JPH04147622A - Wafer chucking table for underwater processing in water - Google Patents

Abstract

PURPOSE:To wash a cutting layer easily by placing a partition wall around a table and by installing a pure water inlet for bringing pure water onto the table at the bottom of the table or on the partition wall. CONSTITUTION:A partition wall 5 is installed around a table 1, which has a pure water inlet 4 at the bottom. After a wafer 2 is chucked by the table 1, pure water is poured onto the table 1 through the pure water inlet 4 to cut the wafer with a blade 3. At that time, the wafer 2 never dries since it is in water. Scraps are eliminated from a cutting layer since pure water 7 overflows from on the table 1. Consequently, the wafer 2 can completely be washed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer chucking table for underwater processing.

[Conventional technology]

As shown in FIG. 2, a conventional wafer chucking table has a flat surface because it chucks a wafer 2 on which elements are formed via a resin lining or an adhesive sheet. The wafer 2 chucked on the wafer chucking table IA is sprayed with pure water from a cleaning nozzle 6 installed near the blade 3, and is cut by the blade 3.

[Problem to be solved by the invention]

This conventional wafer chucking table has a flat surface, so cleaning water flows horizontally to wash away cutting debris, but if the wafer surface is uneven,
Stagnation occurred in the flow, and cutting debris could not be completely washed away.

Furthermore, since the cleaning water is applied only to the cut portion, the area on the wafer other than the cut portion dries, and cutting debris sticks to this area, making it difficult to clean the cutting debris.

[Means to solve the problem]

The wafer chucking table for underwater processing of the present invention is provided with a partition wall around the table, and a pure water inlet for introducing pure water onto the table is provided in the bottom armpit of the table or in the partition wall. 6 [Example] Next, the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a wafer chucking table for underwater processing according to an embodiment of the present invention.

In FIG. 1, a partition wall 5 is provided around the table 1, and has a pure water inlet 4 on the bottom surface.

After chucking the wafer 2, pure water is injected onto the table 1 from the pure water inlet 4, and the wafer 2 is
When cutting the wafer 2, the wafer 2 will not dry because it is in water, and the cutting debris can be discharged using the overflow effect of the pure water 7 from the table 1, so the wafer 2 can be completely cleaned. Become something.

In the above embodiment, the pure water inlet 4 is connected to the table 1.
[Effects of the Invention] As explained above, the present invention removes cutting waste by immersing the wafer in water and overflowing pure water. It has the effect of early removal and prevention of re-deposition. Furthermore, since there is no need to attach a cleaning nostle to the blade, the mechanism can be simplified and the blade can be easily replaced.

[Brief explanation of drawings]

FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1. IA...Table, 2...Wafer, 3...Blade, 4...Pure water inlet, 5...Partition wall, 6...
cleaning nozzle.

Claims (1)

[Claims] A wafer chucking table for underwater processing, characterized in that a partition wall is provided around the table, and a pure water inlet for introducing pure water onto the table is provided at the bottom of the table or on the partition wall.