JPH0412683U - - Google Patents
Info
- Publication number
- JPH0412683U JPH0412683U JP5299990U JP5299990U JPH0412683U JP H0412683 U JPH0412683 U JP H0412683U JP 5299990 U JP5299990 U JP 5299990U JP 5299990 U JP5299990 U JP 5299990U JP H0412683 U JPH0412683 U JP H0412683U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- component mounting
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5299990U JPH0412683U (el) | 1990-05-23 | 1990-05-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5299990U JPH0412683U (el) | 1990-05-23 | 1990-05-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0412683U true JPH0412683U (el) | 1992-01-31 |
Family
ID=31573799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5299990U Pending JPH0412683U (el) | 1990-05-23 | 1990-05-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0412683U (el) |
-
1990
- 1990-05-23 JP JP5299990U patent/JPH0412683U/ja active Pending