JPH04158007A - Device for cleaning mold - Google Patents

Abstract

PURPOSE:To enable the entire cleaning of a mold to be performed, and thus improve the quality of a resin molding by providing nozzles for spouting air toward the mold, and also providing in the proximity thereof dust collecting ports for sucking resin or the like removed by air. CONSTITUTION:To the mold side of a box-shaped base table 300, two base plates 301, 302 are secured in parallel, and on the upper surface of the base plate 301, nozzles 10a, 10b are provided, and dust collecting ports 20a, 20b are provided toward an upper side mold alpha, whereas on the lower surface of the base plate 302, nozzles 10c, 10d are provided, and dust collecting ports 20c, 20d are provided toward the lower side mold beta. On a base 300, a nozzle transporting mechanism 30 is provided that acts to shift the nozzle 10a-10d alternatively. Upon spouting of air toward the mold from the nozzles 10a-10d, resin or the like adhered to the mold is removed and then sucked into the dust collecting ports 20a, 20b. While spouting air, nozzles are shifted over the place of the mold to be cleaned by the nozzle transporting mechanism 30, so that air is blown to the whole places to be cleaned.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention is applied to a mold that is installed, for example, in an auto-molding apparatus for encapsulating semiconductor packages, and that removes and cleans resin debris adhering to the inner surface of the mold after molding is completed. The present invention relates to a cleaning device.

<Conventional technology> As a conventional example of this type, there is a device described below.

This device works by moving a brush connected to a motor to every corner of the mold while pressing it to remove the resin that adhered during molding.Then, a light air blower is applied to the recesses of the mold. This removes and cleans the peeled resin debris from the mold.

<Problems to be Solved by the Invention> However, in the case of the above-mentioned conventional example, since the brush contacts the mold while rotating, it is easily worn, and this becomes brush debris, which becomes a new source of dust generation. There is a drawback. Although this brush waste is removed to some extent by air blowing, the remaining brush waste that is not removed is mixed into the resin of the molded product, and is a major cause of deterioration of the quality of the product.

The present invention was devised in view of the above-mentioned circumstances, and its main purpose is to provide a mold cleaning device that can perform complete cleaning.

<Means for solving the problem> A mold cleaning device according to the first aspect of the present invention includes:
This is a device for removing and cleaning resin, etc. attached to molds for thermosetting resin molding, and includes a nozzle that blows air toward the mold, and a device located near the nozzle that removes resin etc. with the air. It is equipped with a dust collection port that sucks out resin, etc.

A mold cleaning device according to a second aspect of the present invention includes:
The present invention is based on the apparatus of the first aspect, and includes a nozzle moving means for moving the nozzle over the area of the mold to be cleaned.

<Function> First, the mold cleaning device according to the first aspect of the present invention will be explained.

When air is ejected from the nozzle toward the mold, the air removes resin and the like adhering to the mold, and the removed resin and the like are sucked into the dust collection port.

Next, a mold cleaning device according to a second aspect of the present invention will be explained.

When the nozzle is moved by the nozzle moving means over the parts of the mold to be cleaned in a state in which air is ejected from the nozzle, the air reaches all of the parts.

<Example> Hereinafter, an example of the mold cleaning device according to the present invention will be described with reference to the drawings. Figure 1 is an external perspective view, Figure 2
The figure is a front view, FIG. 3 is an enlarged view of parts of the nozzle, FIG. 3(a) is a front view, and FIG. 3(b) is a longitudinal sectional view.

The mold cleaning equipment listed here is equipped with an automold equipment for semiconductor package sealing.
The basic configuration is such that resin debris from semiconductor packages adhering to the upper mold α and lower mold β (see FIG. 2) of the molding molds are automatically removed and cleaned after molding is completed.

In FIG. 1, 300 is a box-shaped base, and two parallel base plates 301 and 302 are respectively attached to the side of the mold. On the upper surface of the base plate 301, nozzles 10a, 10b and dust collection ports 20a, 20b are provided, respectively, facing the upper mold α, while on the lower surface of the base plate 302, nozzles 10c, 10d (see FIG. 2) are provided. ), dust collection ports 20c and 20d (only 20c is shown) are provided toward the lower mold β, respectively.

The nozzles 10a to 10d are all the same and have a structure as shown in FIG. That is, the nozzle port 13 can be inserted into the upper surface of the L-shaped nozzle block 11, and the nozzle port 1
3 can be attached to the nozzle block 11. Further, an air tube 14 is similarly fixed to the side surface of the nozzle block 11. Air tube 14
is led out of the device through the base 300, and its end is connected to a high-pressure air supply source (not shown).

Note that the nozzle block 11 is provided with an elongated hole 15 in order to attach the nozzle to the base plate 301 or the base 302 so that its position can be adjusted. Furthermore, the nozzle block 11 also has a threaded hole for inserting the nozzle port 13, so that the height of the nozzle port 13 can be easily adjusted.

On the other hand, the dust collection ports 20a to 20d are all the same as shown in FIG. 1, and their radial lengths are determined according to the axial lengths of the upper mold α and the lower mold β. Dust collection port 20'a, 2
0b is located near the nozzles 10a and 10b, and dust collection ports 20c and 20d are located near the nozzles 10c and 10.
They are respectively arranged near d.

Although not shown, the dust collection ports 20a to 20d are connected to piping, which is led out of the apparatus through a base 300, and the end thereof is connected to a suction pump (not shown).

Further, the base stand 300 has nozzles 10a and 10b.
, 10c, and 10d are provided with a nozzle moving mechanism 30 that alternately moves them in the direction of the arrow in FIG.

Hereinafter, the nozzle moving mechanism 30 will be explained with reference to FIGS. 1 and 2.

Reference numeral 31 in FIG. 1 is a motor that generates the driving force necessary to move the nozzles 10a to 10d. The rotation of the motor 31 is caused by a pulley 32, a belt 33, a pulley 34, and a shaft 34.
1 to rotating plates 36a and 36b, which will be described later. The shaft 341 passes through the base plate 301.302 and is connected to the shaft guide member 35a.
, 35b.

A rotary plate 36a is attached to the tip of the shaft 341 on the base plate 301 side, while the base plate 3
A rotary play (36b) is attached to the tip on the 02 side. However, the orientation of the tip of the rotating plate 36a and the orientation of the tip of the rotating plate 36b are opposite to each other, as shown in FIG.

A connecting plate 3 is provided at the tip of the rotating plates 36a and 36b.
The ends of the connecting plates 37a and 37b are connected by links, while the other ends of the connecting plates 37a and 37b have a nozzle stand 39a.
, 39b are linked together.

Further, the nozzle stand 39a is made movable in the direction of the arrow shown in FIG. 1 by a base guide 38a attached to the base plate 301, and a nozzle 10a and a nozzle 10b are provided on the upper surface at intervals. There is. One nozzle stand 39b is also completely similar to the above, and is made movable by the base guide 38b, and the nozzle 1 is mounted on the top surface.
0c and 10d are provided, respectively.

Furthermore, plates 391a and 391b are provided at the ends of the nozzle stands 39a and 39b, respectively.
Connecting plates 37a and 37 are provided at the tips of 91a and 391b.
The other ends of b are linked together.

That is, when the motor 31 rotates, the rotating plates 36a and 36b rotate together with the shaft 341. Then, the rotating plate 36a, the connecting plate 37, and the plate 391a
The nozzle stand 39a and the nozzles 10a, 10b are connected to the first nozzle stand 39a and the nozzles 10a, 10b by the link mechanism consisting of the rotating plate 36b, the connecting plate 37b, and the plate 391b.
They are arranged to move alternately in the directions shown in the figure and in opposite directions.

Note that by adjusting the positional relationship between the connecting plate 37a and the rotary plate 36a, the swing area of the nozzles 10a and 10b can be easily changed. The same applies to the connecting plate 37b and the rotating plate 36b.

Furthermore, the base stand 300 has two base guides 4
2.43, it is made movable in the direction of the arrow shown in the figure.

Moreover, the base 300 is connected to the air cylinder 41, and when the air cylinder 41 operates, the base 300 moves.

Note that the nozzle moving mechanism 30 and the nozzle moving mechanism 40 constitute a nozzle moving means.

Next, the operation of the mold cleaning device configured as above will be explained.

First, when the molding of the semiconductor package is completed and the upper mold α and the lower mold β are opened, the air cylinder 41 is operated to bring the base 300 closer to the mold, and the nozzles 10a, 10b and the collector The dust ports 20a and 20b are connected to the upper mold α, the nozzles 10c and 10d and the dust collection hole 20c,
20d are respectively opposed to the lower mold β.

In this state, operate the suction pump (not shown) and open the dust collection port 20.
While sucking the air in this vicinity from a to 20d,
By operating a high-pressure air supply source (not shown), the nozzles 10a~
High pressure air is blown out from 10d.

Then, the resin debris adhering to the upper mold α and the lower mold β are peeled off by air pressure, and the peeled resin debris etc. are quickly sucked into the dust collection ports 20a to 20d. At the same time, the motor 31 is driven to move the nozzles 10a to 10d to the first position.
Swing in the direction shown in the figure.

On the other hand, the air cylinder 41 is operated to remove the nozzles 10a to 10d and the dust collection port 20 along with the base 300.
a to 20d are swung in the direction shown in FIG. 1 by the length of the mold. Then, the air injected from the nozzles 10a and 10b hits the upper mold α, and the air jetted from the nozzles 10c and 10d hits the lower mold β uniformly over the entire surface. Therefore, resin debris and the like adhering to the upper mold α and the lower mold β are completely cleaned.

When cleaning of the mold is completed, the suction pump, high-pressure air supply source, and motor 31 are stopped, and the air cylinder 41 is operated to return the base 300 to its original position and evacuate it. Then, the semiconductor package is molded. This process is repeated from now on.

Note that the mold cleaning device according to the present invention is not limited to application only to an automold device for sealing semiconductor packages, but can be applied to any device as long as it is a mold for molding thermosetting resin.

Further, depending on the size of the mold, or if a nozzle with an air jet angle is used, a mechanism for moving the nozzle is not required.

<Effects of the Invention> As described above, since the mold cleaning device according to the first claim of the present invention removes resin etc. attached to the mold without contact, new dust is generated. There is no. Moreover, since the removed resin and the like are quickly sucked in from the dust collection port, the mold can be completely cleaned. Therefore, there is no fear that dust will enter the resin molded product, which is of great significance in improving the quality of the resin molded product.

Next, the mold cleaning device according to the second aspect of the present invention is such that the air jetted from the nozzle reaches all parts of the mold to be cleaned, so it is necessary even when the mold is large. The number of nozzles used can be reduced.

In the case of the conventional example, if the number of nozzles is increased, it is necessary to increase the amount of air supplied due to the pressure of the air injected from the nozzles, but in the case of the present invention, it is possible to reduce the number of nozzles. Since it is possible, along with this,
This has the advantage of reducing air consumption.

[Brief explanation of drawings]

1 to 3 are diagrams for explaining one embodiment of the mold cleaning device according to the present invention, in which FIG. 1 is an external perspective view, FIG. 2 is a front view, and FIG. 3 is a nozzle. FIG. 3(a) is a front view, and FIG. 3(b) is a longitudinal sectional view. 10a, 10b, 10c, 10d...-Nozzle 20a, 20b, 20c, 20d... Dust collection port 30
．． 40...Nozzle moving mechanism α...Upper mold β...Lower mold Patent applicant Sharp Corporation

Claims (2)

[Claims] (1) A mold cleaning device that removes and cleans resin, etc. attached to a mold for thermosetting resin molding has a nozzle that blows air toward the mold, and a nozzle that is disposed near the nozzle. A mold cleaning device characterized by comprising a dust collection port for sucking resin, etc. removed by air. (2) The mold cleaning device according to claim 1, further comprising a nozzle moving means for moving the nozzle over a portion of the mold to be cleaned.