JPH04140691A - Positioner - Google Patents
PositionerInfo
- Publication number
- JPH04140691A JPH04140691A JP2263033A JP26303390A JPH04140691A JP H04140691 A JPH04140691 A JP H04140691A JP 2263033 A JP2263033 A JP 2263033A JP 26303390 A JP26303390 A JP 26303390A JP H04140691 A JPH04140691 A JP H04140691A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- directions
- axis
- movement
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims abstract 7
- 238000005259 measurement Methods 0.000 claims description 12
- 230000005484 gravity Effects 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 abstract description 7
- 238000005096 rolling process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野）
本発明は、２次元的な平面内での位置決め装置に関し、
特に半導体露光装置、各種測定機および工作機械等に用
いられるＸＹステージに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a positioning device within a two-dimensional plane,
In particular, the present invention relates to an XY stage used in semiconductor exposure equipment, various measuring machines, machine tools, and the like.
従来例を第３図に示す。ステージ基盤１に固定されたＸ
サーボモータ２と送りネジおよびガイド（不図示）によ
りＸステージ３をＸ方向に直線駆動する。同様にＸステ
ージ３に固定されたＸサーボモータ４と送りネジおよび
ガイド（不図示）によりＹステージ５をＹ方向に直線駆
動する。A conventional example is shown in FIG. X fixed to stage base 1
The X stage 3 is linearly driven in the X direction by the servo motor 2, feed screw, and guide (not shown). Similarly, a Y stage 5 is linearly driven in the Y direction by an X servo motor 4 fixed to the X stage 3, a feed screw, and a guide (not shown).
Ｙステージ上のＺＴｉｌｔステージ（不図示）により天
板６を２方向、Ｘ軸回りの回転、Ｙ軸回りの回転方向に
移動可能としている。天板６上にチャック７が固定され
ている。チャック７は位置決め対象物となるウェハ８を
吸着固定する。さらに天板６にはＸミラー１６Ｙミラー
１７が固定されている。これらのミラーはウェハ８のＸ
Ｙ力方向移動量を計測するためのレーザ干渉計用のミラ
ーである。１８はＸ軸のレーザビームの測長軸（レーザ
ビーム光束の中心）、１９はＹ軸のレーザビームの測長
軸である。不図示の干渉計および測長システム、ステー
ジ制御装置により移動量を計測し、今一ボモータに駆動
指令を与えてウェハ８のＸＹ力方向位置決めを行う。A ZTilt stage (not shown) on the Y stage allows the top plate 6 to move in two directions: rotation around the X axis and rotation around the Y axis. A chuck 7 is fixed on the top plate 6. The chuck 7 attracts and fixes a wafer 8, which is an object to be positioned. Furthermore, an X mirror 16 and a Y mirror 17 are fixed to the top plate 6. These mirrors are
This is a mirror for a laser interferometer for measuring the amount of movement in the Y force direction. 18 is the length measurement axis of the X-axis laser beam (the center of the laser beam luminous flux), and 19 is the length measurement axis of the Y-axis laser beam. The amount of movement is measured by an interferometer, a length measuring system, and a stage control device (not shown), and a drive command is given to the motor to position the wafer 8 in the XY force directions.
Ｚステージはウェハを所望の高さに位置決めする。例え
ば投影レンズ像面の高さにウェハ８を位置決めする。The Z stage positions the wafer at a desired height. For example, the wafer 8 is positioned at the height of the projection lens image plane.
しかしながら、上記従来例では、ＸＹステージの姿勢変
化に伴うアツベ誤差の発生をなくすために、ＸＹのレー
ザ測長軸の交点と位置決めすべき点０とを一致させ、ま
たは、ある許容値以内に調整する必要がある。このよう
な調整作業を完全に行うことは極めて困難であり、その
ため、アツベ誤差が発生し、所望の位置決め精度が得ら
れなかフた。However, in the above conventional example, in order to eliminate the occurrence of Atsube errors due to changes in the posture of the There is a need to. It is extremely difficult to perform such adjustment work perfectly, and as a result, errors occur and the desired positioning accuracy cannot be obtained.
また、構成上、レーザ用ミラーはウニへ面の高さに設置
する必要があるが、ミラー重量（ＸＹ両方で約２ｋｇ）
のためＸＹステージの重心位置を高め、この結果、位置
決め時間を長びかせていた。Also, due to the configuration, the laser mirror needs to be installed at the level of the sea urchin surface, but the mirror weight (about 2 kg for both X and Y)
Therefore, the center of gravity of the XY stage was raised, and as a result, the positioning time was lengthened.
本発明は上記従来技術の欠点に鑑みなされたものであっ
て、アツベ誤差を最小限に抑え、高精度の位置決めが達
成できる位置決め装置の提供を目的とする。The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a positioning device that can minimize Atsube errors and achieve highly accurate positioning.
〔課題を解決するための手段及び作用〕前記目的を達成
するため、本発明によればＸＹステージのピッチング、
ロークング、ヨーイングを計測し、ＸＹステージのＸＹ
力方向変位を計測する計測軸と位置決めすべき点とのズ
レ量をあらかしめ既知のものとしておくことによりアツ
ベ誤差を極小（または零）とし、ＸＹステージの動特性
に優利な位置に計測系を配置できるようにした。[Means and effects for solving the problem] In order to achieve the above object, according to the present invention, the pitching of the XY stage,
Measuring the locating and yawing, and
By making the amount of deviation between the measurement axis for measuring displacement in the force direction and the positioning point known in advance, the Atsube error can be minimized (or zero) and the measurement system can be placed in a position that is advantageous for the dynamic characteristics of the XY stage. I was able to place it.
（実施例） 第１図は本発明の実施例の概略斜視図である。(Example) FIG. 1 is a schematic perspective view of an embodiment of the invention.
ステージ基盤１に固定されたＸサーボモータ２と送りネ
ジおよびガイド（不図示）によりＸステージ３をＸ方向
に直線駆動する。同様にＸステージ３に固定されたＹサ
ーボモータ４と送りネジおよびガイド（不図示）により
Ｙステージ５をＹ方向に直線駆動する。Ｙステージ上の
ＺＴｉｌｔステージ（不図示）により天板６をＺ方向、
Ｘ軸回りの回転、Ｙ軸回りの回転方向に駆動する。天板
６はさらにＺ軸廻りに回転可能である。チャック７は天
板６上に固定され、位置決め対象物となるウェハ８を吸
着、固定する。ざらにＹステージ下部にＸミラー９およ
びＹミラー１０が固定されている。これらのミラーはウ
ェハ８のＸＹ力方向移動量、およびピッチング（Ｘ又は
Ｙ＠廻りの回転）、ローリング（Ｙ又はＸ＠廻りの回転
）、ヨーイング（Ｚ軸廻りの回転）方向の移動量を計測
するためのレーザ干渉計用のミラーである。１１〜１５
はレーザ干渉計の測長軸を示す。レーザ１１と１２およ
び１３によりＹ軸回りの回転、Ｚ軸回りの回転およびＸ
軸方向の変位を計測する。An X stage 3 is linearly driven in the X direction by an X servo motor 2 fixed to a stage base 1, a feed screw, and a guide (not shown). Similarly, the Y stage 5 is linearly driven in the Y direction by a Y servo motor 4 fixed to the X stage 3, a feed screw, and a guide (not shown). The top plate 6 is moved in the Z direction by the ZTilt stage (not shown) on the Y stage.
Drives in rotation around the X axis and rotation around the Y axis. The top plate 6 is further rotatable around the Z axis. The chuck 7 is fixed on the top plate 6, and attracts and fixes a wafer 8, which is an object to be positioned. An X mirror 9 and a Y mirror 10 are roughly fixed to the lower part of the Y stage. These mirrors measure the amount of movement of the wafer 8 in the XY force direction, as well as the amount of movement in the pitching (rotation around the X or Y axis), rolling (rotation around the Y or X axis), and yawing (rotation around the Z axis). This is a mirror for a laser interferometer. 11-15
indicates the measurement axis of the laser interferometer. Lasers 11, 12, and 13 rotate around the Y axis, rotate around the Z axis, and
Measure axial displacement.
レーザ１４と１５によりＸ軸回りの回転およびＹ軸方向
の変位を計測する。第１図の装置のＡ−Ａ矢視図を第２
図に示す。レーザ測長軸１１による変位をＸ１１、その
時のＹ軸回りの回転をθア、Ｚ軸回りの回転をθ工とす
ると、位置決めすべき点０のＸ座標の変位Ｘ０は
Ｘｏ ”Ｘｔ＋ Ｌ＋ θ２−Ｌ２θうて表わされる
。従って、Ｌｌ、Ｌ２を前もって測定しておけばｘｏを
正確に求めることができる。Ｙ座標の変位Ｙｏも同様に
して求まる。Ｘｏ、Ｙｏをもとに位置決めを行う。Lasers 14 and 15 measure rotation around the X-axis and displacement in the Y-axis direction. The A-A arrow view of the device in Figure 1 is shown in Figure 2.
As shown in the figure. If the displacement by the laser length measurement axis 11 is X11, the rotation around the Y axis is θa, and the rotation around the Z axis is θ, then the displacement X0 of the X coordinate of the point 0 to be positioned is Xo ''Xt+L+θ2- It is expressed as L2θ. Therefore, if Ll and L2 are measured in advance, xo can be determined accurately. The Y-coordinate displacement Yo can be found in the same way. Positioning is performed based on Xo and Yo.
以上説明した通り、レーザ干渉計用ミラーを従来より低
い位置に配置し、ＸＹステージの重心位置を下げること
ができる。そのため、ＸＹステージの動特性が向上し位
置決め時間の短縮が図られる。また、Ｌｌ、Ｌ２を正確
に計ることにより位置決め精度が向上する。Ｌｌ、Ｌ２
を正確に計ることは必要であるが、絶対値の公差は極め
てゆるく、調整は非常に容易になる。As explained above, the laser interferometer mirror can be placed at a lower position than before, and the center of gravity of the XY stage can be lowered. Therefore, the dynamic characteristics of the XY stage are improved and the positioning time can be shortened. Furthermore, positioning accuracy is improved by accurately measuring Ll and L2. Ll, L2
Although it is necessary to measure accurately, the tolerance of the absolute value is extremely loose, making adjustment very easy.
以上説明したよいうに、ＸＹステージの姿勢（ピッチン
グ、ローリング、ヨーイング）を計測し、ＸＹ方向の測
長軸と位置決めすべき点とのズレ量を前もって測定して
おくことにより、アツベ誤差を極小（または零）とし位
置決め精度を向上させることができる。さらに測長軸を
任意の位置に配置することができるため、測定部品の重
心をＸＹステージの重心に近づけることができＸＹステ
ージの動特性を向上させることができる。また、ＸＹス
テージを構成する上でスペースを有効に活用できる。As explained above, by measuring the attitude (pitching, rolling, yawing) of the XY stage and measuring the amount of deviation between the length measurement axis in the XY direction and the point to be positioned in advance, the Atsube error can be minimized ( or zero) to improve positioning accuracy. Furthermore, since the length measurement axis can be placed at an arbitrary position, the center of gravity of the part to be measured can be moved closer to the center of gravity of the XY stage, and the dynamic characteristics of the XY stage can be improved. Furthermore, space can be effectively utilized when configuring the XY stage.
第１図は本発明の実施例に係る位置決め装置の斜視図、
第２図は第１図のＡ−Ａ矢視図、
第３図は従来例の斜視図である。
１：ステージ基盤、２：ｘサーボモータ、３：Ｘステー
ジ、４：Ｙサーボモータ、５：Ｙステージ、６：天板、
７：チャック、８：ウェハ、９゜Ｘミラー １０：Ｙミ
ラー １１〜１５レーザ測長軸。
特許出願人 キャノン株式会社
代理人 弁理士 伊 東 哲 也FIG. 1 is a perspective view of a positioning device according to an embodiment of the present invention, FIG. 2 is a view taken along the line A-A in FIG. 1, and FIG. 3 is a perspective view of a conventional example. 1: Stage base, 2: x servo motor, 3: X stage, 4: Y servo motor, 5: Y stage, 6: Top plate,
7: Chuck, 8: Wafer, 9°X mirror 10: Y mirror 11-15 Laser length measurement axis. Patent applicant Canon Co., Ltd. agent Patent attorney Tetsuya Ito
Claims (3)
載しかつＸＹ各方向の移動およびＸＹＺ各軸廻りの回転
が可能なステージと、前記ＸＹ各方向の移動量およびＸ
ＹＺ各軸廻りの回転量を検出する検出手段と、該検出手
段の検出結果および予め計測した前記ＸＹ各方向の移動
測定位置と位置決め基準点との間の距離に基づいて真の
ＸＹ各方向の移動量を算出する演算手段とを具備したこ
とを特徴とする位置決め装置。(1) A stage on which a flat object to be positioned is mounted parallel to the XY plane and capable of movement in each of the XY directions and rotation around each of the XYZ axes, and the amount of movement in each of the XY directions and the
A detection means for detecting the amount of rotation around each of the Y and Z axes, and a detection means for detecting the amount of rotation in each of the X and Y directions based on the detection results of the detection means and the distance between the previously measured movement measurement position in each of the X and Y directions and the positioning reference point. 1. A positioning device comprising: arithmetic means for calculating a movement amount.
手段は該レーザ干渉計のレーザ光の測長軸と前記基準点
との間の距離および前記検出結果に基づいて前記移動量
の算出を行うことを特徴とする特許請求の範囲第１項記
載の位置決め装置。(2) The detection means includes a laser interferometer, and the calculation means calculates the amount of movement based on the distance between the measurement axis of the laser beam of the laser interferometer and the reference point and the detection result. The positioning device according to claim 1, wherein the positioning device performs the following steps.
あって、Ｚ方向に関し前記基準点よりステージの重心に
近い側に設けたことを特徴とする特許請求の範囲第２項
記載の位置決め装置。(3) The length measurement axis of the laser interferometer is parallel to the XY plane, and is provided closer to the center of gravity of the stage than the reference point in the Z direction. positioning device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2263033A JPH04140691A (en) | 1990-10-02 | 1990-10-02 | Positioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2263033A JPH04140691A (en) | 1990-10-02 | 1990-10-02 | Positioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04140691A true JPH04140691A (en) | 1992-05-14 |
Family
ID=17383949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2263033A Pending JPH04140691A (en) | 1990-10-02 | 1990-10-02 | Positioner |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04140691A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000306829A (en) * | 2000-01-01 | 2000-11-02 | Nikon Corp | Projection aligner and manufacture of element |
| JP2002107136A (en) * | 2000-09-28 | 2002-04-10 | Advantest Corp | Stage apparatus, measurement method, and electron beam exposure apparatus |
| JP2012040645A (en) * | 2010-08-19 | 2012-03-01 | Canon Inc | Processing device |
| CN102969030A (en) * | 2012-12-03 | 2013-03-13 | 哈尔滨工业大学 | Plane type precise two-dimensional micrometric displacement platform |
| CN102969031A (en) * | 2012-12-12 | 2013-03-13 | 中国科学院光电技术研究所 | Z-thetax-thetay three-degree-of-freedom nanoscale precision split worktable |
-
1990
- 1990-10-02 JP JP2263033A patent/JPH04140691A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000306829A (en) * | 2000-01-01 | 2000-11-02 | Nikon Corp | Projection aligner and manufacture of element |
| JP2002107136A (en) * | 2000-09-28 | 2002-04-10 | Advantest Corp | Stage apparatus, measurement method, and electron beam exposure apparatus |
| JP2012040645A (en) * | 2010-08-19 | 2012-03-01 | Canon Inc | Processing device |
| CN102969030A (en) * | 2012-12-03 | 2013-03-13 | 哈尔滨工业大学 | Plane type precise two-dimensional micrometric displacement platform |
| CN102969031A (en) * | 2012-12-12 | 2013-03-13 | 中国科学院光电技术研究所 | Z-thetax-thetay three-degree-of-freedom nanoscale precision split worktable |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10209107B2 (en) | Geometric error identification method of multi-axis machine tool and multi-axis machine tool | |
| CN108917604B (en) | Normal measuring device and calibration method thereof | |
| US10118227B2 (en) | Machine tool and workpiece flattening method | |
| JPH038683B2 (en) | ||
| JP2001518606A (en) | Device for detecting the position of two objects | |
| JP2831610B2 (en) | measuring device | |
| US6351313B1 (en) | Device for detecting the position of two bodies | |
| JPH04140691A (en) | Positioner | |
| CN110640546B (en) | Measured gear rotation axis measuring method for large gear measurement beside machine | |
| JP3394972B2 (en) | Automatic machine tool | |
| JP2755346B2 (en) | Method and apparatus for measuring motion accuracy of automatic machine tool | |
| JP2006162537A (en) | Calibration method for sensor original position of three-dimensional shape measuring machine | |
| JPS60207742A (en) | On-machine measurement correcting apparatus for machine tool | |
| JP2002001568A (en) | Parameter setting method for laser beam machining head of nc control three-dimensional laser beam machine and nc control three-dimensional laser beam machine | |
| TW202146187A (en) | Coordinate calibration method of manipulator | |
| JPH01250891A (en) | Plane positioning device | |
| JP2003097943A (en) | Method and device for measuring straightness of mobile stage, and three-dimensional shape measuring machine using them | |
| JP2758810B2 (en) | Shape measurement method | |
| JP2005181023A (en) | Measuring device and method of height difference and tilt angle between planes | |
| CN114440849B (en) | Method and device for calibrating verticality of two-dimensional feedback positioning frame | |
| JPH06137852A (en) | Motion error measuring device for linear moving body | |
| JPH11151639A (en) | Inprocess measurement device | |
| JPH04135186A (en) | Reference-position determining method and apparatus for industrial travel robot | |
| JPH0637444Y2 (en) | Machined surface vertical direction detector | |
| JP2572936B2 (en) | Shape measuring instruments |