JPH0415920A - Method and holder for washing wafer - Google Patents

Abstract

PURPOSE:To arrange washing nozzles under arms, improve the reliability of wafer washing, and stably hold a semiconductor wafer by rotating the rollers of both the arms synchronously using two electric movers moved on a rail back and forth individually and having the two wafer holding arms under the rail. CONSTITUTION:The present invention comprises a horizontal rail 22, sliders 23 and 24 moved on the rail back and forth individually, horizontal arms 27 and 28 having fingers 25 and 26 perpendicularly thereto under the sliders, six rollers 32-37 fixed rotatably to roller holders 30 and 31, which are fitted on the periphery of a semiconductor wafer 29, at the tips of the fingers, and washing nozzles under the arms 27 and 28. When the semiconductor wafer 29 at the specified position is held with the sliders 23 and 24 brought close thereto and washing liquid is sprayed on both faces of the semiconductor wafer 29 through the washing nozzles while the rollers 32-37 are rotated synchronously using drives 38 and 39, the wafer is not polluted because the washing liquid does not scatter to the arms 27 and 28 and the other parts.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer cleaning holding device used in a semiconductor device manufacturing process and a cleaning method thereof.

[Conventional technology]

Generally, semiconductor devices are manufactured by repeating basic processes such as film formation, photolithography, etching, and cleaning on semiconductor wafers.

Among these, the cleaning process is for removing heavy metals, organic substances, etc. from the semiconductor wafer, and there is a semiconductor wafer holding device as shown in FIG. 4 for this process. To explain this based on the same figure, in the same figure, those indicated by symbols I and 2 have two fingers 4 to 7 that hold the semiconductor wafer 3, and two arms 9 that move relatively forward and backward by a cylinder 8. -12 are rotatably provided on the fingers 4-7 of both arms 1.2, and are attached to the semiconductor wafer 3.
There are four upper and lower rollers that contact the periphery of the

Further, 13 is a wafer driving motor that rotates the lower rollers 11 and 12 among these rollers 9 to 12.

Note that 14 and 15 are gears that mesh with gear 16 of this motor 13.

In order to clean a semiconductor wafer using the wafer cleaning holding device configured as described above, first, a transfer machine (not shown) is used.
The semiconductor wafer 3 is transferred to a predetermined position by the cylinder 8, and then the two arms 1.2 are moved toward each other by the cylinder 8.
The semiconductor wafer 3 is held by moving the semiconductor wafer 3, and then, while the rollers 11 and 12 are synchronously rotated by the motor 13, a cleaning liquid is sprayed from a nozzle (not shown) onto the front and back surfaces of the semiconductor wafer 3.

[Problem to be solved by the invention]

By the way, in the conventional wafer cleaning holding device,
Since the cleaning nozzle (not shown) is located above the arm 1.2, the cleaning nozzle (not shown) is located above the arm 1.2 during cleaning. The cleaning liquid splashed on the semiconductor wafer 2 bounced off and adhered to the semiconductor wafer 3. As a result, there is a problem in that wafer contamination occurs and reliability in wafer cleaning deteriorates. Further, since the holding force of the semiconductor wafer 3 is adjusted by the driving force of the cylinder 8, there is a problem that the semiconductor wafer 3 is easily damaged when holding the wafer, and stable wafer holding cannot be achieved.

The present invention has been made in view of the above circumstances, and provides a wafer cleaning holding device and its cleaning method that can increase the efficiency of wafer cleaning and realize stable wafer holding. It is something to do.

[Means to solve the problem]

A wafer cleaning holding device according to the present invention has two motorized bodies that move independently of each other on a rail, and two rollers that are provided on both of these motorized bodies and hold a semiconductor wafer below the rail. Each motor-driven body is provided with two drive devices for synchronously rotating the rollers of both arms, and these drive devices and rollers are connected by a transmission mechanism.

Further, a wafer cleaning method according to another invention of the present invention includes 2
The semiconductor wafer is held below the rail by moving the two electric bodies toward each other, and the cleaning liquid is sprayed onto the semiconductor wafer while the rollers are rotated synchronously by a driving device.

[For production]

In the present invention and other inventions thereof, the cleaning nozzle can be positioned below the arm, and
It is possible to control the forward and backward movement of the electric body.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure.

FIG. 1 is a perspective view showing a wafer cleaning holding device according to the present invention. In the same figure, the reference numeral 21 indicates a linear motor as a drive source for holding the wafer, and it has a rail 22 extending in the horizontal direction and two electric bodies as motors that move back and forth independently on the rail 22. slider 2
3.24, of which both sliders 23.24
is provided with a horizontal arm 27.28 having fingers 25.26 extending vertically downwards. At the finger end portions of both horizontal arms 27 and 28, roller holding portions 30.
31 are provided, and these roller holding parts 30.31
Six rollers 32 to 37 that hold the semiconductor wafer 29 below the rail 22 are rotatably provided. Reference numerals 38 and 39 are two driving devices that rotate the rollers 32 to 37 synchronously, and are provided on the slider 23, 24. This drive device 38, 39 and the roller 3
2 to 37 are transmission mechanisms (not shown) such as belts, etc.
connected by.

In the wafer cleaning holding device configured in this way, the semiconductor wafer 29 can be held below the rail 22 and the cleaning nozzle (not shown) can be positioned below the arm 27.28.

Therefore, in this embodiment, since the cleaning liquid does not scatter onto the arms 27, 28, etc. during cleaning, it is possible to prevent the wafer from being contaminated by the cleaning liquid.

In addition, in this embodiment, since the sliders 23 and 24 are components of the linear motor 21, the linear motor 2
By controlling the supply current to the sliders 23 and 1, it is possible to control the forward and backward movement of the sliders 23 and 24, and it is possible to prevent damage to the semiconductor wafer 29 when holding the wafer.

Furthermore, in this embodiment, since the number of rollers is five or more (six), slight movement of the semiconductor wafer 29 does not occur when holding the wafer, and dust generation between the semiconductor wafer 29 and the rollers 32 to 37 is prevented. You can also do it. This is shown in Figures 2 and 3.
This can be explained with a diagram. That is, in the case of the conventional technology with four rollers, a notch called an orientation flat in the semiconductor wafer 3 (for example, the length of the orientation flat in a semiconductor wafer 3 with a diameter of 100 mm is about 32.5 m) 3a. When the roller 12 is positioned, there will be a portion where the roller 12 and the semiconductor wafer 3 do not come into contact, as shown by the broken line in FIG. 37, all rollers 32
.about.37 come into contact with the semiconductor wafer 29.

Next, a wafer cleaning method using the wafer cleaning holding device of this embodiment will be described.

First, the semiconductor wafer 29 is transported to a predetermined position by a transporter (not shown). Next, two sliders 23
．． The semiconductor wafer 29 is held by moving the wafers 24 toward each other.

At this time, the supply current to the linear motor 21 is controlled. Thereafter, the roller 32 is moved by the drive 38,39.
37 are rotated synchronously, a cleaning liquid is sprayed onto the front and back surfaces of the semiconductor wafer 29 from a cleaning nozzle (not shown).

In this way, the semiconductor wafer 29 can be cleaned.

In this embodiment, the linear motor 21 is used as the driving source for holding the wafer, but the present invention is not limited to this (for example, a ball screw extending in the horizontal direction and A starting source consisting of a moving element moving back and forth on this ball screw may also be used.

〔Effect of the invention〕

As explained above, according to the present invention, there are two motorized bodies that move independently of each other on the rail, and two arms that are provided on both of these motorized bodies and have rollers that hold the semiconductor wafer below the rail. and two drive devices for synchronously rotating the rollers of both arms are provided on each electric body, and since these drive devices and rollers are connected by a transmission mechanism, it is also possible to move the two electric bodies toward each other in a direction. The cleaning nozzle can be positioned below the arm because the cleaning liquid is injected onto the semiconductor wafer while the semiconductor wafer is held and the rollers are synchronously rotated by the driving device.

Therefore, since the cleaning liquid does not splash onto the arm or the like during cleaning, it is possible to prevent the cleaning liquid from staining the wafer, thereby increasing the credibility of the wafer cleaning. Also,
By controlling the current supplied to the electric body, the forward and backward movement of the slider can be controlled, so damage to the semiconductor wafer during wafer holding can be prevented, and stable wafer holding can be achieved.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a wafer cleaning holding device according to the present invention, FIGS. 2 and 3 are front views shown to explain the conventional and present wafer holding states, respectively, and FIG. 4 is a conventional wafer holding device. FIG. 2 is a perspective view showing a wafer cleaning holding device of FIG. 21...Linear motor, 22...Rail 23.24
...Slider 27.28...Arm, 29...
・Semiconductor wafer, 32-37...Roller, 38.39
...Drive device. Agent Masuo Oiwa 21: Linear morph 22: Ray 17 23 24: Slighter 27.28: Arm 29: Half-collared sea urchin l\ 32-37: Roller 38.39: Cantern fold I Fig. 2

Claims (2)

[Claims] (1) Two motorized bodies that each advance and retreat independently of each other on a rail, and two arms that are provided on both of these motorized bodies and have rollers that hold a semiconductor wafer below the rail, and these two arms Rotate the rollers synchronously 2
A holding device for cleaning a wafer, characterized in that two driving devices are provided on each of the electric bodies, and these driving devices and the roller are connected by a transmission mechanism. (2) In claim 1, the semiconductor wafer is held below the rail by moving the two electric bodies toward each other, and the cleaning liquid is sprayed onto the semiconductor wafer while the rollers are synchronously rotated by the driving device. Characteristic wafer cleaning method.