JPH0412639U - - Google Patents

Info

Publication number
JPH0412639U
JPH0412639U JP5315990U JP5315990U JPH0412639U JP H0412639 U JPH0412639 U JP H0412639U JP 5315990 U JP5315990 U JP 5315990U JP 5315990 U JP5315990 U JP 5315990U JP H0412639 U JPH0412639 U JP H0412639U
Authority
JP
Japan
Prior art keywords
nozzle
adhesive
adhesive application
nozzle member
holding means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5315990U
Other languages
English (en)
Other versions
JP2505661Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5315990U priority Critical patent/JP2505661Y2/ja
Publication of JPH0412639U publication Critical patent/JPH0412639U/ja
Application granted granted Critical
Publication of JP2505661Y2 publication Critical patent/JP2505661Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る接着剤塗布装置の一例の
正面図、第２図は第１図におけるホルダの平面図
、第３図はそれぞれ異なるノズル部材の拡大正面
図を各々示す。 １……接着剤塗布部、２……ホルダ、３……接
着剤、５，２０，３０……ノズル部材、５ａ，２
３，３３……軸部、６，２１，３１……塗布ノズ
ル、１０……装着孔、１１……割り溝、１２……
ねじ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 接着剤の塗布ノズルを設けたノズル部材を
    有する接着剤塗布手段と、この接着剤塗布手段を
    保持する保持手段とを有する接着剤塗布装置にお
    いて、前記接着剤の塗布パターンまたは塗布量な
    どに応じた複数種類のノズル部材を設けておくと
    ともに、各ノズル部材における前記保持手段によ
    る被保持部分を同大、同一形状に形成し、前記保
    持手段に前記複数種類のノズル部材の中から選ば
    れたノズル部材の被保持部分を装着してなること
    を特徴とする接着剤塗布装置。 (2) 各ノズル部材における被保持部分から塗布
    ノズル先端までの距離を同一にしたことを特徴と
    する請求項１記載の接着剤塗布装置。
JP5315990U 1990-05-22 1990-05-22 接着剤塗布装置 Expired - Fee Related JP2505661Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5315990U JP2505661Y2 (ja) 1990-05-22 1990-05-22 接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5315990U JP2505661Y2 (ja) 1990-05-22 1990-05-22 接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPH0412639U true JPH0412639U (ja) 1992-01-31
JP2505661Y2 JP2505661Y2 (ja) 1996-07-31

Family

ID=31574109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5315990U Expired - Fee Related JP2505661Y2 (ja) 1990-05-22 1990-05-22 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JP2505661Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197729U (ja) * 1987-12-21 1989-06-29
JP3004951U (ja) * 1994-06-03 1994-12-06 株式会社山口工業 自動車の塗装面前処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197729U (ja) * 1987-12-21 1989-06-29
JP3004951U (ja) * 1994-06-03 1994-12-06 株式会社山口工業 自動車の塗装面前処理装置

Also Published As

Publication number Publication date
JP2505661Y2 (ja) 1996-07-31

Similar Documents

Publication Publication Date Title
JPH0412639U (ja)
JPH03115639U (ja)
JPH0355230U (ja)
JPS6451646U (ja)
JPS6231952U (ja)
JPS63136764U (ja)
JPH02116875U (ja)
JPH0296009U (ja)
JPH0437555U (ja)
JPS60123295U (ja) 化粧板
JPS61192727U (ja)
JPS6186101U (ja)
JPS61155867U (ja)
JPH0417994U (ja)
JPS60122125U (ja) 粘着性被覆用品
JPH0211422U (ja)
JPS63170443U (ja)
JPH0386071U (ja)
JPH0464339U (ja)
JPS60151577U (ja) 液体塗布装置
JPH0469428U (ja)
JPS61144529U (ja)
JPS62182797U (ja)
JPS5829327U (ja) 塵払いブラシ
JPH02142425U (ja)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees