JPH04160070A - Ceramic joint body and its production - Google Patents
Ceramic joint body and its productionInfo
- Publication number
- JPH04160070A JPH04160070A JP28386090A JP28386090A JPH04160070A JP H04160070 A JPH04160070 A JP H04160070A JP 28386090 A JP28386090 A JP 28386090A JP 28386090 A JP28386090 A JP 28386090A JP H04160070 A JPH04160070 A JP H04160070A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- active metal
- copper
- metal layer
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 78
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 28
- 230000005496 eutectics Effects 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052863 mullite Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- 230000008646 thermal stress Effects 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000035882 stress Effects 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229910033181 TiB2 Inorganic materials 0.000 description 1
- 229910034327 TiC Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はセラミックス接合体、特にはセラミックス部材
同士を強固に、かつ反りもなく接合することにより、航
空機産業、宇宙産業、各種機械工業、電子工業などの分
野で有用とされるセラミックス接合体およびその製造方
法に関するものである。Detailed Description of the Invention (Industrial Field of Application) The present invention is applicable to the aircraft industry, space industry, various mechanical industries, electronic The present invention relates to a ceramic bonded body that is useful in industrial fields and a method for manufacturing the same.
（従来の技術）
近年、セラミックスはその応用分野が拡大して各方面に
使用されるようになってきているが、このセラミックス
も単独で使用されることはまれで、これは他の部材と組
合せて複合化したもの、あるいはセラミックス部材同士
を接合したものが多用されている。(Conventional technology) In recent years, the field of application of ceramics has expanded and it has come to be used in various fields, but it is rare that ceramics are used alone, but in combination with other materials. Composite materials, or materials made by bonding ceramic members together, are often used.
そして、このセラミックス部材同士の接合方法について
は、接合すべきセラミックス部材の界面にＣｕｂ、 Ｌ
ａＣｒＯ３、Ｓｉｎ、の各粉末を有機溶剤でペースト状
にしたものを塗布し、 １，０００〜１，２００℃で加
熱反応させて接合する方法（特開昭５５−７５９７８号
公報参照）、接合すべきセラミックス界面に炭化けい素
粉束を５０〜９０重量含有する結合剤を介在させ、少な
くとも１００ｋｇ／ｃｍ２の窒素分圧と１．６００〜２
．２００℃の温度で熱間水圧プレス処理する方法（特開
昭５８−８４１８５号公報参照）が提案されている。As for this method of joining ceramic members, a Cub, L
A method of applying a paste of aCrO3 and Sin powder in an organic solvent and heating and reacting at 1,000 to 1,200°C to bond (see JP-A-55-75978), bonding method. A binder containing 50 to 90 weight of silicon carbide powder bundles is interposed at the ceramic interface, and a nitrogen partial pressure of at least 100 kg/cm2 and a nitrogen partial pressure of 1.600 to 2.
．． A method of hot hydraulic pressing at a temperature of 200° C. (see Japanese Patent Laid-Open No. 84185/1985) has been proposed.
（発明が解決しようとする課題）
しかし、この特開昭５５−７５９７６号公報に記載され
ている方法にはセラミックスの種類によってここに使用
する各粉末の混合比を変える必要があるし、得られるセ
ラミックス接合体が信頼性の乏しいものになるという不
利があり、特開昭５５−８４１８５号公報に記載されて
いる方法には接合温度が高く、かつ熱間水圧プレス法の
ために被接合材の寸法、形状が限定されるという欠点が
ある。(Problem to be Solved by the Invention) However, the method described in JP-A-55-75976 requires changing the mixing ratio of each powder used here depending on the type of ceramics. The method described in JP-A-55-84185 has the disadvantage that the ceramic bonded body has poor reliability.The method described in JP-A-55-84185 requires a high bonding temperature, and because of the hot hydraulic press method, It has the disadvantage of being limited in size and shape.
なお、このセラミックス部材同士の接合については、上
記した方法にみられるようにある程度の高温に加熱する
ことが必要とされるのであるが、この加熱・冷却のサイ
クルで発生する残留熱応力（これは接合しようとするセ
ラミックスが大きくなったり、接合するセラミックス間
の熱膨張係数の差が大きいとき、この熱応力も大きくな
るのである）を吸収可能とする方法が未だ提案されてい
ないために、接合しようとするセラミックスに割れが生
じ易いという欠点がある。Note that joining these ceramic members together requires heating to a certain high temperature as seen in the method described above, but the residual thermal stress (this is As the size of the ceramics to be joined increases or the difference in thermal expansion coefficient between the ceramics to be joined increases, the thermal stress increases. The drawback is that the ceramics used for this process tend to crack easily.
（課題を解決するための手段）
本発明はこのような不利、欠点を解決したセラミックス
接合体およびその製造方法に関するものであり、これは
セラミックス部材同士の接合面に活性金属層と銅層およ
び活性金属層を順次積層して介在させ、加熱し接合させ
てなることを特徴とするセラミックス接合体、およびセ
ラミックス部材同士の接合面に活性金属層と銅層および
活性金属層を順次積層して介在させ、不活性ガス雰囲気
中において、活性金属と銅との共晶温度より高いが活性
金属の融点以下の温度に加熱し、セラミックス部材同士
を接合させることを特徴とするセラミックス接合体の製
造方法を要旨とするものである。(Means for Solving the Problems) The present invention relates to a ceramic bonded body that solves the above-mentioned disadvantages and drawbacks, and a method for manufacturing the same. A ceramic bonded body characterized by sequentially stacking and interposing metal layers and heating and bonding them, and an active metal layer, a copper layer, and an active metal layer being sequentially stacked and interposed on the bonding surfaces of ceramic members. Abstract: A method for manufacturing a ceramic bonded body characterized by joining ceramic members together by heating in an inert gas atmosphere to a temperature higher than the eutectic temperature of the active metal and copper but below the melting point of the active metal. That is.
すなわち、本発明者らはセラミックス部材同士を接合さ
せたセラミックス接合体を容易にかつ信頼性の高いもの
として取得する方法について種々検討した結果、セラミ
ックス部材同士の接合面に活性金属層と銅層および活性
金属層を積層し、これを接合すべきセラミックス部材の
界面に介在させ、これを活性金属と銅との共晶温度より
高いが活性金属の融点以下の温度に加熱すれば、この共
晶体によってセラミックス部材同士が強固に接合され、
このときの残留熱応力もこの銅粉末により吸収されるの
で、セラミックスの割れの生ずることがないということ
を見出し、この活性金属層の種類、この加熱接合方法な
どについての研究を進めて本発明を完成させた。That is, the present inventors have studied various ways to easily and reliably obtain a ceramic bonded body in which ceramic members are bonded together, and have found that an active metal layer, a copper layer, and If active metal layers are laminated, interposed at the interface of the ceramic members to be joined, and heated to a temperature higher than the eutectic temperature of the active metal and copper but below the melting point of the active metal, the eutectic Ceramic components are firmly joined together,
It was discovered that the residual thermal stress at this time is also absorbed by the copper powder, so no cracking of the ceramic occurs, and research was carried out on the type of active metal layer, this heating bonding method, etc., and the present invention was developed. Completed.
以下にこれをさらに詳述する。This will be explained in further detail below.
（作用）
本発明はセラミックス部材同士を接合したセラミックス
接合体およびその製造方法に関するものである。(Function) The present invention relates to a ceramic bonded body in which ceramic members are bonded together, and a method for manufacturing the same.
本発明のセラミックス接合体はセラミックス部材同士を
活性金属と銅との共晶体で接合したものであり、このも
のはセラミックス部材同士が強固に接合され、この接合
時の残留熱応力も銅層によって吸収されるのでセラミッ
クスに割れが発生することがないという有利性が与えら
れる。The ceramic bonded body of the present invention is made by bonding ceramic members to each other using a eutectic of active metal and copper.In this product, the ceramic members are firmly bonded to each other, and the residual thermal stress at the time of bonding is also absorbed by the copper layer. This gives the advantage that cracks do not occur in the ceramics.
本発明のセラミックス接合体を構成するセラミックスと
しては＾１２０３、Ｂｅ０１Ｚｒ０２、ＣａＯ１Ｓｉｎ
２、ＭｇＯ、ＴｉＯ２、 ムライト、５ｔ３Ｎ４、Ａｎ
Ｎ、 ＢＮ、ＴｉＮ、ＳｉＣ，ＴｉＣ，ＴｉＢ２、サ
イアロンの少なくとも１種からなるものとされる。Ceramics constituting the ceramic bonded body of the present invention include ^1203, Be01Zr02, CaO1Sin.
2, MgO, TiO2, Mullite, 5t3N4, An
It is made of at least one of N, BN, TiN, SiC, TiC, TiB2, and Sialon.
また、このセラミックス部材は活性金属と銅との共晶体
によって接合されるのであるが、この活性金属としては
これが銅と共晶体を形成するものとすることが必要とさ
れることからＴｉ、 Ｚｒ、 Ｈｆから選択されるもの
とされる。In addition, this ceramic member is bonded by a eutectic of an active metal and copper, and since it is necessary that the active metal forms a eutectic with copper, Ti, Zr, It is assumed that it is selected from Hf.
この活性金属層と銅層は後記する加熱により共晶体とさ
れ、セラミックス部材はこの共晶体によって強固に接合
されたものとなるのであるが、この接合時の加熱、冷却
のサイクルにより発生する残留熱応力はここに存在する
銅層により吸収されるので、本発明のセラミックス接合
体にはこの熱応力による割れの発生が防止される。The active metal layer and the copper layer are turned into a eutectic by heating, which will be described later, and the ceramic component is firmly bonded by this eutectic, but the residual heat generated by the heating and cooling cycle during this bonding Since the stress is absorbed by the copper layer present therein, the ceramic bonded body of the present invention is prevented from cracking due to this thermal stress.
つぎにこのセラミックス接合体の製造方法を述べる。こ
のセラミックス接合体の製造にはまず、接合すべき２枚
以上のセラミックス部材を用意し、この一つのセラミッ
クス部材の表面に活性剤金属層と銅層および活性金属層
を順次３層に積層させたものが介在させられるのである
が、この活性金属層、銅層、活性金属層の３層積層体は
例えば厚さが５〜５０μｍの活性金属箔をセラミックス
部材の表面に載置したのち、この上に厚さが５〜４０μ
ｍの銅箔を載せ、ついでこの上に上記と同じ活性金属箔
を載置するようにすればよい。Next, a method for manufacturing this ceramic bonded body will be described. To manufacture this ceramic bonded body, first, two or more ceramic members to be bonded are prepared, and an activator metal layer, a copper layer, and an active metal layer are sequentially laminated in three layers on the surface of one ceramic member. This three-layer laminate of an active metal layer, a copper layer, and an active metal layer is made by placing, for example, an active metal foil with a thickness of 5 to 50 μm on the surface of a ceramic member, and then placing the activated metal foil on the surface of the ceramic member. The thickness is 5~40μ
m of copper foil may be placed, and then the same active metal foil as above may be placed on top of this.
このように活性金属層と銅層および活性金属層を介在さ
せたセラミックス部材にはこの上にこれと接合すべきセ
ラミックス部材を重ねたのち、必要に応じ加圧し、この
ように構成した積層体を適当な炉の中に挿入し、炉内で
の加熱によって上記した活性金属と銅とを共晶体とし、
この共晶体によってセラミックス部材同上を接合してセ
ラミックス接合体とするのであるが、この加熱は不活性
ガス雰囲気で行なうことがよいことから、炉内の雰囲気
は加熱に先立って、アルゴン、ヘリウムなどの不活性雰
囲気に置換するか、真空とすればよい。After the ceramic member with the active metal layer, copper layer, and active metal layer interposed therebetween is stacked with the ceramic member to be bonded, pressure is applied as necessary to form the laminate. Insert it into a suitable furnace and heat it in the furnace to make the above-mentioned active metal and copper into a eutectic,
The ceramic members are bonded using this eutectic to form a ceramic bonded body, but since it is best to perform this heating in an inert gas atmosphere, the atmosphere in the furnace must be filled with argon, helium, etc. prior to heating. The atmosphere may be replaced with an inert atmosphere or a vacuum may be applied.
この置換が終了したら所望の加熱プロフィールによる熱
処理を開始するのであるが、この加熱温度は活性金属と
銅との共晶温度である８８０℃より高い温度とする必要
がある。しかし、この活性金属が融解すると未接着とな
るので、この温度は活性金属の融点以下、したがってＴ
ｉのときには１，８００℃以下、Ｚｒのときには１，９
００℃以下、Ｈｆのときには２．２０７℃以下とするこ
とがよい、したがって、この加熱は例えば８８０〜１，
１００℃の範囲とすればよく、この加熱時間は３０分程
度とすればよいが、これはもっと短かくしてもよいし、
得られた共晶体を拡散させるためにもつと長い時間とし
てもよく、加熱終了後はセラミックス接合体取出しのた
めに冷却すればよい。しかし、この加熱、冷却のための
昇温、降温は熱処理を行なうセラミックスが熱衝撃に弱
いものもあるのでできるだけゆっくりとするほうがよい
し、特にこの降温速度は残留熱応力を少なくするために
できるだけゆっくりと下げるようにするほうが望ましい
が、この加熱は不活性ガス雰囲気とするか、真空中とす
ることがよい。When this substitution is completed, heat treatment using a desired heating profile is started, but the heating temperature needs to be higher than 880° C., which is the eutectic temperature of the active metal and copper. However, when this active metal melts, it becomes unbonded, so this temperature is below the melting point of the active metal, so T
1,800℃ or less for i, 1,9 for Zr
It is preferable to set the heating temperature to 00°C or lower, and 2.207°C or lower in the case of Hf.
The temperature may be in the range of 100°C, and the heating time may be about 30 minutes, but it may be shorter.
It may be kept for a long time to diffuse the obtained eutectic, and after the heating is completed, it may be cooled to take out the ceramic bonded body. However, it is better to raise and lower the temperature for heating and cooling as slowly as possible, as some ceramics undergoing heat treatment are susceptible to thermal shock. It is preferable to lower the heating temperature, but it is better to perform this heating in an inert gas atmosphere or in a vacuum.
この熱処理が終了すると活性金属層と銅層とは共晶体と
なり、これがセラミックス部材間に存在するようになる
が、加熱下ではこの共晶体が溶融状にあるので、これに
よって複数枚のセラミックス部材は容易にかつ強固に接
合されるし、この接合体には割れの生じることもないの
で、得られたセラミックス接合体には各種産業用に有利
に使用できるようになるという有利性が与えられる。When this heat treatment is completed, the active metal layer and the copper layer form a eutectic, which exists between the ceramic members, but since this eutectic is in a molten state under heating, the multiple ceramic members are Since it is easily and firmly joined and the joined body is free from cracking, the resulting ceramic joined body has the advantage of being able to be advantageously used in various industrial applications.
（実施例） つぎに本発明の実施例をあげる。(Example) Next, examples of the present invention will be given.
実施例
９６％のＡＪ２２０３を主材とする５０ｍｍｘ ５０ｍ
ｍＸ Ｏ，６３５ｍｍのセラミックス板を用意し、この
１枚のセラミックス板の表面に５０ｍｍＸ ５０ｎ＋ｍ
Ｘ ５μｍのチタン箔を載置し、この上に５０＋ａｍＸ
５０ｍｍｘ ３０μ諺の銅箔を重ね、さらにこの上に
５０ｍｍｘ ５０ｍｍｘ ５μｍのチタン箔を重ねたの
ち、この上にこのセラミックス板に接合しようとするも
う一枚のセラミックス板を載置した。Example: 50mm x 50m mainly made of 96% AJ2203
mX O, 635mm ceramic plate is prepared, and 50mmX 50n+m is placed on the surface of this single ceramic plate.
Place a titanium foil with a diameter of 5 μm
A 50 mm x 30 μm copper foil was layered, and a 50 mm x 50 mm x 5 μm titanium foil was layered on top of this, and then another ceramic plate to be bonded to this ceramic plate was placed on top of this.
ついで、この積層体を電気炉内に挿入セットし、炉内の
雰囲気をアルゴンガス雰囲気に置換したのち、炉内の温
度をＴｉと銅の共晶温度である８８０℃以上の８８５℃
まで昇温し、この温度に３０分間保持したのち常温まで
冷却−したところ、２枚のセラミックス板がＴｉと銅の
共晶体で強固に接着されているセラミックス接合体が得
られ、これには割などの不利もないものであった。Next, this laminate was inserted and set in an electric furnace, and after replacing the atmosphere in the furnace with an argon gas atmosphere, the temperature in the furnace was increased to 885°C, which is 880°C or higher, which is the eutectic temperature of Ti and copper.
When the temperature was raised to 100%, maintained at this temperature for 30 minutes, and then cooled to room temperature, a ceramic bonded body was obtained in which two ceramic plates were firmly bonded with a eutectic of Ti and copper. There were no other disadvantages.
（発明の効果）
本発明はセラミックス接合体およびその製造方法に関す
るもので、これは前記したようにセラミックス部材同士
の接合面に活性金属層と銅層および活性金属層を順次積
層して介在させ、加熱し接合させてなるセラミックス接
合体、およびセラミックス部材同士の接合面に活性金属
層と銅層および活性金属層を順次積層して介在させ、不
活性雰囲気中において、活性金属と銅との共晶温度より
高いが、活性金属の融点以下の温度に加熱し、セラミッ
クス部材同士を接合させることを特徴とするセラミック
ス接合体の製造方法を要旨とするものであるが、これに
よればセラミックス部材同士が活性金属と銅との共晶体
によって接合されるので、セラミックス同士を強固にか
つ反りもなく接合させることができるし、この場合には
加熱、冷却のサイクルによる残留反応力が銅層により吸
収されるので熱応力による割れなどの不利のないセラミ
ックス接合体を容易に得ることができるという有利性が
与えられる。(Effects of the Invention) The present invention relates to a ceramic bonded body and a method for manufacturing the same, which includes, as described above, interposing an active metal layer, a copper layer, and an active metal layer by sequentially stacking them on the bonding surfaces of ceramic members. A ceramic bonded body formed by heating and bonding, and an active metal layer, a copper layer, and an active metal layer are sequentially laminated and interposed on the bonding surfaces of ceramic members, and in an inert atmosphere, eutectic of the active metal and copper is formed. The gist of this is a method for manufacturing a ceramic bonded body, which is characterized by heating to a temperature higher than the active metal's melting point, but below the melting point of the active metal, and bonding the ceramic members together; Since it is bonded by a eutectic of active metal and copper, it is possible to bond the ceramics firmly and without warping, and in this case, the residual reaction force due to heating and cooling cycles is absorbed by the copper layer. Therefore, it is possible to easily obtain a ceramic bonded body without disadvantages such as cracking due to thermal stress.
特許出願人 信越化学工業株式会社 □）Patent applicant: Shin-Etsu Chemical Co., Ltd. □)
Claims (1)
および活性金属層を順次積層して介在させ、加熱し接合
させてなることを特徴とするセラミックス接合体。 ２、セラミックスがＡｌ＿２Ｏ＿３、ＢｅＯ、ＺｒＯ＿
２、ＣａＯ、ＳｉＯ＿２、ＭｇＯ、ＴｉＯ＿２、 ムラ
イト、Ｓｉ＿３Ｎ＿４、Ａｌ＿２Ｎ、ＢＮ、ＴｉＮ、Ｓ
ｉＣ、ＴｉＣ、ＴｉＢ＿２、サイアロンから選択された
ものである請求項１に記載したセラミックス接合体。 ３、活性金属がＴｉ、Ｚｒ、Ｈｆから選択されたもので
ある請求項１に記載したセラミックス接合体。 ４、セラミックス部材同士の接合面に活性金属層と銅層
および活性金属層を順次積層して介在させ、不活性雰囲
気中において、活性金属と銅との共晶温度より高いが活
性金属の融点以下の温度に加熱し、セラミックス部材同
士を接合させることを特徴とするセラミックス接合体の
製造方法。[Scope of Claims] 1. A ceramic bonded body, characterized in that an active metal layer, a copper layer, and an active metal layer are successively laminated and interposed on the bonding surfaces of ceramic members and bonded by heating. 2. Ceramics are Al_2O_3, BeO, ZrO_
2, CaO, SiO_2, MgO, TiO_2, Mullite, Si_3N_4, Al_2N, BN, TiN, S
The ceramic bonded body according to claim 1, which is selected from iC, TiC, TiB_2, and Sialon. 3. The ceramic bonded body according to claim 1, wherein the active metal is selected from Ti, Zr, and Hf. 4. An active metal layer, a copper layer, and an active metal layer are sequentially laminated and interposed on the joint surfaces of ceramic members, and in an inert atmosphere, the temperature is higher than the eutectic temperature of the active metal and copper, but below the melting point of the active metal. 1. A method for manufacturing a ceramic bonded body, which comprises heating the ceramic components to a temperature of 10.degree. C. to bond ceramic members together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28386090A JPH04160070A (en) | 1990-10-22 | 1990-10-22 | Ceramic joint body and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28386090A JPH04160070A (en) | 1990-10-22 | 1990-10-22 | Ceramic joint body and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04160070A true JPH04160070A (en) | 1992-06-03 |
Family
ID=17671110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28386090A Pending JPH04160070A (en) | 1990-10-22 | 1990-10-22 | Ceramic joint body and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04160070A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013049598A (en) * | 2011-08-30 | 2013-03-14 | Mino Ceramic Co Ltd | Boron carbide-containing ceramics joint and method of producing the same |
| CN115724665A (en) * | 2022-12-09 | 2023-03-03 | 南方科技大学 | Aluminum nitride substrate and preparation method thereof |
-
1990
- 1990-10-22 JP JP28386090A patent/JPH04160070A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013049598A (en) * | 2011-08-30 | 2013-03-14 | Mino Ceramic Co Ltd | Boron carbide-containing ceramics joint and method of producing the same |
| CN115724665A (en) * | 2022-12-09 | 2023-03-03 | 南方科技大学 | Aluminum nitride substrate and preparation method thereof |
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