JPH0412641U - - Google Patents
Info
- Publication number
- JPH0412641U JPH0412641U JP5305290U JP5305290U JPH0412641U JP H0412641 U JPH0412641 U JP H0412641U JP 5305290 U JP5305290 U JP 5305290U JP 5305290 U JP5305290 U JP 5305290U JP H0412641 U JPH0412641 U JP H0412641U
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- mounting block
- view
- heater chip
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims description 2
- 238000002788 crimping Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5305290U JPH0412641U (el) | 1990-05-23 | 1990-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5305290U JPH0412641U (el) | 1990-05-23 | 1990-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412641U true JPH0412641U (el) | 1992-01-31 |
Family
ID=31573900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5305290U Pending JPH0412641U (el) | 1990-05-23 | 1990-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412641U (el) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57162784U (el) * | 1981-04-08 | 1982-10-13 |
-
1990
- 1990-05-23 JP JP5305290U patent/JPH0412641U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57162784U (el) * | 1981-04-08 | 1982-10-13 |