JPH0415241U - - Google Patents

Info

Publication number
JPH0415241U
JPH0415241U JP5680390U JP5680390U JPH0415241U JP H0415241 U JPH0415241 U JP H0415241U JP 5680390 U JP5680390 U JP 5680390U JP 5680390 U JP5680390 U JP 5680390U JP H0415241 U JPH0415241 U JP H0415241U
Authority
JP
Japan
Prior art keywords
water tank
semiconductor wafer
dicing
rotation axis
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5680390U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5680390U priority Critical patent/JPH0415241U/ja
Publication of JPH0415241U publication Critical patent/JPH0415241U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例に係るダイシング装
置の概略を示す要部縦断面図、第2図イからニは
何れも同実施例のダイシング装置による半導体ウ
エハの切断を順を追つて説明する要部縦断面図、
第3図は従来のダイシング装置の概略を説明する
斜視図である。 1……ダイシングブレード、10……可動水槽
、11……底面、15,15′……流入口、16
,16′……流出口、21……回転軸、30……
半導体ウエハ。
FIG. 1 is a longitudinal cross-sectional view of a main part showing an outline of a dicing device according to an embodiment of the present invention, and FIGS. A vertical sectional view of the main parts,
FIG. 3 is a perspective view illustrating the outline of a conventional dicing device. 1... Dicing blade, 10... Movable water tank, 11... Bottom, 15, 15'... Inlet, 16
, 16'... Outlet, 21... Rotating shaft, 30...
semiconductor wafer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 流入口と流出口とを有し、底面に半導体ウエハ
を支持し、略水平配置された回転軸回りに揺動す
る可動水槽と、該水槽上に配置され半導体ウエハ
と平行に相対移動するダイシングブレードとより
なることを特徴とするダイシング装置。
A movable water tank having an inflow port and an outflow port, supporting a semiconductor wafer on the bottom surface, and swinging around a rotation axis arranged substantially horizontally, and a dicing blade arranged on the water tank and moving relatively in parallel with the semiconductor wafer. A dicing device characterized by:
JP5680390U 1990-05-29 1990-05-29 Pending JPH0415241U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5680390U JPH0415241U (en) 1990-05-29 1990-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5680390U JPH0415241U (en) 1990-05-29 1990-05-29

Publications (1)

Publication Number Publication Date
JPH0415241U true JPH0415241U (en) 1992-02-06

Family

ID=31580956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5680390U Pending JPH0415241U (en) 1990-05-29 1990-05-29

Country Status (1)

Country Link
JP (1) JPH0415241U (en)

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