JPH04131938U - semiconductor wafer carrier - Google Patents

semiconductor wafer carrier

Info

Publication number
JPH04131938U
JPH04131938U JP3718791U JP3718791U JPH04131938U JP H04131938 U JPH04131938 U JP H04131938U JP 3718791 U JP3718791 U JP 3718791U JP 3718791 U JP3718791 U JP 3718791U JP H04131938 U JPH04131938 U JP H04131938U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
partition
partitions
pair
high partition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3718791U
Other languages
Japanese (ja)
Inventor
伸弘 三上
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP3718791U priority Critical patent/JPH04131938U/en
Publication of JPH04131938U publication Critical patent/JPH04131938U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】作業者が半導体ウェハを収納する際に、高仕切
と低仕切が交互にあるため、作業者が高仕切の側面に軽
く当て収納し易くなると共に、半導体ウェハを同一の凹
部に誤収納することにより、半導体ウェハの接触による
傷がつかないようにする。 【構成】半導体ウェハの端面を支持する一対の高仕切1
と、高仕切1に隣接し、下面8からの高さが高仕切1よ
り低い一対の低仕切2とを前面7に平行で交互に有し、
高仕切1と高仕切2との間に凹部4を有する。
(57) [Summary] [Purpose] When a worker stores semiconductor wafers, the high and low partitions are arranged alternately, making it easier for the worker to store the semiconductor wafers by lightly touching the side of the high partition. By erroneously storing the semiconductor wafer in the same recess, damage caused by contact with the semiconductor wafer is prevented. [Structure] A pair of high partitions 1 that support the edge of a semiconductor wafer
and a pair of low partitions 2 adjacent to the high partition 1 and having a lower height from the lower surface 8 than the high partition 1, which are parallel to the front surface 7 and alternately,
A recess 4 is provided between the high partition 1 and the high partition 2.

Description

【考案の詳細な説明】[Detailed explanation of the idea]

【0001】0001

【産業上の利用分野】[Industrial application field]

本考案は半導体ウェハキャリアに関する。 The present invention relates to a semiconductor wafer carrier.

【0002】0002

【従来の技術】[Conventional technology]

(a),(b)は従来の一例を示す斜視図、および断面図である。 (a) and (b) are a perspective view and a sectional view showing a conventional example.

【0003】 従来の半導体ウェハキャリアは、隣接する半導体ウェハの端面を支持する前面 7に平行な一対の仕切9と、仕切9に隣接した同一形状の一対の仕切10により 前面7に平行で相対向した凹部4を有し構成される。0003 Traditional semiconductor wafer carriers have a front surface that supports the edge of adjacent semiconductor wafers. A pair of partitions 9 parallel to 7 and a pair of partitions 10 of the same shape adjacent to partition 9 It has concave portions 4 parallel to and facing each other on the front surface 7.

【0004】 前記凹部4に半導体ウェハを収納する時には、例えば作業者がピンセットによ り半導体ウェハ端部を把持して、仕切9と仕切10との間に接近させ、目視で確 認後、凹部4に収納していた。0004 When storing the semiconductor wafer in the recess 4, the operator may use tweezers, for example. Grip the edge of the semiconductor wafer, bring it close to between partition 9 and partition 10, and visually confirm it. After recognition, it was stored in recess 4.

【0005】[0005]

【考案が解決しようとする課題】[Problem that the idea aims to solve]

上述した従来の半導体ウェハキャリアは、隣接している一対の仕切が同一形状 で比較的細かいピッチで並んでいるため、作業者が半導体ウェハを収納する際に 、半導体ウェハの左右どちらか一方を、隣接している半導体ウェハが既に収納さ れている凹部に誤って収納することも容易にできてしまうため、相互の半導体ウ ェハが接触し、傷が付易いという問題点があった。 In the conventional semiconductor wafer carrier mentioned above, a pair of adjacent partitions have the same shape. Because they are lined up at a relatively fine pitch, it is difficult for workers to store semiconductor wafers. , if either the left or right side of the semiconductor wafer is already accommodated with an adjacent semiconductor wafer. It is easy to accidentally store the semiconductors in the recesses where they are placed. There was a problem in that the wafers came into contact with each other and were easily damaged.

【0006】[0006]

【課題を解決するための手段】[Means to solve the problem]

本考案の半導体ウェハキャリアは、半導体ウェハの端面を支持する一対の高仕 切と、前記高仕切に隣接し下面からの高さが前記高仕切より低い一対の低仕切と 、半導体ウェハを収納する相対向した凹部を前面に平行に有している。 The semiconductor wafer carrier of the present invention consists of a pair of high-quality materials that support the edge of a semiconductor wafer. a pair of low partitions adjacent to the high partition and having a lower height from the lower surface than the high partition; , having parallel recesses on the front surface that accommodate the semiconductor wafer and facing each other.

【0007】[0007]

【実施例】 次に、本考案の実施例について、図面を参照して説明する。【Example】 Next, embodiments of the present invention will be described with reference to the drawings.

【0008】 図1(a),(b)は本考案の一実施例を示す斜視図、および断面図である。[0008] FIGS. 1(a) and 1(b) are a perspective view and a sectional view showing an embodiment of the present invention.

【0009】 図(a),(b)に示す半導体ウェハキャリアは、半導体ウェハの端面を支持 する一対の高仕切1と、高仕切1に隣接し、下面8からの高さが高仕切1より低 い一対の低仕切2とを前面7に平行で交互に有し、高仕切1と高仕切2との間に 凹部4を有する。[0009] The semiconductor wafer carrier shown in Figures (a) and (b) supports the end surface of the semiconductor wafer. a pair of high partitions 1 that are adjacent to the high partition 1 and whose height from the bottom surface 8 is lower than the high partition 1; It has a pair of low partitions 2 parallel to the front surface 7 and alternately, and between the high partitions 1 and 2. It has a recess 4.

【0010】 次に本実施例による半導体ウェハキャリアへの半導体ウェハ収納時の使用法を 説明する。0010 Next, we will explain how to use this example when storing semiconductor wafers in a semiconductor wafer carrier. explain.

【0011】 作業者が、ピンセットにより端部を把持した第一の半導体ウェハを、高仕切1 の側面5に半導体ウェハ端面を軽く当て、凹部4が前面7に平行で相対向してい ることを確認して収納する。[0011] A worker holds the first semiconductor wafer, the end of which is gripped with tweezers, into the high partition 1. Lightly touch the end surface of the semiconductor wafer to the side surface 5 of the Make sure that it is stored properly.

【0012】 次に第2の半導体ウェハを収納する時には、次の位置にある高仕切3の側面6 に半導体ウェハの端面を同様にして軽く当て収納する。0012 Next, when storing the second semiconductor wafer, the side surface 6 of the high partition 3 in the next position In the same way, lightly touch the end face of the semiconductor wafer and store it.

【0013】[0013]

【考案の効果】[Effect of the idea]

以上説明したように、本考案は、隣接する半導体ウェハの端面を支持する一対 の高仕切と、前記高仕切に隣接し、下面からの高さが前記高仕切より低い一対の 低仕切と、半導体ウェハを収納する相対向した凹部を前面に平行に有することに よって、作業者が半導体ウェハを収納する際に、高仕切と低仕切が交互にあるた め、目で仕切の断差を確認し、作業者が高仕切の側面に軽く当て収納し易くなる と共に、半導体ウェハを同一の凹部に誤収納することにより、半導体ウェハの接 触による傷がつかなくなるという効果がある。 As explained above, the present invention provides a pair of devices that support the end surfaces of adjacent semiconductor wafers. a pair of high partitions that are adjacent to the high partition and whose height from the bottom surface is lower than that of the high partition. It has a low partition and parallel recesses facing each other on the front surface for storing semiconductor wafers. Therefore, when workers store semiconductor wafers, they need to use high and low partitions alternately. This makes it easier for the worker to visually check the difference in the partition and store it by lightly touching the side of the high partition. At the same time, by incorrectly storing semiconductor wafers in the same recess, semiconductor wafers may be connected. It has the effect of preventing scratches caused by touch.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】(a),(b)は本考案の一実施例を示す斜視
図、および断面図である。
FIGS. 1(a) and 1(b) are a perspective view and a sectional view showing an embodiment of the present invention.

【図2】(a),(b)は従来の一例を示す斜視図、お
よび断面図である。
FIGS. 2(a) and 2(b) are a perspective view and a sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 高仕切 2 低仕切 3 高仕切 4 凹部 5 側面 6 側面 7 前面 8 下面 9 仕切 10 仕切 1 High partition 2 Low partition 3 High partition 4 Recess 5 side 6 side 7 Front 8 Bottom surface 9 Partition 10 Partition

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 半導体ウェハの端面を支持する一対の高
仕切と、前記高仕切に隣接し下面からの高さが前記高仕
切より低い一対の低仕切と、半導体ウェハを収納する相
対向した凹部を前面に平行に有することを特徴とした半
導体ウェハキャリア。
1. A pair of high partitions that support end surfaces of semiconductor wafers, a pair of low partitions adjacent to the high partitions and having a lower height from the lower surface than the high partitions, and opposing recesses that accommodate the semiconductor wafers. A semiconductor wafer carrier characterized in that it has parallel to the front surface.
JP3718791U 1991-05-24 1991-05-24 semiconductor wafer carrier Pending JPH04131938U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3718791U JPH04131938U (en) 1991-05-24 1991-05-24 semiconductor wafer carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3718791U JPH04131938U (en) 1991-05-24 1991-05-24 semiconductor wafer carrier

Publications (1)

Publication Number Publication Date
JPH04131938U true JPH04131938U (en) 1992-12-04

Family

ID=31919000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3718791U Pending JPH04131938U (en) 1991-05-24 1991-05-24 semiconductor wafer carrier

Country Status (1)

Country Link
JP (1) JPH04131938U (en)

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