JPH04137580A - Stem for semiconductor laser - Google Patents

Abstract

PURPOSE:To obtain a stem for semiconductor laser which can be manufactured at a lower cost than the conventional metallic stem through a less number of manufacturing processes by integrally molding a lead frame provided with the first to third lead sections by using a resin. CONSTITUTION:A lead frame 10 is provided with the first lead section 11 which is die-bonded to a laser diode and monitor photodiode, second lead section 12 which is wire-bonded to the anode of the laser diode, and third lead section 13 which is wire-bonded to the monitor photodiode and integrally molded by using a resin. Therefore, the cost of the package can be reduced as a whole, because the wire-bonding can be performed easily and the cap stuck to a resin section 20 can be miniaturized and formed by using a resin.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a stem for a semiconductor laser, and particularly to a stem used for a semiconductor laser used in ordinary consumer equipment with low output such as for CD or VD. Regarding.

<Prior Art> A conventional stem for a semiconductor laser is made of metal, such as copper or iron. That is, conventional stems are manufactured through the steps of manufacturing a metal eyelet, attaching a lead bin with a hermetic seal, and plating the surface. The cap, another part of the pancage, has been made by welding hard glass to a metal eyelet using low-melting glass and then plating it. Note that the stem and cap have been bonded together by welding.

<Problems to be Solved by the Invention> As described above, since the stem is made of metal, the stem itself is expensive. Furthermore, the assembly of semiconductor lasers is naturally complicated, and there are disadvantages in that the number of steps is large.

Furthermore, since welding is used to bond the stem and the cap, there is a risk of mechanical damage to the laser diode and the package itself, which are die-bonded to the stem in advance.

The present invention was devised in view of the above circumstances, and aims to provide a novel stem for a semiconductor laser, which is inexpensive in cost and free from damage to the laser diode by molding the lead frame with resin. There is.

<Means for Solving the Problems> The stem for a semiconductor laser according to the present invention has a first structure in which a laser diode and a monitor photodiode are die-bonded.
A lead frame having a lead part, a second glue part to which the anode of the laser diode is wire-bonded, and a third lead part to which the monitor photodiode is wire-bonded is integrally molded using a resin mold.

Further, the laser die bonding portion of the lead frame and the die bonding portion of the monitor photodiode are formed on the same lead, and the die bonding portion of the monitor photodiode has an inclined structure.

<Operation> The lead frame is composed of the first, second and third lead parts. Die-bonding parts for the laser diode and the monitor photodiode are respectively formed in the first stack part.

<Example> Hereinafter, an example according to the present invention will be described with reference to the drawings. FIG. 1 is a drawing according to the present invention, in which (a) is a side view and (b) is a front view.

The stem for a semiconductor laser of the present invention includes a lead frame 10 and a resin part 20 molded onto the lead frame 10.

The lead frame 10 is preferably made of copper in order to suppress the temperature rise of the laser diode. The lead frame 10 includes a first lead portion 11 to which a laser diode and a monitor photodiode are die-bonded;
It has a second lead part 12 to which the anode of the laser diode is wire-bonded, and a third lead part 13 to which the monitor photodiode is wire-bonded. It is assumed that this lead frame 10 has a part of tie bars and other parts like a normal lead frame.

As shown in FIG. 1(a), the first lead part 11 is not parallel to the second lead part 12 and the third lead part 13 in side view, but is inclined near the base of the resin part 200. It is bent in the middle to become parallel to the second lead part 12 and the third lead part 13. The degree of this inclination is preferably 5 to 13 degrees.

The top portion 111 of the first lead portion 11 is a portion to which a not-shown laser diode is die-bonded. In this case, the laser diode die-bonded to the stem of the present invention is of a type that does not have a reflective surface, that is, it emits laser light in equal parts upward and downward in FIG. 1.

A monitor photodiode is die-bonded to the inclined portion 112 of the first lead portion 11 .

A shown by dotted lines in FIG. 1(b) is a laser diode, and B is a monitor photodiode.

By doing so, the laser diode die-bonded to the top part 111 emits approximately equal amounts of laser light upward and downward, so that the monitor photodiode die-bonded to the slope part 112 receives sufficient light. Therefore, the peak oscillation of the laser diode can be detected using this monitor photodiode.

A second glue portion 12 and a third lead portion 13 are arranged on the left and right sides of the first lead portion 11 .

The anode of a laser diode is wire-bonded to the second lead portion 12 . A monitor photodiode is wire-bonded to the third glue portion 13. In both cases, it is preferable that the tip be slanted so that the tip is thin like that of a normal kitchen knife.This makes it easier to perform wire bonding, and also reduces the size of the camp to be bonded to the resin part 20. (thickness) can be made smaller.

Although it is of course possible to attach a conventional metal cap to the semiconductor laser stem of the present invention, it is also possible to attach a resin cap to the stem, which reduces the cost of the entire package. can.

<Effects of the Invention> The semiconductor laser stem of the present invention has the following effects.

■Since the lead frame and resin are integrally molded, it can be manufactured at a lower cost than conventional metal stems, and the number of manufacturing steps can be reduced.

■Die-bond the laser diode and monitor photodiode to the first lead part. Since the monitor photodiode is die-bonded to the inclined portion, the monitor photodiode can sufficiently receive the laser light from the laser diode without being blocked.

■Since resin is used, it is easy to attach resin caps. That is, since welding and the like required in the prior art are not used, the laser diode is not damaged.

[Brief explanation of drawings]

FIG. 1 is a drawing according to the present invention, A top view, and (b) a front view. 10・・・・Lead frame 11...First lead part 111...Top 112...Slope part 12...Second lead part 13...Third lead part 20...Resin Patent applicant: Sharp Corporation Agent Patent Attorney Takaharu Dai Nishi (a) side

Claims (3)

[Claims] (1) A lead frame having a first lead part to which the laser diode and monitor photodiode are die-bonded, a second lead part to which the anode of the laser diode is wire-bonded, and a third lead part to which the monitor photodiode is wire-bonded. A semiconductor laser stem characterized by being integrally molded using a resin mold. (2) The stem for a semiconductor laser according to claim 1, wherein the laser die bonding portion of the lead frame and the die bonding portion of the monitor photodiode are formed on the same lead, and the die bonding portion of the monitor photodiode has an inclined structure. (3) The stem for a semiconductor laser according to claim 2, wherein the die bonding portion of the monitor photodiode has an inclination of 5° to 13°.