JPH0414458Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electrode plate mounting structure for an electrolytic/plating tank. More specifically, the present invention relates to an electrode plate mounting structure for an electrolytic/plating tank that is unlikely to cause electrical failure.

[Prior art and its problems] Conventionally, as shown in FIG. As shown in FIG. 6, a bus bar 6 to which a conductive wire 4 for supplying electricity is connected is installed in an electrolytic/plating tank. The electrode plate 2 is provided on the upper part of the bus bar 6, and the suspension part 3 of the electrode plate 2 is suspended from the bus bar 6.

By the way, when performing electrolysis and plating using the electrolysis and plating tank 1 shown in FIGS. 5 and 6, the electrode 2
When the electrolytic solution 7 in the electrolytic plating tank 1 is scattered in the form of mist or droplets due to gas generated from the surface of Droplets fall and the electrolyte 7 splashes, and these mist adhere to the electrode rod 5, bus bar 6, and hanging part 3, causing energization drops and failures between the hanging part 3 and the electrode rod 5 and bus bar 6. Since it may not be possible to perform electrolysis and plating uniformly, it is necessary to constantly clean the electrode rod 5, bus bar 6, and hanging part 3, and therefore the plating work must be frequently interrupted. The disadvantage is that work efficiency is low. In addition, if a large amount of mist is generated, a local exhaust system must be installed in the electrolytic/plating tank 1, but since the exhaust port is above the electrode rod 5 or bus bar 6, the efficiency of exhausting the mist is reduced. At the same time, the dirt adhering to the hanging part 3 became even more serious, and energization drops or failures in energization sometimes occurred between the electrode rod 5 or bus bar 6 and the hanging part 3.

[Problems to be solved by the invention] Therefore, in view of the problems of the prior art described above, the inventor of the present invention has developed a method that eliminates the occurrence of energization drops and energization failures during electrolysis and plating operations, and that during electrolysis and plating We conducted intensive research to create an electrolysis/plating tank that could efficiently exhaust the mist generated during the process, and did not require electrode rods or busbars. However, we unexpectedly discovered that the top edge of the side plate of the electrolysis/plating tank We have discovered that all of the above problems can be solved by attaching a hanging part of an electrode plate to the hanging part of the electrode plate and connecting a conductive wire for energizing the electrode to the hanging part of the electrode plate, and have completed the present invention. It was it.

[Means for solving the problem] That is, in the present invention, a hanging part of the electrode plate is attached to the upper end of the side plate of the electrolytic/plating tank, and a conductive wire for supplying electricity is connected to the hanging part of the electrode plate. The present invention relates to an electrode plate mounting structure for an electrolytic/plating tank characterized by the following.

[Function] In this invention, the electrode plate is suspended by simply attaching the hanging part of the electrode plate to the upper part of the side plate of the electrolytic/plating tank, and electrode rods and bus bars are not required, so the manufacturing cost of the equipment is reduced. This reduces the risk of energization drops and energization failures caused by the scattered electrolyte, and allows the generated mist to be efficiently exhausted.

[Example] Next, the electrode plate mounting structure of the electrolysis/plating tank of the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic perspective view showing an embodiment of the electrode plate mounting structure for an electrolytic/plating tank according to the present invention.

In FIG. 1, a hanging portion 3 provided on an electrode plate 2 is attached to the upper end of a side plate of an electrolysis/plating tank 1.

As the electrolysis/plating tank 1, a tank conventionally used as a plating tank, a plating pre-treatment tank, a plating post-treatment tank, an alumite tank, an electrodeposition coating tank, etc. is used. The material of the electrolytic/plating tank 1 may be an insulator such as FRP to prevent short circuit between the two electrodes.
Also, between the electrode plate 2 and the electrolytic/plating tank 1,
For example, it may be made of metal such as iron or copper as long as it is insulated with a rubber sheet, plastic sheet, ceramic sheet, or the like.

The electrode plate 2 has a different anode side and a cathode side. For example, when the electrolytic plating tank 1 is used as a plating tank, a plating material is usually provided on the anode side, and an adherend is provided on the cathode side. will be provided. Examples of the plating material include commonly used materials such as copper, zinc, and nickel.
If the adherend has a rod-like or plate-like shape, it can be directly used as a cathode; If plating is to be performed, the material may be placed in a net or drum. If the plating material is too small to be used directly as an electrode plate, an electrode plate holder 9 as shown in FIG. 2 may be used. The electrode plate holder 9 is a cylindrical container, and has a structure in which a mesh is provided on the side surface so that the electrolytic solution can easily penetrate inside. Pole plate insert 9
There is no particular limitation on the shape, and as shown in FIG. 2, the shape may be a quadrangular prism, or it may be cylindrical. The material is also not particularly limited and may be appropriately selected depending on the type of electrolyte normally used. Examples include titanium-plated metal surfaces such as titanium, zirconium, and iron.

The hanging part 3 is provided on the electrode plate 2 in order to attach the electrode plate 2 to the upper end of the side plate of the electrolysis/plating tank 1. The hanging portion 3 may be made integrally with the electrode plate 2, or the electrode plate 2 and the hanging portion 3 may be made integrally with each other.
They may be constructed as separate parts and connected to each other with bolts or the like, as shown in FIG. 3, for example. In the present invention, there is no particular limitation on the shape of the hanging portion 3, and it may be of any shape as long as it can be attached to the upper end of the side plate of the electrolysis/plating tank 1. Hanging part 3
An example of the shape is shown in FIGS. 3 and 4. Also, when the hanging part 3 is attached to the upper end of the side surface of the electrolytic/plating tank 1, the electrolytic/plating
In order to prevent the plating tank 1 and the electrode plate 2 from coming into contact with each other, a spacer 10 may be provided on the electrode plate 2 as shown in FIG. It may be provided.

The conductive wire 4 is connected to the hanging part 3 of the electrode plate 2 to supply electricity to the electrode. The position where the conductive wire 4 is provided on the hanging portion 3 of the electrode plate 2 is not particularly limited, and may be located at any position. Further, methods for connecting the conductive wire 4 and the hanging portion 2 of the electrode plate 2 include welding, screwing, etc., but the present invention is not limited to these methods, but can also be applied to other methods. Good too.

Note that the electrode plate 2 provided with the hanging part 3 is
Although there is no particular limitation on the position at which the electrodes 2 are installed in the plating tank 1, the two electrodes 2 are usually provided so as to face each other as shown in FIG.

[Effects of the invention] The electrolytic/plating tank electrode plate mounting structure of the present invention does not require the electrode rods and busbars that are required in conventional electrolytic/plating tanks, so the structure can be simplified and costs can be reduced. There is no risk of energization drops or energization failures occurring, and the mist generated during energization can be efficiently exhausted.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view showing one embodiment of the electrolytic/plating tank of the present invention, and FIGS. 2 to 4 are schematic perspective views showing one embodiment of the electrodes used in the electrolytic/plating tank of the present invention, respectively. , FIG. 5, and FIG. 6 are schematic perspective views showing conventional electrolysis/plating tanks, respectively. Main symbols in the drawings: 1... Electrolytic/plating tank, 2...
...Electrode plate, 3... Hanging part, 4... Conductive wire.

Claims (1)

[Scope of utility model registration request] An electrolysis/plating device characterized in that a hanging part of an electrode plate is attached to the upper end of the side plate of the electrolytic/plating tank, and a conductive wire for supplying electricity is connected to the hanging part of the electrode plate.
Electrode plate mounting structure for plating tank.