JPH0412689Y2 - - Google Patents

Info

Publication number
JPH0412689Y2
JPH0412689Y2 JP1987019078U JP1907887U JPH0412689Y2 JP H0412689 Y2 JPH0412689 Y2 JP H0412689Y2 JP 1987019078 U JP1987019078 U JP 1987019078U JP 1907887 U JP1907887 U JP 1907887U JP H0412689 Y2 JPH0412689 Y2 JP H0412689Y2
Authority
JP
Japan
Prior art keywords
support plate
center line
leads
external leads
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987019078U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63127141U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987019078U priority Critical patent/JPH0412689Y2/ja
Publication of JPS63127141U publication Critical patent/JPS63127141U/ja
Application granted granted Critical
Publication of JPH0412689Y2 publication Critical patent/JPH0412689Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987019078U 1987-02-12 1987-02-12 Expired JPH0412689Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987019078U JPH0412689Y2 (https=) 1987-02-12 1987-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987019078U JPH0412689Y2 (https=) 1987-02-12 1987-02-12

Publications (2)

Publication Number Publication Date
JPS63127141U JPS63127141U (https=) 1988-08-19
JPH0412689Y2 true JPH0412689Y2 (https=) 1992-03-26

Family

ID=30813349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987019078U Expired JPH0412689Y2 (https=) 1987-02-12 1987-02-12

Country Status (1)

Country Link
JP (1) JPH0412689Y2 (https=)

Also Published As

Publication number Publication date
JPS63127141U (https=) 1988-08-19

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