JPH04126776A - Electrically conductive coating composition - Google Patents
Electrically conductive coating compositionInfo
- Publication number
- JPH04126776A JPH04126776A JP2245751A JP24575190A JPH04126776A JP H04126776 A JPH04126776 A JP H04126776A JP 2245751 A JP2245751 A JP 2245751A JP 24575190 A JP24575190 A JP 24575190A JP H04126776 A JPH04126776 A JP H04126776A
- Authority
- JP
- Japan
- Prior art keywords
- alcohol
- parts
- solvent
- paint
- coating composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 8
- 239000012799 electrically-conductive coating Substances 0.000 title claims 2
- 239000002904 solvent Substances 0.000 claims abstract description 22
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims abstract description 10
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011230 binding agent Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 8
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 150000001298 alcohols Chemical class 0.000 claims abstract description 6
- SJWFXCIHNDVPSH-UHFFFAOYSA-N octan-2-ol Chemical compound CCCCCCC(C)O SJWFXCIHNDVPSH-UHFFFAOYSA-N 0.000 claims abstract description 5
- BODRLKRKPXBDBN-UHFFFAOYSA-N 3,5,5-Trimethyl-1-hexanol Chemical compound OCCC(C)CC(C)(C)C BODRLKRKPXBDBN-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000008199 coating composition Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229910052763 palladium Inorganic materials 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229910052697 platinum Inorganic materials 0.000 abstract description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 abstract 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導電性塗料組成物に関し、より詳しくは部品を
塗料槽に浸漬する際、塗料液面を平にすることにより、
塗料が均一に部品に付着するようにレベリング性を改善
した塗料組成物に係わる。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a conductive coating composition, and more specifically, when parts are immersed in a paint tank, by flattening the coating liquid level,
It relates to a paint composition with improved leveling properties so that the paint adheres uniformly to parts.
従来、積層セラミックコンデンサ、タンタル固体電解コ
ンデンサ、チップ抵抗等の小型電子部品の端子電極を形
成するために、銀塗料、銀パラジウム塗料、銅塗料等の
導電性塗料をデイツプ法等により、電子部品の端子部分
に塗布する方式が利用されている。このような塗布方式
を用いる場合、実際の量産ラインの塗布工程においては
、同時に多数の電子部品め端子部分に塗料を塗布しなけ
ればならず、塗布前の塗料の液面はできるだけ平である
ことが望ましい。通常は、塗料の相分離を防ぐため、撹
拌を行っており、塗料のレベリング性が不良であれば、
液面にうねりを生じ、多数の部品に同時に均一に塗料を
塗布することは困難となる。しかるに、従来の塗料が量
産工程において、十分満足できる程良好なレベリング性
を有していたとは言い難く、従来の電気的特性を維持し
ながら、よりレベリング性を向上させ得る導電性塗料が
望まれていた。Conventionally, in order to form terminal electrodes of small electronic components such as multilayer ceramic capacitors, tantalum solid electrolytic capacitors, and chip resistors, conductive paints such as silver paint, silver palladium paint, and copper paint are applied to electronic components using the dip method. A method is used in which it is applied to the terminal area. When using this type of coating method, in the actual coating process on a mass production line, the paint must be applied to many electronic component terminals at the same time, and the liquid level of the paint must be as flat as possible before application. is desirable. Usually, stirring is performed to prevent phase separation of the paint, and if the leveling properties of the paint are poor,
This causes undulations in the liquid surface, making it difficult to uniformly apply paint to many parts at the same time. However, it is difficult to say that conventional paints have sufficiently good leveling properties in the mass production process, and there is a need for conductive paints that can improve leveling properties while maintaining conventional electrical properties. was.
本発明は導電性を低下させることなく、レベリンク性を
向上させ得る導電性塗料組成物を提供することを目的と
する。An object of the present invention is to provide a conductive coating composition that can improve level linking properties without reducing conductivity.
本発明は金属粉、有機バインダーおよび溶剤を含む導電
性塗料組成物において、溶剤成分として２−エチルヘキ
シルアルコール、２−オクチルアルコール、ｎ−オクチ
ルアルコール、３゜５．５−トリメチルヘキシルアルコ
ール、ノニルアルコールの群から選ばれる１種以上のア
ルコールを他の溶剤と混合して用いることにより、前記
問題点を解決したものである。The present invention provides a conductive coating composition containing metal powder, an organic binder, and a solvent, in which 2-ethylhexyl alcohol, 2-octyl alcohol, n-octyl alcohol, 3゜5.5-trimethylhexyl alcohol, and nonyl alcohol are used as solvent components. The above problems are solved by using one or more alcohols selected from the group mixed with other solvents.
本発明では溶剤成分として、２−エチルヘキシルアルコ
ール、２−オクチルアルコール、ｎ−オクチルアルコー
ル、３，５．５−）−リメチルヘキシルアルコール、ノ
ニルアルコールの群から選ばれる１種以上のアルコール
（以下、これを本発明必須溶剤という）を他の溶剤と混
合して用いているため、これらアルコールが塗料の粘度
を低下せしめ、レベリング性を改善するものと思われる
。In the present invention, the solvent component is one or more alcohols selected from the group of 2-ethylhexyl alcohol, 2-octyl alcohol, n-octyl alcohol, 3,5.5-)-limethylhexyl alcohol, and nonyl alcohol (hereinafter referred to as (referred to as the essential solvent of the present invention) is used in combination with other solvents, it is thought that these alcohols reduce the viscosity of the paint and improve the leveling properties.
以下、本発明をより詳細に説明する。The present invention will be explained in more detail below.
本発明で使用する金属粉は、一般に導電性塗料に用いら
れる導電性良好な金属であればいずれをも使用できる。As the metal powder used in the present invention, any metal with good conductivity that is generally used in conductive paints can be used.
例えば、Ａｕ、Ａｇ、Ｐｔ。For example, Au, Ag, Pt.
Ｐｄ、Ｃｕ、Ｎｉ、ＡＱ等の１種または２種、あるいは
これらの合金、混合物も利用できる。One or two of Pd, Cu, Ni, AQ, etc., or an alloy or a mixture thereof can also be used.
さらにこれら金属または合金を表面に被覆した粉体も使
用できる。その形状は１球状、樹枝状、鱗片状、粒状等
のあらゆる形状のものが含まれる。さらに、比表面積、
タップ密度、粒度分布等の物性も特に限定されない。Furthermore, powder whose surface is coated with these metals or alloys can also be used. Its shape includes all shapes such as spherical, dendritic, scaly, and granular. Furthermore, the specific surface area,
Physical properties such as tap density and particle size distribution are also not particularly limited.
本発明で使用する有機バインダーとしては、熱硬化性樹
脂および熱可塑性樹脂が挙げられる。Organic binders used in the present invention include thermosetting resins and thermoplastic resins.
熱硬化性樹脂としては、例えばフェノール樹脂、エポキ
シ樹脂、メラミン樹脂、ウレタン樹脂等が挙げられる。Examples of the thermosetting resin include phenol resin, epoxy resin, melamine resin, and urethane resin.
熱可塑性樹脂としては、例えばアクリル樹脂、ポリエス
テル樹脂等が挙げられる。勿論、これらの２種あるいは
それ以上の混合物でもよい。Examples of thermoplastic resins include acrylic resins and polyester resins. Of course, a mixture of two or more of these may also be used.
溶剤としては、２−エチルヘキシルアルコール、２−オ
クチルアルコール、ｎ−オクチルアルコール、３，５．
５−トリメチルヘキシルアルコール、ノニルアルコール
の群から選ばれる１種以上のアルコールを必須成分とす
る。混合可能な溶剤としては、上記した有機バインダー
としての樹脂の良溶剤であれば、いずれをも使用でき、
例えばメチルカルピトール、ｎ−ブチルセロソルブ、ｎ
−ブチルカルピトールアセテート等が挙げられる。Examples of the solvent include 2-ethylhexyl alcohol, 2-octyl alcohol, n-octyl alcohol, 3,5.
The essential component is one or more alcohols selected from the group of 5-trimethylhexyl alcohol and nonyl alcohol. As a miscible solvent, any solvent can be used as long as it is a good solvent for the resin as an organic binder mentioned above.
For example, methyl calpitol, n-butyl cellosolve, n
-butylcarpitol acetate and the like.
その他の添加剤として、必要に応じて各種の分散剤、消
泡剤等が使用できる。As other additives, various dispersants, antifoaming agents, etc. can be used as necessary.
上記した、金属粉、有機バインダー、溶剤、その他添加
剤等の割合は、金属粉１００重量部に対し、有機バイン
ダー５〜６０重量部、本発明必須の溶剤０．１〜５０重
量部、その他の溶剤０．１−５０重量部、添加剤等０．
０１〜２重量部とする。有機バインダーの量が５重量部
を下回ると、導電性および塗膜強度が低下するようにな
り、逆に６ｏ重量部を超えると、やはり導電性が低下す
る。本発明必須の溶剤の量が０．１重量部を下回ると、
レベリング性が悪くなり、逆に５０重量部を超えると、
粘度が低下し過ぎ、作業性も悪化する。その他の溶剤は
作業性の良い塗料粘度に調整するために適当量添加する
。実用的には上記に示した範囲の量とすることが適当で
ある。また、添加剤（分散剤、消泡剤等）は必要に応じ
て適当量添加する。実用的には上記に示した範囲の量と
する。The proportions of the metal powder, organic binder, solvent, other additives, etc. mentioned above are: 5 to 60 parts by weight of the organic binder, 0.1 to 50 parts by weight of the solvent essential to the invention, and 100 parts by weight of the metal powder. 0.1-50 parts by weight of solvent, 0.0 parts by weight of additives, etc.
01 to 2 parts by weight. If the amount of the organic binder is less than 5 parts by weight, the conductivity and coating strength will decrease, and if it exceeds 6 parts by weight, the conductivity will also decrease. When the amount of the solvent essential to the present invention is less than 0.1 part by weight,
Leveling properties deteriorate, and conversely, if it exceeds 50 parts by weight,
The viscosity decreases too much and workability deteriorates. Other solvents are added in appropriate amounts to adjust the viscosity of the paint to provide good workability. Practically speaking, it is appropriate to set the amount within the range shown above. Further, additives (dispersants, antifoaming agents, etc.) are added in appropriate amounts as necessary. Practically speaking, the amount should be within the range shown above.
以下に実施例を示す。Examples are shown below.
第１表に示すような配合組成とした実施例１〜８および
比較例１〜３の塗料を３本ロールミルで混練して調製し
た。これらについて、比抵抗、ＴＩ値（チクソトロピッ
ク・インデックス）、付着性を測定した。The coating compositions of Examples 1 to 8 and Comparative Examples 1 to 3 having compositions shown in Table 1 were kneaded and prepared using a three-roll mill. Regarding these, specific resistance, TI value (thixotropic index), and adhesion were measured.
坦抵■夾定ガ遣
各試料塗料を紙フエノール基板上に２００メツシユテト
ロンスクリーンにてスクリーン印刷し、１６０℃のエア
オーブン中で３０分間加熱硬化させた後、抵抗を測定し
、比抵抗に換算した。Resistance Determination Each sample paint was screen printed on a paper phenol substrate using a 200 mesh Tetron screen, heated and cured in an air oven at 160°C for 30 minutes, then the resistance was measured and the specific resistance was determined. Converted.
工」」■しＬ１族
Ｅ型粘度計（東京計器製）で測定した１０回転での粘度
と１回転での粘度との比で表される。It is expressed as the ratio of the viscosity at 10 revolutions and the viscosity at 1 revolution as measured with an L1 group E type viscometer (manufactured by Tokyo Keiki).
すなわち、ＴＩ＝１回転での粘度／１０回転での粘度、
である。このＴＩ値が大きい程、チクシトロピック性が
大きくなり、レベリング性が悪くなる。逆に、この値が
小さい程、レベリング性が良くなる。That is, TI=viscosity at 1 rotation/viscosity at 10 rotations,
It is. The larger the TI value, the greater the thiccitropic property and the worse the leveling property. Conversely, the smaller this value is, the better the leveling properties are.
付１立夾定方蒸
量産テストにおいて、１万個の積層セラミックコンデン
サの外部電極として各試料塗料を使用した場合の付着性
の良否を下記の基準で判定した。Attachment 1: In the constant steam production test, the adhesion of each sample paint when used as the external electrode of 10,000 multilayer ceramic capacitors was judged based on the following criteria.
良好＝９９％以上むらなく均一に塗料が付着している。Good = paint adheres evenly and uniformly at 99% or more.
不良：上記以外の場合。Defective: Cases other than those listed above.
これらの測定結果を第１表に併記した。第１表より、実
施例１〜７の本発明必須の溶剤成分を含む塗料はいずれ
もレベリング性は良好であり、塗料の液面は平（山と谷
のギャップが１ｍｍ未満）なものとなった。従って、量
産時の多数の部品が同時に浸漬される場合に、部品間で
付着性のむらは生じなかった。これに対し、比較例１〜
３の塗料はレベリング性が不良のため、塗料の液面にう
ねり（山と谷のギャップが１ｍｍ以上）が生し、多数の
部品を同時に浸漬すると、部品間にむらが生じた。These measurement results are also listed in Table 1. From Table 1, all of the paints containing the essential solvent component of the present invention in Examples 1 to 7 had good leveling properties, and the liquid level of the paint was flat (the gap between the peaks and valleys was less than 1 mm). Ta. Therefore, when a large number of parts during mass production were immersed at the same time, no uneven adhesion occurred between the parts. On the other hand, Comparative Examples 1~
Since the paint No. 3 had poor leveling properties, the liquid level of the paint was undulating (the gap between the peaks and valleys was 1 mm or more), and when many parts were immersed at the same time, unevenness occurred between the parts.
（以下、余白）
〔発明の効果〕
以上のような本発明によれば、極めて良好なレベリング
性を有する塗料組成物が得られ、積層セラミックコンデ
ンサ、タンタル固体電解コンデンサ、チップ抵抗等の小
型の電気部品の端子部分等に導電性塗料を塗布する際、
電気特性 ′を維持しながら、付着性に優れ、量
産工程に適したものが得られ、当業界において極めて有
用である。(Hereinafter, blank space) [Effects of the Invention] According to the present invention as described above, a coating composition having extremely good leveling properties can be obtained, and can be used for small electrical applications such as multilayer ceramic capacitors, tantalum solid electrolytic capacitors, and chip resistors. When applying conductive paint to the terminals of parts, etc.
It is extremely useful in this industry because it has excellent adhesion while maintaining electrical properties and is suitable for mass production processes.
Claims (1)
料組成物において、溶剤成分として２−エチルヘキシル
アルコール、２−オクチルアルコール、ｎ−オクチルア
ルコール、３，５，５−トリメチルヘキシルアルコール
、ノニルアルコールの群から選ばれる１種以上のアルコ
ールを他の溶剤と混合して用いることを特徴とする導電
性塗料組成物。1. In a conductive coating composition containing metal powder, an organic binder, and a solvent, the group of solvent components is 2-ethylhexyl alcohol, 2-octyl alcohol, n-octyl alcohol, 3,5,5-trimethylhexyl alcohol, and nonyl alcohol. An electrically conductive coating composition characterized by using one or more alcohols selected from the following in combination with other solvents.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2245751A JP2754087B2 (en) | 1990-09-14 | 1990-09-14 | Conductive paint composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2245751A JP2754087B2 (en) | 1990-09-14 | 1990-09-14 | Conductive paint composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04126776A true JPH04126776A (en) | 1992-04-27 |
| JP2754087B2 JP2754087B2 (en) | 1998-05-20 |
Family
ID=17138255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2245751A Expired - Fee Related JP2754087B2 (en) | 1990-09-14 | 1990-09-14 | Conductive paint composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2754087B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005298793A (en) * | 2004-03-18 | 2005-10-27 | Sekisui Chem Co Ltd | Conductive paste |
-
1990
- 1990-09-14 JP JP2245751A patent/JP2754087B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005298793A (en) * | 2004-03-18 | 2005-10-27 | Sekisui Chem Co Ltd | Conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2754087B2 (en) | 1998-05-20 |
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