JPH04133430U - Gas pipe connection equipment for semiconductor manufacturing equipment - Google Patents
Gas pipe connection equipment for semiconductor manufacturing equipmentInfo
- Publication number
- JPH04133430U JPH04133430U JP1744292U JP1744292U JPH04133430U JP H04133430 U JPH04133430 U JP H04133430U JP 1744292 U JP1744292 U JP 1744292U JP 1744292 U JP1744292 U JP 1744292U JP H04133430 U JPH04133430 U JP H04133430U
- Authority
- JP
- Japan
- Prior art keywords
- tube
- reaction tube
- gas introduction
- gas
- exhaust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 43
- 239000007789 gas Substances 0.000 claims description 43
- 238000009792 diffusion process Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 239000012495 reaction gas Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
Abstract
(57)【要約】
【目的】 ガス漏れを防止し、ガス導入管及び排気管の
位置調整を容易にする。
【構成】 反応管1とガス導入管2の接続部9,10及
び反応管1と排気管の接続部をそれぞれOリング3を介
在させて接続する。
(57) [Summary] [Purpose] To prevent gas leaks and facilitate position adjustment of gas introduction pipes and exhaust pipes. [Structure] The connection parts 9 and 10 between the reaction tube 1 and the gas introduction pipe 2 and the connection part between the reaction tube 1 and the exhaust pipe are connected with an O-ring 3 interposed therebetween.
Description
【0001】0001
本考案は、半導体素子材料である半導体に各種薄膜を形成させる酸化拡散装置 等の半導体製造装置に使用するガス導入管,排気管のガス管接続装置に関するも のである。 This invention is an oxidation diffusion device that forms various thin films on semiconductors, which are semiconductor material. Regarding gas pipe connection devices for gas introduction pipes and exhaust pipes used in semiconductor manufacturing equipment such as It is.
【0002】0002
従来装置は、図3のように石英反応管1とガス導入管2との間及び反応管1と 排気管との間はテーパー摺合せ8により接続されていた。なお、反応管1と排気 管との間の接続も全く同様な構成になっている。 In the conventional device, as shown in FIG. It was connected to the exhaust pipe by a tapered sliding fitting 8. In addition, reaction tube 1 and exhaust The connections with the pipes are also configured in exactly the same way.
【0003】0003
このような接続装置にあっては、ガス漏れを完全に止めることができず、HCl などのようなガスを使用した場合、漏れガスにより外部の金属が腐食されるとい う問題が生じる。また、テーパー摺合せ接続の場合、管相互の位置が一義的に定 まるので、反応管1に合わせて、ガス導入管2と排気管の位置を調整する必要が ある。 With such a connection device, gas leakage cannot be completely stopped, and HCl If you use a gas such as, the leaked gas may corrode the external metal. A problem arises. In addition, in the case of a tapered sliding connection, the mutual position of the pipes is uniquely defined. Therefore, it is necessary to adjust the positions of gas inlet pipe 2 and exhaust pipe to match reaction tube 1. be.
【0004】0004
本考案装置は上記の課題を解決するため、図1に示すように反応管1内に反応 ガスをガス導入管2より導入し排気管より排気して反応管1内の半導体に酸化, 拡散等の成膜処理を行う半導体製造装置において、前記反応管1とガス導入管2 の接続部9,10及び反応管1と排気管の接続部をそれぞれOリング3を介在さ せて接続してなる。 In order to solve the above-mentioned problems, the device of the present invention has a reaction tube inside the reaction tube 1 as shown in Fig. 1. Gas is introduced through the gas introduction pipe 2 and exhausted through the exhaust pipe to oxidize the semiconductor in the reaction tube 1. In a semiconductor manufacturing apparatus that performs film formation processing such as diffusion, the reaction tube 1 and the gas introduction tube 2 The connections 9 and 10 between the reaction tube 1 and the exhaust pipe are connected through O-rings 3 It connects.
【0005】[0005]
このように接続部9,10をOリング3を介在させて接続したので、ガス漏れ を防止でき、反応管1に対しガス導入管2及び排気管の位置調整を容易に行うこ とができることになる。 Since the connecting parts 9 and 10 were connected through the O-ring 3 in this way, gas leakage was avoided. This makes it possible to easily adjust the position of the gas introduction pipe 2 and the exhaust pipe with respect to the reaction tube 1. This means that you can do this.
【0006】[0006]
図1は本考案装置の第1実施例の要部の構成を示す断面図である。図1におい て1は石英反応管、2は反応管1内に反応ガスを導入するガス導入管である。反 応管1とガス導入管2の接続部9,10間は球面摺り合せ4で接続されている。 この第1実施例では反応管1の接続部9の凹状球面にガス導入管2の接続部10 の凸状球面を摺合せで接続している。摺合せ接続部の凸状球面にOリング溝3A が設けられ、このOリング溝3A内にOリング3が挿設されている。反応管1及 びガス導入管2にそれぞれフランジ5,6が設けられ、これらのフランジ5,6 間がスプリング7でクランプされている。又、反応管1と排気管との間も全く同 様の接続構成になっている。 FIG. 1 is a sectional view showing the configuration of the main parts of a first embodiment of the device of the present invention. Figure 1 Smell 1 is a quartz reaction tube, and 2 is a gas introduction tube for introducing a reaction gas into the reaction tube 1. anti Connection portions 9 and 10 of the reaction tube 1 and the gas introduction tube 2 are connected by a spherical sliding joint 4. In this first embodiment, the connection part 10 of the gas introduction tube 2 is attached to the concave spherical surface of the connection part 9 of the reaction tube 1. The convex spherical surfaces of are connected by sliding. O-ring groove 3A on the convex spherical surface of the sliding connection part is provided, and the O-ring 3 is inserted into this O-ring groove 3A. Reaction tube 1 and Flanges 5 and 6 are provided on the gas introduction pipe 2 and the gas introduction pipe 2, respectively, and these flanges 5 and 6 The gap is clamped with a spring 7. Also, the connection between reaction tube 1 and exhaust pipe is exactly the same. The connection configuration is as follows.
【0007】 この第1実施例は上記のように反応管1とガス導入管2との間及び反応管1と 排気管との間をそれぞれ凹凸状球面摺り合せ4で接続し、各摺り合せ接続部にO リング3を挿設すると共に反応管1,ガス導入管2及び排気管にそれぞれフラン ジ5,6を設けて各フランジ5,6間をスプリング7でクランプしたので、反応 管1,ガス導入管2及び排気管が一直線上に配設されていなくても、スプリング 7でクランプされ、Oリング3でシールされるため、ガス漏れが生じるおそれは ないばかりでなく、反応管1に対しガス導入管2及び排気管の位置調整が容易に 行なえることになる。[0007] This first embodiment is arranged between the reaction tube 1 and the gas introduction tube 2 and between the reaction tube 1 and the gas introduction tube 2 as described above. Connect to the exhaust pipes with uneven spherical sliding joints 4, and connect O to each sliding connection part. Insert ring 3 and install flan into reaction tube 1, gas introduction tube 2 and exhaust tube. Since the flanges 5 and 6 were provided and the spring 7 was used to clamp the space between the flanges 5 and 6, the reaction Even if the pipe 1, gas inlet pipe 2, and exhaust pipe are not arranged in a straight line, the spring 7 and sealed with O-ring 3, so there is no risk of gas leakage. Not only is it easy to adjust the position of the gas introduction pipe 2 and the exhaust pipe with respect to the reaction tube 1. It will be possible to do it.
【0008】 又、反応管1に対しガス導入管2及び排気管の位置調整を容易に行い位置調整 の時間を短縮することができる。[0008] In addition, the position of the gas introduction pipe 2 and exhaust pipe can be easily adjusted with respect to the reaction tube 1. time can be reduced.
【0009】 図2は第2実施例の要部の構成を示す断面図である。 この第2実施例は、反応管1とガス導入管2の接続部9,10をそれぞれフラ ンジとし、これらフランジ9,10間にOリング3とアウタリング11を挿設し 、両フランジ9,10をブロック12,13で挟付け、両ブロック12,13に 貫通させたシャフト14の一端部を一方のブロック12に固定し、このシャフト 14の他端部に、弾性体受け15を取付け、他方のブロック13とこの弾性体受 け15間にスプリング7を挿設してなる。 反応管1と排気管との間も全く同様に接続されている。[0009] FIG. 2 is a cross-sectional view showing the configuration of essential parts of the second embodiment. In this second embodiment, the connecting portions 9 and 10 of the reaction tube 1 and the gas introduction tube 2 are connected to flanges, respectively. and insert the O-ring 3 and outer ring 11 between these flanges 9 and 10. , both flanges 9 and 10 are sandwiched between blocks 12 and 13, and both blocks 12 and 13 are One end of the shaft 14 passed through is fixed to one block 12, and this shaft An elastic member receiver 15 is attached to the other end of the block 14, and the elastic member receiver 15 is connected to the other block 13. A spring 7 is inserted between the grooves 15. The reaction tube 1 and the exhaust pipe are also connected in exactly the same way.
【0010】 この第2実施例は上記のような構成であるから、反応管1とガス導入管2のフ ランジ9,10間及び反応管1と排気管のフランジ間にそれぞれOリング3とア ウタリング11を挿設し、両フランジ9,10をブロック12,13で挟付け、 両ブロック12,13間をスプリング7でクランプしたので、反応管1,ガス導 入管2及び排気管が一直線上に配設されていなくても、スプリング7でクランプ され、Oリング3及びアウタリング11でシールされるため、ガス漏れが生じる おそれはないばかりでなく、反応管1に対しガス導入管2及び排気管の位置調整 が容易に行なえることになる。0010 Since this second embodiment has the above-mentioned configuration, the reaction tube 1 and the gas introduction tube 2 are An O-ring 3 and an aperture between the flanges 9 and 10 and between the flanges of the reaction tube 1 and the exhaust pipe, respectively. Insert the outer ring 11, sandwich both flanges 9 and 10 between blocks 12 and 13, Since both blocks 12 and 13 are clamped with spring 7, reaction tube 1 and gas guide Clamp with spring 7 even if the inlet pipe 2 and exhaust pipe are not arranged in a straight line gas leakage occurs because it is sealed with O-ring 3 and outer ring 11. Not only is there no risk, but the position of the gas introduction pipe 2 and exhaust pipe relative to the reaction pipe 1 is adjusted. can be done easily.
【0011】 又、ブロック13と弾性体受け15を指で挟み、スプリング7を圧縮すると、 ブロック12,13間が広がり、ブロック12,13,シャフト14,弾性体受 け15及びスプリング7を一体にフランジ9,10より容易に脱着できる。脱着 が容易なため装置のメンテナンス時間を削減できる。[0011] Also, if you hold the block 13 and the elastic body receiver 15 between your fingers and compress the spring 7, The space between the blocks 12 and 13 is expanded, and the blocks 12 and 13, the shaft 14, and the elastic body support are expanded. The retainer 15 and the spring 7 can be easily attached and detached together from the flanges 9 and 10. Detachment Since maintenance is easy, equipment maintenance time can be reduced.
【0012】0012
本考案によれば、反応管1とガス導入管2の接続部9,10及び反応管1と排 気管の接続部をそれぞれOリング3によりシールできるので、ガス漏れを完全に 防止することができ、外部の金属が腐食される恐れはない。又、反応管1に対し ガス導入管2及び排気管の位置調整を容易に行い位置調整の時間を短縮すること ができる。 According to the present invention, the connection portions 9 and 10 between the reaction tube 1 and the gas introduction tube 2, and the connection portions 9 and 10 between the reaction tube 1 and the gas inlet tube 2 and the Each trachea connection can be sealed with an O-ring 3, completely preventing gas leaks. There is no risk of corrosion of the external metal. Also, for reaction tube 1 To easily adjust the position of a gas inlet pipe 2 and an exhaust pipe to shorten the time for position adjustment. I can do it.
【図1】本考案装置の第1実施例の要部の構成を示す断
面図である。FIG. 1 is a cross-sectional view showing the configuration of essential parts of a first embodiment of the device of the present invention.
【図2】第2実施例の要部の構成を示す断面図である。FIG. 2 is a cross-sectional view showing the configuration of essential parts of a second embodiment.
【図3】従来装置の1例の要部の構成を示す断面図であ
る。FIG. 3 is a sectional view showing the configuration of essential parts of an example of a conventional device.
1 (石英)反応管 2 ガス導入管 3 Oリング 3A Oリング溝 4 球面摺合せ 5,6 フランジ 7 弾性体(スプリング) 9,10 接続部(フランジ) 11 アウタリング 12,13 ブロック 14 シャフト 15 弾性体受け 1 (quartz) reaction tube 2 Gas introduction pipe 3 O-ring 3A O-ring groove 4 Spherical sliding 5,6 Flange 7 Elastic body (spring) 9,10 Connection part (flange) 11 Outer ring 12,13 blocks 14 Shaft 15 Elastic body receiver
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 // C23C 14/58 8414−4K H01L 21/205 7739−4M (72)考案者 小泉 幹夫 東京都港区虎ノ門二丁目3番13号 国際電 気株式会社内Continuing from the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location // C23C 14/58 8414−4K H01L 21/205 7739−4M (72) Inventor Mikio Koizumi Toranomon, Minato-ku, Tokyo 2-3-13 Kokusai Electric Co., Ltd.
Claims (4)
(2)より導入し排気管より排気して反応管(1)内の
半導体に酸化,拡散等の成膜処理を行う半導体製造装置
において、前記反応管(1)とガス導入管(2)の接続
部(9,10)及び反応管(1)と排気管の接続部をそ
れぞれOリング(3)を介在させて接続してなる半導体
製造装置のガス管接続装置。Claim 1: A semiconductor in which a reaction gas is introduced into a reaction tube (1) through a gas introduction tube (2) and exhausted through an exhaust tube to perform film formation processes such as oxidation and diffusion on the semiconductor inside the reaction tube (1). In the production apparatus, the connecting portions (9, 10) between the reaction tube (1) and the gas introduction tube (2) and the connecting portion between the reaction tube (1) and the exhaust tube are connected with an O-ring (3) interposed therebetween. Gas pipe connection equipment for semiconductor manufacturing equipment.
部(9,10)及び反応管(1)と排気管の接続部をそ
れぞれ球面摺合せ(4)で接続し、各摺合せ接続部の摺
り合せ面にOリング溝(3A)を設け、これらのOリン
グ溝(3A)内にOリング(3)を挿設してなる請求項
1の半導体製造装置のガス管接続装置。2. The connecting portions (9, 10) between the reaction tube (1) and the gas introduction tube (2) and the connecting portion between the reaction tube (1) and the exhaust tube are connected by spherical sliding fittings (4), respectively. 2. A gas pipe connection for semiconductor manufacturing equipment according to claim 1, wherein O-ring grooves (3A) are provided in the sliding surface of the sliding connection part, and O-rings (3) are inserted into these O-ring grooves (3A). Device.
気管にそれぞれフランジ(5,6)を設け、反応管
(1)のフランジ(5)とガス導入管(2)のフランジ
(6)との間及び反応管(1)のフランジ(5)と排気
管のフランジとの間をそれぞれ弾性体(7)でクランプ
してなる請求項2の半導体製造装置のガス管接続装置。3. The reaction tube (1), the gas introduction tube (2), and the exhaust tube are provided with flanges (5, 6), respectively, and the flange (5) of the reaction tube (1) and the flange of the gas introduction tube (2) are provided. 3. A gas pipe connection device for a semiconductor manufacturing apparatus according to claim 2, wherein elastic bodies (7) are clamped between the flange (5) of the reaction tube (1) and the flange of the exhaust pipe.
部(9,10)及び反応管(1)と排気管の接続部をそ
れぞれフランジとし、これらフランジ(9,10)間に
Oリング(3)とアウタリング(11)を挿設し、両フ
ランジ(9,10)をブロック(12,13)で挟付
け、両ブロック(12,13)間を弾性体(7)で押圧
してなる請求項1の半導体製造装置のガス管接続装置。4. The connecting portion (9, 10) between the reaction tube (1) and the gas introduction tube (2) and the connecting portion between the reaction tube (1) and the exhaust tube are respectively flanges, and a gap between these flanges (9, 10) is provided. Insert the O-ring (3) and outer ring (11) into the holder, sandwich the flanges (9, 10) between the blocks (12, 13), and insert the elastic body (7) between the blocks (12, 13). 2. A gas pipe connection device for semiconductor manufacturing equipment according to claim 1, which is formed by pressing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992017442U JP2581049Y2 (en) | 1991-03-22 | 1992-02-24 | Semiconductor manufacturing equipment |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1744291 | 1991-03-22 | ||
JP3-17442 | 1991-03-22 | ||
JP1992017442U JP2581049Y2 (en) | 1991-03-22 | 1992-02-24 | Semiconductor manufacturing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04133430U true JPH04133430U (en) | 1992-12-11 |
JP2581049Y2 JP2581049Y2 (en) | 1998-09-17 |
Family
ID=31948303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1992017442U Expired - Lifetime JP2581049Y2 (en) | 1991-03-22 | 1992-02-24 | Semiconductor manufacturing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2581049Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012104755A (en) * | 2010-11-12 | 2012-05-31 | Tokyo Electron Ltd | Assembly method of vacuum processing apparatus and the vacuum processing apparatus |
KR20180043953A (en) * | 2016-10-21 | 2018-05-02 | 삼성중공업 주식회사 | Flange assembly for pipe and method for installing the same |
JP2020528491A (en) * | 2017-06-21 | 2020-09-24 | ピコサン オーワイPicosun Oy | Substrate processing equipment and method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63165843U (en) * | 1987-04-20 | 1988-10-28 | ||
JPH01141996U (en) * | 1988-03-23 | 1989-09-28 | ||
JPH03149489A (en) * | 1989-11-02 | 1991-06-26 | Fujitsu Ltd | Coupler for connection of gas piping |
-
1992
- 1992-02-24 JP JP1992017442U patent/JP2581049Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63165843U (en) * | 1987-04-20 | 1988-10-28 | ||
JPH01141996U (en) * | 1988-03-23 | 1989-09-28 | ||
JPH03149489A (en) * | 1989-11-02 | 1991-06-26 | Fujitsu Ltd | Coupler for connection of gas piping |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012104755A (en) * | 2010-11-12 | 2012-05-31 | Tokyo Electron Ltd | Assembly method of vacuum processing apparatus and the vacuum processing apparatus |
KR20180043953A (en) * | 2016-10-21 | 2018-05-02 | 삼성중공업 주식회사 | Flange assembly for pipe and method for installing the same |
JP2020528491A (en) * | 2017-06-21 | 2020-09-24 | ピコサン オーワイPicosun Oy | Substrate processing equipment and method |
US11505864B2 (en) | 2017-06-21 | 2022-11-22 | Picosun Oy | Adjustable fluid inlet assembly for a substrate processing apparatus and method |
Also Published As
Publication number | Publication date |
---|---|
JP2581049Y2 (en) | 1998-09-17 |
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Legal Events
Date | Code | Title | Description |
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EXPY | Cancellation because of completion of term |