JPH0414710B2 - - Google Patents

Info

Publication number
JPH0414710B2
JPH0414710B2 JP16490384A JP16490384A JPH0414710B2 JP H0414710 B2 JPH0414710 B2 JP H0414710B2 JP 16490384 A JP16490384 A JP 16490384A JP 16490384 A JP16490384 A JP 16490384A JP H0414710 B2 JPH0414710 B2 JP H0414710B2
Authority
JP
Japan
Prior art keywords
resin composition
resin
epoxy
weight
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16490384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6143620A (ja
Inventor
Tsutomu Nagata
Tatsuo Sato
Hiroyuki Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP16490384A priority Critical patent/JPS6143620A/ja
Publication of JPS6143620A publication Critical patent/JPS6143620A/ja
Publication of JPH0414710B2 publication Critical patent/JPH0414710B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP16490384A 1984-08-08 1984-08-08 封止用樹脂組成物 Granted JPS6143620A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16490384A JPS6143620A (ja) 1984-08-08 1984-08-08 封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16490384A JPS6143620A (ja) 1984-08-08 1984-08-08 封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6143620A JPS6143620A (ja) 1986-03-03
JPH0414710B2 true JPH0414710B2 (id) 1992-03-13

Family

ID=15802052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16490384A Granted JPS6143620A (ja) 1984-08-08 1984-08-08 封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6143620A (id)

Also Published As

Publication number Publication date
JPS6143620A (ja) 1986-03-03

Similar Documents

Publication Publication Date Title
JPH0468345B2 (id)
JPH08245755A (ja) エポキシ樹脂組成物および電子部品封止装置
JPH0513185B2 (id)
JPH0249329B2 (id)
JPH1030049A (ja) エポキシ樹脂組成物および電子部品封止装置
JPH0548770B2 (id)
JP2641183B2 (ja) 封止用樹脂組成物
JPS6042418A (ja) 封止用樹脂組成物
JPH0414710B2 (id)
JPH0621152B2 (ja) 封止用樹脂組成物
JPH0562612B2 (id)
JPH0528243B2 (id)
JPS60161423A (ja) 封止用樹脂組成物
JPS6143621A (ja) 封止用樹脂組成物
JPH093169A (ja) 封止用樹脂組成物および電子部品封止装置
JPH0621154B2 (ja) 封止用樹脂組成物
JPS60152522A (ja) 封止用樹脂組成物
JPS6333416A (ja) 封止用樹脂組成物
JPH0468329B2 (id)
JP3468900B2 (ja) 半導体装置
JPH03142956A (ja) 樹脂封止型半導体装置
JPH0552846B2 (id)
JPH0314050B2 (id)
JPH0668006B2 (ja) 封止用樹脂組成物
JPH0739471B2 (ja) 封止用樹脂組成物