JPH04144745A - Coated molded form - Google Patents

Coated molded form

Info

Publication number
JPH04144745A
JPH04144745A JP26641890A JP26641890A JPH04144745A JP H04144745 A JPH04144745 A JP H04144745A JP 26641890 A JP26641890 A JP 26641890A JP 26641890 A JP26641890 A JP 26641890A JP H04144745 A JPH04144745 A JP H04144745A
Authority
JP
Japan
Prior art keywords
group
outer layer
thermoplastic resin
groups
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26641890A
Other languages
Japanese (ja)
Inventor
Kazuo Yamamiya
山宮 和夫
Noriyoshi Watanabe
渡辺 宣義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP26641890A priority Critical patent/JPH04144745A/en
Publication of JPH04144745A publication Critical patent/JPH04144745A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a coated molded form having excellent adhesive properties by doubly molding a thermoplastic resin for an outer layer having a specific functional group to a polyamide resin molded form. CONSTITUTION:A thermoplastic resin for an outer layer having at least one kind or more of functional groups selected from a vinyl group, a carboxylic group, an epoxy group, a hydroxyl group, an amino group, a nitrile group, an acrylamide group, an isocyanate group, an acrylate group, an acryl group and an aldehyde group is doubly molded to a polyamide resin molded form, thus acquiring a coated molded form. Polystyrene, an ABS resin, polyethylene, polypropylene, etc., are cited as the thermoplastic resin employed for the doubly molded outer layer. The coated molded form having excellent water resistance and weather resistance can be obtained by using the thermoplastic resin or a thermoplastic resin composition. It is desirable that functional group content is employed within a range of 0.05-25wt.%, preferably 0.1-15wt.% to the thermoplastic resin for the doubly molded outer layer.

Description

【発明の詳細な説明】 [産業上の利用分野コ 本発明はポリアミド樹脂成形品に外層用熱可塑性樹脂を
二重成形する際に、密着性に優れた外層を与える被覆成
形品に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a coated molded product that provides an outer layer with excellent adhesion when double-molding a thermoplastic resin for an outer layer onto a polyamide resin molded product.

[従来の技術] 一般にポリアミド樹脂は高結晶性の性質を有しており、
それゆえポリアミド樹脂成形品に二重成形した際に外層
との密着性が良好とはいえない。
[Prior art] Polyamide resin generally has highly crystalline properties,
Therefore, when double molded into a polyamide resin molded article, the adhesion with the outer layer cannot be said to be good.

ポリアミド樹脂は、通常、耐熱性、剛性、強度、耐溶剤
性、成形性に優れていることから、機械部品、電気機器
、自動車部品などに広く使用されるようになってきてい
る。
Polyamide resins are generally excellent in heat resistance, rigidity, strength, solvent resistance, and moldability, and have therefore come to be widely used in mechanical parts, electrical equipment, automobile parts, and the like.

しかし、ポリアミド樹脂は、通常耐水性、耐候性に劣る
という欠点を有する。
However, polyamide resins usually have the disadvantage of poor water resistance and weather resistance.

上記欠点を改良するため、ポリアミド樹脂成形品の表面
に耐水性、耐候性に優れる他の熱可塑性樹脂を二重成形
する方法が知られている。
In order to improve the above drawbacks, a method is known in which another thermoplastic resin having excellent water resistance and weather resistance is double molded on the surface of a polyamide resin molded product.

一般にポリアミド樹脂成形品に外層用熱可塑性樹脂を二
重成形する場合は、前処理法として両樹脂と密着性に優
れた接着剤又はホットメルト接着剤をポリアミド樹脂成
形品表面に塗布する方法が知られている。
Generally, when double-molding a thermoplastic resin for the outer layer on a polyamide resin molded product, a known pretreatment method is to apply an adhesive or hot melt adhesive that has excellent adhesion to both resins to the surface of the polyamide resin molded product. It is being

しかるにこれらの方法は工程の複雑化、コスト高を招き
実用上不都合な点が多い。
However, these methods have many practical disadvantages, such as complicating the process and increasing costs.

[発明が解決しようとする課題] 本発明はかかる従来技術の課題を解決し、ポリアミド樹
脂成形品に優れた密着性を有する外層を与える被覆成形
品を得る事を目的とする。
[Problems to be Solved by the Invention] It is an object of the present invention to solve the problems of the prior art and to obtain a coated molded product that provides an outer layer with excellent adhesion to a polyamide resin molded product.

[課題を解決する為の手段] 本発明者らは鋭意検討の結果、ポリアミド樹脂成形品を
二重成形する際に、使用する外層用熱可塑性樹脂が特定
の官能基を有していると優れた密着性を有する外層を得
ることを見出し、本発明を完成させた。
[Means for Solving the Problems] As a result of intensive studies, the present inventors have found that when double molding a polyamide resin molded product, it is better if the thermoplastic resin for the outer layer used has a specific functional group. The inventors have discovered that it is possible to obtain an outer layer with excellent adhesion, and have completed the present invention.

すなわち、本発明は、ポリアミド樹脂成形品に、ビニル
基、カルボキシル基、エポキシ基、ヒドロキシル基、ア
ミノ基、ニトリル基、アクリルアミド基、イソシアネー
ト基、アクリレート基、アシル基、アルデヒド基から選
ばれた少なくとも1種以上の官能基を有する外層用熱可
塑性樹脂を二重成形して得られる被覆成形品に関する発
明である。
That is, the present invention provides polyamide resin molded articles with at least one group selected from vinyl groups, carboxyl groups, epoxy groups, hydroxyl groups, amino groups, nitrile groups, acrylamide groups, isocyanate groups, acrylate groups, acyl groups, and aldehyde groups. This invention relates to a coated molded product obtained by double molding a thermoplastic resin for an outer layer having more than one type of functional group.

本発明でポリアミド樹脂成形品を成形する際に使用する
ポリアミド樹脂として、四員環以上のラクタムもしくは
ω−アミノ酸の重縮合、又は二塩基酸とジアミンとの重
縮合によって得られるポリアミド樹脂が挙げられる。 
上記四員環以上のラクタムもしくはω−アミノ酸として
ε−カプロラクタム、ω−ラウロラクタム、ω−アミノ
カプリル酸、ω−アミノラウリン酸が例示できる。
Examples of the polyamide resin used in molding the polyamide resin molded article in the present invention include polyamide resins obtained by polycondensation of lactams or ω-amino acids having four or more membered rings, or polycondensation of dibasic acids and diamines. .
Examples of the lactam or ω-amino acid having four or more membered rings include ε-caprolactam, ω-laurolactam, ω-aminocaprylic acid, and ω-aminolauric acid.

二塩基酸とジアミンから得られるポリアミドとして、ゲ
ルタール酸、アジピン酸、アゼライン酸、セバシン酸、
スペリン酸、ドデカンニ酸、エイコシオン酸、イソフタ
ル酸、テレフタル酸等の二塩基酸とテトラメチレンジア
ミン、ヘキサメチレンジアミン、オクタメチレンジアミ
ン、メタキシリレンジアミン、パラキシリレンジアミン
、パラフェニレンジアミン等のジアミン類から得られる
重合体もしくは共重合体が例示できる。
Polyamides obtained from dibasic acids and diamines include geltaric acid, adipic acid, azelaic acid, sebacic acid,
From dibasic acids such as speric acid, dodecanniic acid, eicosionic acid, isophthalic acid, and terephthalic acid, and diamines such as tetramethylene diamine, hexamethylene diamine, octamethylene diamine, metaxylylene diamine, paraxylylene diamine, and paraphenylene diamine. The resulting polymer or copolymer can be exemplified.

上記ポリアミドの具体例として、ナイロン4、ナイロン
6、ナイロン12、ナイロン66、ナイロン610、ナ
イロン612、ポリメタキシリレンアジパミド、ポリメ
タキシリレンアジパミド、ポリメタキシリレンドデカミ
ド、ポリへキサメチレンテレフタラミド等およびこれら
の混合物あるいは共重合体が挙げられるが、特にこれら
に限定されるものではない。
Specific examples of the polyamides include nylon 4, nylon 6, nylon 12, nylon 66, nylon 610, nylon 612, polymethaxylylene adipamide, polymethaxylylene adipamide, polymethaxylylene dodecamide, polyhexamethylene Examples include, but are not limited to, phthalamide and mixtures or copolymers thereof.

又、本発明で使用するポリアミド樹脂は、上記ポリアミ
ド樹脂単味の他、他の熱可塑性・熱硬化性樹脂を配合し
たもの、及びガラス繊維、炭素繊維、鉱物質ウィスカ、
炭酸カルシウム、タルク、マイカ、ウオラストナイト等
の無機充填剤を1種以上配合したもの、更に、樹脂組成
物に通常添加される酸化熱および紫外線等による劣化に
対する安定剤、結晶核剤、可塑剤、帯電防止剤、滑剤等
を配合したものも含まれる。
In addition, the polyamide resin used in the present invention includes, in addition to the above-mentioned single polyamide resin, those blended with other thermoplastic/thermosetting resins, glass fibers, carbon fibers, mineral whiskers,
Formulated with one or more inorganic fillers such as calcium carbonate, talc, mica, and wollastonite, as well as stabilizers against deterioration caused by oxidation heat and ultraviolet rays, crystal nucleating agents, and plasticizers that are usually added to resin compositions. , antistatic agents, lubricants, etc. are also included.

本発明の二重成形の外層に使用する熱可塑性樹脂として
は、ポリスチレン、ABS樹脂、ポリエチレン、ポリプ
ロピレン、石油樹脂、塩化ビニル樹脂、アクリル樹脂、
ポリアミド、酢酸ビニル樹脂、ポリブチレンテレフタレ
ート、エチレンビニルアルコール樹脂、エチレン酢酸ビ
ニル樹脂、ポリアセタール、ポリフェニレンエーテル、
フェノキシ樹脂、ポリウレタン、熱可塑性エラストマー
、及びこれらの樹脂を混合して得られる熱可塑性樹脂組
成物が挙げられるがこれらの樹脂及び樹脂組成物にガラ
ス繊維、炭素繊維、鉱物質ウィスカ、炭酸カルシウム、
タルク、マイカ、ウオラストナイト等の無機充填剤を1
種以上配合したもの、更に、樹脂組成物に通常添加され
る酸化熱および紫外線等による劣化に対する安定剤、結
晶核剤、可塑剤、帯電防止剤、滑剤等を配合したものも
含まれる。
Thermoplastic resins used for the outer layer of the double molding of the present invention include polystyrene, ABS resin, polyethylene, polypropylene, petroleum resin, vinyl chloride resin, acrylic resin,
Polyamide, vinyl acetate resin, polybutylene terephthalate, ethylene vinyl alcohol resin, ethylene vinyl acetate resin, polyacetal, polyphenylene ether,
Examples include phenoxy resin, polyurethane, thermoplastic elastomer, and thermoplastic resin compositions obtained by mixing these resins, but these resins and resin compositions may also contain glass fibers, carbon fibers, mineral whiskers, calcium carbonate,
1 inorganic filler such as talc, mica, wollastonite, etc.
It also includes those containing at least one type of stabilizer, a crystal nucleating agent, a plasticizer, an antistatic agent, a lubricant, etc., which are usually added to resin compositions to prevent deterioration due to heat of oxidation and ultraviolet rays.

上記熱可塑性樹脂、もしくは熱可塑性樹脂組成物を使用
することにより、耐水性、又は耐候性に優れた被覆成形
品を得ることができる。
By using the above thermoplastic resin or thermoplastic resin composition, a coated molded article with excellent water resistance or weather resistance can be obtained.

本発明において外層用可塑性樹脂に使用する官能基は、
ビニル基、カルボキシル基、エボキシ基、ヒドロキシル
基、アミノ基、ニトリル基、アクリルアミド基、イソシ
アネート基、アクリレート基、アシル基、アルデヒド基
から選ばれた少なくとも1種以上のものである。
In the present invention, the functional groups used in the plastic resin for the outer layer are:
It is at least one selected from a vinyl group, a carboxyl group, an epoxy group, a hydroxyl group, an amino group, a nitrile group, an acrylamide group, an isocyanate group, an acrylate group, an acyl group, and an aldehyde group.

上記官能基は、ポリアミド樹脂と親和性がよいか、又は
成形加工時にポリアミド樹脂と反応するために、二重成
形して得られる外層は内層のポリアミド樹脂成形品と密
着性に優れたものとなる。
The above functional groups have a good affinity with the polyamide resin or react with the polyamide resin during molding, so the outer layer obtained by double molding has excellent adhesion to the inner layer polyamide resin molded product. .

°尚、上記官能基は外層用熱可塑性樹脂に付加又はグラ
フト、重縮合等により直接化学的に結合しているか又は
官能基自体が反応しているか及びこれら官能基を含む物
質がブレンドされているかの如何は問わない。
°In addition, whether the above functional groups are directly chemically bonded to the thermoplastic resin for the outer layer by addition, grafting, polycondensation, etc., or whether the functional groups themselves are reacted, and whether substances containing these functional groups are blended. It doesn't matter what happens.

本発明のこれら官能基含有量は二重成形される外層用熱
可塑性樹脂に対し0.05〜25重量%、好ましくは、
0.1〜15重量%の範囲が望ましい。
The content of these functional groups in the present invention is 0.05 to 25% by weight based on the thermoplastic resin for the outer layer to be double molded, preferably,
A range of 0.1 to 15% by weight is desirable.

官能基含有量が少ない場合は二重成形に於る密着性向上
効果が小さく、多すぎても密着性向上効果は向上しない
When the functional group content is small, the effect of improving adhesion in double molding is small, and when it is too large, the effect of improving adhesion is not improved.

本発明の被覆成形品は、ポリアミド樹脂を用いて、通常
の方法で射出成形して得た成形品の上に、更に外層用熱
可塑性樹脂を射出成形することにより得られる。
The coated molded article of the present invention is obtained by injection molding a thermoplastic resin for an outer layer on a molded article obtained by injection molding using a polyamide resin in a conventional manner.

[作用及び発明の効果〕 本発明のポリアミド樹脂成形品に特定の官能基を有する
外層用熱可塑性樹脂を二重成形することにより、密着性
に優れた被覆成形品が得られ、且つポリアミド樹脂成形
品に新たな機能を付与する事が可能となる。
[Actions and Effects of the Invention] By double-molding the polyamide resin molded product of the present invention with a thermoplastic resin for an outer layer having a specific functional group, a coated molded product with excellent adhesion can be obtained, and the polyamide resin molded product It becomes possible to add new functions to products.

[実施例] 以下実施例及び比較例により本発明を更に具体的に説明
する。
[Examples] The present invention will be explained in more detail below using Examples and Comparative Examples.

尚、二重成形して得られる被覆成形品の外層の密着性の
評価は、T剥離強度によった。
The adhesion of the outer layer of the coated molded product obtained by double molding was evaluated based on T-peel strength.

すなわち、二重成形された被覆成形品の外層の熱可塑性
樹脂層に1/2” (12,7mm)幅に切れ目を入れ
、この外層を直角方向に引き剥す時の荷重(kg)を測
定し、T剥離強度とした。
That is, a 1/2" (12.7 mm) wide cut was made in the outer thermoplastic resin layer of a double-molded covering molded product, and the load (kg) when this outer layer was peeled off in the right angle direction was measured. , T peel strength.

実施例1 三菱瓦斯化学■製のポリ(メタキシリレンアジパミド)
のペレット(重合体1gを98%硫酸100mlに溶解
し、25℃で測定した相対粘度が2.10のもの)を成
形金型温度130℃、溶融樹脂温度250℃で射出成形
して、1/2”Xi/16″×5”の短冊形状の成形品
を得た。
Example 1 Poly(methaxylylene adipamide) manufactured by Mitsubishi Gas Chemical ■
pellets (1 g of polymer dissolved in 100 ml of 98% sulfuric acid, relative viscosity of 2.10 measured at 25°C) were injection molded at a mold temperature of 130°C and a molten resin temperature of 250°C. A rectangular molded product measuring 2"Xi/16" x 5" was obtained.

この成形品を1/2”×1/8”×5″の形状の金型内
に装着した後、金型温度50℃、樹脂温度230℃で、
無水マレイン酸変性ポリプロピレン(ポリプロピレン1
00重量部に対し2重量部の無水マレイン酸を反応させ
て得たもの)を射出成形した。
After installing this molded product in a mold with a shape of 1/2" x 1/8" x 5", the mold temperature was 50°C and the resin temperature was 230°C.
Maleic anhydride modified polypropylene (polypropylene 1
(obtained by reacting 00 parts by weight with 2 parts by weight of maleic anhydride) was injection molded.

得られた被覆成形品のポリプロピレン外層のT剥離強度
を測定した。
The T-peel strength of the polypropylene outer layer of the obtained coated molded article was measured.

結果を第1表に示した。The results are shown in Table 1.

実施例2 実施例1に於て無水マレイン酸変性ポリプロピレンをポ
リ (エチレンビニルアルコール)(樹脂中のヒドロキ
シル基濃度=15重量%)にした他は全く同様にして被
覆成形品を得た。
Example 2 A coated molded article was obtained in exactly the same manner as in Example 1 except that poly(ethylene vinyl alcohol) (hydroxyl group concentration in the resin = 15% by weight) was used instead of maleic anhydride-modified polypropylene.

外層のT剥離強度を測定した結果を第1表に示した。Table 1 shows the results of measuring the T-peel strength of the outer layer.

実施例3 実施例1において無水マレイン酸変性ポリプロピレンを
エチレン、エチルアクリレート、無水マレイン酸共重合
樹脂(配合重量比二8071515)にした他は、全(
同様にして被覆成形品を得た。外層のT剥離強度を測定
した結果を第1表に示した。
Example 3 Except for changing the maleic anhydride-modified polypropylene in Example 1 to ethylene, ethyl acrylate, and maleic anhydride copolymer resin (blending weight ratio 28071515), all (
A coated molded article was obtained in the same manner. Table 1 shows the results of measuring the T-peel strength of the outer layer.

実施例4 実施例1に於てポリアミド樹脂をポリ (ヘキサメチレ
ンアジパミド)(東し■製、商品名:アミランCM30
01N)に代え成形金型温度80度、溶融樹脂温度27
8度で成形した他は全く同様にし無水マレイン酸変性エ
チレン・プロピレン共重合体く共重合体100重量部に
対し、1.5重量部の無水マレイン酸を反応させたもの
)との被覆成形品を得、外層のT剥離強度を測定した。
Example 4 In Example 1, the polyamide resin was changed to poly (hexamethylene adipamide) (manufactured by Toshi ■, product name: Amilan CM30).
01N), the mold temperature is 80 degrees, and the molten resin temperature is 27 degrees.
A coated molded product made of a maleic anhydride-modified ethylene/propylene copolymer (100 parts by weight of the copolymer was reacted with 1.5 parts by weight of maleic anhydride) in the same manner except that it was molded at 8 degrees Celsius). was obtained, and the T peel strength of the outer layer was measured.

比較例1 実施例1に於てポリプロピレンを未処理品にした他は全
く同様にして被覆成形品を得、外層のT剥離強度を測定
した。結果を第1表に示した。
Comparative Example 1 A coated molded product was obtained in exactly the same manner as in Example 1 except that the polypropylene was not treated, and the T-peel strength of the outer layer was measured. The results are shown in Table 1.

第  1  表 特許出願人 三菱瓦斯化学株式会社 代理人 弁理士  小 堀 貞 文Table 1 Patent applicant: Mitsubishi Gas Chemical Co., Ltd. Agent Patent Attorney Sadafumi Kohori

Claims (3)

【特許請求の範囲】[Claims] (1)ポリアミド樹脂成形品に、ビニル基、カルボキシ
ル基、エポキシ基、ヒドロキシル基、アミノ基、ニトリ
ル基、アクリルアミド基、イソシアネート基、アクリレ
ート基、アシル基、アルデヒド基から選ばれた少なくと
も1種以上の官能基を有する外層用熱可塑性樹脂を二重
成形して得られる被覆成形品。
(1) At least one type of polyamide resin molded product selected from vinyl groups, carboxyl groups, epoxy groups, hydroxyl groups, amino groups, nitrile groups, acrylamide groups, isocyanate groups, acrylate groups, acyl groups, and aldehyde groups. A coated molded product obtained by double molding a thermoplastic resin for the outer layer that has a functional group.
(2)請求項(1)項において使用する外層用熱可塑性
樹脂中の官能基濃度が0.05〜25重量%であること
を特徴とする被覆成形品。
(2) A coated molded article characterized in that the thermoplastic resin for the outer layer used in claim (1) has a functional group concentration of 0.05 to 25% by weight.
(3)請求項(1)項において外層用熱可塑性樹脂とし
てエチレン・プロピレン共重合体を使用することを特徴
とする被覆成形品。
(3) A coated molded article according to claim (1), characterized in that an ethylene-propylene copolymer is used as the thermoplastic resin for the outer layer.
JP26641890A 1990-10-05 1990-10-05 Coated molded form Pending JPH04144745A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26641890A JPH04144745A (en) 1990-10-05 1990-10-05 Coated molded form

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26641890A JPH04144745A (en) 1990-10-05 1990-10-05 Coated molded form

Publications (1)

Publication Number Publication Date
JPH04144745A true JPH04144745A (en) 1992-05-19

Family

ID=17430661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26641890A Pending JPH04144745A (en) 1990-10-05 1990-10-05 Coated molded form

Country Status (1)

Country Link
JP (1) JPH04144745A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9789637B2 (en) 2012-07-16 2017-10-17 Denso Corporation Electronic device and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9789637B2 (en) 2012-07-16 2017-10-17 Denso Corporation Electronic device and method for manufacturing the same

Similar Documents

Publication Publication Date Title
JP2921581B2 (en) Moldings consisting of separately composed, at least partially incompatible, pieces of different polymers and a process for their production
US5416172A (en) Transparent polyamide compositions having high resistance to chemical agents
US4755552A (en) Impact-resistant polyamide molding compounds
US4745143A (en) Salt resistant polyamide composition
JPS61126171A (en) Polyamide resin composition
JPS6228983B2 (en)
JP3235856B2 (en) Molding resin composition
US4861815A (en) Hydrophobicized, easily-flowing thermoplastic polyamide containing monoepoxide
US4801633A (en) Salt resistant polyamide composition
JPH04144745A (en) Coated molded form
JP3089434B2 (en) Two-layer injection molded product
JPH06207099A (en) Thermoplastic molding material
JPH07258483A (en) Thermoplastic resin composition
JP2718083B2 (en) Molding material
JPS63172765A (en) Thermoplastic molding material based on polyamide and ethylene copolymer
FI111852B (en) Polyamide-based flexible translucent composition, process for its transformation, and articles made from this composition
KR100409068B1 (en) Composition of thermoplastic polyesteric resin improved mechanical strength
KR102582903B1 (en) Thermoplastic resin composition and article manufactured using the same
KR20030027219A (en) A polyamide resin composition for outside door handle of automobile
KR102582224B1 (en) Thermoplastic resin composition and article manufactured using the same
JPS595143B2 (en) Polyamide resin composition
JP2695490B2 (en) Reinforced polyamide / polyolefin resin composition
KR20100049347A (en) Polyamide/ionomer blend resin composition or reaction product
KR20230004186A (en) Thermoplastic resin composition and article manufactured using the same
JPH0254383B2 (en)