JPH04122932A - Processing method for dampening-waterless photosensitive planographic printing plate - Google Patents
Processing method for dampening-waterless photosensitive planographic printing plateInfo
- Publication number
- JPH04122932A JPH04122932A JP24273490A JP24273490A JPH04122932A JP H04122932 A JPH04122932 A JP H04122932A JP 24273490 A JP24273490 A JP 24273490A JP 24273490 A JP24273490 A JP 24273490A JP H04122932 A JPH04122932 A JP H04122932A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- photosensitive
- silicone rubber
- printing plate
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title description 4
- -1 polypropylene Polymers 0.000 claims abstract description 37
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 34
- 239000004945 silicone rubber Substances 0.000 claims abstract description 33
- 239000000126 substance Substances 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 14
- 239000003960 organic solvent Substances 0.000 claims description 12
- 238000004043 dyeing Methods 0.000 abstract description 13
- 239000007788 liquid Substances 0.000 abstract description 13
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000004743 Polypropylene Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 229920001155 polypropylene Polymers 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 47
- 239000011347 resin Substances 0.000 description 47
- 239000010410 layer Substances 0.000 description 42
- 150000001875 compounds Chemical class 0.000 description 32
- 229920000642 polymer Polymers 0.000 description 28
- 239000000203 mixture Substances 0.000 description 27
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 24
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 22
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- 239000000975 dye Substances 0.000 description 13
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- 150000002989 phenols Chemical class 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 150000001299 aldehydes Chemical class 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 8
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 239000000049 pigment Substances 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 8
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 8
- 238000011282 treatment Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000009833 condensation Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 150000002576 ketones Chemical class 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 238000004040 coloring Methods 0.000 description 5
- 229940118056 cresol / formaldehyde Drugs 0.000 description 5
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 150000007514 bases Chemical class 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- 238000006068 polycondensation reaction Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229940079877 pyrogallol Drugs 0.000 description 4
- MGSRCZKZVOBKFT-UHFFFAOYSA-N thymol Chemical compound CC(C)C1=CC=C(C)C=C1O MGSRCZKZVOBKFT-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 239000004111 Potassium silicate Substances 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- 239000004115 Sodium Silicate Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- HRBFQSUTUDRTSV-UHFFFAOYSA-N benzene-1,2,3-triol;propan-2-one Chemical compound CC(C)=O.OC1=CC=CC(O)=C1O HRBFQSUTUDRTSV-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 150000007530 organic bases Chemical class 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 229920006122 polyamide resin Polymers 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 3
- 229910052913 potassium silicate Inorganic materials 0.000 description 3
- 235000019353 potassium silicate Nutrition 0.000 description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 3
- 229910052911 sodium silicate Inorganic materials 0.000 description 3
- 239000012192 staining solution Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- WOAHJDHKFWSLKE-UHFFFAOYSA-N 1,2-benzoquinone Chemical compound O=C1C=CC=CC1=O WOAHJDHKFWSLKE-UHFFFAOYSA-N 0.000 description 2
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 2
- 229940105324 1,2-naphthoquinone Drugs 0.000 description 2
- QPVRKFOKCKORDP-UHFFFAOYSA-N 1,3-dimethylcyclohexa-2,4-dien-1-ol Chemical compound CC1=CC(C)(O)CC=C1 QPVRKFOKCKORDP-UHFFFAOYSA-N 0.000 description 2
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 description 2
- XNIOWJUQPMKCIJ-UHFFFAOYSA-N 2-(benzylamino)ethanol Chemical compound OCCNCC1=CC=CC=C1 XNIOWJUQPMKCIJ-UHFFFAOYSA-N 0.000 description 2
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- MWGATWIBSKHFMR-UHFFFAOYSA-N 2-anilinoethanol Chemical compound OCCNC1=CC=CC=C1 MWGATWIBSKHFMR-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- MSHFRERJPWKJFX-UHFFFAOYSA-N 4-Methoxybenzyl alcohol Chemical compound COC1=CC=C(CO)C=C1 MSHFRERJPWKJFX-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- FZERHIULMFGESH-UHFFFAOYSA-N N-phenylacetamide Chemical compound CC(=O)NC1=CC=CC=C1 FZERHIULMFGESH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- 239000005844 Thymol Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 239000000981 basic dye Substances 0.000 description 2
- SESFRYSPDFLNCH-UHFFFAOYSA-N benzyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1=CC=CC=C1 SESFRYSPDFLNCH-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- RECUKUPTGUEGMW-UHFFFAOYSA-N carvacrol Chemical compound CC(C)C1=CC=C(C)C(O)=C1 RECUKUPTGUEGMW-UHFFFAOYSA-N 0.000 description 2
- HHTWOMMSBMNRKP-UHFFFAOYSA-N carvacrol Natural products CC(=C)C1=CC=C(C)C(O)=C1 HHTWOMMSBMNRKP-UHFFFAOYSA-N 0.000 description 2
- 235000007746 carvacrol Nutrition 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 235000010980 cellulose Nutrition 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 2
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 2
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- OUGJKAQEYOUGKG-UHFFFAOYSA-N ethyl 2-methylidenebutanoate Chemical compound CCOC(=O)C(=C)CC OUGJKAQEYOUGKG-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- AFRJJFRNGGLMDW-UHFFFAOYSA-N lithium amide Chemical class [Li+].[NH2-] AFRJJFRNGGLMDW-UHFFFAOYSA-N 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- JILPJDVXYVTZDQ-UHFFFAOYSA-N lithium methoxide Chemical compound [Li+].[O-]C JILPJDVXYVTZDQ-UHFFFAOYSA-N 0.000 description 1
- AZVCGYPLLBEUNV-UHFFFAOYSA-N lithium;ethanolate Chemical compound [Li+].CC[O-] AZVCGYPLLBEUNV-UHFFFAOYSA-N 0.000 description 1
- 229940107698 malachite green Drugs 0.000 description 1
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- AWJZTPWDQYFQPQ-UHFFFAOYSA-N methyl 2-chloroprop-2-enoate Chemical compound COC(=O)C(Cl)=C AWJZTPWDQYFQPQ-UHFFFAOYSA-N 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- CXKWCBBOMKCUKX-UHFFFAOYSA-M methylene blue Chemical compound [Cl-].C1=CC(N(C)C)=CC2=[S+]C3=CC(N(C)C)=CC=C3N=C21 CXKWCBBOMKCUKX-UHFFFAOYSA-M 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 229960000907 methylthioninium chloride Drugs 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- PJASPDPXLKIZHB-UHFFFAOYSA-N n-(3-nitrophenyl)prop-2-enamide Chemical compound [O-][N+](=O)C1=CC=CC(NC(=O)C=C)=C1 PJASPDPXLKIZHB-UHFFFAOYSA-N 0.000 description 1
- JEPAGMKWFWQECH-UHFFFAOYSA-N n-(4-chlorophenyl)prop-2-enamide Chemical compound ClC1=CC=C(NC(=O)C=C)C=C1 JEPAGMKWFWQECH-UHFFFAOYSA-N 0.000 description 1
- POVITWJTUUJBNK-UHFFFAOYSA-N n-(4-hydroxyphenyl)prop-2-enamide Chemical compound OC1=CC=C(NC(=O)C=C)C=C1 POVITWJTUUJBNK-UHFFFAOYSA-N 0.000 description 1
- AJDUTMFFZHIJEM-UHFFFAOYSA-N n-(9,10-dioxoanthracen-1-yl)-4-[4-[[4-[4-[(9,10-dioxoanthracen-1-yl)carbamoyl]phenyl]phenyl]diazenyl]phenyl]benzamide Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2NC(=O)C(C=C1)=CC=C1C(C=C1)=CC=C1N=NC(C=C1)=CC=C1C(C=C1)=CC=C1C(=O)NC1=CC=CC2=C1C(=O)C1=CC=CC=C1C2=O AJDUTMFFZHIJEM-UHFFFAOYSA-N 0.000 description 1
- YLFDIUNVGXCCPV-UHFFFAOYSA-N n-benzyl-n-propylpropan-1-amine Chemical compound CCCN(CCC)CC1=CC=CC=C1 YLFDIUNVGXCCPV-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- HKOOXMFOFWEVGF-UHFFFAOYSA-N phenylhydrazine Chemical compound NNC1=CC=CC=C1 HKOOXMFOFWEVGF-UHFFFAOYSA-N 0.000 description 1
- 229940067157 phenylhydrazine Drugs 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
- BDAWXSQJJCIFIK-UHFFFAOYSA-N potassium methoxide Chemical compound [K+].[O-]C BDAWXSQJJCIFIK-UHFFFAOYSA-N 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical compound NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 235000019794 sodium silicate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- HSVFKFNNMLUVEY-UHFFFAOYSA-N sulfuryl diazide Chemical compound [N-]=[N+]=NS(=O)(=O)N=[N+]=[N-] HSVFKFNNMLUVEY-UHFFFAOYSA-N 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000003573 thiols Chemical group 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical class [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- AODQPPLFAXTBJS-UHFFFAOYSA-M victoria blue 4R Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)=C(C=C1)C2=CC=CC=C2C1=[N+](C)C1=CC=CC=C1 AODQPPLFAXTBJS-UHFFFAOYSA-M 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000001043 yellow dye Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、湿し水不要の感光性平版印刷版の処理方法に
関するものであり、更に詳しくは印刷特性が向上し、印
刷時の耐薬品性に優れ、しかも作業性が向上し、更に自
動現像機を小型化することができる湿し水不要の感光性
平版印刷版の処理方法に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for processing photosensitive lithographic printing plates that does not require dampening water, and more specifically, improves printing properties and improves chemical resistance during printing. The present invention relates to a method for processing a photosensitive lithographic printing plate that does not require dampening water, has excellent properties, has improved workability, and can further downsize an automatic processor.
[発明の背景コ
従来、湿し水不要の感光性平版印刷版(以下、必要に応
し「版材114Jという)としては、支持体上に順に感
光層及びインキ反撥層を塗設したものが知られている。[Background of the Invention] Conventionally, a photosensitive lithographic printing plate that does not require dampening water (hereinafter referred to as "plate material 114J" if necessary) is one in which a photosensitive layer and an ink repellent layer are coated on a support in this order. Are known.
この版材料を露光・現像することにより湿し水不要の平
版印刷版(以下、必要に応し「印刷版」という)を得る
ことができる。By exposing and developing this plate material, a lithographic printing plate that does not require dampening water (hereinafter referred to as "printing plate" as necessary) can be obtained.
このような版材料は、現像時又は現像後の版の状態(現
像性、キズ、版の汚れ等)を調へる必要があり、そのた
め検版性に優れていなければならない。It is necessary to control the state of the plate (developability, scratches, stains on the plate, etc.) during or after development of such plate materials, and therefore it must have excellent plate inspection properties.
この検版性を良好にするために、従来、特開昭54−1
03103号公報や特開昭57−198465号公報等
に記載されている如く、現像した後、染料水溶液て画像
部を染色することが行われている。In order to improve this plate inspection property, conventionally, JP-A-54-1
As described in Japanese Patent Laid-open No. 03103 and Japanese Patent Application Laid-open No. 57-198465, after development, the image area is dyed with an aqueous dye solution.
しかしながら、版材料を現像後、画像部を可視画するた
めに、染料を含む染色液で処理すると、染色液を補充す
る時や染色液の交換時等において手や衣服が汚れ、また
染色処理を行うことにより処理工程が増え、従って自動
現像機が大型になり設備上好ましくない。However, after developing the plate material, if it is treated with a staining solution containing dye in order to visualize the image area, hands and clothes will become dirty when replenishing the dyeing solution or replacing the dyeing solution, and the dyeing process will be difficult. Doing so increases the number of processing steps and therefore increases the size of the automatic processor, which is not desirable in terms of equipment.
そこで、本発明者等は、前記の検版性を考慮すると共に
染色液を使用しない方法について種々研究した結果、プ
ライマー層中に含まれるキノンジアジド化合物の一部を
光分解し、ついで現像した後又は現像と同時に塩基性物
質を含む処理液で処理して画像部のみが発色し、更に印
刷特性に優れた印刷版が得られることを見出し、ここに
本発明を成すに至った。Therefore, the present inventors have conducted various studies on methods that do not use a staining solution while considering the above-mentioned plate inspection properties, and have found that after photodegrading a part of the quinonediazide compound contained in the primer layer, and then developing or It was discovered that a printing plate with excellent printing properties, in which only the image area develops color, can be obtained by processing with a processing liquid containing a basic substance at the same time as development, and has now accomplished the present invention.
[発明の目的]
したがって、本発明の第1の目的は、染色液を不要とし
、従って染色液で手や衣服が汚れることがない点て作業
性の良好な湿し水不要の感光性平版印刷版の処理方法を
提供することにある。[Object of the Invention] Therefore, the first object of the present invention is to provide photosensitive lithographic printing that does not require a dampening solution and has good workability in that it does not require a dyeing solution and therefore does not stain hands or clothes with the dyeing solution. The purpose is to provide a method for processing editions.
また本発明の第2の目的は、染色ン夜を不要とし、従っ
て自動現像機の小型化が可能な湿し水不要の感光性平版
印刷版の処理方法を提供することにある。A second object of the present invention is to provide a method for processing a photosensitive lithographic printing plate that does not require dyeing and therefore does not require dampening water and can downsize an automatic processor.
更に本発明の第3の目的は、細線再現性、シャドー及び
ハイライトの再現性等の印刷特性が向上し、更に印刷時
の耐薬品性が向上した湿し水不要の感光性平版印刷版の
処理方法を提供することにある。A third object of the present invention is to provide a photosensitive lithographic printing plate that does not require dampening water and has improved printing characteristics such as fine line reproducibility, shadow and highlight reproducibility, and improved chemical resistance during printing. The purpose is to provide a processing method.
[発明の構成]
本発明の前記諸口的は、
1)支持体上にキノンジアジド化合物を含むプライマー
層、感光層及びシリコーンゴム層をこの順に有する湿し
水不要の感光性平版印刷版を画像露光し、ついで該感光
性平版印刷版を塩基性物質を含む水性処理液で現像後又
は現像と同時に処理して画像様に発色させることを特徴
とする湿し水不要の感光性平版印刷版の処理方法。[Structure of the Invention] The above aspects of the present invention are as follows: 1) A photosensitive lithographic printing plate that does not require dampening water and has a primer layer containing a quinonediazide compound, a photosensitive layer, and a silicone rubber layer in this order on a support is imagewise exposed. , and then treating the photosensitive lithographic printing plate with an aqueous processing solution containing a basic substance after or simultaneously with development to develop color in an image-wise manner. .
2)請求項1記載の塩基性物質を含む水性処理液か水を
50重量%以上含み、かつ有機溶剤を含むことを特徴と
する湿し水不要の感光性平版印刷版の処理方法によって
それぞれ達成される。2) Achieved by a method for processing a photosensitive lithographic printing plate that does not require dampening water, characterized in that the aqueous processing solution containing a basic substance according to claim 1 contains 50% by weight or more of water and an organic solvent. be done.
以下に、本発明の構成について、更に具体的に説明する
。Below, the configuration of the present invention will be explained in more detail.
本発明は、水不要の感光性平版印刷版のプライマー層中
に含まれるキノンジアジド化合物の一部を光分解し、つ
いで現像した後又は現像と同時に塩基性物質を含む処理
液で処理して画像部のみを発色させることにより画像部
のみ発色した画像が得られるので、染色液を使用しない
で検版性の優れた画像を得ることができ、したがって印
刷特性に優れると共に作業性が向上し、かつ自動現像機
を小型化できるという優れた効果を奏する。In the present invention, a part of the quinone diazide compound contained in the primer layer of a photosensitive lithographic printing plate that does not require water is photolyzed, and then, after or simultaneously with development, the image area is treated with a processing solution containing a basic substance. By coloring only the image area, it is possible to obtain an image in which only the image area is colored. Therefore, it is possible to obtain an image with excellent plate inspection properties without using a staining solution. Therefore, it has excellent printing characteristics, improves workability, and can be automated. This has the excellent effect of making the developing machine smaller.
本発明に用いられるプライマー層に含まれるキノンジア
ジド化合物とは、キノンジアジド基を含む化合物とアル
カリ可溶性樹脂との反応生成物の場合又はキノンジアジ
ド基を含む化合物とアルカリ可溶性樹脂との混合物であ
る場合のいづれが又は両方からなる意味に用いられる。The quinonediazide compound contained in the primer layer used in the present invention is either a reaction product of a compound containing a quinonediazide group and an alkali-soluble resin, or a mixture of a compound containing a quinonediazide group and an alkali-soluble resin. Or used to mean both.
以下にその代表的なものについて説明する。Typical examples will be explained below.
オルトキノンシアシト基を含む高分子化合物としては、
例えば0−ナフトキノンシアシトスルホン酸と、フェノ
ール類及びアルデヒド又はケトンの重縮合樹脂とのエス
テル化合物が挙げられる。As a polymer compound containing an orthoquinone cyacyto group,
Examples include ester compounds of 0-naphthoquinone cyasitosulfonic acid and polycondensation resins of phenols and aldehydes or ketones.
前記のフェノール類としては、例えば、フェノール、0
−クレゾール、m−クレゾール、p−クレゾール、3.
5−キシレノール、カルバクロール、チモール等のm個
フエノール、カテコール、レゾルシン、ヒドロキノン等
の二価フェノール、ピロガロール、フロログルシン等の
三価フェノール等が挙げられる。Examples of the phenols include phenol, 0
-cresol, m-cresol, p-cresol, 3.
Examples include m-phenols such as 5-xylenol, carvacrol, and thymol, dihydric phenols such as catechol, resorcinol, and hydroquinone, and trihydric phenols such as pyrogallol and phloroglucin.
前記のアルデヒドとしては、ホルムアルデヒド、ヘンズ
アルデヒト、アセトアルデヒド、クロトンアルデヒド、
フルフラール等が挙げられる。Examples of the aldehyde include formaldehyde, henzaldehyde, acetaldehyde, crotonaldehyde,
Examples include furfural.
これらのアルデヒドのうち好ましいものは、ホルムアル
デヒド及びヘンズアルデヒトである。Preferred among these aldehydes are formaldehyde and henzaldehyde.
更に前記のケトンとしては、アセトン、メチルエチルケ
トン等が挙げられる。Furthermore, examples of the above-mentioned ketones include acetone, methyl ethyl ketone, and the like.
前記重縮合樹脂の具体的な例としては、フェノール・ホ
ルムアルデヒド樹脂、m−クレゾール・ホルムアルデヒ
ド樹脂、m−1〇−混合クレゾール・ホルムアルデヒド
樹脂、レゾルシン・ヘンズアルデヒド樹脂、ピロガロー
ル・アセトン樹脂等が挙げられる。Specific examples of the polycondensation resin include phenol/formaldehyde resin, m-cresol/formaldehyde resin, m-10-mixed cresol/formaldehyde resin, resorcinol/henzaldehyde resin, pyrogallol/acetone resin, and the like.
前記0−ナフトキノンジアジド化合物のフェノール類の
0)1基に対する0−ナフトキノンシアシトスルホン酸
の縮合率(0)1基1個に対する反応率)は、15〜8
0%が好ましく、より好ましくは20〜45%である。The condensation rate of 0-naphthoquinone cyacytosulfonic acid per 1 group of phenols in the 0-naphthoquinonediazide compound (reaction rate per 1 group) is 15 to 8.
It is preferably 0%, more preferably 20-45%.
更に本発明に用いられる0−キノンジアジド化合物とし
ては、特開昭58〜43451号公報に記載された化合
物も使用することができる。Further, as the O-quinonediazide compound used in the present invention, compounds described in JP-A-58-43451 can also be used.
上記0−キノンジアジド化合物のうち、1.2−ヘンゾ
キノンジアジトスルホニルクロリト又は1.2−ナフト
キノンシアジトスルホニルクロリトとピロガロール・ア
セトン縮合樹脂又は2,3.4−1−リヒトロキシヘン
ゾフェノンを反応させて得られる0−キノンジアジドエ
ステル化合物が最も好ましい。Among the above 0-quinonediazide compounds, 1,2-henzoquinone diazitosulfonyl chloride or 1,2-naphthoquinone cyaditosulfonyl chloride and pyrogallol acetone condensation resin or 2,3,4-1-lihydroxyhenzophenone are used. O-quinonediazide ester compounds obtained by the reaction are most preferred.
本発明に用いられる0−キノンジアシド化合物としては
、上記化合物を各々単独て用いてもよいし、2種以上の
化合物を組合せて用いてもよい6本発明に用いらする○
−キノンジアジドを含む高分子化合物は、塗布性を考慮
すると、分子量が1500以上有するものが好ましく、
更に好ましくは、2000以上の分子量を有するものが
よい。As the 0-quinonediaside compound used in the present invention, each of the above compounds may be used alone, or two or more kinds of compounds may be used in combination.
- The polymer compound containing quinonediazide preferably has a molecular weight of 1500 or more in consideration of coating properties,
More preferably, those having a molecular weight of 2000 or more are preferred.
前記の0−キノンジアシド化合物を含むプライマーJm
は、種々の樹脂と混合して用いた方がよい。Primer Jm containing the above 0-quinonediaside compound
is preferably used in combination with various resins.
本発明に用いられるプライマー層としては、例えばポリ
エステル樹脂、塩化ビニル−酢酸ビニル共重合体、アク
リル樹脂、塩化ビニル樹脂、ポリアミド樹脂、ポリビニ
ルブチラール樹脂、エポキシ樹脂、アクリレート系共重
合体、酢酸ビニル系共重合体、フェノキシ樹脂、ボッウ
レタン樹脂、ポリカーボネート樹脂、ポリアクリロニト
リルブタジェン、ポリ酢酸ビニル等、フェノール樹脂が
挙げられる。Examples of the primer layer used in the present invention include polyester resin, vinyl chloride-vinyl acetate copolymer, acrylic resin, vinyl chloride resin, polyamide resin, polyvinyl butyral resin, epoxy resin, acrylate copolymer, and vinyl acetate copolymer. Examples include phenolic resins such as polymers, phenoxy resins, polyurethane resins, polycarbonate resins, polyacrylonitrile butadiene, and polyvinyl acetate.
好ましくはエポキシ樹脂、アクリル樹脂、ポリエステル
樹脂、ウレタン樹脂等を挙げることかできるが、フェノ
ール々Δ]脂を併用することが好ましい。これらの樹脂
は、光で硬化させた形で用いることが好ましい。Preferred examples include epoxy resins, acrylic resins, polyester resins, urethane resins, etc., but it is preferable to use phenolic resins in combination. It is preferable to use these resins in a light-cured form.
また上記プライマー層を構成するアンカー剤としては、
例えばシランカップリング剤、シリコーンプライマー等
を用いることがてき、また有機チタネート等も有効であ
る。In addition, as the anchor agent constituting the primer layer,
For example, silane coupling agents, silicone primers, etc. can be used, and organic titanates and the like are also effective.
上記プライマー層の厚さは、通常0.1〜20μmであ
り、好ましくは0.3〜1(lμ国である。The thickness of the primer layer is usually 0.1 to 20 μm, preferably 0.3 to 1 μm.
このプライマー層はアルカリ可溶性でない方がよいが、
発色のためにはフェノール性水酸基を有する重合体を5
重量%〜50重量%含むことが好ましい。This primer layer should not be alkali-soluble, but
For color development, a polymer with phenolic hydroxyl groups is used.
It is preferable that the content is from % to 50% by weight.
本発明に用いられる湿し水不要の感光性平版印刷版のプ
ライマー層中に含有されているキノンジアジド化合物は
、適正画像露光においてキノンジアジド化合物のキノン
ジアジド単位の30モル%〜70モル%が光分解するが
、好ましくはキノンジアジド単位の40モル%〜60モ
ル%が光分解するのがよい。その調節のためにプライマ
ー層に紫外線吸収剤や黄色染料を添加することができる
。In the quinonediazide compound contained in the primer layer of the photosensitive lithographic printing plate that does not require dampening water and used in the present invention, 30 mol% to 70 mol% of the quinonediazide units of the quinonediazide compound photodecompose during proper image exposure. , preferably 40 mol % to 60 mol % of the quinonediazide units are photodecomposed. In order to adjust this, an ultraviolet absorber or a yellow dye can be added to the primer layer.
キノンジアジド単位の光分解が30モル%以下の場合は
、画像再現性が悪く、発色濃度も低い。When the photodecomposition of quinonediazide units is 30 mol % or less, image reproducibility is poor and color density is low.
また光分解が70モル%以上の場合には画像部において
十分な発色濃度が得られない。Furthermore, if the photodecomposition is 70 mol% or more, sufficient color density cannot be obtained in the image area.
本発明に用いられる処理液中に添加される塩基性物質と
しては、通常の化学分野で用いられる塩基を意味し、無
機または有機のいずれの塩基でもよい。The basic substance added to the treatment liquid used in the present invention means a base used in the ordinary chemical field, and may be either an inorganic or an organic base.
有機塩基としては、アンモニア、ヒドラジン、ヒドロキ
シアミン、炭素数1から30の有機塩基が好ましい。こ
れらの具体例としてはたとえは、アンモニア(アンモニ
ウムハイドロキサイド)、メチルアミン、エチルアミン
、ジメチルアミン、ジエチルアミン、トリメチルアミン
、トリエチルアミン、プロピルアミン、ブチルアミン、
アミルアミン、ジプロピルアミン、ジブチルアミン、シ
アミルアミン、トリプロピルアミン、トリブチルアミン
、メチルジエチルアミン、エチレンジアミン、トリメチ
レンジアミン、テトラメチレンジアミン、ポリエチレン
イミン、ヘンシルアミン、N、N−ジメチルベンジルア
ミン、NN−ジェチルヘンシルアミン、N、N−ジプロ
ピルベンジルアミン、0−またはm−またはp−メトキ
シまたはメチルベンジルアミン、N、N−ジ(メトキシ
ヘンシル)アミン、β−フェニルエチルアミン、ε、δ
−フェニルアミルアミン、γ−フェニルプロピルアミン
、シクロヘキシルアミン、アニリン、モノメチルアニリ
ン、ジメチルアニリン、トルイジン、ベンジジン、α−
またはβ−ナフチルアミン、0−またはm−またはp−
フユニレンジアミン、ピロリジン、ピペラジン、モルホ
リン、ウロトロピン、ジアザビシクロウンデカン、ピロ
ール、ピリジン、キノリン、ヒドラジン、フェニルヒド
ラジン、N、N′−ジフェニルヒドラジン、ヒドロキシ
ルアミン、セミカルバジド、水酸化テトラアルキルアン
モニウム、アミノ安息香酸、ホルムアミド、アセタミド
、N、N−ジメチルホルムアミド、N、N−ジメチルア
ニリン1〜、アセトアニリド、モノエタノールアミン、
ジェタノールアミン、トリエタノールアミン、2−(2
−アミノエチル)エタノーノペ 2−アミノ−2−メチ
ル−1,3−プロパンジオール、2−アミノ−1,3−
プロパンジオール、2−アミノ−2−ヒドロキシメチル
−1,3−プロパンジオールなどのアミン化合物(1級
、2級、3級アミン、モノアミン、ジアミン、トリアミ
ン、テトラアミンからポリアミンまで、脂肪族釦式アミ
ン、脂肪族環式アミン、芳香族アミン、ペテロ環式アミ
ン)および酸アミドなどのアミン話導体あるいはカルボ
ン酸とアミンの塩(例えばオクタン酸などとモノエタノ
ールアミン、ジェタノールアミンなどとの塩)などがあ
げられる。As the organic base, ammonia, hydrazine, hydroxyamine, and an organic base having 1 to 30 carbon atoms are preferred. Specific examples of these include ammonia (ammonium hydroxide), methylamine, ethylamine, dimethylamine, diethylamine, trimethylamine, triethylamine, propylamine, butylamine,
Amylamine, dipropylamine, dibutylamine, cyamylamine, tripropylamine, tributylamine, methyldiethylamine, ethylenediamine, trimethylenediamine, tetramethylenediamine, polyethyleneimine, hensylamine, N,N-dimethylbenzylamine, NN-jethylhensylamine , N,N-dipropylbenzylamine, 0- or m- or p-methoxy or methylbenzylamine, N,N-di(methoxyhensyl)amine, β-phenylethylamine, ε, δ
-Phenylamylamine, γ-phenylpropylamine, cyclohexylamine, aniline, monomethylaniline, dimethylaniline, toluidine, benzidine, α-
or β-naphthylamine, 0- or m- or p-
Fuynylene diamine, pyrrolidine, piperazine, morpholine, urotropin, diazabicycloundecane, pyrrole, pyridine, quinoline, hydrazine, phenylhydrazine, N,N'-diphenylhydrazine, hydroxylamine, semicarbazide, tetraalkylammonium hydroxide, aminobenzoic acid acid, formamide, acetamide, N,N-dimethylformamide, N,N-dimethylaniline 1~, acetanilide, monoethanolamine,
jetanolamine, triethanolamine, 2-(2
-aminoethyl)ethanolonope 2-amino-2-methyl-1,3-propanediol, 2-amino-1,3-
Amine compounds such as propanediol, 2-amino-2-hydroxymethyl-1,3-propanediol (primary, secondary, tertiary amines, monoamines, diamines, triamines, tetraamines to polyamines, aliphatic button amines, amine conductors such as aliphatic cyclic amines, aromatic amines, petrocyclic amines) and acid amides, or salts of carboxylic acids and amines (for example, salts of octanoic acid and monoethanolamine, jetanolamine, etc.). can give.
また、ナトリウムメチラート、ナトリウムエチラート、
ナトリウムプロピラード、カリウムメチラート、カリウ
ムエチラート、カリウムプロピラード、リチウムメチラ
ート、リチウムエチラートなどのアルカリ金属アルコラ
ード、ナトリウム、カリウム、リチウムのアミド、エチ
ルアミド、ジプロピルアミドなどのアルカリ金属アミド
などが用いられる。無機塩基としては水酸化ナトリウム
、水酸化カリウム、水酸化リチウム、水酸化カルシウム
、水酸化バリウム、炭酸ナトリウム、炭酸カリウム、炭
酸リチウム、炭酸カルシウム、炭酸バリウム、炭酸水素
ナトリウム、炭酸水素カリウム、リン酸ナトリウム、リ
ン酸カリウム、ケイ酸ナトリウム、ケイ酸カリウム、ナ
トリウムメタシリケートなどのアルカリ金属、アルカリ
土類金属の水酸化物、炭酸塩、重炭酸塩、リン酸塩、ケ
イ酸塩、メタケイ酸塩等が挙げられる。Also, sodium methylate, sodium ethylate,
Alkali metal alcoholades such as sodium propylade, potassium methylate, potassium ethylate, potassium propylate, lithium methylate, lithium ethylate, alkali metal amides such as sodium, potassium, and lithium amides, ethylamide, dipropylamide, etc. are used. It will be done. Inorganic bases include sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, barium hydroxide, sodium carbonate, potassium carbonate, lithium carbonate, calcium carbonate, barium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, and sodium phosphate. , hydroxides, carbonates, bicarbonates, phosphates, silicates, metasilicates of alkali metals and alkaline earth metals such as potassium phosphate, sodium silicate, potassium silicate, sodium metasilicate, etc. Can be mentioned.
この中でケイ酸ナトリウム、ケイ酸カリウムは特に好ま
しい。Among these, sodium silicate and potassium silicate are particularly preferred.
本発明の処理方法は、プライマー層としてキノンジアジ
ド化合物を含む湿し水不要感光性平版印刷版を画像露光
した後、現像工程を行い、ついで塩基性物質を含む処理
液で画像部を処理して発色させるが、好ましくは現像液
に塩基性物質を含有させて一裕とし、該現像液で現像と
同時に発色させることがよい。The processing method of the present invention involves imagewise exposing a photosensitive lithographic printing plate that does not require dampening water and containing a quinonediazide compound as a primer layer, and then performing a development step, and then processing the image area with a processing solution containing a basic substance to develop color. However, it is preferable to add a basic substance to the developer to make it more stable, and to develop the color at the same time as the development with the developer.
また塩基性物質を含む処理液で処理する場合、その処理
液のpHは11以上が好ましく、更に好ましくはpHは
12〜135である。Further, when processing with a processing liquid containing a basic substance, the pH of the processing liquid is preferably 11 or more, and more preferably 12 to 135.
更に塩基性物質を含む処理液は、水を主成分とするが、
その中に含まれる塩基性物質の量は、0.1重量%〜2
0重量%であり、好ましくは1重量%〜10重量%であ
る。Furthermore, the treatment liquid containing basic substances is mainly composed of water,
The amount of basic substance contained therein is 0.1% by weight to 2% by weight.
0% by weight, preferably 1% to 10% by weight.
本発明に用いられる湿し水不要感光性平版印刷版は、塩
基性物質を含む処理液で処理した後、または現像液と同
時に処理液で処理した後、水洗することが好ましい。The photosensitive lithographic printing plate that does not require dampening water and is used in the present invention is preferably washed with water after being treated with a treatment liquid containing a basic substance, or after being treated with a treatment liquid simultaneously with a developer.
本発明に用いられる塩基性物質を含む処理液は、水を5
0重量%以上含むことが好ましいが、更に好ましくは水
を8011量%以上含むものがよい。The treatment liquid containing a basic substance used in the present invention contains 50% water.
It is preferable to contain water in an amount of 0% by weight or more, and more preferably 8011% by weight or more.
この他、塩基性物質を含む処理液には、有機溶剤、界面
活性剤等を添加することにより発色性を向上させること
ができ、特に有機溶剤としては水難溶性有機溶剤を用い
ることが好ましい。In addition, color development can be improved by adding an organic solvent, a surfactant, etc. to the treatment liquid containing a basic substance, and it is particularly preferable to use a sparingly water-soluble organic solvent as the organic solvent.
この添加剤として用いられる水9「溶性有機溶剤は、2
0℃における水に対する溶解度が10重量%以下の有機
溶剤であり、例えば、ジイソブチルケトン、アセトフェ
ノン、イソホロン、コハク酸ジエチル、安息香酸メチル
、蓚酸ジエチル、フタル酸ジメチル、酢酸インブチル、
安息香酸ベンジル、エチレングリコールモノフェニルエ
ーテル、エチレングリコールジブチルエーテル、エチレ
ングリコールベンジルエーテル、ジエチレングリコール
ジ−n−ブチルエーテル、ジエチレングリコールジアセ
テート、n−アミルアルコール、ベンジルアルコール、
シクロヘキサノン、シクロヘキサノール、N−ベンジル
エタノールアミン、アニシルアルコール、ジメチルベン
ジルカルピトール2−N−エチルアニリノエタノール、
プロピレングリコールモノフェニルエーテル、N−フェ
ニルエタノールアミン等が挙げられる。The water soluble organic solvent used as this additive is 2
An organic solvent having a solubility in water at 0°C of 10% by weight or less, such as diisobutyl ketone, acetophenone, isophorone, diethyl succinate, methyl benzoate, diethyl oxalate, dimethyl phthalate, inbutyl acetate,
Benzyl benzoate, ethylene glycol monophenyl ether, ethylene glycol dibutyl ether, ethylene glycol benzyl ether, diethylene glycol di-n-butyl ether, diethylene glycol diacetate, n-amyl alcohol, benzyl alcohol,
Cyclohexanone, cyclohexanol, N-benzylethanolamine, anisyl alcohol, dimethylbenzylcarpitol 2-N-ethylanilinoethanol,
Examples include propylene glycol monophenyl ether and N-phenylethanolamine.
これらの中でもエチレングリコールモノフェニルエーテ
ル、エチレングリコールヘンシルエーテル、ヘンシルア
ルコール、シクロヘキサノン、シクロヘキサノール、N
−ベンジルエタノールアミン、アニシルアルコール、ジ
メチルベンジルカルピトール、2−N−エチルアニリノ
エタノール、プロピレングリコールモノフェニルエーテ
ル、N−フェニルエタノールアミンが特に有効である。Among these, ethylene glycol monophenyl ether, ethylene glycol hensyl ether, hensyl alcohol, cyclohexanone, cyclohexanol, N
-Benzylethanolamine, anisyl alcohol, dimethylbenzylcarpitol, 2-N-ethylanilinoethanol, propylene glycol monophenyl ether, and N-phenylethanolamine are particularly effective.
本発明に用いられる有機溶剤の使用量は、1重量%〜1
0重量%、好ましくは2重量%〜631量%が好ましい
。The amount of organic solvent used in the present invention is 1% by weight to 1% by weight.
0% by weight, preferably 2% to 631% by weight is preferred.
本発明に用いられる有機溶剤1つまたは2つ以上を混合
して用いることができる。One or more organic solvents used in the present invention can be used in combination.
本発明に用いられる湿し水不要感光性平版印刷版の感光
層は、現像時に画像部となる部分の感光層を除去するタ
イプのものが好ましい。The photosensitive layer of the photosensitive lithographic printing plate that does not require dampening water used in the present invention is preferably of a type that removes the photosensitive layer in the portion that will become the image area during development.
以下余白
本発明の湿し水不要感光性平版印刷版の処理方法に用い
られる感光層には、ポジ型感光性組成物またはネガ型感
光性組成物のいづれをも使用することができるが、この
ポジ型感光性組成物としては、オルトキノンジアジド基
を含む高分子化合物が主として用いられるが、ここでオ
ルトキノンシアシト基を含む高分子化合物とは、オルト
キノンジアジド基を含む化合物とアルカリ可溶性樹脂と
の反応生成物の場合又はオルトキノンジアジド基を含む
化合物とアルカリ可溶性樹脂との混合物である場合のい
づれか又は両方からなる意味に用いられる。The following margin: Either a positive-working photosensitive composition or a negative-working photosensitive composition can be used in the photosensitive layer used in the processing method of the present invention for a photosensitive lithographic printing plate that does not require dampening water. As a positive photosensitive composition, a polymer compound containing an orthoquinonediazide group is mainly used. Here, the polymer compound containing an orthoquinonediazide group is a combination of a compound containing an orthoquinonediazide group and an alkali-soluble resin. It is used in the meaning of either or both of a reaction product and a mixture of a compound containing an orthoquinonediazide group and an alkali-soluble resin.
以下にその代表的なものについて説明する。Typical examples will be explained below.
オルトキノンシアシト基を含む高分子化合物としては、
例えば0−ナフトキノンジアジドスルホン酸と、フェノ
ール類及びアルデヒド又はケトンの重縮合樹脂とのエス
テル化合物が挙げられる。As a polymer compound containing an orthoquinone cyacyto group,
For example, ester compounds of 0-naphthoquinonediazide sulfonic acid and polycondensation resins of phenols and aldehydes or ketones may be mentioned.
前記のフェノール類としては、例えば、フェノール、0
−クレゾール、m−クレゾール、p−クレゾール、3.
5−キシレノール、カルバクロール、チモール等のm個
フエノール、カテコール、レゾルシン、ヒドロキノン等
の二価フェノール、ピロガロール、フロログルシン等の
三価フェノール等が挙げられる。Examples of the phenols include phenol, 0
-cresol, m-cresol, p-cresol, 3.
Examples include m-phenols such as 5-xylenol, carvacrol, and thymol, dihydric phenols such as catechol, resorcinol, and hydroquinone, and trihydric phenols such as pyrogallol and phloroglucin.
前記のアルデヒドとしては、ホルムアルデヒド、ベンズ
アルデヒド、アセトアルデヒド、クロトンアルデヒド、
フルフラール等が挙げられる。Examples of the aldehyde include formaldehyde, benzaldehyde, acetaldehyde, crotonaldehyde,
Examples include furfural.
これらのアルデヒドのうち好ましいものは、ホルムアル
デヒド及びベンズアルデヒドである。Preferred among these aldehydes are formaldehyde and benzaldehyde.
更に前記のケトンとしては、アセトン、メチルエチルケ
トン等が挙げられる。Furthermore, examples of the above-mentioned ketones include acetone, methyl ethyl ketone, and the like.
前記重縮合樹脂の具体的な例としては、フェノール・ホ
ルムアルデヒド樹脂、m−クレゾール・ホルムアルデヒ
ド樹脂、m−、o−混合クレゾール・ホルムアルデヒド
樹脂、レゾルシン・ヘンズアルデヒド樹脂、ピロガロー
ル・アセトン樹脂等が挙げられる。Specific examples of the polycondensation resin include phenol/formaldehyde resin, m-cresol/formaldehyde resin, m-, o-mixed cresol/formaldehyde resin, resorcinol/henzaldehyde resin, pyrogallol/acetone resin, and the like.
前記0−ナフトキノンシアシト化合物のフェノール類の
O)I基に対する吋ナフトキノンシアシトスルホン酸の
縮合率(0)1基1個に対する反応率)は、15〜80
%が好ましく、より好ましくは20〜45%である。The condensation rate (0) of the 0-naphthoquinone cyasito sulfonic acid with respect to the O)I group of the phenol in the 0-naphthoquinone cyasito compound (reaction rate per 1 group) is 15 to 80.
%, more preferably 20 to 45%.
更に本発明に用いられる0−キノンジアジド化合物とし
ては、特開昭58−43451号公報に記載された化合
物も使用することができる。Further, as the O-quinonediazide compound used in the present invention, compounds described in JP-A-58-43451 can also be used.
上記0−キノンジアジド化合物のうち、1.2−ペンゾ
キノンジアジトスルホニルクロリト又は1.2−ナフト
キノンシアシトスルホニルクロリドとピロガロール・ア
セトン縮合樹脂又は2,3.4−トリヒドロキシベンゾ
フェノンを反応させて得られる0−キノンジアジドエス
テル化合物が最も好ましい。Among the above 0-quinonediazide compounds, 1,2-penzoquinone diazitosulfonyl chloride or 1,2-naphthoquinone cyasitosulfonyl chloride is reacted with a pyrogallol acetone condensation resin or 2,3,4-trihydroxybenzophenone. The resulting O-quinonediazide ester compound is most preferred.
本発明に用いられる○−キノンジアジド化合物としては
、上記化合物を各々単独で用いてもよいし、2 fi!
以上の化合物を組合せて用いてもよい。As the ○-quinonediazide compound used in the present invention, each of the above compounds may be used alone, or 2 fi!
The above compounds may be used in combination.
本発明に用いられる。−キノンジアジドを含む高分子化
合物は、塗布性を考慮すると、分子量が1500以上有
するものが好ましく、更に好ましくは、2000以上の
分子量を有するものがよい。Used in the present invention. - The polymer compound containing quinonediazide preferably has a molecular weight of 1,500 or more, more preferably 2,000 or more, in consideration of coating properties.
前記の0−キノンジアジド化合物は、アルカリ可溶性樹
脂と混合して用いた方がよい。アルカリ可溶性樹脂とし
ては、ノボラック樹脂、フェノール性水酸基を有するビ
ニル系重合体、特開昭55−57841号公報に記載さ
れている多価フェノールとアルデヒド又はケトンとの縮
合樹脂等が挙げられる。ノボラック樹脂としては、例え
ばフェノール・ホルムアルデヒド樹脂、クレゾール・ホ
ルムアルデヒド樹脂、特開昭55−57841号公報に
記載されているようなフェノール・クレゾール・ホルム
アルデヒド共重縮合樹脂、特開昭55−127553号
公報に記載されているようなp−置換フェノールとフェ
ノールもしくは、クレゾールとホルムアルデヒドとの共
重縮合樹脂等が挙げられる。The above-mentioned 0-quinonediazide compound is preferably used in combination with an alkali-soluble resin. Examples of alkali-soluble resins include novolac resins, vinyl polymers having phenolic hydroxyl groups, and condensation resins of polyhydric phenols and aldehydes or ketones described in JP-A-55-57841. Examples of the novolac resin include phenol-formaldehyde resin, cresol-formaldehyde resin, phenol-cresol-formaldehyde copolycondensation resin as described in JP-A-55-57841, and phenol-cresol-formaldehyde copolycondensation resin as described in JP-A-55-127553. Examples include copolycondensation resins of p-substituted phenol and phenol or cresol and formaldehyde as described above.
また、フェノール性水酸基を有するビニル系重合体とし
ては、該フェノール性水酸基を有する単位を分子構造中
に有する重合体であり、下記の一般式[I]〜−数式[
V]の少なくとも1つの構造単位を含む重合体か好まし
い。Moreover, the vinyl polymer having a phenolic hydroxyl group is a polymer having a unit having the phenolic hydroxyl group in its molecular structure, and is a polymer having the following general formula [I] to -numerical formula [
Polymers containing at least one structural unit of V] are preferred.
−数式 [ ] 一般式[+1] (CR+ R2−C,R。-Mathematical formula [ ] General formula [+1] (CR+ R2-C,R.
モ
→
八う−
−0H
一般式[II+ ]
一般式
[]
一般式[V]
+CR3
CR4)
H
[式中R1
およびR2
はそれぞれ水素原子、
アル
キル基又はカルボキシル基、好ましくは水素原子を表わ
す。R3は水素原子、ハロゲン原子又はアルキル基を表
わし、好ましくは水素原子又はメチル基、エチル基等の
アルキル基を表わす、R4は水素原子、アルキル基、ア
リール基又はアラルキル基を表わし、好ましくは水素原
子を表わす、Aは窒素原子又は酸素原子と芳香族炭素原
子とを連結する、置換基を有していてもよいアルキレン
基を表わし、mはO〜10の整数を表わし、Bは置換基
を有していてもよいフェニレン基又は置換基を有しても
よいナフチレン基を表わす。]本発明の感光性組成物に
用いられる重合体としては共重合体型の構造を有するも
のが好ましく、前記−数式[I]〜−数式[V]でそれ
ぞれ示される構造単位と組合せて用いることができる単
量体単位としては、例えばエチレン、プロピレン、イン
ブチレン、ブタジェン、イソプレン等のエチレン系不飽
和オレフィン類、例えばスチレン、αメチルスチレン、
p−メチルスチレン、p−クロロスチレン等のスチレン
頚、例えばアクリル酸、メタクリル酸等のアクリル酸類
、 例えばイタコン酸、マレイン酸、無水マレイン酸等
の不飽和脂肪族ジカルボン酸類、例えばアクリル酸メチ
ル、アクリル酸エチル、アクリル酸−n−ブチル、アク
リル酸イソブチル、アクリル酸ドデシル、アクリル酸−
2−クロロエチル、アクリル酸フェニル、α−クロロア
クリル酸メチル、メタクリル酸メチル、メタクリル酸エ
チル、エタクリル酸エチル等のα−メチレン脂肪族モノ
カルボン酸のエステル類、例えばアクリロニトリル、メ
タアクリロニトリル等のニトリル類、例えばアクリルア
ミド等のアミド類、例えばアクリルアニリド、p−クロ
ロアクリルアニリド、m−二トロアクリルアニリド、ω
−メトキシアクリルアニリド等のアニリド類、例えば酢
酸ビニル、プロピオン酸ビニル、ベンジェ酸ビニル、酪
酸ビニル等のビニルエステル類、例えばメチルビニルエ
ーテル、エチルビニルエーテル、インブチルビニルエー
テル、β−クロロエチルビニルエーテル等のビニルエー
テル順、塩化ビニル、ビニリデンクロライド、ビニリデ
ンシアナイト、例えば1−メチル−1−メトキシェチし
・ン、1.1−ジメトキシエチレン、1.2−ジメトキ
シエチレン、1.1−ジメトキシカルボニルエチレン、
1−メチル−1−二トロエチレン等のエチレン話導体類
、例えばN−ビニルピロール、N−ビニルカルバゾール
、N−ビニルインドール、N−ビニルピロリドン、N−
ビニルピロリドン等のN−ビニル系車量体がある。これ
らのビニル系車量体は、不飽和二重結合が開裂した構造
で高分子化合物中に存在する。Mo→ Yau-0H General formula [II+] General formula [] General formula [V] +CR3 CR4) H [In the formula, R1 and R2 each represent a hydrogen atom, an alkyl group or a carboxyl group, preferably a hydrogen atom. R3 represents a hydrogen atom, a halogen atom, or an alkyl group, preferably a hydrogen atom or an alkyl group such as a methyl group or an ethyl group, R4 represents a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group, preferably a hydrogen atom , A represents an alkylene group which may have a substituent and which connects a nitrogen atom or an oxygen atom and an aromatic carbon atom, m represents an integer of O to 10, and B has a substituent. represents a phenylene group which may have a substituent or a naphthylene group which may have a substituent. ] The polymer used in the photosensitive composition of the present invention preferably has a copolymer-type structure, and can be used in combination with the structural units represented by formulas [I] to [V] above. Examples of monomer units that can be used include ethylenically unsaturated olefins such as ethylene, propylene, imbutylene, butadiene, and isoprene, such as styrene, α-methylstyrene,
Styrene necks such as p-methylstyrene and p-chlorostyrene, acrylic acids such as acrylic acid and methacrylic acid, unsaturated aliphatic dicarboxylic acids such as itaconic acid, maleic acid, and maleic anhydride, such as methyl acrylate, acrylic Ethyl acrylate, n-butyl acrylate, isobutyl acrylate, dodecyl acrylate, acrylic acid
Esters of α-methylene aliphatic monocarboxylic acids such as 2-chloroethyl, phenyl acrylate, methyl α-chloroacrylate, methyl methacrylate, ethyl methacrylate, and ethyl ethacrylate; nitriles such as acrylonitrile and methacrylonitrile; Amides such as acrylamide, e.g. acrylanilide, p-chloroacrylanilide, m-nitroacrylanilide, ω
- anilides such as methoxyacrylanilide, vinyl esters such as vinyl acetate, vinyl propionate, vinyl benzoate, vinyl butyrate, vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, inbutyl vinyl ether, β-chloroethyl vinyl ether, Vinyl chloride, vinylidene chloride, vinylidene cyanite, such as 1-methyl-1-methoxyethylene, 1,1-dimethoxyethylene, 1,2-dimethoxyethylene, 1,1-dimethoxycarbonylethylene,
Ethylene conductors such as 1-methyl-1-nitroethylene, such as N-vinylpyrrole, N-vinylcarbazole, N-vinylindole, N-vinylpyrrolidone, N-
There are N-vinyl caramers such as vinylpyrrolidone. These vinyl-based caramers exist in polymer compounds with a structure in which unsaturated double bonds are cleaved.
上記の単量体のうち脂肪族モノカルボン酸のエステル類
、ニトリル類が本発明の目的に対して優れた性能を示し
、好ましい。Among the above monomers, aliphatic monocarboxylic acid esters and nitriles exhibit excellent performance for the purpose of the present invention and are therefore preferred.
これらのアルカリ可溶性樹脂は、塗布性を考慮すると、
分子量が1500以上有するものが好ましく、更に好ま
しくは、2000以上の分子量を有するものがよい。Considering the applicability of these alkali-soluble resins,
Those having a molecular weight of 1,500 or more are preferable, and those having a molecular weight of 2,000 or more are more preferable.
またこれらの感光性組成物には、上記の素材の他、必要
に応して染料、顔料等の色素、感脂化剤、可塑剤、界面
活性剤、有機酸、酸無水物、露光により酸を発生し得る
化合物等を添加することができる。In addition to the above-mentioned materials, these photosensitive compositions also contain pigments such as dyes and pigments, sensitizing agents, plasticizers, surfactants, organic acids, acid anhydrides, and acidic substances when exposed to light. A compound etc. that can generate can be added.
本発明に用いられるネガ型感光性物質は、種々のものが
あるが、以下に記載されるように、その代表的なものに
ついて説明する。There are various types of negative photosensitive materials used in the present invention, and representative ones will be described below.
(1)ジアゾ樹脂を含む感光性組成物
p−ジアゾジフェニルアミンとホルムアルデヒドとの縮
合物で代表されるジアゾ樹脂は、水溶性のものでも水不
溶性のものでもよいが、好ましくは特公昭47−116
7号及び同57−43890号公報等に記載されている
ような水不溶性かつ通常の有機溶媒可溶性のものが使用
される。特に好ましくは下記の一般式[I]で示される
ジアゾ樹脂である。(1) Photosensitive composition containing diazo resin The diazo resin represented by the condensate of p-diazodiphenylamine and formaldehyde may be water-soluble or water-insoluble, but is preferably
7 and No. 57-43890, etc., which are water-insoluble and soluble in ordinary organic solvents are used. Particularly preferred is a diazo resin represented by the following general formula [I].
一般式[lコ
[式中、RI 、 R2およびR3は、水素原子、アル
キル基又はアルコキシ基を示し、R4は水素原子、アル
キル基又はフェニル基を示す。General formula [lco[wherein RI, R2 and R3 represent a hydrogen atom, an alkyl group or an alkoxy group, and R4 represents a hydrogen atom, an alkyl group or a phenyl group.
XはPF6又は BF4を示し、Yは−NH−−5−又
は−〇−を示す。]
ジアゾ樹脂は皮膜形成性樹脂、特に水酸基を有する親油
性高分子化合物と混合して使用するのが好ましい。この
ような親油性高分子化合物としては、前記に掲げたもの
の他、側鎖に脂肪族水酸基を有するモノマー、例えば2
−ヒドロキシエチルアクリレート又は2−ヒドロキシエ
チルメタクリレートと他の共重合し得るモノマーとの共
重合体が挙げられる。これら以外にも、必要に応してポ
リビニルブチラール樹脂、ポリウレタン樹脂、ポリアミ
ド樹脂、エポキシ樹脂、ノボラック樹脂、天然樹脂等を
添加してもよい。X represents PF6 or BF4, and Y represents -NH--5- or -0-. ] The diazo resin is preferably used in combination with a film-forming resin, particularly a lipophilic polymer compound having a hydroxyl group. In addition to those listed above, such lipophilic polymer compounds include monomers having an aliphatic hydroxyl group in the side chain, such as 2
Copolymers of -hydroxyethyl acrylate or 2-hydroxyethyl methacrylate and other copolymerizable monomers can be mentioned. In addition to these, polyvinyl butyral resins, polyurethane resins, polyamide resins, epoxy resins, novolac resins, natural resins, etc. may be added as necessary.
ジアゾニウム塩と併用される結合剤としては種々の高分
子化合物が使用され得るが、好ましくは特開昭54−9
8613号公報に記載されているような芳香族性水酸基
を有する単量体、例えばN−(4−ヒドロキシフェニル
)アクリルアミド、N−(4−ヒドロキシフェニル)メ
タクリルアミド、o+、m−、またはp−ヒドロキシス
チレン、o−、m−、またはp−ヒドロキシフェニルメ
タクリレート等と他の単量体との共重合体、米国特許第
4.123,276号明細書に記載されているようなヒ
ドロキシエチルアクリレート単位またはヒドロキシエチ
ルメタクリレート単位を主なる繰り返し単位として含む
ポリマー シェラツク、ロジン等の天然樹脂、ポリビニ
ルアルコール、米国特許第3,751,257号明細書
に記載されているポリアミド樹脂、米国特許第3,66
0.097号明細書に記載されている線状ポリウレタン
樹脂、ポリビニルアルコールのフタレート化樹脂、ビス
フェノールAとエピクロルヒドリンから縮合されたエポ
キシ樹脂、酢酸セルロース、セルロースアセテートフタ
レート等のセルロース類が含有される。Various polymeric compounds can be used as the binder used in combination with the diazonium salt, but preferably, JP-A-54-9
Monomers having an aromatic hydroxyl group as described in Japanese Patent No. 8613, such as N-(4-hydroxyphenyl)acrylamide, N-(4-hydroxyphenyl)methacrylamide, o+, m-, or p- Copolymers of hydroxystyrene, o-, m-, or p-hydroxyphenyl methacrylate and the like with other monomers, hydroxyethyl acrylate units as described in U.S. Pat. No. 4,123,276 or a polymer containing hydroxyethyl methacrylate units as a main repeating unit Natural resins such as shellac and rosin, polyvinyl alcohol, polyamide resins described in U.S. Patent No. 3,751,257, U.S. Patent No. 3,66
0.097, a phthalated polyvinyl alcohol resin, an epoxy resin condensed from bisphenol A and epichlorohydrin, and celluloses such as cellulose acetate and cellulose acetate phthalate.
アルカリ可溶性樹脂としては、ノボラック樹脂、フェノ
ール性水酸基を有するビニル系重合体、特開昭55−5
7841号公報に記載されている多価フェノールとアル
デヒド又はケトンとの縮合樹脂等が挙げられる。ノボラ
ック樹脂としては、例えばフェノール・ホルムアルデヒ
ド樹脂、クレゾール・ホルムアルデヒド樹脂、特開昭5
5−57841号公報に記載されているようなフェノー
ル・クレゾール・ホルムアルデヒド共重縮合樹脂、特開
昭55−127553号公報に記載されているようなp
−置換フェノールとフェノールもしくは、クレゾールと
ホルムアルデヒドとの共重縮合樹脂等が挙げられる。Examples of the alkali-soluble resin include novolac resin, vinyl polymer having a phenolic hydroxyl group, and JP-A-55-5
Examples include condensation resins of polyhydric phenols and aldehydes or ketones described in Japanese Patent No. 7841. Examples of novolac resins include phenol/formaldehyde resin, cresol/formaldehyde resin, and JP-A-5
Phenol-cresol-formaldehyde copolycondensation resin as described in JP-A No. 5-57841, p as described in JP-A-55-127553
Examples include copolycondensation resins of -substituted phenol and phenol or cresol and formaldehyde.
またこれらの感光性組成物には、上記の素材の他、必要
に応じて染料、顔料等の色素、感脂化剤、可塑剤、界面
活性剤、有機酸、酸無水物、露光により酸を発生し得る
化合物等を添加することができる。In addition to the above-mentioned materials, these photosensitive compositions may also contain colorants such as dyes and pigments, sensitizing agents, plasticizers, surfactants, organic acids, acid anhydrides, and acids that can be removed by exposure to light. Compounds that may be generated can be added.
これらの結合剤は感光性組成物の固形分中に40〜99
重量%、好ましくは50〜95重量%含有される。また
ジアゾ樹脂は1〜60重量%、好ましくは3〜30重量
%含有される。These binders are present in the solid content of the photosensitive composition in an amount of 40 to 99%.
It is contained in an amount of 50 to 95% by weight. The diazo resin is contained in an amount of 1 to 60% by weight, preferably 3 to 30% by weight.
これらの感光性組成物には、その他の染料、顔料等の色
素、感脂化剤、可塑剤、界面活性剤などを添加すること
ができる。Other dyes, pigments such as pigments, fat-sensitizing agents, plasticizers, surfactants, etc. can be added to these photosensitive compositions.
(2)重合体の主鎖又は側鎖に−C)I−C)i−C−
基を有する高分子化合物を含む感光性組成物
このような高分子化合物としては、重合体の主顧又は側
鎖に感光性基として−CH−CH−C−を含むポリエス
テル類、ポリアミド類、ポリカーボネート類のような感
光性重合体を主成分とするもの(例えば米国特許第3,
030,208号、同第3゜707.373号及び同第
3,453,237号に記載されているような化合物)
;シンナミリデンマロン酸等の(2−プロベリデン)マ
ロン酸化合物及び二官能性グリコール類から8導される
感光性ポリエステル類を主成分としたもの(例えば米国
特許第2,956,878号及び同第3.173.78
7号に記載されているような感光性重合体)、ポリビニ
ールアルコール、澱粉、セルロース及びその類似物のよ
うな水酸基含有重合体のケイ皮酸エステル類(例えば米
国特許第2.690.966号、同第2,752,37
2号、同第2.732,301号等に記載されているよ
うな感光性重合体)等が挙げられる。(2) In the main chain or side chain of the polymer -C)I-C)i-C-
Photosensitive composition containing a polymer compound having groups Examples of such polymer compounds include polyesters, polyamides, and polycarbonates containing -CH-CH-C- as a photosensitive group in the main or side chain of the polymer. (e.g., U.S. Patent No. 3,
No. 030,208, No. 3707.373 and No. 3,453,237)
; those whose main components are photosensitive polyesters derived from (2-probeliden) malonic acid compounds such as cinnamylidene malonic acid and difunctional glycols (for example, U.S. Pat. No. 2,956,878 and No. 3.173.78
7), cinnamate esters of hydroxyl-containing polymers such as polyvinyl alcohol, starch, cellulose, and the like (e.g., U.S. Pat. No. 2,690,966). , same No. 2,752,37
2, No. 2,732,301, etc.).
これらの感光性組成物には、他の増感剤、安定化剤、可
塑剤、顔料や染料等を含有させることができる。These photosensitive compositions may contain other sensitizers, stabilizers, plasticizers, pigments, dyes, and the like.
(3)付加重合性不飽和化合物からなる光重合性組成物
この組成物は、好ましくは、(a)少なくとも2個の末
端ビニル基を有するビニル単量体、(b)光重合開始剤
及び(C)バインダーとしての高分子化合物からなる。(3) Photopolymerizable composition comprising an addition polymerizable unsaturated compound This composition preferably comprises (a) a vinyl monomer having at least two terminal vinyl groups, (b) a photopolymerization initiator, and ( C) Consists of a polymer compound as a binder.
この成分(a)のビニル車量体としては、特公昭35−
5093号、同35−14719号、同44−2872
7号の各公報に記載されている。As the vinyl caramer of this component (a),
No. 5093, No. 35-14719, No. 44-2872
It is described in each publication No. 7.
ポリオールのアクリル酸又はメタクリル酸エステル、即
ちジエチレングリコールジ(メタ)アクリレート、トリ
エチレングリコールジ(メタ)アクリレート、ペンタエ
リスリトールトリ (メタ)アクリレート、トリメチロ
ールプロパントリ(メタ)アクリレート等、あるいはメ
チレンビス(メタ)アクリルアミド、エチレンビス(メ
タ)アクリルアミドのようなビス(メタ)アクリルアミ
ド類、あるいはウレタン基を含有する不飽和単量体、例
えばジー(2′−メタクリロキシエチル)−2,4−ト
リレンジウレタン、ジー(2−アクリロキシエチル)ト
リメチレンジウレタン等のようなジオールモノ(メタ)
アクリレートとジイソシアネートとの反応生成物等が挙
げられる。Acrylic or methacrylic esters of polyols, such as diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, or methylene bis(meth)acrylamide , bis(meth)acrylamides such as ethylene bis(meth)acrylamide, or unsaturated monomers containing urethane groups, such as di(2'-methacryloxyethyl)-2,4-tolylene diurethane, di( Diol mono(meth) such as 2-acryloxyethyl) trimethylene diurethane etc.
Examples include reaction products of acrylate and diisocyanate.
前記成分(b)の光重合開始剤としては、前記の一般式
[1]で示される化合物が使用し得るが、他の種類のも
のも使用できる。例えば、前記のJ、にosar著「ラ
イト・センシシテイブ・システムズ」第5童に記載され
ているようなカルボニル化合物、有機硫黄化合物、過硫
化物、レドックス系化合物、アゾ並びにジアゾ化合物、
ハロゲン化合物、光還元性色素などがある。更に具体的
には英国特許第1,459,563号に開示されている
。As the photopolymerization initiator of component (b), the compound represented by the above general formula [1] can be used, but other types can also be used. For example, carbonyl compounds, organic sulfur compounds, persulfides, redox compounds, azo and diazo compounds, as described in "Light Sensitive Systems", Vol.
These include halogen compounds and photoreducible dyes. More specifically, it is disclosed in British Patent No. 1,459,563.
更に、成分(C)のバインダーとしては、公知の種々の
ポリマーを使用することができる。具体的なバインダー
の詳細は、米国特許第4.072.527号に記載され
ている。Furthermore, various known polymers can be used as the binder for component (C). Details of specific binders are described in US Pat. No. 4,072,527.
これらの光重合性組成物には、熱重合禁止剤、可塑剤、
染料やB1等を含有させることができる。These photopolymerizable compositions contain thermal polymerization inhibitors, plasticizers,
A dye, B1, etc. can be contained.
(4)アジド基を含む感光性組成物
感光性アジド化合物としては、アジド基が直接又はカル
ボニル基又はスルホニル基を介して芳香環に結合してい
る芳香族アジド化合物が好ましく使用される。(4) Photosensitive composition containing an azide group As the photosensitive azide compound, an aromatic azide compound in which the azide group is bonded to an aromatic ring directly or via a carbonyl group or a sulfonyl group is preferably used.
例えば、米国特許第3,096,311号明細書に記載
されているようなボリアシトスチレン、ポリビニル−p
−アジドヘンシアート、ポリビニル−p−アジドベンザ
ール、特公昭45−9613号公報に記載のアジドアリ
ールスルフォニルクロリドと不飽和炭化水素系ポリマー
との反応生成物、又特公昭43−21017号、同44
−229号、同44−22954号、同45−2491
5号の各公報に記載されているような、スルホニルアジ
ドやカルボニルアジドを持つポリマー等が挙げられる。For example, boriasitostyrene, polyvinyl-p as described in U.S. Pat. No. 3,096,311;
-Azidohensiatate, polyvinyl-p-azidobenzal, reaction product of azidoarylsulfonyl chloride and unsaturated hydrocarbon polymer described in Japanese Patent Publication No. 45-9613, and Japanese Patent Publication No. 43-21017, No. 44
No.-229, No. 44-22954, No. 45-2491
Polymers having sulfonyl azide or carbonyl azide as described in each publication of No. 5 can be mentioned.
前記感光性組成物に添加される感脂化剤、界面活性剤、
増感剤、安定化剤、熱重合禁止剤、可塑剤、染料や顔料
等の色素などの添加剤類は、その種類によって添加量は
異るが、概して感光性塗布液に含まれる感光性組成物に
対して、0.01〜20重量%、好ましくは0.05〜
10重量%が適当である。A liposensitizing agent and a surfactant added to the photosensitive composition,
The amount of additives such as sensitizers, stabilizers, thermal polymerization inhibitors, plasticizers, and pigments such as dyes and pigments varies depending on the type, but in general, they are included in the photosensitive composition contained in the photosensitive coating solution. 0.01 to 20% by weight, preferably 0.05 to 20% by weight based on the product
10% by weight is suitable.
本発明において好ましく用いられる染料は、塩基性染料
及び油溶性染料がある。具体的には、ビクトリア・ピュ
ア・ブルー・BOH,ビクトリア・ブルー・BH、メチ
ル・バイオレット、アイゼン・マラカイトグリーン(以
上、保土谷化学工業製)、パテント・ピュア・ブルー・
Vx10−ダミン・B、メチレン・ブルー(以上、住友
化学工業製)等の塩基性染料、並びにスーダン・ブルー
・111 ビクトリア・ブルー・F4R(以上、BA、
S、F製)、オイル・ブルー・#603、オイル・ブル
ー・BOS、オイル・ブルー・IIN(以上、オリエン
ト化学工業製)等の油溶性染料が挙げられる。Dyes preferably used in the present invention include basic dyes and oil-soluble dyes. Specifically, Victoria Pure Blue BOH, Victoria Blue BH, Methyl Violet, Eisen Malachite Green (manufactured by Hodogaya Chemical Industry), Patent Pure Blue
Basic dyes such as Vx10-Damine B, Methylene Blue (manufactured by Sumitomo Chemical), Sudan Blue 111, Victoria Blue F4R (BA,
Oil-soluble dyes include Oil Blue #603, Oil Blue BOS, and Oil Blue IIN (manufactured by Orient Chemical Industries).
本発明に用いられるシリコーンゴムとしては、次のよう
な一般式[I]で示される繰り返し単位を有する分子量
数千〜数十万の主鎖中または主鎖の末端に水酸基を有す
る線状有機ポリシロキサンを主成分とするものが好まし
い。The silicone rubber used in the present invention is a linear organic polymer having a repeating unit represented by the following general formula [I] and having a molecular weight of several thousand to hundreds of thousands and a hydroxyl group in the main chain or at the end of the main chain. Those containing siloxane as a main component are preferred.
一般式[11
%式%
ここでnは2以上の整数、Rは炭素数1〜lOのアルキ
ル基、ハロゲン化アルキル基、アルコキシル基、ビニル
基、アリール基、シラノール基(OH基)、であり、R
の60%以上がメチル基であるものが好ましい。なお上
記シラノール基(OH基)は主鎖中または主鎖の末端の
どちらにあってもよいが、末端にあることが好ましい。General formula [11% formula% where n is an integer of 2 or more, R is an alkyl group having 1 to 10 carbon atoms, a halogenated alkyl group, an alkoxyl group, a vinyl group, an aryl group, a silanol group (OH group), ,R
Preferably, 60% or more of the methyl groups are methyl groups. The silanol group (OH group) may be located either in the main chain or at the end of the main chain, but is preferably located at the end.
本発明に用いられるシランカップリング剤(またはシリ
コーン架橋剤)としては、
RnS+X4−n
(式中、nは1〜3の整数であり、Rはアルキル、アリ
ール アルケニルまたはこれらの組合された一価の基を
表し、またこれらの基はハロゲン、アミン、ヒドロキシ
、アルコキシ、アリーロキシ、チオール等の官能基を有
していてもよい。The silane coupling agent (or silicone crosslinking agent) used in the present invention is RnS + These groups may also have functional groups such as halogen, amine, hydroxy, alkoxy, aryloxy, and thiol.
Xは一0H1−CH2、−〇AC1−o−N−cり、
−cp、−Br、−■等の置換基を表す。ここでR2
、R3は上記のRと同しものを表し、R2、R3はそれ
ぞれ同じであっても異っていてもよい。またAcはアセ
チル基を表す。)で示されるシラン化合物である。X is -0H1-CH2, -0AC1-o-N-c,
Represents a substituent such as -cp, -Br, -■, etc. Here R2
, R3 represent the same as R above, and R2 and R3 may be the same or different. Moreover, Ac represents an acetyl group. ) is a silane compound represented by
つまり本発明において有用なシリコーンゴムは、このよ
うなシリコーン・ヘースボリマーと、上記に挙げるよう
なシリコーン架橋剤との綜合反応によって得られるもの
である。That is, the silicone rubber useful in the present invention is obtained by a synthetic reaction between such a silicone haze polymer and a silicone crosslinking agent such as those listed above.
本発明に用いられるシランカップリング剤の具体例とし
ては、
HN [(CH2) 3si (OMe) 3] 2
、ビニルトリエトキシシラン、Cj! (CH2) 3
sj (OMe) 3、CH35i (OAc) 3、
R5(CH2) ssi (OMe) 3、ビニルトリ
ス(メチルエチルケトオキシム)シラン等が挙げられる
。Specific examples of the silane coupling agent used in the present invention include HN [(CH2) 3si (OMe) 3] 2
, vinyltriethoxysilane, Cj! (CH2) 3
sj (OMe) 3, CH35i (OAc) 3,
Examples include R5(CH2)ssi(OMe)3, vinyltris(methylethylketoxime)silane, and the like.
前記のシリコーンゴムは市販品としても人手でき、例え
ば東芝シリコーン社製YE−3085等がある。またそ
の他の有用なシリコーンゴムは、前述の如きベース・ポ
リマーと、次のような一般式[11]で示される繰り退
し単位を有するシリコーンオイルとの反応、あるいはR
の3%程度がビニル基であるシリコーンのベース・ポリ
マーとの付加反応、あるいは該シリコーンオイル同士の
反応によっても得ることができる。The silicone rubber mentioned above can be manufactured manually as a commercially available product, such as YE-3085 manufactured by Toshiba Silicone Co., Ltd. In addition, other useful silicone rubbers can be produced by reacting the above-mentioned base polymer with a silicone oil having a repeating unit represented by the following general formula [11], or by reacting R
It can also be obtained by an addition reaction with a base polymer of silicone, about 3% of which is vinyl groups, or by reaction between the silicone oils.
一般式[,11コ HR
(式中、Rは一般式[1]で示されるポリマーの置換基
であるRと同義であり、mは2以上の整数、nはOまた
は1以上の整数である。)このような架橋反応によって
シリコーンゴムを得るためには、架橋反応を触媒を用い
て行う。この触媒としては、錫、亜鉛、コバルト、鉛、
カルシウム、マンガン、等の金属の有機カルボン酸塩、
例えばラウリル酸ジブチルスズ、スズ(II)オクトエ
ート、ナフテン酸コバルト等、あるいは塩化金酸等が用
いられる。General formula [, 11co HR (wherein, R has the same meaning as R, which is a substituent of the polymer represented by general formula [1], m is an integer of 2 or more, and n is O or an integer of 1 or more ) In order to obtain silicone rubber by such a crosslinking reaction, the crosslinking reaction is carried out using a catalyst. This catalyst includes tin, zinc, cobalt, lead,
Organic carboxylates of metals such as calcium, manganese, etc.
For example, dibutyltin laurate, tin(II) octoate, cobalt naphthenate, or chloroauric acid may be used.
またシリコーンゴムの強度を向上させ、印刷作業中に生
じる摩擦力に耐えるシリコーンゴムを得るためには、充
填剤(フィラー)を混合することもできる。予めフィラ
ーの混合されたシリコーンゴムは、シリコーンゴムスト
ック、あるいはシリコーンゴムディスバージョンとして
市販されており、本発明のようにコーティングによりシ
リコーンゴム膜を得ることが好ましい場合には、RTV
あるいはLTVシリコーンゴムのディスバージョンが好
んで用いられる。このような例としては、トーレシリコ
ーン社製5ylOff 23.5RX−257、S H
237等のベーパーコーティング用シリコーンゴムディ
スバージョンがある。Additionally, fillers can be mixed in to improve the strength of the silicone rubber and to obtain a silicone rubber that can withstand the frictional forces generated during printing operations. Silicone rubber mixed with filler in advance is commercially available as silicone rubber stock or silicone rubber dispersion, and when it is preferable to obtain a silicone rubber film by coating as in the present invention, RTV
Alternatively, dispersion of LTV silicone rubber is preferably used. An example of this is 5ylOff 23.5RX-257, S H manufactured by Toray Silicone.
There are silicone rubber dispersions for vapor coating such as 237.
本発明においては、縮合架橋タイプのシリコーンゴムを
用いることが好ましい。In the present invention, it is preferable to use condensation and crosslinking type silicone rubber.
シリコーンゴム層には、更に接着性を向上させるために
アミノ基を有するシランカップリング剤を含有している
ことが好ましい。The silicone rubber layer preferably contains a silane coupling agent having an amino group in order to further improve adhesiveness.
好ましいシランカップリング剤としては、例えば次のよ
うなものがある。Examples of preferable silane coupling agents include the following.
(a) H2NCH2CH2NH(CH2) ssi
(OC+(3) 。(a) H2NCH2CH2NH(CH2) ssi
(OC+(3).
(b) H2NCE2CH2NH(CH2) 3Si
(QC)13) 2 (CH3)(C) 82N (C
)12) ssl (OEj) 。(b) H2NCE2CH2NH(CH2) 3Si
(QC) 13) 2 (CH3) (C) 82N (C
)12) ssl (OEj).
本発明に用いられるシリコーンゴム層中には、更に光増
感剤を少量含有させることができる。The silicone rubber layer used in the present invention may further contain a small amount of photosensitizer.
本発明に用いられるシリコーンゴム層は、シリコーンゴ
ムを適当な溶媒に溶解した後、感光層上に塗布、乾燥す
る。The silicone rubber layer used in the present invention is prepared by dissolving silicone rubber in a suitable solvent, applying it onto the photosensitive layer, and drying it.
本発明の支持体としては、通常の平版印刷機にセットで
きるたわみ性と印刷時に加わる荷重に耐えるものである
ことが好ましく、例えばアルミニウム、亜鉛、銅、鋼等
の金属板、及びクロム、亜鉛、銅、ニッケル、アルミニ
ウム及び鉄等がメツキまたは蒸着された金属板、紙、プ
ラスチックフィルム及びガラス板、樹脂コート紙、アル
ミニウム等の金属箔が張られた紙等が挙げられる。The support of the present invention is preferably one that is flexible enough to be set in a normal lithographic printing machine and that can withstand the load applied during printing, such as metal plates such as aluminum, zinc, copper, and steel, and metal plates such as chromium, zinc, Examples include metal plates plated or vapor-deposited with copper, nickel, aluminum, iron, etc., paper, plastic films, glass plates, resin-coated paper, paper covered with metal foil such as aluminum, and the like.
これらのうち好ましいものはアルミニウム板である。Among these, aluminum plates are preferred.
上記接着性向上のための支持体自体に対する処理は特に
限定されるものではなく、各種粗面化処理等が含まれる
。The treatment for the support itself to improve the adhesion is not particularly limited, and includes various surface roughening treatments.
本発明の版材を構成する各層の厚さは、以下の通りであ
る。即ち支持体は50〜400μm1好ましくは100
〜300μm、感光層は0.05〜10μm1好ましく
は0.5〜5μm1シリコ一ンゴム層は0.1〜10μ
m1好ましくは0.5〜2μmである。The thickness of each layer constituting the plate material of the present invention is as follows. That is, the support has a thickness of 50 to 400 μm, preferably 100 μm.
~300 μm, photosensitive layer 0.05-10 μm, preferably 0.5-5 μm, silicone rubber layer 0.1-10 μm
m1 is preferably 0.5 to 2 μm.
本発明において、シリコーンゴム層の上面には必要に応
じて保護層を有していてもよい。In the present invention, a protective layer may be provided on the upper surface of the silicone rubber layer, if necessary.
以下余白
[実施例コ
以下に、本発明を実施例により具体的に説明するが、本
発明はこれらによって制限されるものではない。In the following, the present invention will be specifically explained with reference to examples, but the present invention is not limited by these examples.
実施例−1
通常の方法で脱脂したスムースアルミ板上に乾燥重量で
2 、0g/m”になるように下記の組成のプライマー
層組成物を塗布し、120℃で5分間加熱硬化した。Example 1 A primer layer composition having the following composition was coated on a smooth aluminum plate degreased in a conventional manner to a dry weight of 2.0 g/m'' and cured by heating at 120° C. for 5 minutes.
[プライマー層組成物コ
エビコート1001 (シェル化学製のビスフェノー
ルA系エポキシ樹脂、当量は450〜500)100重
量部
アデカハートナーEH700(旭電化(株)製、酸無水
物系硬化剤)
347f1量部
アデカハートナーEHC30(旭電化(株)製、第三級
アミン系硬化促進剤) 10重量部ナフトキノン−
(1,2)−ジアジド−(2)−5−スルホン酸クロラ
イドとピロガロール・アセトン樹脂とのエステル化合物
(特開昭60−143345号公報の合成例2に記載さ
れた化合物)50重量部
エチルセロソルブ 1500重量部メチルセ
ロソルブ 800重量部次に上記プライマ
ー層上に下記の組成の感光性組成物を乾燥重量でo、2
sg/m”となるように塗布し90℃で乾燥して感光層
を形成した。[Primer layer composition Koebicoat 1001 (bisphenol A epoxy resin manufactured by Shell Chemical, equivalent weight 450-500) 100 parts by weight Adeka Hartner EH700 (manufactured by Asahi Denka Co., Ltd., acid anhydride curing agent) 347f 1 part Adeka Heartner EHC30 (manufactured by Asahi Denka Co., Ltd., tertiary amine curing accelerator) 10 parts by weight naphthoquinone
Ester compound of (1,2)-diazide-(2)-5-sulfonic acid chloride and pyrogallol acetone resin (compound described in Synthesis Example 2 of JP-A-60-143345) 50 parts by weight ethyl cellosolve 1500 parts by weight Methyl cellosolve 800 parts by weight Next, on the primer layer, a photosensitive composition having the following composition was added to the dry weight:
sg/m'' and dried at 90°C to form a photosensitive layer.
[感光層組成物コ
p−ジアゾジフェニルアミンのパラホルムアルデヒド縮
金物のへキサフルオロリン酸塩
50重量部
2−ヒドロキシエチルメタクリレート、N−(4ヒドロ
キシフエニル)メタクリルアミド、メタクリル酸のモル
比40157/3の共重合樹脂
50重量部ビクトリアピュアブルーBOH(保止
ケ谷化学(株)製、染料) 1重量
部メチルセロソルブ 900部次いで
上記感光層上に下記のシリコーンゴム組成物を乾燥重量
で1.8g/m”になるように塗布し、90℃で10分
間乾燥してシリコーンゴム層を形成した。[Photosensitive layer composition Cop-diazodiphenylamine paraformaldehyde condensate hexafluorophosphate 50 parts by weight 2-hydroxyethyl methacrylate, N-(4-hydroxyphenyl) methacrylamide, methacrylic acid molar ratio 40157/3 copolymer resin of
50 parts by weight Victoria Pure Blue BOH (manufactured by Hodokugaya Chemical Co., Ltd., dye) 1 part by weight Methyl Cellosolve 900 parts Next, the following silicone rubber composition was applied to the photosensitive layer to a dry weight of 1.8 g/m''. The silicone rubber layer was formed by coating the silicone rubber layer and drying it at 90° C. for 10 minutes.
[シリコーンゴム層組成物]
両末端に水酸基を有するジメチルポリシロキサン(分子
量82,000) 100重量部トリアセ
トキシシラン 10重量部ジブチル錫ラウレ
ート 08重量部アイソパーE(エッソ化学
製) 9001量部更に上記シリコーンゴム層上に厚
さ8μの片面マット化ポリプロピレンフィルムをラミネ
ートして氷なし感光性平版印刷版を得た。[Silicone rubber layer composition] Dimethylpolysiloxane having hydroxyl groups at both ends (molecular weight 82,000) 100 parts by weight Triacetoxysilane 10 parts by weight Dibutyltin laurate 08 parts by weight Isopar E (manufactured by Esso Chemical) 9001 parts by weight Furthermore, the above silicone A single-sided matted polypropylene film having a thickness of 8 μm was laminated on the rubber layer to obtain an ice-free photosensitive lithographic printing plate.
このようにして得られた感光性平版印刷版のシリコーン
ゴム層上にポジフィルムを真空密着させた後、光源とし
てメタルハライドランプを用いて露光した。A positive film was vacuum-adhered onto the silicone rubber layer of the photosensitive lithographic printing plate thus obtained, and then exposed using a metal halide lamp as a light source.
次いでこの版材料を下記の塩基性化合物を含有する現像
液を自動現像機の現像部に30で仕込み、30℃に温調
した後、現像部においてブラシ周速120 m/min
で100秒で現像して露光部のシリコーンゴム層を除去
した。またリンス部にはラウリル硫酸ナトリウム1重量
%及びクエン酸5重量%を含む水溶液を101仕込んだ
。Next, this plate material was charged with a developing solution containing the following basic compound into the developing section of an automatic processor at 30° C., and after the temperature was adjusted to 30° C., the brush peripheral speed was set at 120 m/min in the developing section.
The film was developed for 100 seconds to remove the silicone rubber layer in the exposed area. Further, 101% of an aqueous solution containing 1% by weight of sodium lauryl sulfate and 5% by weight of citric acid was charged into the rinsing section.
[現像液] (p)113.0)
ケイ酸カリウム水溶液(Si(h: 26重量%、に、
0:14重量%) 20重量水
酸化カリウム 3重量水
100重量このように、上記露
光された版材料を塩基性化合物を含有する現像液で処理
し、次いでリンス処理することによりシリコーンゴム層
の除去された画像部の感光層は、赤褐色に発色し、現像
後の可視画性が付与された。[Developer] (p) 113.0) Potassium silicate aqueous solution (Si (h: 26% by weight,
0:14% by weight) 20wt potassium hydroxide 3wt water
100 weight As described above, the exposed plate material was treated with a developer containing a basic compound and then rinsed, so that the photosensitive layer in the image area from which the silicone rubber layer was removed developed a reddish-brown color. Visible image quality after development was provided.
本発明では、染色工程を設けることなく可視画像を得る
ことができるので、手や衣服を染色液で汚すことがなく
なり、また染色液による染色工程を必要としないので、
自動現像機がコンパクト化された。In the present invention, a visible image can be obtained without a dyeing process, so there is no need to stain hands or clothes with a dyeing solution, and a dyeing process using a dyeing solution is not required.
The automatic developing machine has been made more compact.
そしてこのようにして得られた印刷版を使用して印刷を
行ったところ、シャドーからハイライトに至るまで良好
な画像再現性を示し、またプレートクリナー等に対する
耐薬品性にも優れていた。When printing was carried out using the printing plate thus obtained, it showed good image reproducibility from shadows to highlights, and was also excellent in chemical resistance to plate cleaners and the like.
実施例−2〜6
実施例1で用いた現像液を第1表に示した添加剤を含む
現像液に変更する以外は、実施例1と全く同様にして実
施例1で製造した水なし感光性平版印刷版の処理を行っ
た。Examples 2 to 6 Waterless photosensitizers produced in exactly the same manner as in Example 1 except that the developer used in Example 1 was changed to a developer containing the additives shown in Table 1. The lithographic printing plate was processed.
比較例1
実施例1で使用した水なし感光性平版印刷版のプライマ
ー層にキノンジアジド化合物を含まないこと以外は、実
施例1と同様にして試験を行った。Comparative Example 1 A test was conducted in the same manner as in Example 1, except that the primer layer of the waterless photosensitive lithographic printing plate used in Example 1 did not contain a quinonediazide compound.
以上の実施例2〜6及び比較例1から明らかなように、
実施例2〜6では、第1表の如くいづれの場合にも画像
部は赤褐色の発色を示した。As is clear from the above Examples 2 to 6 and Comparative Example 1,
In Examples 2 to 6, as shown in Table 1, the image area exhibited a reddish brown color in all cases.
これに対して比較例1では塩基性化合物を含む現像液で
処理したにもかかわらず画像部において殆ど発色がなく
、したがフて画像部における可視画像が得られなかった
。On the other hand, in Comparative Example 1, there was almost no color development in the image area even though it was processed with a developer containing a basic compound, and therefore no visible image was obtained in the image area.
また本発明の如〈実施例3.5.6の有機溶剤を含む場
合には、より発色性が優れ、特にベンジルアルコールの
ような水難溶性有機溶剤の場合に優れた発色性を示すと
共に耐薬品性に優れていることがわかった。比較例1で
は、印刷時に用いるプレートクリーナー等の薬品に対し
て極めて弱いものであった。In addition, when the organic solvent of Example 3.5.6 is included, as in the present invention, the coloring property is more excellent, especially when using a poorly water-soluble organic solvent such as benzyl alcohol, it shows excellent coloring property and is also resistant to chemicals. It turned out that he has excellent sex. Comparative Example 1 was extremely sensitive to chemicals such as plate cleaners used during printing.
以下余白
[発明の効果]
本発明の湿し水不要の感光性平版印刷版のプライマー層
にキノンジアジド化合物を含有し、かつ塩基性化合物を
含む処理液で処理することにより、版材料の着色に染色
液を用いる染色工程が不要となるので、着色工程で手や
衣服が汚れることがなく作業性が向上し、また染色工程
が不要であるため自動現像機がコンパクトとなるという
優れた効果を奏するものである。The following margins [Effects of the invention] The primer layer of the photosensitive lithographic printing plate that does not require dampening water of the present invention contains a quinone diazide compound and is treated with a processing liquid containing a basic compound, thereby changing the coloring of the plate material. Since there is no need for a dyeing process that uses a liquid, work efficiency is improved because hands and clothes do not get dirty during the coloring process, and since there is no need for a dyeing process, the automatic developing machine can be made more compact. It is.
また印刷時に用いられる種々の薬品に対して被膜の劣化
が少なく、耐薬品性が優れている。Furthermore, the coating is less likely to deteriorate with respect to various chemicals used during printing, and has excellent chemical resistance.
Claims (1)
層、感光層及びシリコーンゴム層をこの順に有する湿し
水不要の感光性平版印刷版を画像露光し、ついで該感光
性平版印刷版を塩基性物質を含む水性処理液で現像後又
は現像と同時に処理して画像様に発色させることを特徴
とする湿し水不要の感光性平版印刷版の処理方法。 2)請求項1記載の塩基性物質を含む水性処理液が水を
50重量%以上含み、かつ有機溶剤を含むことを特徴と
する湿し水不要の感光性平版印刷版の処理方法。[Scope of Claims] 1) A photosensitive lithographic printing plate that does not require dampening water and has a primer layer containing a quinonediazide compound, a photosensitive layer, and a silicone rubber layer in this order on a support is imagewise exposed, and then the photosensitive lithographic printing is performed. A method for processing a photosensitive lithographic printing plate that does not require dampening water, characterized in that the plate is treated with an aqueous processing solution containing a basic substance after or simultaneously with development to develop color in an image-like manner. 2) A method for processing a photosensitive lithographic printing plate that does not require dampening water, characterized in that the aqueous processing solution containing a basic substance according to claim 1 contains 50% by weight or more of water and an organic solvent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24273490A JPH04122932A (en) | 1990-09-14 | 1990-09-14 | Processing method for dampening-waterless photosensitive planographic printing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24273490A JPH04122932A (en) | 1990-09-14 | 1990-09-14 | Processing method for dampening-waterless photosensitive planographic printing plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04122932A true JPH04122932A (en) | 1992-04-23 |
Family
ID=17093459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24273490A Pending JPH04122932A (en) | 1990-09-14 | 1990-09-14 | Processing method for dampening-waterless photosensitive planographic printing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04122932A (en) |
-
1990
- 1990-09-14 JP JP24273490A patent/JPH04122932A/en active Pending
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