JPH0412406A - Flat superthin film insulated wire - Google Patents

Abstract

PURPOSE:To obtain a flat superthin film insulated wire having few defects such as pin holes by performing zincate treatment on a flat molded Al conductor and forming an insulating film of a resin varnish of the thickness not exceeding 5mum on this treated surface by electrodeposition. CONSTITUTION:A flat conductor 1 of Al is rolled into a flat shape. Zincate treatment is performed on this conductor 1, or further on this zincate treatment surface 2. Cu plating 3 is performed, further thereon, an insulating film 4 is formed by a resin varnish. This insulating film 4 is made a superthin film, whose thickness on the flat surface (surface of the width W) in the width direction of the conductor 1 is not exceeding 5mum. Thereby, the insulating film 4 of the corner part not only of the flat surface of the width W is extremely scarce in a defect such as pin hole, poor voltage resistance, poor heat shock resistance and crack, and a super thin film of the wire as a whole can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a rectangular ultra-thin film insulated wire having a conductor made of aluminum.

[Conventional technology]

Currently, as ultra-thin film insulated wires, particularly rectangular ultra-thin film insulated wires, only insulated wires having a relatively thick insulation film of about 8 to 20 μm at most have been proposed.

However, with recent advances in technology, there is a strong demand for thinner TL line insulating layers in order to reduce the weight and size of electrical equipment. Insulated wires have not been developed at all. The reason for this is that although it is relatively easy to form an ultra-thin insulating layer on both flat surfaces of a rectangular conductor depending on the method of applying and baking the insulating varnish, it is difficult to form an ultra-thin insulating layer on some of the corners of the conductor. This is because it is extremely difficult to form. On the other hand, as another method of manufacturing a rectangular insulated wire, there is a method of manufacturing an insulated wire by forming an insulating film on a round conductor and then rolling it. However, with this method, residual stress remains in the insulating film, resulting in a significant decline in voltage resistance and heat shock resistance.Also, when the rolling ratio is high or the insulating film is ultra-thin, cracks may occur in the film. .

[Problem to be solved by the invention]

The problem to be solved by the present invention is to develop a rectangular insulated wire in which a super II insulation film is formed on a rectangular conductor in view of the problems disclosed in the above-mentioned conventional techniques. More specifically, at least a rectangular conductor (particularly a thickness of 500 μm
The purpose of the present invention is to develop a rectangular ultra-thin film insulated wire in which an insulating layer of super 11 films, in which the thickness of the insulating film on the flat surface in the width direction of the ultra-fine wire (as described below) is 5 μm or less, is formed on a rectangular conductor.

[Means to solve the problem]

This problem involves performing zincate treatment on a conductor made of aluminum that has been formed into a rectangular shape by rolling, or further applying copper plating on the zincate treatment surface, and then electrodepositing a resin varnish on the zincate treatment surface or copper plating surface. The present invention is solved by a rectangular ultra-thin film insulated wire having an insulating film formed thereon, characterized in that the thickness of the insulating film on the flat surface at least in the width direction of the conductor is 5 μm or less.

[Structure and operation of the invention]

The insulated wire of the present invention basically has the following configuration.

(i) The conductor is made of aluminum; (11) the conductor is a rectangular conductor formed by rolling, particularly an ultra-fine rectangular conductor; (ii) the conductor is subjected to zincate treatment;
or copper plating is further applied on the zincate-treated surface; (iv) an insulating film is formed by electrodeposition of resin varnish on the zincate-treated surface or copper-plated surface; (v) The thickness of the insulating film on a flat surface (hereinafter referred to as a flat part) at least in the width direction of the conductor is an ultra-thin film of 5 μm or less.

These items will be explained in more detail below.

The conductor in the insulated wire of the present invention is a rectangular conductor made of aluminum, preferably a very thin rectangular conductor. Specifically, as shown in FIGS. 1 and 2, the thickness t of the conductor is 500 μm or less, preferably 10 to 200 μm.
It is about m. Radiation W is approximately 100 to 5000 μm. Also, the aspect ratio (tow) is 1:3 to 1:10.
It is about 0.

The above-mentioned rectangular conductor is formed by rolling, and the rolling process can be performed by a conventional method.For example, a round conductor can be formed into an ultra-fine rectangular conductor using a rolling roll, or a large-sized rectangular conductor can be formed. For example, the conductor is formed into a small rectangular conductor using a rolling roll or the like.

By producing a rectangular conductor by rolling, it is possible to stably form each treatment layer by the following zincate treatment, copper plating treatment, and further electrodeposition treatment. That is, as described in the related art, it is possible to prevent film cracking and deterioration in voltage resistance, heat sickness resistance, etc. that occur when an insulating film is formed on a round conductor and then rolled into a rectangular conductor.

In addition, when a round conductor is subjected to zincate treatment and copper plating treatment and then rolled, cracks occur in the copper plating layer.
A uniform insulating film cannot be obtained in the next process of electrodeposition, and in addition, the formation of an insulating film due to the roughness of the cut surface of a part of the conductor corner that occurs when cutting individual rectangular conductors from a rectangular conductor plate. It can also solve difficulties.

The zincate treatment, copper plating treatment, and electrodeposition treatment applied to the rectangular conductor can all be performed by conventional means, and each treatment will be described next.

First, prior to the zincate treatment, it is desirable to remove aluminum oxide on the surface of the aluminum conductor using caustic soda or the like.

The zincate treatment may be carried out using a technique known per se, and preferably the treatment technique disclosed in JP-A-61-148900, for example. The processing liquid used for zincate treatment is
7. on the aluminum surface. Any material that can form an n-layer may be used, such as a treatment liquid containing a zinc compound such as zinc oxide and a caustic alkali such as caustic soda. A particularly preferred treatment solution is 200 to 600 g of caustic soda/
l, zinc oxide 20-200 g/j! , ferric chloride 0.
5-20g/l, potassium tartrate 1-100g//! ,
It is an aqueous solution consisting of 0.5 to 20 g/f of sodium nitrate.

The zincate treatment on the aluminum surface may be carried out at any temperature, but if it is carried out at a low temperature it will take a long time to form the Zn layer, while at a high temperature it will be difficult for the Zn layer to adhere to the aluminum surface. 20-65°C1 preferably 25
It is desirable to carry out in the temperature range of ~55°C. When carried out in this temperature range, the preferred treatment time is 1 to 60 seconds, preferably 3 to 30 seconds. Also, Z due to zincate treatment
The thickness of the n layer is 0.05 to 2.0 μm, preferably 0.05 to 2.0 μm.
The thickness may be approximately 0.08 to 1.0 μm.

Copper plating treatment on the zincate-treated surface of the zincate-treated aluminum conductor does not necessarily need to be performed in the present invention, and the process may be omitted and proceed to the next electrodeposition treatment. However, if copper plating is applied,
The presence of the copper plating layer makes it easier to solder when attaching terminals when using the completed wire. Therefore, the copper plating treatment may be performed according to a conventionally known technique, and either an electroplating method or a chemical plating method may be used. Also, there is no need to form a particularly thick copper plating layer,
A thin layer of about 0.1 to 10 μm is sufficient.

The electrodeposition treatment may also be performed using a conventionally known technique. In the insulation coating formed by electrodeposition, the thickness of the insulation coating at least on the flat part of the rectangular conductor is 5 μm or less, which is an ultra-thin insulation coating that has never been seen before, and is one of the greatest features of the present invention. It is. Conventionally, such an ultra-thin insulating layer has never been formed on an ultra-fine rectangular conductor, and as already explained in (Prior Technology), it is almost impossible to form an insulating layer on a part of the corner of the conductor, making it difficult to insulate. This could not form a film, and at the same time, when rolling a round electric wire on which an insulating film has already been formed, there are problems as described above.

The thickness of this insulating film is 5 μm or less at least on the flat portion of the rectangular conductor. More preferably, as shown in FIGS. 1 and 2, the flat portion of the conductor (surface in the width W direction) has a thickness of 0.5 to 3 μm, particularly preferably 0.
．． It is about 8 to 2 μm, and it is larger in the corner part of the conductor (plane in the direction of thickness t) than in the flat part,
Usually, it is 1.1 times or more than the flat part, for example, 1.1 to 10 times, preferably about 1.2 to 5 times. Although the insulating film is such an ultra-thin film as a whole, the number of pinholes (measurement method is JISC3), which is one of the indicators of its insulating properties.
003), 100 pieces/m or less, for example 70
particles/m or less, and has extremely excellent stable coverage from a practical standpoint.

A specific example of the electrodeposition process for forming such an ultra-thin insulating layer will be described below.

The ultra-thin insulating layer in the present invention has the above-mentioned zincate treatment (
It is formed by electrodepositing a resin varnish, preferably a water-dispersed resin varnish, on a rectangular conductor that has been subjected to a rectangular conductor (and copper plating treatment) to form an electrodeposited film, and then baking this. that time,
It is preferable that the thickness of a portion of the conductor corner is 1.1 times or more greater than the thickness of the flat portion under the electrodeposition conditions described below.

Even if baking is then performed under normal conditions, a good ultra-thin insulating layer can be formed. For your reference, when an ultra-thin film formed by electrodeposition using a solution-based resin varnish is baked, the formed ultra-thin film may sometimes flow due to the surface tension of the resin varnish. This makes it difficult to form a uniform film, and this is particularly noticeable at some corners, where almost no film is formed. Even if it can be formed, it can only be formed partially and it is difficult to form a high-quality insulating film. On the other hand, the number of pinholes is too large to be counted.

The resin varnish used in the present invention may be any resin varnish that can form an insulating film by electrodeposition, and any resin varnish that has been conventionally used as an electrodeposition resin varnish can be used. Among these, preferred is a water-dispersed varnish of acrylic resin. Examples of the acrylic resin in this case include the following. That is, (
a) As a component, at least one compound represented by the formula (1); As a type of compound and component (iii), the formula (2); ,
At least one compound represented by the formula (1) representing a glycidyl ether group or a glycidyl ester group (excluding cases where R1 and R4 are both hydrogen atoms or alkyl groups), and as component (C) Alternatively, from a copolymer obtained by reacting at least the above three components with an unsaturated organic acid having at least one double bond that can react with each double bond of the compound represented by formula (2). It is an acrylic resin.

The above (a) component R, , Rx, (b) component Ra, R
The number of carbon atoms in each of the organic acids serving as components 4 and (C) is approximately 30 or less, particularly preferably 15 or less, from the viewpoint of heat resistance of the resulting polyacrylic resin.

Preferred examples of component (a) include acrylonitrile,
These include methacrylonitrile, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, and acrolein. Particularly preferred examples of component (a) include those having a total carbon number of 15 or less in view of the heat resistance of the resulting polyacrylic resin.

Preferred examples of component (b) include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, acrylamide, methylol acrylamide, and ethylol acrylamide.

Preferred examples of component (C) include -basic acids such as acrylic acid, crotonic acid, vinyl acetic acid, methacrylic acid,
α-ethylacrylic acid, β-methylcrotonic acid, tiglic acid, 2-pentenoic acid, 2-hexenoic acid, 2-heptenoic acid, 2-octenoic acid, lO-undecenoic acid, 9-octadecenoic acid, cinnamic acid, atorbic acid , α-benzyl acrylic acid, methyl atrobic acid, 2,4-pentadienoic acid, 2,
4-hexadienoic acid, 2,4-dodecanedienoic acid, 9゜12-octadecadienoic acid, etc., maleic acid, fumaric acid, itaconic acid, citraconic acid, mesaconic acid, glutaconic acid, muconic acid, dihydromucone as dibasic acids. Examples of the tribasic acid include 1,2.4-putenttricarboxylic acid. More preferred examples of component (C) include acrylic acid, methacrylic acid, α-ethyl acrylic acid,
These include crotonic acid, maleic acid, and fumaric acid.

The polyacrylic resin used in the present invention is produced by a known polymerization method, such as emulsion polymerization, solution polymerization, or suspension polymerization, from 1 to 20 moles of component (a), preferably 2 to 20 moles of component (a) per mole of component (b) above.
~lO moles, most preferably 4 to 6 moles, and 0.01 to 0.2 moles per mole of component (a) plus component (b);
Preferably, it is obtained by reacting with 0.03 to 0.1 mol of component (C).

The above polyacrylic resin may be modified with styrene, its derivatives, or diolefins. In this case, the styrene derivative may have a nitrile group, a nitro group, a hydroxyl group, an amino group, or a vinyl group. , a phenyl group, a halogen atom such as chlorine or bromine, an alkyl group, an aralkyl group, or an N-alkylamino group.

In this specification, the alkyl group has 1 to 4 carbon atoms, such as methyl, ethyl, propyl, butyl, isobutyl, etc.
are preferred, which include, for example, aralkyl groups, N
The same applies to groups including an alkyl moiety as a part of the group, such as -alkyquamid group and alkylol group. In addition, as the aralkyl group, benzyl group, α or β
Examples of the N-alkylamino group include N-methylamino, N-ethylamino, and N-propylamino. Among these, preferred examples of styrene derivatives include methylstyrene, ethylstyrene, divinylbenzene, and chlorostyrene, and preferred examples of the diolefins include butadiene, pentadiene, and methyl-butadiene. The polyacrylic resin containing these modifiers is produced by the above-mentioned known polymerization method (a
), [with]), and (C) by adding one or more of the above-mentioned modifiers to a mixture and polymerizing the mixture, but the amount of styrene and its derivatives and diolefin added is (
a) Each mole of component should be kept to about 2 moles or less in the former case and about 1 mole or less in the latter case. The reason for this is that in the case of styrene, the resulting polyacrylic resin has poor flexibility, while in the case of diolefin, the softening temperature is low.

The polyacrylic resin used in the present invention usually has a molecular weight of about 10.00
It has a degree of polymerization of 0 to 1,000,000, but if the degree of polymerization is too low, the toughness of the resulting polyacrylic resin will be poor, while if the degree of polymerization is too high, the workability during painting will be worse. The preferred degree of polymerization of the polyacrylic resin is about 100,000 to 500,000.

Among the acrylic resins, epoxy acrylic resins are particularly preferred. In general, an emulsion of a polyacrylic resin itself produced by emulsion polymerization, or an emulsion of a polyacrylic resin dispersed in water together with a surfactant is preferred as the varnish.

When manufacturing the rectangular ultra-thin film insulated wire of the present invention, the concentration of the resin varnish is 0.1 to 10% by weight, preferably 0.
．． A suitable amount is about 3 to 5% by weight. If the concentration of the resin varnish is higher than 10% by weight, it will be difficult to form a good ultra-thin film, while if it is lower than 0.1% by weight, the number of pinholes will increase and the insulation will be insufficient. Further, the size of the resin dispersed particles in the water-dispersed varnish is usually 1.0 μm or less, preferably about 0.5 μm or less, and if the dispersed particles are too large, it is difficult to form a good ultra-thin film.

In the present invention, in the electrodeposition process, the conductor is immersed in a resin varnish and then electrodeposited. The conditions for electrodeposition at this time are that the DC voltage is 5~
100V, preferably 7 to 30V, electrodeposition time usually 0.
01 to 30 seconds, preferably about 0.03 to 15 seconds, and the varnish temperature during electrodeposition is 5 to 40°C, preferably 10 to 3
It is 5°C. At this time, it is also possible to superimpose alternating current charging on direct current charging.

Further, the baking temperature of the electrodeposition layer is usually 100 to 700°C, preferably 200 to 600°C.

Hereinafter, a specific method for manufacturing the rectangular ultra-viJ membrane insulated wire of the present invention will be explained based on the process flowchart shown in FIG.

First, an aluminum round conductor C' (for example, about 300 μm in diameter) wound on a winder lO is rolled by a rolling roll 11, and a rectangular conductor C (for example, thickness L 70 μm, width W 1000 pm, aspect ratio 1;14
．． 3) Shape.

Next, the aluminum oxide layer on the surface of the rectangular conductor is removed by treatment with a caustic soda aqueous solution (for example, 120 g/l) (this step is not shown). After that, caustic soda (e.g. 400 g/l), zinc oxide (e.g. 100 g/l), zinc oxide (e.g. 100 g/l),
g/f), ferric chloride (e.g., l g/l), potassium tartrate (e.g., 5 g/l), sodium nitrate (e.g., 5 g/f), zincate treatment aqueous solution tank 20 (e.g., temperature 30 C) (for example, for 30 seconds);
Zn layer (for example, 0.1 μm thick) on the surface of the rectangular conductor
is precipitated and immersed in the washing tank 21 to be washed with water.

Then, in order to perform copper plating using an electroplating method, the ZnN is passed through an electroplating bath 30 to form a copper plating layer (eg, 1.0 μm thick) on the ZnN. Thereafter, this is immersed in a water washing tank 31 to be washed with water, and if necessary, further dried in a dryer 32 to obtain an aluminum rectangular conductor having a Zn layer and a copper plating layer in this order on the conductor C.

Next, conductor C connected to the anode side of the DC power supply (not shown)
passes through an electrodeposition bath 40 filled with a water-dispersible resin varnish 41. A cylindrical cathode 42 is placed in the electrodeposition bath 40, and the resin is uniformly deposited on the copper plating layer of the conductor C due to the potential difference between the conductor C, which is an anode, and the cathode 42.

In the present invention, when the above-mentioned polyacrylic resin varnish is used as the water-dispersed varnish, the electrodeposited layer may be immediately dried and baked, but before drying and baking, a solvent bath filled with organic solvent 5I is used. It is particularly preferred to pass through 50 ml of water. The organic solvent 51 may be a polyacrylic resin that has been dissolved in at least about 1% by weight, preferably at least about 10% by weight, of water, and is precipitated on the conductor before drying and baking, but in a semi-cured state or earlier. A material that at least swells, preferably dissolves, is used.

For example, monohydric or polyhydric alcohols such as methanol, ethanol, probal, ethylene glycol, glycerin, or ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol isopropyl ether, ethylene glycol motu ether, ethylene glycol diethyl ether,
Cellosolves such as ethylene glycol dibutyl ether and ether glycol monophenyl ether, nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone, and ion-containing solvents such as dimethyl sulfoxide. is exemplified. In particular, N,N-dimethylformamide, N,N-
dimethylacetamide, N-methyl-2-pyrrolidone,
Dimethyl sulfoxide is preferred.

By the treatment with such a fla-containing solvent, the baking of the polyacrylic resin particles in the electrodeposited layer effectively causes their fusion to proceed, thereby forming a uniform film with few pinholes. Note that instead of passing the electrodeposited resin layer through the solvent bath 50, the same effective treatment can be performed by passing it through the vapor or mist of the above-mentioned organic solvent.

Next, a wiping device W such as an air wiper or a roller wiper is installed at the outlet of the electrodeposition tank 40 and the i-solvent tank 50.
(not shown) may be provided to continuously remove excess portions of the electrodeposition bath liquid 41 and organic solvent bath liquid 51 deposited on the deposited resin layer. In particular, when electrodeposition coating is performed at high speed, the adhering bath liquid may cause foaming during the baking process, which may impede high speed work. Therefore, if the bath liquid is removed by the above-mentioned wiping method, foaming can be prevented and high-speed work of about 50 m/min or higher can be performed.

The conductor leaving the organic solvent bath 50 enters a drying device 60. There, the conductor is heated to evaporate and remove the organic solvent and water in the deposited resin layer. The temperature of the drying device f60 varies depending on the type of organic solvent, but is generally 60 to 300°C, preferably about 100 to 250°C. High temperatures (e.g., about 200-500° C.) may be applied in the drying device 60 to simultaneously facilitate evaporative removal of the liquid and semi-cure or fully cure the electrodeposited resin on the conductor. In other words, the portion near the outlet of the drying device 60 may be maintained at a high temperature that can cure the electrodeposited resin, or another baking and curing device may be provided after the drying device. In this case, the resin layer is initially heated to about 150°C.
It is dried at a relatively low temperature, and then baked and hardened at a high temperature.

After drying, it is transferred to a baking furnace 70 where it is baked and hardened, and then wound up by a winder 80.

The baking temperature is around 200-700°C. In addition,
In some cases, baking and curing in the baking oven 70 may be omitted if the material is sufficiently baked and hardened during drying.

It goes without saying that the electric wire of the present invention may be provided with a self-fusing layer as an upper layer of the insulating layer to facilitate the work when the electric wire is wound into a coil.In this case, the insulating layer may be semi-cured or
Alternatively, a self-bonding layer is formed after complete curing. As for the formation method of the self-adhesive layer, it does not need to function as an insulator, and even if the layer thickness is quite uneven, it is acceptable, so the conventional so-called dip method painting is sufficient, and the varnish drawing method is sufficient. It may be done with felt etc. as appropriate.

Through the above manufacturing process, Zn1i2, copper plated N
3. An insulated wire in which the insulating film 4 is sequentially formed is obtained.

The insulated wire shown in FIG. 2 does not have the copper plating layer 3, which can be achieved by omitting the copper plating process in the above manufacturing process and performing the electrodeposition process after the zincate process.

〔Example〕

The present invention will be explained in more detail by showing Examples and Comparative Examples below. The water-dispersed resin varnish used in the following examples was prepared as follows.

[Varnish A]

Acrylic nitrile 5 mol, acrylic acid 1 mol, glycidyl methacrylate 0.3 mol, ion exchange water 760
A mixture consisting of 7.5 g of sodium lauryl sulfate, and 0.13 g of sodium persulfate is placed in a flask, and stirring is continued for 15 to 30 minutes at room temperature under a nitrogen stream. after that,
When this mixture was reacted for 4 hours at a temperature of 50 to 60°C, a water-dispersed acrylic varnish was obtained.

[Varnish B]

Acrolein 5 instead of the monomer mixture of [Varnish A]
Varnish A was prepared in the same manner as [Varnish A] except that 1 mole of methacrylic acid and 0.3 mole of acrylamide were used as monomers.

[Varnish C]

5 moles of ethyl acrylate, 1 mole of acrylic acid, 0.3 moles of methylol acrylamide, 1.200 moles of ion-exchanged water
g, uralyl sulfate ester soda 12g, i! 5 Except for using 0.2 g of sodium sulfate as a monomer [Varnish A]
Prepared in a similar manner.

[Varnish D]

Acrylic nitrile 5 mol, maleic acid 1 mol, glycidyl methacrylate 0.3 mol, ion exchange water 840 g
, lauryl sulfate ester soda 8g, persulfate soda 0.
It was prepared in the same manner as [Varnish A] except that 15 g was used as the monomer.

[Varnish E]

5 moles of ethyl acrylate, 1 mole of maleic acid, 0.3 moles of glycidyl acrylate, 1300 g of ion exchange water,
Lauryl sulfate ester soda 13g, persulfate soda 0.
It was prepared in the same manner as (varnish A) except that 2 g was used as the monomer.

C Varnish F] 5 mol of methacrylonitrile, 1 mol of methacrylic acid,
0.3 mol of methylol acrylamide, 9 mol of ion exchange water
Varnish A was prepared in the same manner as [Varnish A] except that 00 g of varnish, 9 g of sodium lauryl sulfate, and 0.2 g of sodium persulfate were used as monomers.

[Varnish G] 5 moles of methacrylonitrile, 1 mole of maleic acid, 0.3 moles of aryl glycidyl ether, 97% of ion-exchanged water
Varnish A
] was prepared in the same manner.

[Varnish H]

Acrylic nitrile 3 mol, ethyl acrylate 2 mol, acrylic acid 0.5 mol, methacrylic acid 0.5 mol, glycidyl methacrylate 0.2 mol, acrylamide 0
．． Varnish A was prepared in the same manner as [Varnish A] except that 1 mol, 950 g of ion-exchanged water, 9.5 g of sodium lauryl sulfate, and 0.16 g of sodium persulfate were used as monomers.

[Varnish■]

5 moles of methyl methacrylate, 0.5 moles of acrylic acid,
[Varnish A ] was prepared in the same manner as.

[Varnish J] Butyl acrylate 5 mol, acrylic acid 0.5 mol, methacrylic acid 0.5 mol, glycidyl methacrylate 0
．． 2 mol, acrylamide 0.1 mol, ion exchange water 1
Varnish A was prepared in the same manner as [Varnish A] except that 500 g of varnish, 15 g of sodium lauryl sulfate ester, and 0.25 g of sodium persulfate were used as monomers.

[Varnish K]

Acrylic nitrile 5 mol, acrylic acid 1 mol, glycidyl methacrylate 0.3 mol, styrene 2 mol, ion exchange water 1200 g, lauryl sulfate ester soda 12
Varnish A was prepared in the same manner as [Varnish A] except that 0.2 g of sodium persulfate was used as the monomer.

[Varnishing] Acrylic nitrile 3 mol, ethyl acrylate 2 mol, acrylic acid 0.5 mol, methacrylic acid 0.5 mol, glycidyl methacrylate-1.02 mol, acrylamide O
,] mol, 1 mol of 1.3-butadiene, 1 mol of ion-exchanged water
Varnish A was prepared in the same manner as [Varnish A] except that 100 g of varnish, 1 g of sodium lauryl sulfate, and 0.18 g of sodium persulfate were used as monomers.

[Varnish M]

100 parts by weight of diglycidyl polyether of bisphenol A, 100 parts by weight of polyester consisting of trimellidic anhydride, adipic acid, maleic anhydride, and ethylene glycol, and 0.2 parts by weight of hydroquinone at 150°C.
The mixture was reacted for 1 hour, and then 40 parts by weight of dioxane and 60 parts by weight of methyl ethyl ketone were each gradually added and dissolved to obtain a uniform resin solution. The resin solution was dispersed under stirring in 20 parts by weight of 30% ammonia water in which 2 parts by weight of sodium lauryl sulfate ester was dissolved, and then the dispersion was heated in a nitrogen atmosphere to remove the organic solvent and ammonia. An aqueous dispersion of epoxy ester was obtained.

250 parts by weight of an aqueous dispersion of the epoxy ester, 10 parts by weight of styrene, 0.05 parts by weight of potassium persulfate, 0.017 parts by weight of sodium bisulfite, and 50 parts by weight of ion-exchanged water.
The system consisting of parts by weight was subjected to emulsion polymerization at 70° C. for 3 hours to obtain a water-dispersed epoxy ester varnish.

[Varnish N]

Polyester amide imide resin powder 10 with acid value 140
0 parts by weight was dispersed in water containing 1 part by weight of sodium benzenesulfonate and 7 parts by weight of 30% ammonia water per 100 parts by weight of the powder, and then the dispersion was heated in a nitrogen atmosphere to remove ammonia. An aqueous dispersion of polyesteramideimide resin having a solid content of 20% by weight was obtained.

Examples 1 to 7 As described above, an aluminum round conductor was rolled into a rectangular conductor, and then subjected to zincate treatment and copper plating treatment, and a Zn layer and a copper plating layer were sequentially formed on the conductor. In a vertical furnace, each of the above [Varnish A] to [Varnish G] was diluted with water and applied to a rectangular conductor serving as an anode according to the electrodeposition coating method under the conditions listed in Table 1 and the conditions below. %
It was applied at a concentration of Electrodeposition conditions other than those shown in Table 1 are as shown below.

Cathode: 6 cm diameter and 30 cm long copper cylindrical anode/cathode path H: 31 Varnish temperature: 20°C The obtained coated conductor wire was then placed in a 1 m long chamber filled with saturated vapor of N,N-dimethylformamide. pass through. Then, vapor of N,N-dimethylformamide is applied onto the acrylic resin layer deposited on the aluminum conductor wire. The deposited layer thus treated with N,N-dimethylformamide vapor was dried at 200°C and baked at 400°C to form an ultra-thin film as shown in Table 1 and a structure as shown in Figure 1. An insulated wire was obtained.

Examples 8 to 14 Insulated wires as shown in FIG. 2 were obtained by performing the same steps as in Examples 1 to 7 except that copper plating was not performed.

Comparative Example 1 A sample was produced in the same manner as in Example 1 except that the zincate treatment and copper plating treatment were not performed, but as shown in the description, no insulating film was formed on either the flat portion or a portion of the corner.

Comparative Example 2 Solution type resin varnish (product name: X600W,
An insulating film was formed by repeating the steps of varnish dipping, felt drawing, and baking twice using a dip coat method (manufactured by Nitto Denko ■). Of course, zincate treatment and copper plating treatment were not performed.

Experimental Example 1 The conditions for manufacturing electric wires, the structure of the manufactured electric wires, the results of the pinhole test, and the beauty of the appearance of the electric wires in each example and comparative example are shown in Table 1. The number of pinholes per meter of electric wire is shown according to C3003.

(The following is a blank space) [Effects of the Invention] Since the rectangular super-E membrane insulated wire of the present invention is configured as described above, it has the following effects.

The insulation coating not only on the flat part but also on some corners of the rectangular conductor has extremely few defects such as pinholes, voltage resistance, heat-on yoke resistance, and cracks.

In addition, the thickness of the insulating film at least on the flat part is 5 μm.
It is an ultra-thin insulating film that covers the entire wire.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an example of the rectangular insulated wire of the present invention,
FIG. 2 is a sectional view showing another example of the rectangular insulated wire of the present invention,
FIG. 3 is a schematic flowchart showing the manufacturing process of the insulated wire of the present invention. 1: Rectangular conductor 2: Zn layer 3: Copper plating layer 4: Insulating film t; Thickness W; Width: Rectangular conductor: Round conductor

Claims (1)

[Claims] A conductor made of aluminum formed into a rectangular shape by rolling is subjected to zincate treatment, or copper plating is further applied on the zincate treatment surface, and an insulating film is formed by electrodeposition of resin varnish on the zincate treatment surface or copper plating surface. 1. A rectangular ultra-thin film insulated wire, characterized in that the thickness of the insulating film on the flat surface of the conductor in at least the width direction of the conductor is 5 μm or less.