JPH04131650U - sputtering equipment - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a sputtering device that facilitates not only target replacement but also maintenance inside the chamber. [Structure] The sputtering apparatus of the present invention includes a cover 4 that forms part of a chamber side wall 3a and is rotatable around a hinge 5, and a cover 4 that is provided on the cover 4, forms a part of the side wall 3a, and supports a target 8. The plate 6 is rotatable around the hinge 7.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention provides a sputtering device, especially a sputtering device with a A target support is used to support a target placed opposite the substrate on which a film is to be deposited. The present invention relates to a sputtering device having a holding device.

0002

[Conventional technology]

Generally, sputtering equipment separates the substrate to be deposited and the target in a chamber. A film is formed on the substrate by arranging them facing each other and applying, for example, a high frequency voltage between them. It performs formation.

0003 In such sputtering equipment, a chip is installed to facilitate target replacement. A target support member forming a part of the chamber side wall is configured to be movable in the horizontal direction, In addition, it has been proposed that the entire support member is rotatable (Japanese Patent Laid-Open No. 1-27 No. 2768, No. 1-312070).

0004 When replacing the target, move the target support member horizontally and placed outside the chamber. Next, rotate the entire support member to position the target in a horizontal position. to become a force. In this state, target replacement work is performed.

[0005]

[Problem that the idea aims to solve]

When replacing the target, clean the walls inside the chamber, replace the adhesion prevention plate, etc. In many cases, maintenance is also carried out at the same time.

[0006] However, in the conventional configuration, the target and the support member are located at the chamber opening. Because it is placed at the front, this support member etc. gets in the way and makes maintenance easier. The problem arises that it cannot be done.

[0007] The purpose of this invention is not only to replace the target, but also to perform maintenance inside the chamber. It is an object of the present invention to provide a sputtering device that can perform sputtering easily.

[0008]

[Means to solve the problem]

The sputtering device according to the present invention has a Target support for supporting the target placed opposite the substrate on which the film is to be deposited. The apparatus includes a first lid plate and a second lid plate. Said first lid The plate constitutes a part of the chamber side wall and is rotatable around a vertical axis. Said The second lid plate is provided on the first lid plate, constitutes a part of the chamber side wall, and serves as a target. It is rotatable around a horizontal axis.

[0009]

[Effect]

In the sputtering apparatus according to the present invention, during maintenance inside the chamber, Rotate the first lid plate around the vertical axis. This allows the second lid to support the target to The plate rotates around the vertical axis together with the first cover plate.

0010 This provides sufficient work space in front of the chamber side wall for maintenance work. can be done easily.

[0011] Also, when replacing the target, the second cover plate can be rotated around the horizontal axis. Pull the target outward from the side wall of the chamber. This makes replacement work easier. I can do it.

0012

【Example】

Figure 1 shows an in-line vertical sputtering device according to an embodiment of the present invention. There is. This sputtering device consists of an inlet chamber 1 and an outlet chamber arranged at both ends. 2, and a film forming chamber 3 disposed between them. Inside each room 1 to 3 As shown in the deposition chamber 3, each substrate cart 4 holding the substrate to be deposited is in a vertical position. It is designed to be transported while being supported by force. In addition, in each room 1 to 3, A transport mechanism (not shown) for transporting the substrate cart 4 is provided.

[0013] A target support device as shown in FIGS. 2 and 3 is provided at the front of the film forming chamber 3. It is.

[0014] In these figures, on the side wall 3a of the chamber 3 there is an opening formed in the side wall 3a. A cover 4 is arranged to close the mouth (not shown). This cover 4 is It is attached to the side wall 3a by a screw 5, and is rotatable around a vertical axis. Ru. Further, an opening (not shown) is formed in the cover 4, and an opening (not shown) is formed on the cover 4. A plate 6 is arranged that can close this opening. This plate 6 is It is attached to the cover 4 by the lower hinge 7 and can be rotated around the horizontal axis. It becomes. A target 8 is supported on the inner surface of the plate 6. Tar The get 8 is connected to each substrate transported within the film forming chamber 3 at the closed position of the plate 6. It is now possible to face each other. Additionally, a target 8 is provided on the outer surface of the plate 6. and a matching box 10 for efficiently supplying power between the boards. ing. A handle 11 is attached on the matching box 10.

[0015] Next, the operation will be explained. When replacing the target 8, use the handle 11 to hold the plate 6 on the hinge 7. The target 8 is placed in a horizontal position (see the two-dot chain line in FIG. 2). this condition Replace target 8 from the state. In this case, target 8 is horizontal. This makes the replacement work easy.

[0016] When performing maintenance on the film forming chamber 3, the plate 6 is placed in close contact with the cover 4. From the state (solid line state in FIGS. 2 and 3), rotate the cover 4 around the hinge 5 ( (See the two-dot chain line in Figure 3). Then, maintenance inside the film forming chamber 3 is performed from the opening of the side wall 3a. Do the work.

[0017] In this case, the entire cover 4 including the plate 6 and target 8 is attached to the side wall 3a. Because the opening is retracted, there is sufficient space in front of the opening to work. Secured. This improves workability and makes maintenance work easier. .

[0018]

[Effect of the idea]

The sputtering apparatus according to the present invention includes a first lid plate that is rotatable around a vertical axis; Since a second cover plate is provided on the first cover plate and is rotatable around a horizontal axis, the Not only replacement of the target but also maintenance inside the chamber can be easily performed. Especially in In line type sputtering equipment, especially to suppress dust generation inside the chamber. This has become an important issue, and a structure that allows easy maintenance is essential for the steps after film formation. It has the effect of greatly contributing to improving retention.

[Brief explanation of drawings]

FIG. 1 is a schematic front view of an in-line sputtering apparatus according to an embodiment of the present invention.

FIG. 2 is an overall perspective view of the embodiment.

FIG. 3 is an overall perspective view of the embodiment.

[Explanation of symbols]

3 Film forming chamber 4 Cover 5,7 Hinge 6 plate 8 Target

Claims (1)

[Scope of utility model registration request] 1. A sputtering apparatus comprising a target support device for supporting a target disposed facing a substrate to be deposited in a chamber of the sputtering apparatus, wherein a vertical axis constitutes a part of a side wall of the chamber. a first lid plate rotatable around a horizontal axis; and a second lid plate rotatable around a horizontal axis, which is provided on the first lid plate, forms a part of the chamber side wall, and supports the target. , sputtering equipment.