, or password information using a portable storage medium issuing device, and the card is issued and handed to the user.

Now, when a portable storage medium is issued by such a portable storage medium issuing device, the user's name, card number, expiration date, etc. are formed on the surface of the portable storage medium in embossed letters (highlighted letters). be done. Conventionally, to form these embossed characters, a pedestal for forming embossed characters made of a plastic material such as vinyl chloride that forms a portable storage medium and a material that has physical properties such as a photopolymer, etc. is used as a portable storage medium. Provided on the surface of the medium. and,
A method has been considered in which embossed characters are formed by cutting this embossed character forming base into a predetermined shape (
(See Japanese Patent Application Laid-Open No. 178089/1989).

By the way, in the conventional portable storage medium issuing device, the first
As shown in FIG. 2, the portable storage medium is transported with the surface having the embossed character forming base facing upward. and,
Predetermined embossed characters are formed in a cutting section composed of a spindle motor, a cutter, etc. Here, when forming embossed characters on a portable storage medium using the above method, a large amount of chips (forming embossed characters made of photopolymer, etc. Cutting the pedestal produces fine powder such as photopolymer.

Then, these chips end up being deposited on the surface of the portable storage medium being issued and on the surface of the conveyance device.

(Problems to be Solved by the Invention) As described above, in the conventional portable storage medium issuing device, the chips generated when forming embossed characters on the portable storage medium are deposited on the portable storage medium and the conveyance device. scattered. Therefore, there is a problem in that not only the aesthetic appearance of the issued portable storage medium is significantly impaired, but also there is a risk that chips may enter the mechanism of the conveying device, causing the device to malfunction.

The present invention has been made in view of the above-mentioned problems, and allows the portable storage medium to be transported without the chips generated by embossed character formation being scattered or stacked on the surface of the portable storage medium and the transport device for the portable storage medium. A portable storage medium publishing device capable of publishing can be provided.

[Configuration of the Invention (Means for Solving the Problem) In order to achieve the above object, the portable storage medium issuing device of the present invention includes a control means for controlling the process of issuing a portable storage medium, and a control means for controlling the process of issuing a portable storage medium. The device includes a cutting means for cutting the embossed portion of the portable storage medium under the control of the cutting means, and a conveying means for conveying the portable storage medium to the position of the cutting means. It is characterized by being held and transported in the same state as before.

(Function) In the present invention, when a portable storage medium is issued, the portable storage medium is transported by the transport means. This conveying means conveys the portable storage medium in an upright position by holding only one end of the portable storage medium. The portable storage medium is conveyed by the conveyance means to the position of the cutting means, and the embossed portion provided on the surface of the portable storage medium is cut by the cutting means, thereby forming predetermined embossed characters.

(Example) Hereinafter, the portable recording medium issuing machine of the present invention will be explained using a multifunctional IC.
An embodiment applied to a card issuing machine (hereinafter referred to as issuing machine) will be described in detail with reference to the drawings.

First, FIG. 8 shows an I with a keyboard and display as an example of a portable storage medium issued by the issuing machine of this embodiment.
The appearance of the first side 201 of the C card 20 is shown. That is, the IC card 20 has a structure in which various electronic components and thin plates are sandwiched between two rectangular thin stainless steel plates, for example. At the end of the first surface 201 of the IC card 20, a magnetic stripe 21 formed in a strip shape in the longitudinal direction is provided. Furthermore, the IC card 20 includes a liquid crystal display section 22 that displays data stored in a memory section (not shown) built into the card body, and a control section built into the card body that can input data into the memory section. (not shown)
A keyboard 23 is provided for sending commands to the IC card 20, and a contact portion 24 is provided for electrical communication between the IC card 20 and the outside of the IC card.

FIG. 9 shows the IC card 20 shown in FIG.
It is an external view seen from 02. The second IC card 20
Similarly to the first surface 201, a magnetic stripe 21 is provided at the end of the surface. Further, an embossing base 26 made of synthetic resin for forming the embossing pattern 25 is provided. The emboss pattern 25 is formed by processing the emboss pedestal 26 using a cutting device 40, which will be described later. Next, FIG. 10 shows the IC card 20 after the emboss pattern 25 has been formed.
FIG. 11 is a view of the IC card 20 after the embossed pattern 25 is formed, viewed from the side end in the lateral direction.

On the other hand, FIG. 1 shows a block diagram of the IC card issuing machine 1 of this embodiment. The issuing all control unit 2 includes a host processor 3 consisting of a control section, a memory section (not shown), etc., a hard disk drive 4 that stores programs for controlling the entire issuing machine 1, and a floppy disk for reading issuing data. It is composed of a disk device 5.

Here, the issuance data is when the IC card 20 is issued.
This refers to data to be written to the IC card 20.

Connected to the host processor 3 are a keyboard 6 for performing various operations, and a CRT display 7 for displaying operating procedures, the status of issuing processing, and the like.

Further, the host processor 3 is connected to a key card reader 8, and by inserting the key card 9 into the key card reader 8, the key card 9 and the host processor 3 are connected.
are mutually accessible.

Here, the key card 9 is I
It is similar to the C card 20. This key card 9 contains a PIN for verifying the identity of the operator of the issuing machine 1.
The operator PIN input from the keyboard 6 is sent to the key card 9 via the key card reader 8, where the operator PIN is verified. If the input operator PIN is correct, the operator is permitted to access the issuing machine 1.

Furthermore, in order to keep a record of the issuance of the IC card 20, the host processor 3 outputs information such as the date and time of issuance, the name of the issuance data file (the file name in which the above-mentioned issuance data is stored), and the number of IC cards issued. A printer (not shown) is connected. Also, host processor 3
An issuance processing unit 10 that performs actual IC card issuance processing is connected to. Next, this issue processing unit 10 will be explained in detail.

In the issuance processing unit 10, the microprocessor 11 first receives the issuance data from the host processor 3, controls the transport mechanism of the IC card 20, and processes the IC card 2.
Control for writing magnetic data on the magnetic stripe 21 of 0, I
Control is performed to write IC data into the memory section (not shown) of the C card 20, control to form an embossed pattern 25 on the surface of the IC card 20, etc. The IC cards 20 before being issued are stored in a hopper 12, and are taken out one by one according to instructions from the microprocessor 11. The IC card 20 taken out from this hopper 12 is inserted into the magnetic stripe reader/writer 1.
3. Then, after magnetic data is written on the magnetic stripe 21, it is conveyed to the reader/writer 14.

The reader/writer 14 writes IC data into a memory section (not shown) of the IC card 20. The IC card 20 on which the IC data has been written is placed in the embossing unit 1.
Embossed pattern 2 is conveyed to
5 formation is performed. When the formation of the embossed pattern 25 is completed, the IC card 20 is stored in the stacker 16. IC cards 20 on which magnetic data or IC data are not normally written or whose emboss patterns are not normally formed during the above processing are stored in the reject stacker 17. Here, among the operations described above, the transportation (including removal and storage) of the IC card is performed under the control of the mechanical controller 18. Next, a means for transporting this IC card 20 will be explained.

FIG. 2 shows an external view of the IC card transport device 30. Here, FIG. 182(a) is a front view of the conveyance device 30, and FIG.
b) and FIG. 2(c) are side views of the conveyance device 30. The conveyance device 30 includes a card pickup section 31, a guide rail 33 that supports a guide roller 32 attached to the card pickup section 31, and a card pickup section 31. A wire 34 is fixed to a part of the section 31. It also has a drive device (not shown) including a motor or the like that drives these elements. The card pickup section 31 holds the IC card 20 by grasping both upper ends of the IC card 20 with the claw sections 35. When the IC card 20 is grasped, the claw portion 35 is in a closed state as the spring 36 presses the holding plate 37, as shown in FIG. 2(b). By the way, the hopper 12 mentioned above
At the position of the stacker 16 or the stacker 17, the claw portion 35 is opened as shown in FIG. 2(c) by pressing the presser plate 37 with a solenoid or the like (not shown). Here, in the hopper 12, the IC card 20 is stored in an upright state, as shown in FIG. 3(a). When removing the IC card 20, the IC card 20 is pushed up by a push-up device (not shown) as shown in FIG. 3(b), and inserted into the claw portion 35 in the open state. Then, by stopping the driving of the solenoid and the like, the claw portion 35 is brought into a closed state, and the IC card 20 is grasped by the claw portion 35. Then, the IC card 20 is conveyed in an upright state by the conveyance device, while the stacker 16
At the position of the reject stacker 17, the claw portion 35 is opened again by the operation of a solenoid, etc.
The C card 20 is separated from the pickup section 31, and the IC card 20 is placed in the stacker 16 or reject stacker 1.
It is stored in 7. Here, the configurations of the stacker 16 and the reject stacker 17 are similar to the configuration of the hopper 12 shown in FIG. 3.

Next, the embossing unit 15 will be explained with reference to FIGS. 4 and 5. Here, FIG. 4 is a horizontal sectional view of the embossing unit 15, and FIG. 5 is a vertical sectional view of the embossing unit 16. Embossing unit 1
Reference numeral 5 denotes a cutting device 40 for cutting the embossed base 26 of the IC card 20, a clamper section 41 for holding the IC card 20 during the cutting process, and a clamper section 41 for holding the IC card 20 during the cutting process, and a clamper part 41 that adheres to the IC card 20 among the chips generated during the cutting process. It has a cleaning device 42 for removing the chips. Here, the term "chips" refers to synthetic resin powder forming the embossed pedestal 26 that is generated by cutting. Furthermore, it has a hood 43 that covers the cutting device 40 and the cleaning device 42, and a dust collector 44 connected to the hood 43. This hood 43 is provided with a card slit 431 (shown in FIG. 6) through which the IC card 20 is passed. Further, an opening 432 (shown in FIG. 6) is provided on the cutting device 40 side. Further, a floor device 45 for generating an air curtain between the cutting device 40 and the clamper section 41 is provided. Further, the dust collector 44 includes a duct 44
1 and a vacuum 442, and the chips sucked by the vacuum 442 are
It is collected in a filter (not shown) provided at the end.

This filter has a structure that allows air to pass through, and only chips are collected in the filter. Further, this filter is removable from the dust collector 44, and the collected chips can be disposed of by periodically replacing the filter. Further, the blower device 45 has a pro-adduct 451. This pro-adduct 451 is attached to the front surface of the clamper section 41 (on the presser clamper 412 side, which will be described later), and has a plurality of air blowing holes 452. While cutting the embossed pedestal 26 of the IC card 20 using the cutting device ft40,
Air is blown out from the air blowing hole 452 of the pro-adduct 451, thereby generating an air curtain between the cutting device 40 and the clamper section 41.

The embossing unit 15 configured as described above is controlled by an embossing control section (not shown).

Next, the configuration of the cutting device 40 will be explained in detail. The cutting device 40 includes a cutter 401 for cutting the embossed pedestal 26 of the IC card 20, a spindle motor 402 for rotating the cutter 401 at high speed, and three for moving the spindle motor 402 in three axial directions. It consists of a drive device having a servo motor 403. These controls are performed by an NC controller (not shown). This NC controller controls the servo motor 403 to drive the spindle motor 4 in accordance with a control command sent from a control section (not shown) of the embossing unit 15.
02 to a predetermined position, and then move the spindle motor 4 to a predetermined position.
02 to rotate and stop the cutter 401.

Through these operations, the emboss pedestal 26 of the IC card 20 is cut, and a predetermined emboss pattern 25 is formed.

Next, the configuration of the clamper section 41 will be explained in detail with reference to FIG. 6. Here, FIG. 6(a) is a front view of the clamper part 41, and FIG. 6(b) is a cross section of the clamper part taken along line AA' (shown in FIG. 6(a)) when no cutting is being performed. 6(C) is a sectional view taken along the line AA' of the clamper section 41 during cutting. Clamper part 41
is the IC card 2 transported by the transport device 30.
0, and a presser clamper 412 that fixes the second surface (the surface on which the emboss pedestal 26 is provided) 202 side of the IC card. The presser clamper 412 includes an IC card 20.
An opening 413 is provided in a portion where the embossing pedestal 26 is located. Furthermore, this presser clamper 412 is connected to a solenoid 415 via a slide shaft 414. Further, a spring 416 is attached to one end of the slide shaft 414. Here, when the cutting device 40 is not cutting the embossed pedestal 26 of the IC card 20, the fixed clamper 411 and the presser clamp are 412 are spaced apart. On the other hand, when the cutting device 40 is cutting the embossed base 26 of the IC card 20, the presser clamper 411 is moved by the action of the solenoid 415, as shown in FIG. 6(c). Fixed by clamper 4
The IC card 20 is sandwiched and fixed between the clamper 11 and the presser clamper 412. At this time, the second side 2 of the IC card 20
02, the part of the embossing pedestal 26 is the presser clamper 41
The portion of the second surface 202 of the IC card 20 other than the embossing pedestal 26 is in close contact with the presser clamper 412 .

The slide shaft 414 is supported by a slide bearing (not shown) to allow linear movement, and is smoothly driven as the solenoid 415 is driven.

Next, the configuration of the cleaning device 42 will be explained in detail. As shown in FIGS. 4 and 5, the cleaning device 42 includes two brush rollers 421, two shafts 422 to which each brush roller 421 is attached, and a brush drive motor that rotationally drives these shafts 422. It consists of 423. A pulley 424 is provided at the lower end of the shaft 422, and a brush drive motor 423
The shaft 422 and the brush roller 421 are rotated by transmitting the rotation to the pulley 424 by a belt (not shown).

Further, gears (not shown) are provided between these shafts 422, and the individual brush rollers 421 rotate in opposite directions.

The above is the configuration of the issuing machine 1 of this embodiment, especially the cutting device 40.
The configuration of the system was explained. Next, the process of forming the emboss pattern 25 on the emboss pedestal 26 of the IC card 20 using the cutting device 40 will be explained using the flowchart shown in FIG. First, the conveyance device 30 is moved to the hopper 12 (Step), and as described above,
After opening the claw portion 35 by operating a solenoid (not shown) and inserting the IC card 20 into the claw portion 35, the pick-up portion 31 picks up the IC card by deenergizing the solenoid.
The IC card 20 is removed by holding the card 20 (Step 2). Next, the transport device 30 transports the IC card 20 to the position of the MS reader/writer 13 (Step 3), and magnetic data is written on the magnetic stripe 21 of the IC card 20 by the MS reader/writer 13 (Step 4). When the magnetic data writing process is completed,
The transport device 30 transports the IC card 20 to the position of the reader/writer 14 (Step 5). Then, the reader/writer 14 writes the IC data into a memory (not shown) via the contact section 24 of the IC card (Ste
p6). When the IC data writing process is completed, the transport device 3
0 is transported to the clamper section 41 position of the IC curl l'20t-emboss unit 15. Here, the IC card 20 passes through the slit 431 provided in the hood 43 between the fixed clamper 411 and the presser clamper 412 with both ends thereof being gripped by the claws 35 of the card pickup section 31 of the transport device [30]. transported. And fixed clamper 41
1 and the presser clamper 412, the transport device 30 is stopped (Step 7). Subsequently, the solenoid 415 of the clamper section 41 described above is driven by a command from an embossing control section (not shown), so that the presser clamper 412 is moved and the IC card 20 is pressed against the fixed clamper 411 and fixed. (Step 8). Here, since the pickup section 31 and the clamper section 41 of the conveyance device 30 are configured so as not to interfere with each other, the pickup section 31
While holding the IC card 20, the IC card 20 can be fixed using the clamper section 41. As a result, when creating the emboss pattern 25, the IC card 20 is removed from the pickup section 31.
There is no need to remove the IC card 2o from the pickup section 31 or the clamper section 41 again after the emboss pattern 25 has been created.

Now, in step 5, the IC card 20 is moved to the clamper section 41.
When the IC card 2 is fixed to the
A process of creating a predetermined embossing pattern 25 on the embossing pedestal 26 of No. 0 is performed.

First, the rotation of the spindle motor 402 of the cutting device 40 is started in response to a command from the embossing control section. At the same time, the vacuum 442 of the dust collector 44 and the blower device 45 are driven (Step 9). Next, the rotation speed of the spindle motor 402, the suction force of the vacuum 442, and the flow rate of air by the floor device 45 are waited for a predetermined period of time until they reach certain values (Step 1).
0). Then, by driving the servo motor 403 by an NC controller (not shown), the cutter 401 attached to the spindle motor 403 is moved to the hood 43.
The emboss pedestal 26 of the IC card 20 is cut through the opening 432 provided in the emboss pattern 25.
is created (StepH). When cutting of the predetermined emboss pattern 25 is completed, the cutter 40'1 is retracted under the control of the NC controller, and then the rotation of the spindle motor 403 is stopped (Step 12).
. Subsequently, the solenoid 415 of the clamper section 41 described above is deenergized in response to a command from the embossing control section.
The presser clamper 412 moves and the IC card 20 is released from the clamper section 41 (Step 13).

Next, the IC card 20 is transported to the position of the cleaning device 42 by the transport device 30 (Step 14). Here, the brush drive motor 423 of the cleaning device 42
has already started rotating under the control of the embossing control section before the IC card 20 is conveyed. Transport device 3
The IC card 20 conveyed by the brush roller 420 is passed between two rotating brush rollers 421. This causes the above-mentioned occurrence during cutting of the embossing pedestal 26,
Chips attached to the surface of the IC card 20 are removed (St
ep15). As described above, the brush rollers 421 rotate in opposite directions to each other, and further rotate in a direction opposite to the conveying force and direction of the IC card 20.
Chips adhering to the surface are thoroughly removed. 5te
When the cleaning of the IC card 20 is completed in step p15, the drive of the vacuum 442 and the blower device is stopped by a command from the embossing control section (step 16).

Next, it is determined whether the issuance processing for this IC card 20 has been completed normally (Step
17). Then, if the issuance process is completed normally, I
The C card 20 is transported to the position of the stacker 16 by the transport device 30 (Step 18). Subsequently, the claw portion 35 of the card pickup portion 31 is released by the operation of the solenoid, thereby releasing the IC card 20 from the pickup knob portion 31 and storing the IC card 20 in the stacker 16 (Step 19). The card 20 issuing process ends. On the other hand, the IC card 20 determined in step 17 that the issuance process has not been completed normally
is transported to the position of the reject stacker 17 by the transport device 30 (Step 20). Then, the IC card 20 is released from the pickup section 31 by opening the claw section 35 of the card pickup section 31 by the operation of the solenoid, and the IC card 20 is stored in the reject stacker 17 (Step 21).

Now, in the above-mentioned IC card 20 issuing process, processing of chips generated during the embossed pattern 25 forming process will be explained. First, as mentioned above, the clamper section 41
The cleaning device 42 is covered with a hood 43 to prevent chips from flying out from the hood 43.

Furthermore, before the cutter 401 starts cutting, the vacuum 442 of the dust collector 44 and the blower device 45 are driven. Among these, the pro-adduct 451 of the blower device 45
An air curtain is created between the cutting surface and the cutting device by forcefully blowing air out of the air blowing holes 452 provided in the cutting surface. As a result, chips generated on the cutting surface are blocked by this air curtain, and the hood 43
It does not jump out from the opening 432. Furthermore, the air blown out from the air blowing hole 452 of the product duct 451 not only generates an air curtain, but also blows the surface of the IC card 20 undergoing the emboss pattern 25 creation process. This prevents chips from adhering to the surface of the IC card 20.

Here, at the same time as the floor device 45 is driven, the dust collector 44
vacuum 442 is being driven.

This vacuum 442 sucks the air inside the hood 43 through the duct 441 to the vacuum 442 side.

As a result, chips generated within the hood 43 are sucked into the vacuum 442. The chips sucked by this vacuum 442 are collected in a filter (not shown). This filter has a structure that allows air to pass through.
Only chips are collected in the filter (. Now, the vacuum 442 is driven not only while cutting the embossed pedestal 26 but also while cleaning the IC card 20. The cleaning device 42 In this case, chips adhering to the surface of the IC card 20 are removed from the brush roller 421.
However, the chips that are brushed off here are also
It is sucked out by a vacuum 442 and collected on a filter.

The functions of the hood 43, the dust collector 44, and the blower device 45 can prevent chips from scattering inside the issuing machine 1. In addition, since the generated chips are collected in one place,
Chips can be easily disposed of.

As described above, the IC card issuing machine 1 of this embodiment is
The cards 20 are stored in the stacker 16 in an upright position. The transport device 30 holds a part of the upper end of the IC card 20 with a card pickup section 31 and transports the IC card 20 in an upright position. The IC card 20 conveyed to the cutting device 40 is subjected to the embossed pattern 26 forming process while remaining in an upright position. At this time, chips are generated by cutting the embossing pedestal 25 on the second surface 202 of the IC card 20, but since the IC card 20 is in an upright position, the chips fall.

That is, the generated chips are on the second surface 202 of the IC card 20.
Nothing remains on top.

Further, since the transport device 30 carries out the transport while holding the upper end of the IC card 20, the mechanism of the transport device 30 itself is located above the IC card 20.

Therefore, the chips generated during the process of forming the embossed pattern 26 do not fall onto the conveying device 30. Therefore, it is possible to prevent fine powder of chips from entering the mechanism of the conveying device.

[Effects of the Invention] As detailed above, in the portable storage medium issuing device of the present invention, chips generated when cutting the embossed portion of the portable storage medium are not stacked on the surface of the portable storage medium. Therefore, it is possible to issue the portable storage medium without damaging its surface appearance.

Furthermore, since the chips do not fall onto the conveyance means, there is no possibility that the chips may enter the mechanism of the conveyance means and cause a malfunction of the conveyance means.

[Brief explanation of drawings]

Figures 1 to 11 are for explaining this embodiment. Figure 1 is a block diagram of the IC card issuing machine, Figure 2 is an external view of the conveyance device, and Figure 3 is the hopper and conveyance device. Figure 4 is a horizontal sectional view of the embossing unit, Figure 5 is a vertical sectional view of the embossing unit, Figure 6 is an external view of the clamper, and Figure 7 is an IC card. Flowchart for explaining the flow of issuance processing, No. 8
Figure 9 is an external view of the first side of the IC card, Figure 9 is an external view of the second side of the IC card, Figure 10 is an external view of the second side of the IC card after embossed characters are formed, and Figure 9 is an external view of the second side of the IC card. FIG. 11 is a side view of the IC cart in the lateral direction after embossed characters are formed. 1... Issuing machine 15... Embossing unit 20.
・IC card 26... Emboss pedestal 30... Conveyance device 40... Cutting device 41... Clamper section 42.
・Cleaning device 43...Hood 44...Dust collecting device 45...Blower device Representative Patent attorney Nori Chika Ken Yudo Yamashita - Figure 1 Part' Enf Takumi Figure 4 Figure 5 Figure 7) A. Figure 6 (b) Figure 6 Figure 6 Figure 8 Figure 9 Figure 10 Figure 11

Claims (1)

[Claims] Controlling the process of issuing a portable storage medium in a portable storage medium issuing device that forms predetermined embossed characters by cutting the embossed part of a portable storage medium having an embossed part and issues the portable storage medium. a cutting means for cutting the embossed portion of the portable storage medium under the control of the control means; and a conveying means for conveying the portable storage medium to the position of the cutting means, the conveying means A portable storage medium issuing device is characterized in that it holds and transports a portable storage medium in an upright position.