JPH04147622A - Wafer chucking table for underwater processing in water - Google Patents
Wafer chucking table for underwater processing in waterInfo
- Publication number
- JPH04147622A JPH04147622A JP27277990A JP27277990A JPH04147622A JP H04147622 A JPH04147622 A JP H04147622A JP 27277990 A JP27277990 A JP 27277990A JP 27277990 A JP27277990 A JP 27277990A JP H04147622 A JPH04147622 A JP H04147622A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pure water
- partition wall
- water inlet
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 238000005192 partition Methods 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は水中加工用ウェハチャッキングテーブルに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer chucking table for underwater processing.
従来のウェハチャッキングテーブルは、第2図に示すよ
うに、素子が形成されたウェハ2を樹脂跋たは粘着シー
トを介してチャッキングするため、表面は平坦な構造と
なっている。ウェハチャッキングのテーブルIAにチャ
ッキングされたウェハ2は、ブレード3の近傍に取付け
られている洗浄ノズル6から純水をかけられ、ブレード
3で切断される。As shown in FIG. 2, a conventional wafer chucking table has a flat surface because it chucks a wafer 2 on which elements are formed via a resin lining or an adhesive sheet. The wafer 2 chucked on the wafer chucking table IA is sprayed with pure water from a cleaning nozzle 6 installed near the blade 3, and is cut by the blade 3.
この従来のウェハチャッキングテーブルは、表面が平坦
であるため、洗浄水が水平方向に流れながら切断屑を洗
い流しているが、ウェハ表面が凸凹になっている場合、
流れによどみが発生し、完全に切断屑を洗い流せなかっ
た。This conventional wafer chucking table has a flat surface, so cleaning water flows horizontally to wash away cutting debris, but if the wafer surface is uneven,
Stagnation occurred in the flow, and cutting debris could not be completely washed away.
また、洗浄水が切断部のみにかかつているために、切断
部以外のウェハ上が乾燥し、この部分に切断屑がこびり
つくため、切断屑の洗浄が困難であるという問題点があ
った。Furthermore, since the cleaning water is applied only to the cut portion, the area on the wafer other than the cut portion dries, and cutting debris sticks to this area, making it difficult to clean the cutting debris.
本発明の水中加工用ウェハチャッキングテーブルは、テ
ーブルの周囲に隔壁を設けると共に、このテーブル上に
純水を導入するための純水注入口をテーブルの底部腋た
は前記隔壁に設けたものである6
〔実施例〕
次に本発明について図面を参照して説明する。The wafer chucking table for underwater processing of the present invention is provided with a partition wall around the table, and a pure water inlet for introducing pure water onto the table is provided in the bottom armpit of the table or in the partition wall. 6 [Example] Next, the present invention will be described with reference to the drawings.
第1図は、本発明の一実施例の水中加工用ウェハチャッ
キングテーブルの断面図である。FIG. 1 is a sectional view of a wafer chucking table for underwater processing according to an embodiment of the present invention.
第1図において、テーブル1の周囲には隔壁5が設けら
れ、底面に純水注入口4を有している。In FIG. 1, a partition wall 5 is provided around the table 1, and has a pure water inlet 4 on the bottom surface.
ウェハ2をチャッキングしたのち、テーブル1上に純水
注入口4から純水を注入して、ブレード3にてウェハ2
の切断を行う場合、ウェハ2は水中にあるため乾燥する
ことはなく、また切断屑はテーブル1からの純水7のオ
ーバーフロー作用を利用して排出させることができるた
め、ウェハ2の洗浄は完全なものとなる。After chucking the wafer 2, pure water is injected onto the table 1 from the pure water inlet 4, and the wafer 2 is
When cutting the wafer 2, the wafer 2 will not dry because it is in water, and the cutting debris can be discharged using the overflow effect of the pure water 7 from the table 1, so the wafer 2 can be completely cleaned. Become something.
尚、上記実施例においては、純水注入口4をテーブル1
の底面に設けた場合について説明したが、隔壁5に設け
てもよい6
〔発明の効果〕
以上説明したように本発明は、ウェハを水中に浸し、純
水をオーバーフローさせることにより、切断屑の早期除
去及び再付着防止ができるという効果を有する。またブ
レード部に洗浄ノスルの取付けが不要になる為、機構が
簡略でき、ブレード交換が容易にできるという効果も有
する。In the above embodiment, the pure water inlet 4 is connected to the table 1.
[Effects of the Invention] As explained above, the present invention removes cutting waste by immersing the wafer in water and overflowing pure water. It has the effect of early removal and prevention of re-deposition. Furthermore, since there is no need to attach a cleaning nostle to the blade, the mechanism can be simplified and the blade can be easily replaced.
第1図は本発明の一実施例の断面図、第2図は従来例の
断面図である。
1、IA・・・テーブル、2・・・ウェハ、3・・・ブ
レード、4・・・純水注入口、5・・・隔壁、6・・・
洗浄ノズル。FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1. IA...Table, 2...Wafer, 3...Blade, 4...Pure water inlet, 5...Partition wall, 6...
cleaning nozzle.
Claims (1)
上に純水を導入するための純水注入口をテーブルの底部
または前記隔壁に設けたことを特徴とする水中加工用ウ
ェハチャッキングテーブル。A wafer chucking table for underwater processing, characterized in that a partition wall is provided around the table, and a pure water inlet for introducing pure water onto the table is provided at the bottom of the table or on the partition wall.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27277990A JPH04147622A (en) | 1990-10-11 | 1990-10-11 | Wafer chucking table for underwater processing in water |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27277990A JPH04147622A (en) | 1990-10-11 | 1990-10-11 | Wafer chucking table for underwater processing in water |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04147622A true JPH04147622A (en) | 1992-05-21 |
Family
ID=17518633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27277990A Pending JPH04147622A (en) | 1990-10-11 | 1990-10-11 | Wafer chucking table for underwater processing in water |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04147622A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100366922B1 (en) * | 1999-01-19 | 2003-01-06 | 메코 이큅먼트 엔지니어 베. 파우. | Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s) |
-
1990
- 1990-10-11 JP JP27277990A patent/JPH04147622A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100366922B1 (en) * | 1999-01-19 | 2003-01-06 | 메코 이큅먼트 엔지니어 베. 파우. | Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s) |
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