JPH04147791A - Flux composition for soldering - Google Patents
Flux composition for solderingInfo
- Publication number
- JPH04147791A JPH04147791A JP27058490A JP27058490A JPH04147791A JP H04147791 A JPH04147791 A JP H04147791A JP 27058490 A JP27058490 A JP 27058490A JP 27058490 A JP27058490 A JP 27058490A JP H04147791 A JPH04147791 A JP H04147791A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- soldering
- alkylene oxide
- flux composition
- activator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims description 23
- 238000005476 soldering Methods 0.000 title claims description 14
- 239000000203 mixture Substances 0.000 title claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 18
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 16
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims abstract description 12
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 9
- 239000002253 acid Substances 0.000 claims abstract description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 8
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000012190 activator Substances 0.000 claims abstract description 7
- 239000011975 tartaric acid Substances 0.000 claims abstract description 7
- 235000002906 tartaric acid Nutrition 0.000 claims abstract description 7
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims abstract description 5
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims abstract description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000001361 adipic acid Substances 0.000 claims abstract description 4
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 4
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims abstract description 4
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims abstract description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims abstract description 4
- 239000011976 maleic acid Substances 0.000 claims abstract description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000007519 polyprotic acids Polymers 0.000 claims abstract description 3
- 150000001875 compounds Chemical class 0.000 claims description 9
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 150000007513 acids Chemical class 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 229920000223 polyglycerol Polymers 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 238000009736 wetting Methods 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerol group Chemical group OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 102220474387 PDZ and LIM domain protein 7_H63A_mutation Human genes 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 229940125773 compound 10 Drugs 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント配線板等の、はんだ付けの際に用い
るフラックスに関し、更に詳しくは、プリント配線基板
、集積回路あるいは電子回路用部品等の、はんだ付けを
する際に用いる室温で液状のはんだ付け用フラックス組
成物に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a flux used for soldering printed wiring boards, etc., and more specifically, to a flux used for soldering printed wiring boards, integrated circuits, electronic circuit parts, etc. , relates to a soldering flux composition that is liquid at room temperature and used when soldering.
（従来の技術）
従来使用されているこの種のはんだ付け用フラックスの
多くは、ロジン変性樹脂系であって、有機溶剤に溶解し
たものが使用された。(Prior Art) Most soldering fluxes of this kind that have been used in the past are based on rosin-modified resins and are dissolved in organic solvents.
更に、これらのロジン変性樹脂系の有機溶剤型のフラッ
クスの代りに無機酸を主成分とする水洗性のフラックス
も使用された。Furthermore, instead of these rosin-modified resin-based organic solvent fluxes, water-washable fluxes containing inorganic acids as a main component have also been used.
（発明の解決しようとする課題）
しかしながら、一般にロジン変性樹脂系のものは有機溶
剤洗浄型のフラックスであり、かかるフラックスによる
ときには、はんだ付け後のフラックス残漬を除去するた
めにフロン１１３を主成分とし低級アルコールを含む有
機溶剤を用いて洗浄しなければならない。(Problems to be Solved by the Invention) However, rosin-modified resin-based fluxes are generally organic solvent cleaning type fluxes, and when using such fluxes, Freon 113 is the main component to remove flux residue after soldering. and must be cleaned using an organic solvent containing lower alcohol.
しかし、フロン１１３を主成分とする洗浄剤は、地球環
境保護の立場からそれの使用が禁止される方向にある。However, the use of detergents containing Freon 113 as a main component is being prohibited from the standpoint of protecting the global environment.
また、有機溶剤が高価格であり、そ゛のうえ、有機溶剤
による洗浄では、イオン性物質の除去が困難であり、絶
縁抵抗や誘電性などの電気的な特性を低下させるという
欠点がある。Further, organic solvents are expensive, and cleaning with organic solvents has the disadvantage that it is difficult to remove ionic substances and deteriorates electrical properties such as insulation resistance and dielectricity.
更に、無機酸を用いた水洗性タイプのフラックスは、プ
リント配線基板上に塗布するソルダーレジスト膜に対し
て、はんだ付け時に化学的な変化を及ぼし、ソルダーレ
ジスト膜のふくれや表面の白化が発生しやすい、また、
絶縁抵抗や誘電率などの電気的な特性を低下させること
により信頼性に欠ける。Furthermore, washable fluxes that use inorganic acids can chemically change the solder resist film applied to the printed wiring board during soldering, causing blistering of the solder resist film and whitening of the surface. easy, also
It lacks reliability due to a decrease in electrical properties such as insulation resistance and dielectric constant.
本発明は、上記のような欠点のないフラックス、すなわ
ち、水で洗浄可能で電気的な特性の低下が少なく、ソル
ダーレジスト膜のふくれや白化のない、はんだ付け用フ
ラックス組成物を提供することを目的とする。The present invention aims to provide a flux that does not have the above-mentioned drawbacks, that is, a flux composition for soldering that can be washed with water, has little deterioration in electrical properties, and does not cause blistering or whitening of the solder resist film. purpose.
（課題を解決するための手段）
本発明者等は、これらの目的を解決するため、種々検討
の結果、はんだ付け用フラックス組成物において、グリ
コール酸、酒石酸などのオキシカルボン酸、マロン酸、
コハク酸、グルタル酸、アジピン酸、マレイン酸、クエ
ン酸などの多塩基酸から選ばれた少なくとも１種の有機
酸を活性剤とし、一般式
％式％）］
Ｂは重合度２〜ｌＯのポリグリセリン残基、ａ・０〜４
０、ｂ＝０〜４０、ｃ＝０〜１６、ｄ＝０〜１６でａ、
ｂがともに０ではなく、かつＣとｄは全アルキレンオキ
シド付加分子量の４０％以下であり、エチレンオキシド
とプロピレンオキシドが共存するときの付加はランダム
でもブロックでもよ（、ｍ＝０〜１２で、ｎ＝０〜１２
で■とｎが共に０ではなく、■＋ｎ ＝３〜１２で示さ
れるポリグリセリンのアルキレンオキシド誘導体化合物
をベース剤とすることを特徴とするはんだ付け用フラッ
クス組成物により解決した。(Means for Solving the Problems) In order to solve these objects, the present inventors have conducted various studies and found that in soldering flux compositions, oxycarboxylic acids such as glycolic acid and tartaric acid, malonic acid,
At least one organic acid selected from polybasic acids such as succinic acid, glutaric acid, adipic acid, maleic acid, and citric acid is used as an activator, and B is a polyester having a polymerization degree of 2 to 1O. Glycerin residue, a.0-4
0, b = 0 to 40, c = 0 to 16, d = 0 to 16, a,
Both b is not 0, and C and d are 40% or less of the total alkylene oxide addition molecular weight, and when ethylene oxide and propylene oxide coexist, addition may be random or block (, m = 0 to 12, n =0~12
The problem was solved by a soldering flux composition characterized by using as a base agent an alkylene oxide derivative compound of polyglycerin in which both ■ and n are not 0, and ■+n = 3 to 12.
本発明に使用される活性剤としては、オキシカルボン酸
としては、グリコール酸、酒石酸などであり、二塩基酸
としては、マロン酸、コハク酸、グルタル酸、アジピン
酸、マレイン酸などであり、多塩基酸としては、クエン
酸などである。Examples of the activator used in the present invention include oxycarboxylic acids such as glycolic acid and tartaric acid, and dibasic acids such as malonic acid, succinic acid, glutaric acid, adipic acid, and maleic acid. Examples of the basic acid include citric acid.
そしてこれらの有機酸の活性剤から選ばれた少なくとも
１種もしくは二種以上併用して使用される。At least one type or a combination of two or more types selected from these organic acid activators are used.
本発明に使用されるベース剤としてのポリグリセリンの
アルキレンオキシド誘導体化合物は１本質的には水滴性
であり、耐熱性に優れかつ洗浄性に優れた化合物であり
、
一般式
％式％］
Ｂは重合度２〜ｌＯのポリグリセリン残基、ｍ＝０〜４
０、ｂ＝０〜４０、Ｃ＝０〜１６、ｄ＝０〜１６でａ、
ｂがともに０ではなく、かつＣとｄは全アルキレンオキ
シド付加分子量の４０％以下であり、エチレンオキシド
（以下ＥＯと略す）とプロピレンオキシド（以下ＰＯと
略す）が共存するときの付加はランダムでもブロックで
もよく、■・０〜１２で、ｎ・０〜１２で■とｎが共に
０ではなく、−十〇・３〜１２で示される。The alkylene oxide derivative compound of polyglycerin as a base agent used in the present invention is a compound that is essentially water-drop-like, has excellent heat resistance, and has excellent detergency. Polyglycerin residue with degree of polymerization 2-1O, m=0-4
0, b=0-40, C=0-16, d=0-16, a,
Both b is not 0, and C and d are 40% or less of the total alkylene oxide addition molecular weight, and when ethylene oxide (hereinafter abbreviated as EO) and propylene oxide (hereinafter abbreviated as PO) coexist, the addition is random or blocked. However, in the case of ■・0 to 12, and n・0 to 12, both ■ and n are not 0, but are expressed as −10・3 to 12.
ＥＯの付加量が限定されるのは、請求範囲以外であると
高い耐熱性が得られず、ＥＯ付加量はＯＨ基−個当り４
０モル以下が望ましい、ＰＯの付加量が４０％以下に限
定されるのは、それ以上であると水に不溶となり良好な
洗浄性が得られず、かつ熱的に不安定となるためである
。The reason why the amount of EO added is limited is that if it is outside the claimed range, high heat resistance cannot be obtained, and the amount of EO added is 4 per OH group.
The amount of PO added is preferably 0 mol or less, and is limited to 40% or less because if it is more than that, it becomes insoluble in water, making it impossible to obtain good detergency and becoming thermally unstable. .
ＥＯ，ＰＯの比率が限定されるもう一つの理由は、良好
な濡れ特性を得るためであり、請求の範囲内が特に望ま
しい。Another reason why the ratio of EO and PO is limited is to obtain good wetting properties, and it is particularly desirable that the ratio be within the claimed range.
Ｂで示されるポリグリセリンの重合度が限定されるのは
重合度が１、つまりグリセリンははんだ付け効果が少な
いためであり、重合度がｌＯを越えると粘度が著しく高
くなってしまうためである。The degree of polymerization of polyglycerin represented by B is limited because the degree of polymerization is 1, that is, glycerin has little soldering effect, and when the degree of polymerization exceeds 1O, the viscosity becomes extremely high.
（実施例） 本発明を実施例に基づいて詳細に説明する。(Example) The present invention will be explained in detail based on examples.
本発明に使用した化合物は次に示す。The compounds used in the present invention are shown below.
以下の構造式で（Ｅｌは−ＣＨＲ−ＣＨ２−０−ＣＨ。In the following structural formula (El is -CHR-CH2-0-CH.
（Ｐ）は−ＣＨ，−ＣＨ−０−を示す。(P) represents -CH, -CH-0-.
化合物１ 化合物２
化合物３
化合物４．５、
瞥
Ｃ）ＩＯＩＥ） ５ｓｔ１
ＣＨＯ（Ｅｌ 、Ｈ
化合物６
化合物７
化合物８．９
化合物１０
実施例１
フラックス組成物の活性成分である酒石酸６ｇ、上記化
合物１．１５ｇをイソプロピルアルコールに溶解して全
体として１００ｇとしたフラックス溶液を作成した。Compound 1 Compound 2 Compound 3 Compound 4.5, Compound C)IOIE) 5st1 CHO(El, H Compound 6 Compound 7 Compound 8.9 Compound 10 Example 1 6 g of tartaric acid, which is the active ingredient of the flux composition, and the above compound 1. A flux solution was prepared by dissolving 15 g in isopropyl alcohol to make a total of 100 g.
実施例２〜１０．比較例１〜５
ベース材料ＩＳｇに酒石酸、マロン酸、クエン酸、グリ
コール酸を組合わせてイソプロピルアルコールに溶解し
て全体として１００ｇとしたフラックス溶液を作成し、
下記の方法ではんだ付け性を評価した。Examples 2-10. Comparative Examples 1 to 5 A flux solution was prepared by combining base material ISg with tartaric acid, malonic acid, citric acid, and glycolic acid and dissolving it in isopropyl alcohol to make a total of 100 g.
Solderability was evaluated using the following method.
なお、活性剤の添加量は、酒石酸の場合６ｇ、マロン酸
の場合４．２ｇ、クエン酸の場合４．２ｇ、グリコール
酸の場合６．１ｇとした。The amount of the activator added was 6 g in the case of tartaric acid, 4.2 g in the case of malonic acid, 4.2 g in the case of citric acid, and 6.1 g in the case of glycolic acid.
本発明のフラックス組成物のはんだ付け性の評価方法は
次の方法により評価した。The solderability of the flux composition of the present invention was evaluated by the following method.
測定装置
レスカ製ソルダーチエカー ５ＡＴ−２０（１Ｇ測定方
法
１）酸化銅（１３０℃×３０分熱処理１１５よび酸化ニ
ッケル（１３０℃×ｌθ分熱処理）のテストピース（０
，３Ｘ ５ Ｘ ３０ｍ■）にフラックスを塗布２）ソ
ルダーチエッカ−を用い、以下の条件ではんだ付けを行
なう
はんだ：日本ゲンマ製 Ｈ６３Ａ
はんだ温度＝２３０℃
浸漬速度： １６ｍ５／ｓｅｃ
浸漬深さ：２■Ｉ
浸漬時間； ４ｓｅｃ
３）結果を以下の条件で記録し、濡れ時間（Ｔｌと濡れ
力（Ｌ）を求める
測定感度： ２ｇ／２５ｃ■
チャートスピード： ６０ｃｍ／■ｉｎ濡れ時間（丁）
テストピースがはんだ浴に接してから、はんだが接触角
９０度で濡れるまでの時間（ｓｅｅ’）をメニスコグラ
フから読み取る。Measuring device Resca solder checker 5AT-20 (1G measurement method 1) Copper oxide (130°C x 30 minutes heat treatment 115) and nickel oxide (130°C x lθ minutes heat treatment) test piece (0
, 3 x 5 x 30 m) 2) Use a solder checker to solder under the following conditions. Solder: Nippon Genma H63A Solder temperature = 230°C Immersion speed: 16m5/sec Immersion depth: 2 ■I Soaking time; 4 sec 3) Record the results under the following conditions to determine wetting time (Tl and wetting force (L)) Measurement sensitivity: 2g/25c■ Chart speed: 60cm/■in wetting time (min) Test piece The time (see') from when the solder comes into contact with the solder bath until the solder gets wet at a contact angle of 90 degrees is read from the meniscograph.
■が小さいほど濡れ性が良好なことを示す。The smaller the value of ■, the better the wettability.
結果を第１表に示す。The results are shown in Table 1.
第
表
（発明の効果）
本発明のはんだ付け性フラックスは従来の製品に比べて
、水溶性で、洗浄性に優れ、はんだ付け性も良好である
。Table 1 (Effects of the Invention) The solderable flux of the present invention is water-soluble, has excellent cleanability, and has good solderability compared to conventional products.
Claims (1)
、酒石酸などのオキシカルボン酸、マロン酸、コハク酸
、グルタル酸、アジピン酸、マレイン酸、クエン酸など
の多塩基酸から選ばれた少なくとも１種の有機酸を活性
剤とし、一般式▲数式、化学式、表等があります▼ Ｂは重合度２〜１０のポリグリセリン残基、ａ＝０〜４
０、ｂ＝０〜４０、ｃ＝０〜１６、ｄ＝０〜１６でａ、
ｂがともに０ではなく、かつｃとｄは全アルキレンオキ
シド付加分子量の４０％以下であり、エチレンオキシド
とプロピレンオキシドが共存するときの付加はランダム
でもブロックでもよく、ｍ＝０〜１２で、ｎ＝０〜１２
でｍとｎが共に０ではなく、ｍ＋ｎ＝３〜１２で示され
るポリグリセリンのアルキレンオキシド誘導体化合物を
ベース剤とすることを特徴とするはんだ付け用フラック
ス組成物。[Scope of Claims] In the soldering flux composition, an oxycarboxylic acid such as glycolic acid and tartaric acid, and a polybasic acid such as malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid, and citric acid are used. At least one type of organic acid is used as an activator, and there are general formulas ▲ mathematical formulas, chemical formulas, tables, etc. ▼ B is a polyglycerin residue with a degree of polymerization of 2 to 10, a = 0 to 4
0, b = 0 to 40, c = 0 to 16, d = 0 to 16, a,
Both b is not 0, and c and d are 40% or less of the total alkylene oxide addition molecular weight, and when ethylene oxide and propylene oxide coexist, the addition may be random or block, m = 0 to 12, and n = 0-12
A flux composition for soldering, characterized in that m and n are both not 0, and the alkylene oxide derivative compound of polyglycerin represented by m+n=3 to 12 is used as a base agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27058490A JPH04147791A (en) | 1990-10-11 | 1990-10-11 | Flux composition for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27058490A JPH04147791A (en) | 1990-10-11 | 1990-10-11 | Flux composition for soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04147791A true JPH04147791A (en) | 1992-05-21 |
Family
ID=17488163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27058490A Pending JPH04147791A (en) | 1990-10-11 | 1990-10-11 | Flux composition for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04147791A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985126A (en) * | 1996-07-15 | 1999-11-16 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover |
| JP2012115871A (en) * | 2010-11-30 | 2012-06-21 | Panasonic Corp | Solder paste |
| JP6332526B1 (en) * | 2017-05-25 | 2018-05-30 | 千住金属工業株式会社 | flux |
-
1990
- 1990-10-11 JP JP27058490A patent/JPH04147791A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985126A (en) * | 1996-07-15 | 1999-11-16 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover |
| JP2012115871A (en) * | 2010-11-30 | 2012-06-21 | Panasonic Corp | Solder paste |
| JP6332526B1 (en) * | 2017-05-25 | 2018-05-30 | 千住金属工業株式会社 | flux |
| JP2018196900A (en) * | 2017-05-25 | 2018-12-13 | 千住金属工業株式会社 | flux |
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