JPH041220A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH041220A JPH041220A JP22057290A JP22057290A JPH041220A JP H041220 A JPH041220 A JP H041220A JP 22057290 A JP22057290 A JP 22057290A JP 22057290 A JP22057290 A JP 22057290A JP H041220 A JPH041220 A JP H041220A
- Authority
- JP
- Japan
- Prior art keywords
- ketimine
- glycidyl ether
- epoxy resin
- ether
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 36
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims abstract description 32
- -1 butyl- Chemical group 0.000 claims abstract description 24
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920002050 silicone resin Polymers 0.000 claims abstract description 15
- 125000001841 imino group Chemical group [H]N=* 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 7
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 claims abstract description 5
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 3
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 5
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 4
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 3
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 claims description 3
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 claims description 3
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 claims description 3
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 claims description 3
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 claims description 3
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000539 dimer Substances 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- LUKZQXIIABXJOH-UHFFFAOYSA-N 2-(2,2-dimethylpropoxymethyl)oxirane Chemical compound CC(C)(C)COCC1CO1 LUKZQXIIABXJOH-UHFFFAOYSA-N 0.000 claims 1
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 claims 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 150000004658 ketimines Chemical class 0.000 abstract description 26
- 238000003860 storage Methods 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 abstract description 2
- 125000003717 m-cresyl group Chemical group [H]C1=C([H])C(O*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 abstract 1
- 125000000552 p-cresyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1O*)C([H])([H])[H] 0.000 abstract 1
- 239000000047 product Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000012024 dehydrating agents Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- CJAGRJAFLCPABV-UHFFFAOYSA-N 2-(4-methylpentan-2-ylideneamino)-n-[2-(4-methylpentan-2-ylideneamino)ethyl]ethanamine Chemical compound CC(C)CC(C)=NCCNCCN=C(C)CC(C)C CJAGRJAFLCPABV-UHFFFAOYSA-N 0.000 description 1
- CLSFJOSFPTTYLQ-UHFFFAOYSA-N 2-(methylideneamino)-n-[2-(methylideneamino)ethyl]ethanamine Chemical compound C=NCCNCCN=C CLSFJOSFPTTYLQ-UHFFFAOYSA-N 0.000 description 1
- FPHDXPRLWRPJNS-UHFFFAOYSA-N 2-(propan-2-ylideneamino)-n-[2-(propan-2-ylideneamino)ethyl]ethanamine Chemical compound CC(C)=NCCNCCN=C(C)C FPHDXPRLWRPJNS-UHFFFAOYSA-N 0.000 description 1
- HJEORQYOUWYAMR-UHFFFAOYSA-N 2-[(2-butylphenoxy)methyl]oxirane Chemical compound CCCCC1=CC=CC=C1OCC1OC1 HJEORQYOUWYAMR-UHFFFAOYSA-N 0.000 description 1
- HPILSDOMLLYBQF-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COC(CCC)OCC1CO1 HPILSDOMLLYBQF-UHFFFAOYSA-N 0.000 description 1
- ZGMQJOYUICXLDZ-UHFFFAOYSA-N 6-(4-methylpentan-2-ylideneamino)-n-[6-(4-methylpentan-2-ylideneamino)hexyl]hexan-1-amine Chemical compound CC(C)CC(C)=NCCCCCCNCCCCCCN=C(C)CC(C)C ZGMQJOYUICXLDZ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- MRYPLDDLZVDMON-AXDSSHIGSA-N C(C(=C)C)(=O)OC1C[C@H](NC1)C(=O)[Si](OC)(OC)OC Chemical compound C(C(=C)C)(=O)OC1C[C@H](NC1)C(=O)[Si](OC)(OC)OC MRYPLDDLZVDMON-AXDSSHIGSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- RLAHWVDQYNDAGG-UHFFFAOYSA-N Methanetriol Chemical class OC(O)O RLAHWVDQYNDAGG-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000013466 adhesive and sealant Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- ORYURPRSXLUCSS-UHFFFAOYSA-M silver;octadecanoate Chemical compound [Ag+].CCCCCCCCCCCCCCCCCC([O-])=O ORYURPRSXLUCSS-UHFFFAOYSA-M 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はエポキシ樹脂組成物に関し、更に詳しくは−液
系のエポキシ樹脂組成物に関し、その目的とする所は常
温で貯蔵安定性に優れ、接着力に優れ、しかも硬化後の
硬化物が優れた弾力性を有する一液系エポキシ樹脂組成
物を提供せんとすることである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an epoxy resin composition, and more particularly to a liquid-based epoxy resin composition. It is an object of the present invention to provide a one-component epoxy resin composition which has excellent adhesive strength and whose cured product has excellent elasticity after curing.
〔従来の技術]
周知の通りエポキシ樹脂は各種特性に優れ、就中特に接
着力が大きいために接着剤をはしめ、その他塗料、注型
材料、含浸材料、シール相等各種の分野に於いて広く使
用されている。しかし乍らこのエポキシ樹脂は、所謂主
剤と硬化剤とから成る二液系のものが大半であり、主剤
と硬化剤とを予め混合したー液系のものでは、容易に硬
化反応が生じ、混合した後長時間放置(未使用)してお
くことが出来ず、可使時間が極めて短いという欠点があ
る。また硬化物はおおむね硬く、弾力性に乏しいという
難点が指摘され、その用途を制限している。[Prior Art] As is well known, epoxy resins have excellent properties, especially high adhesive strength, and are widely used in various fields such as adhesives, paints, casting materials, impregnation materials, and sealants. has been done. However, most of these epoxy resins are two-component systems consisting of a so-called base resin and a hardening agent.If the base resin and hardener are pre-mixed, a curing reaction easily occurs, resulting in a hardening reaction. It has the disadvantage that it cannot be left unused (unused) for a long time after use, and its pot life is extremely short. Furthermore, it has been pointed out that the cured product is generally hard and has poor elasticity, which limits its use.
可使時間を長くする対策として種々の方法例えば潜在性
硬化剤を用いる方法、酸またはアクリロニトリルを硬化
剤であるアミンに付加する方法等が知られているが、有
効な方法は少なく、実用上未だ満足すべき状態には至っ
ていない。弾力性を改善する方法として、例えばウレタ
ン変性エポキシ樹脂やエポキシ樹脂と液状アクリロニト
リルブタジェン共重合体やポリサルファイド等を併用す
る方法が開発されているが、これらは二液系のものであ
り、−液系のものではない。Various methods are known to prolong pot life, such as using latent hardeners and adding acid or acrylonitrile to amine hardeners, but there are few effective methods and there are still no practical methods. We have not yet reached a satisfactory state. As a method to improve elasticity, for example, methods have been developed in which urethane-modified epoxy resins or epoxy resins are used in combination with liquid acrylonitrile butadiene copolymers or polysulfides, but these are two-component systems; It's not a system thing.
従って本発明が解決しようとする課題は常温での貯蔵安
定性に優れ、弾力性の優れた硬化物を与えうる一液系エ
ポキシ樹脂を新たに開発することである。Therefore, the problem to be solved by the present invention is to develop a new one-component epoxy resin that has excellent storage stability at room temperature and can provide a cured product with excellent elasticity.
この課題は、
(イ)エポキシ樹脂
(ロ)下記−船蔵
[但し式中R1,Rz、R3及びR4は同一または異な
る水素、炭素数1〜6のアルキル基、またはアルキル基
を有しまたは有しないフェニル基、Xl、x2及びX、
は同一または相違なる炭素数2〜6のアルキレン基を示
し、mは0〜1の整数である]
で表されるケチミンであって、且つその骨格中ののイミ
ノ基がスチレンオキサイド、ブチルグリシジルエーテル
及びアリルグリシジルエーテル、Ptert−ブチルフ
ェニルグリシジルエーテル、P−seC−ブチルフェニ
ルグリシジルエーテル、m+ p+−クレジルグリシジ
ルエーテル、P−クレジルグリシジルエーテル、ビニル
シクロヘキサンジオキサイド、バーサチック酸グリシジ
ルエステル、カルダノール変性グリシジルエーテル、ダ
イマー酸グリシジルエステル、1.6−ヘキサンシオー
ルジグリシジルエーテル、レゾルシノールジグリシジル
エーテル、エチレングリコールジグリシジルエーテル、
プロピレングリコールジグリシジルエーテル、1,4−
ブタンジオールジグリシジルエーテル及びネオペンチル
グリコールジグリシジルエーテルの少なくとも1種と反
応したもの
(ハ)変性シリコーン樹脂、及び
(ニ)変性シリコーン樹脂用触媒
を含有して成るエポキシ樹脂組成物。(a) Epoxy resin (b) Below - Onboard [However, in the formula, R1, Rz, R3 and R4 are the same or different hydrogens, alkyl groups having 1 to 6 carbon atoms, or having or possessing an alkyl group. phenyl group, Xl, x2 and X,
represent the same or different alkylene groups having 2 to 6 carbon atoms, and m is an integer of 0 to 1], and the imino group in the skeleton is styrene oxide, butyl glycidyl ether. and allyl glycidyl ether, Ptert-butylphenyl glycidyl ether, P-seC-butylphenyl glycidyl ether, m+ p+-cresyl glycidyl ether, P-cresyl glycidyl ether, vinyl cyclohexane dioxide, versatic acid glycidyl ester, cardanol modified glycidyl ether , dimer acid glycidyl ester, 1,6-hexanesiol diglycidyl ether, resorcinol diglycidyl ether, ethylene glycol diglycidyl ether,
Propylene glycol diglycidyl ether, 1,4-
An epoxy resin composition comprising (c) a modified silicone resin reacted with at least one of butanediol diglycidyl ether and neopentyl glycol diglycidyl ether, and (d) a catalyst for the modified silicone resin.
または上記(イ)〜(ニ)の成分に更に(ネ)シラン化
合物、
を含有して成るエポキシ樹脂組成物となすことによって
解決される。Alternatively, the problem can be solved by forming an epoxy resin composition which further contains (ne) a silane compound in addition to the components (a) to (d) above.
〔発明の作用並びに構成]
本発明者の研究に依ると、上記(イ)〜(ニ)の各成分
、就中上記(ロ)で表される一般式(1)のケチミンの
イミノ基を上記特定の成分と反応させて得たケチミン誘
導体を使用することにより、−液系でありながら極めて
貯蔵安定性に優れ、また得られた硬化物が優れた弾力性
を有することが見出された。また同じく、更にこれに上
記(ホ)のシラン化合物を併用するときは特に接着強度
が大きく向上することが見出された。本発明はこれらの
新しい知見に基づいて完成されている。[Operation and structure of the invention] According to the research of the present inventor, each of the components (a) to (d) above, especially the imino group of the ketimine of the general formula (1) represented by the above (b), is It has been found that by using a ketimine derivative obtained by reacting with a specific component, the resulting cured product has excellent storage stability despite being a -liquid system, and the resulting cured product has excellent elasticity. Similarly, it has been found that when the above-mentioned silane compound (e) is used in combination, the adhesive strength is greatly improved. The present invention has been completed based on these new findings.
本発明に於いて使用される (イ)成分たるエポキシ樹
脂としては、通常のエポキシ樹脂が広い範囲で適宜に使
用され、その具体例としては例えば、ビスフェノールA
、ビスフェノールF、ビスフェノールAD等とエピクロ
ールヒドリンを反応させて得られるビスフェノールA型
エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビス
フェノールAD型エポキシ樹脂等やこれらを水添化した
エポキシ樹脂、グリシジルエステル型エポキシ樹脂、ノ
ボランク型エポキシ樹脂、ウレタン結合を有するウレタ
ン変性エポキシ樹脂、メタキシレンジアミンやヒダント
インなどをエポキシ化した含窒素エポキシ樹脂、ポリブ
タジェンあるいは、NBRを含有するゴム変性エポキシ
樹脂等があげられる。As the epoxy resin used in the present invention as component (a), a wide range of ordinary epoxy resins can be used, and specific examples include bisphenol A.
, bisphenol A type epoxy resin obtained by reacting bisphenol F, bisphenol AD, etc. with epichlorohydrin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, etc., epoxy resins hydrogenated from these, glycidyl ester type epoxy Examples include a novolanc type epoxy resin, a urethane-modified epoxy resin having a urethane bond, a nitrogen-containing epoxy resin obtained by epoxidizing metaxylene diamine or hydantoin, and a rubber-modified epoxy resin containing polybutadiene or NBR.
本発明に於いて使用される一般式(I)で表されるケチ
ミンとしては、例えば2,5.8− トリアザ−1,8
ノナジエン、2,10−ジメチル−3,6,9−トリア
ザ2.9−ウンデカジエン、2,10〜ジフェニール−
3,6゜9−トリアザ−2,9−ウンデカジエン、3.
11−ジメチル−4,7,10−)ジアザ−3,10−
トリデカジエン、3゜11−ジエチル−4,7,10−
トリアザ−3,10−トリデカジエン、2,4,12.
14−テトラメチル−5,8,11−トリアザ4.11
−ペンタデカジエン、2,4,20.22−テトラメチ
ル−5,12,19−トリアザ−4,19−トリエイコ
サジエン、2.4,15.17−テトラメチル−5,8
,IL14−テトラアザ4.14−オクタデカジエンが
好ましいものとして例示出来る。またこれと反応させる
べき成分としてはスチレンオキサイド、ブチルグリシジ
ルエーテル及びアリル(脂肪族)グリシジルエーテル、
Ptert−ブチルフェニルグリシジルエーテル、P−
seC〜ブチルフェニルグリシジルエーテル、m+ p
+−クレジルグリシジルエーテル、P−クレジルグリシ
ジルエーテル、ビニルシクロヘキサンジオキサイド、バ
ーサチック酸グリシジルエステル、カルダノール変性グ
リシジルエーテル、ダイマー酸グリシジルエステル、1
.6−ヘキサンシオールジグリシジルエーテル、レゾル
シノールジグリシジルエーテル、エチレングリコールジ
グリシジルエーテル、プロピレングリコールジグリシジ
ルエーテル、■、4−ブタンジオールジグリシジルエー
テル及びネオペンチルグリコールジグリシジルエーテル
の少なくとも1種であり、特にスチレンオキサイドが好
ましい。これら反応させるべき成分は前記−船蔵(1)
で表されるケチミン中のイミノ基と反応するが、咳式中
mが1の場合には2つのイミノ基のいずれか又は双方と
反応しても良い。反応方法としてはこれ等両成分が反応
しうる方法がいずれも通用出来、その代表的な方法を例
示すると次の通りである。即ち前記ケチミン中のイミノ
基1ケに対し前記成分0.5モル以上好ましくは1モル
以上、で混合することが望ましい。ケチミンは水分に敏
感であるので、この反応は無水条件下で実施される。Examples of the ketimine represented by the general formula (I) used in the present invention include 2,5.8-triaza-1,8
Nonadiene, 2,10-dimethyl-3,6,9-triaza-2,9-undecadiene, 2,10-diphenyl-
3,6°9-triaza-2,9-undecadiene, 3.
11-dimethyl-4,7,10-)diaza-3,10-
Tridecadiene, 3゜11-diethyl-4,7,10-
Triaza-3,10-tridecadiene, 2,4,12.
14-tetramethyl-5,8,11-triaza 4.11
-pentadecadiene, 2,4,20.22-tetramethyl-5,12,19-triaza-4,19-trieicosadiene, 2.4,15.17-tetramethyl-5,8
, IL14-tetraaza4,14-octadecadiene can be exemplified as a preferred example. Components to be reacted with this include styrene oxide, butyl glycidyl ether, allyl (aliphatic) glycidyl ether,
Ptert-butylphenyl glycidyl ether, P-
seC~butylphenylglycidyl ether, m+p
+-cresyl glycidyl ether, P-cresyl glycidyl ether, vinyl cyclohexane dioxide, versatic acid glycidyl ester, cardanol modified glycidyl ether, dimer acid glycidyl ester, 1
.. At least one of 6-hexanesiol diglycidyl ether, resorcinol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 4-butanediol diglycidyl ether, and neopentyl glycol diglycidyl ether, especially styrene. Oxides are preferred. These components to be reacted are as described above - Shipura (1)
It reacts with the imino group in ketimine represented by the formula, but when m in the formula is 1, it may react with either or both of the two imino groups. As the reaction method, any method that allows both components to react can be used, and typical methods are as follows. That is, it is desirable to mix the component in an amount of 0.5 mole or more, preferably 1 mole or more, per imino group in the ketimine. Since ketimine is sensitive to moisture, this reaction is carried out under anhydrous conditions.
特に加熱する必要はないが、150°Cで1〜2時間加
熱してもよい。配合の割合は少なくともケチミンのイミ
ノ基が50%以上好ましくは80%以上、特に好ましく
は100%反応する割合である。尚両成分のうちの1種
が未反応若干残存していてもかまわない。There is no particular need for heating, but heating may be performed at 150°C for 1 to 2 hours. The blending ratio is such that at least 50% or more, preferably 80% or more, and particularly preferably 100% of the imino groups of ketimine react. Incidentally, there is no problem even if one of the two components remains unreacted.
本発明に於いて使用される(ハ)成分たる変性シリコー
ン樹脂としては、−船蔵、
6n
(R5O)3−− Si
(式中、R3は炭素数1〜12の1価の炭化水素基、R
6は炭素数1〜6の1価の炭化水素基、nはO〜2の整
数である)
で示される加水分解性ケイ素官能基を末端に有するポリ
エーテル共重合体をいう。The modified silicone resin as component (iii) used in the present invention includes: -Ship stock, 6n (R5O)3--Si (wherein R3 is a monovalent hydrocarbon group having 1 to 12 carbon atoms, R
6 is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of O to 2.
具体例としては、ポリ(メチルジメトキシシリルエーテ
ル)等が例示され、市販のものが使用できる。これらの
ポリエーテル重合体は一種類のみを使用してもよいし、
二種類以上を混合して使用してもよい。Specific examples include poly(methyldimethoxysilyl ether), and commercially available products can be used. Only one type of these polyether polymers may be used, or
You may use a mixture of two or more types.
本発明に於いて使用される (ニ)成分たる変性シリコ
ーン樹脂用触媒は上記変性シリコーン樹脂を硬化せしめ
るための触媒であって、この作用を有するものであれば
使用出来、その具体例としては、オクチル酸錫、ステア
リン酸銀、ナフテン酸鉄、オクチル酸鉛などの金属有機
カルボン酸塩、ジ−n−ブチル錫−ジ−ラウレート、ジ
ーn−ブチル錫−ジーラウレート、ジ−n−ブチル錫−
ジッタレートなどの有機錫、アルキルチタン酸塩などが
単独もしくは混合して使用できる。The modified silicone resin catalyst used in the present invention as component (d) is a catalyst for curing the above-mentioned modified silicone resin, and can be used as long as it has this effect. Specific examples include: Metal organic carboxylates such as tin octylate, silver stearate, iron naphthenate, lead octylate, di-n-butyltin-di-laurate, di-n-butyltin-dilaurate, di-n-butyltin-
Organic tins such as ditterate, alkyl titanates, etc. can be used alone or in combination.
これ等(イ)〜(ニ)の各成分の使用割合は(ハ)成分
100重量部に対し、 (イ)成分10〜200、好ま
しくは20〜100重量部、特に好ましくは35〜10
0重量部、(ロ)成分1〜100、好ましくは2〜40
重量部、(ニ)成分0.1〜10、好ましくは6重量部
以下である。The ratio of each of these components (a) to (d) is 10 to 200, preferably 20 to 100 parts by weight, particularly preferably 35 to 10 parts by weight of component (b) to 100 parts by weight of component (c).
0 parts by weight, component (b) 1 to 100, preferably 2 to 40
The amount of component (d) is 0.1 to 10 parts by weight, preferably 6 parts by weight or less.
(ロ)成分たるケチミン誘導体は主にエポキシ樹脂の硬
化剤として作用し、特に上記特定の成分と反応したもの
で、エポキシ樹脂と反応すべきイミノ基がなくなるかま
たは減少しているため、その貯蔵安定性に大きく貢献す
る。ケチミン誘導体の使用量が上記所定量に達しない場
合は硬化速度が遅くなる傾向を有し、また所定量よりも
多くなると可使時間が短くなる傾向を示す。The ketimine derivative, which is the component (b), mainly acts as a curing agent for epoxy resins, and in particular, it reacts with the above-mentioned specific components, and since the imino groups that should react with the epoxy resin are gone or have decreased, its storage It greatly contributes to stability. When the amount of the ketimine derivative used does not reach the above-mentioned predetermined amount, the curing speed tends to be slow, and when it exceeds the predetermined amount, the pot life tends to become short.
(ハ)成分たる変性シリコーン樹脂は、主に硬化後の硬
化物の弾力性付与及び接着性付与に関連し、変性シリコ
ーン樹脂用触媒の存在下に空気中の水分により硬化する
。この(ハ)成分の使用量が上記所定の値に達しない場
合には弾力性が不充分となり、また多くなると接着性が
低下する傾向がある。The modified silicone resin as component (c) is mainly related to imparting elasticity and adhesiveness to the cured product after curing, and is cured by moisture in the air in the presence of a catalyst for the modified silicone resin. If the amount of component (c) used does not reach the above-mentioned predetermined value, the elasticity will be insufficient, and if it exceeds the amount, the adhesiveness will tend to decrease.
本発明に於いては上記(イ)〜(ニ)の各成分の他に更
に脱水剤を使用することが好ましい。脱水剤は主にケチ
ミンが水によって分解し、エポキシ樹脂と反応してしま
うこと、あるいは変性シリコーン樹脂が保存中に水と反
応して硬化してしまうことを未然に防止するために使用
され、このような脱水作用のあるものが広く有効に使用
されるが、通常ビニルトリメトキシシラン、ビニルトリ
エトキシシラン等のビニルシラン、γ−メタクリロキシ
プロリルトリメトキシシランの様なアクリルシラン、ア
セチルアセトン、オルツギ酸エステル等が好ましいもの
として使用され、その使用量は変性シリコーン樹脂10
0重量部に対し、1〜10重量部程度である。In the present invention, it is preferable to further use a dehydrating agent in addition to the components (a) to (d) above. Dehydrating agents are mainly used to prevent ketimine from decomposing with water and reacting with epoxy resins, or to prevent modified silicone resins from reacting with water and hardening during storage. Generally, vinyl silanes such as vinyltrimethoxysilane and vinyltriethoxysilane, acrylic silanes such as γ-methacryloxyprolyltrimethoxysilane, acetylacetone, and orthoformic acid esters are widely used. etc. are preferably used, and the amount used is 10% of the modified silicone resin.
The amount is about 1 to 10 parts by weight relative to 0 parts by weight.
本発明に於いては必要に応じ更に(ホ)成分たるシラン
化合物を併用することが出来る。二の(ホ)成分は主に
接着性向上の目的で使用され、通常エポキシシラン、又
は(及び)これとアミノシランとの反応物がエポキシ樹
脂100重量部に対し1〜10重量部使用される。In the present invention, a silane compound as component (e) may be used in combination as required. The second (e) component is used mainly for the purpose of improving adhesiveness, and usually 1 to 10 parts by weight of epoxy silane or (and) a reaction product of this with amino silane is used per 100 parts by weight of the epoxy resin.
本発明に於いては更に必要に応じこの種分野に於いて従
来から使用されて来たその他の各種添加剤が使用され、
更に具体的には、老化防止剤、充填剤、着色剤、可塑剤
、粘度調整剤、紫外線吸収剤等が配合出来る。In the present invention, various other additives that have been conventionally used in this type of field may be used as necessary.
More specifically, anti-aging agents, fillers, colorants, plasticizers, viscosity modifiers, ultraviolet absorbers, etc. can be added.
本発明の一液系エボキシ樹脂組成物を調製する方法は上
記(イ)〜(ニ)または(伺〜(ホ)、更には脱水剤や
その他の添加剤を均一に混合出来る方法であればいかな
る方法でも良い。調製後は適宜密封容器に入れて保存す
る。The one-component epoxy resin composition of the present invention can be prepared by any method as long as it can uniformly mix the dehydrating agent and other additives. After preparation, store it in an airtight container as appropriate.
本発明の組成物はエポキシ樹脂が従来がら使用されて来
た用途いずれの用途にも広く使用出来、特に接着剤、シ
ール剤に好適なばかりでなく、その池床材、ライニング
材、塗料、封止材等の用途にも有効に使用される。The composition of the present invention can be widely used in any of the applications for which epoxy resins have traditionally been used, and is particularly suitable for adhesives and sealants, as well as pond bed materials, lining materials, paints, and sealants. It is also effectively used as a retaining material.
以下に実施例をあげて本発明を更に詳しく説明する。 The present invention will be explained in more detail with reference to Examples below.
実施例1〜6及び比較例1
下記第1表に示す所定の各成分を所定量配合し、−液系
エポキシ樹脂組成物を調製した。数値はいずれも重量部
を示す。得られた組成物についてその物性を測定した。Examples 1 to 6 and Comparative Example 1 Predetermined amounts of each of the predetermined components shown in Table 1 below were blended to prepare a liquid-based epoxy resin composition. All numbers indicate parts by weight. The physical properties of the obtained composition were measured.
この結果を第1表に併記した。The results are also listed in Table 1.
ケチミン−1
2,4,12,14−テトラメチル−5,8,11−ト
リアザ−4,11ペンタデカジエン 1モルとスチレン
オキサイド1モルを150°CX2時間加熱反応させた
もの。Ketimine-1 A product obtained by heating and reacting 1 mole of 2,4,12,14-tetramethyl-5,8,11-triaza-4,11pentadecadiene and 1 mole of styrene oxide at 150°C for 2 hours.
ケチミン−2
ケチミン1のスチレンオキサイドに変えてブチルグリシ
ジルエーテルを反応させたもの。Ketimine-2 Ketimine-2 is obtained by reacting butyl glycidyl ether instead of styrene oxide in Ketimine-1.
ケチミン−3
ケチミン1のスチレンオキサイドに代えてアリルグリシ
ジルエーテルを反応させたもの。Ketimine-3 Ketimine-3 is obtained by reacting allyl glycidyl ether in place of styrene oxide in Ketimine-1.
ケチミン−4
ケチミン1に於いてスチレンオキサイドを全く使用せず
、未反応のもの。Ketimine-4 Ketimine 1 without using any styrene oxide and unreacted.
製 法
実施例1
変性シリコーン樹脂(鐘淵化学工業製、商品名MSポリ
マー2OA)100重量部、エポキシ樹脂(油化シェル
エポキシ製、商品名エピコート828)35重量部、炭
酸カルシウム130重量部、酸化チタン20重量部を減
圧下で撹拌混合する。そこへケチミン−110重量部、
脱水剤としてビニルトリメトキシシラン(日本ユニカー
製、商品名NUCシリコーンA171) 5重量部、シ
ラン化合物としてエポキシシラン(信越化学類、商品名
KBM403)2重量部、シリコーン樹脂用触媒として
ジブチル錫化合物(三共有機合成製、商品名スタンN0
918)2重量部加え、減圧撹拌して本発明の組成物を
製造した。Manufacturing method example 1 100 parts by weight of modified silicone resin (manufactured by Kanebuchi Chemical Co., Ltd., trade name MS Polymer 2OA), 35 parts by weight of epoxy resin (manufactured by Yuka Shell Epoxy, trade name Epicote 828), 130 parts by weight of calcium carbonate, oxidation 20 parts by weight of titanium are stirred and mixed under reduced pressure. There, ketimine-110 parts by weight,
5 parts by weight of vinyltrimethoxysilane (manufactured by Nippon Unicar, trade name: NUC Silicone A171) as a dehydrating agent, 2 parts by weight of epoxysilane (manufactured by Shin-Etsu Chemicals, trade name: KBM403) as a silane compound, dibutyltin compound (trimethoxysilane) as a catalyst for silicone resin. Manufactured by Kyōkisei, product name Stan N0
918) was added and stirred under reduced pressure to produce a composition of the present invention.
実施例2〜6
ケチミンの種類を対応する各ケチミンにした以外は実施
例1と同様に製造した。Examples 2 to 6 Products were produced in the same manner as in Example 1, except that the types of ketimines were changed to the corresponding ketimines.
比較例1
ケチミンの種類を対応するケチミンにした以外は実施例
1と同様に製造した。Comparative Example 1 A product was produced in the same manner as in Example 1 except that the type of ketimine was changed to the corresponding ketimine.
但し第1表の各特性は次の方法で測定したものである。However, each characteristic in Table 1 was measured by the following method.
硬化物物性
上記組成物を厚さ2++oになる様に20’C165%
RHの雰囲気中に7日及び28日間放置し、JIS K
6301に準じ2号ダンベルを用いて引張強さ及び伸び
を測定した。Physical Properties of Cured Product The above composition was cured at 20'C165% to a thickness of 2++o.
Leave in RH atmosphere for 7 and 28 days, JIS K
Tensile strength and elongation were measured using a No. 2 dumbbell according to 6301.
貯蔵安定性
上記組成物をカートリッジに充填密栓して20°CX7
日、28日又は50°CX7日、28日間放置の後に、
組成物の粘度を観察した。判定基準は次の通りとした。Storage stability The above composition was filled into a cartridge and sealed at 20°C
After leaving for 28 days or 7 days at 50°C for 28 days,
The viscosity of the composition was observed. The criteria for evaluation were as follows.
◎・・・変化なし
○・・・わずかに増粘
△・・・増粘大
×・・・ゲル化
実施例7〜11
実施例1に於いて使用したケチミン−1に代えて、対応
するケチミンを各々使用し、第2表の配合割合で実施例
1と同様に組成物を調製した。これら各組成物について
第1表と同様にその特性を測定した。この結果を第2表
に併記する。◎... No change ○... Slightly increased viscosity △... Largely increased viscosity ×... Gelling Examples 7 to 11 Instead of Ketimine-1 used in Example 1, the corresponding ketimine was used. A composition was prepared in the same manner as in Example 1 at the blending ratios shown in Table 2. The properties of each of these compositions were measured in the same manner as in Table 1. The results are also listed in Table 2.
第2表に於いて使用したケチミン−5〜ケチミン−9は
各々次のようにして製造したものである。Ketimine-5 to Ketimine-9 used in Table 2 were each produced as follows.
ケチミン−1のスチレンオキサイドに代えて各々次の化
合物を用い、その他はケチミン−1の場合と同様に処理
したもの。The following compounds were used in place of styrene oxide in ketimine-1, and the other treatments were the same as in the case of ketimine-1.
ケチミン−5・・・P−ter−ブチルフェニルグリシ
ジルエーテル
ケチミン−6・・・P−sec−ブチルグリシジルエー
テル
ケチミン−7・・・m + p+−クレジルグリシジル
エーテル
ケチミン−8・・・P−タレジルグリシジルエーテル
ケチミン−9・・・ビニルシクロヘキサンジオキサイド
実施例12〜15
実施例1に於いて使用したケチミン−1に代えて、対応
するケチミンを各々使用し、第3表の配合割合で実施例
1と同様に組成物を調製した。これら組成物について第
1表と同様にその特性を測定した。この結果を第3表に
示す。但し実施例工2及び13は反応すべき成分が2官
能のエポキシ樹脂を用いた場合を示す。また実施例14
及び15は本発明で使用する一般式(I)で表されるケ
チミン中mが1の場合(即ちイミノ基が一般式中2つあ
る場合)にその夫りの2つのイミノ基を反応すべき成分
でいずれも反応せしめた場合を示す。Ketimine-5...P-ter-butylphenyl glycidyl ether ketimine-6...P-sec-butyl glycidyl ether ketimine-7...m+p+-cresyl glycidyl ether ketimine-8...P-sauce Dylglycidyl ether ketimine-9...Vinyl cyclohexane dioxide Examples 12 to 15 In place of ketimine-1 used in Example 1, corresponding ketimines were used, and examples were prepared at the blending ratios shown in Table 3. A composition was prepared in the same manner as in Example 1. The properties of these compositions were measured in the same manner as in Table 1. The results are shown in Table 3. However, Examples 2 and 13 show cases where the component to be reacted is a difunctional epoxy resin. Also, Example 14
and 15, when m is 1 in the ketimine represented by the general formula (I) used in the present invention (i.e., when there are two imino groups in the general formula), the corresponding two imino groups should be reacted. The case where both components were reacted is shown.
第3表に於いて使用したケチミンは以下の通りである。The ketimines used in Table 3 are as follows.
ケチミン−10及び11
ケチミンーエのスチレンオキサイドに代えて夫々1,6
−ヘキサンシオールグリシジルエーテル(ケチミン−1
0)及びレゾルシノールジグリシジルエーテル(ケチミ
ン−11)を使用し、その他はケチミン−1と同様に処
理したもの。Ketimine-10 and 11 1 and 6 respectively in place of styrene oxide in Ketimine-1
-hexanethiol glycidyl ether (ketimine-1
0) and resorcinol diglycidyl ether (ketimine-11), and otherwise treated in the same manner as ketimine-1.
ケチミン−12
2,4,15,17−テトラメチル−5,8,IL14
−テトラアザ−4,14−オクタデカジエンの1モルと
スチレンオキサイド2モルとを150°CX2時間加熱
反応させたもの。Ketimine-12 2,4,15,17-tetramethyl-5,8,IL14
1 mole of -tetraaza-4,14-octadecadiene and 2 moles of styrene oxide were reacted by heating at 150° C. for 2 hours.
ケチミン−13
ケチミン−12のスチレンオキサイド2モルに代えてフ
ェニルグリシジルエーテル2モルを使用し、その他はケ
チミン−12と同様に処理したもの。Ketimine-13 Ketimine-12 was treated in the same manner as Ketimine-12 except that 2 moles of phenyl glycidyl ether were used in place of 2 moles of styrene oxide in Ketimine-12.
実施例16〜19及び比較例2
実施例工に於いて使用したケチミン−1に代えて、対応
するケチミンを各々使用し、第4表の配合割合で実施例
1と同様に組成物を調製した。これら組成物について第
1表と同様にその特性を測定した。この結果を第4表に
示す。但しこの例は、ケチミン中のイミノ基1個に対し
、反応さすべき成分の量を種々変化させた場合である。Examples 16 to 19 and Comparative Example 2 Compositions were prepared in the same manner as in Example 1 using the corresponding ketimines in place of ketimine-1 used in the examples and using the blending ratios shown in Table 4. . The properties of these compositions were measured in the same manner as in Table 1. The results are shown in Table 4. However, in this example, the amount of the component to be reacted with one imino group in ketimine was varied.
く使用したケチミン〉
ケチミン−1に於いてスチレンオキサイドの使用量を下
記の通り変え、その他はケチミン−1と同様に処理した
もの。Ketimine used in most cases> Ketimine-1 was treated in the same manner as Ketimine-1 except that the amount of styrene oxide used was changed as shown below.
ケチミン−14・・・スチレンオキサイド 0.5モル
ケチミン−15・・・スチレンオキサイド 0.8モル
ケチミン−16・・・スチレンオキサイド 0.9モル
ケチミン−17・・・スチレンオキサイド 1.2モル
実施例20〜25
実施例1に於いて各種成分の配合量を第5表に示す配合
例とし、その他は実施例1と同様に処理して各組成物を
調製した。但し、この例はケチミンの量を種々変えて配
合した例を示している。同様にこれらの組成物について
特性を測定した。この結果を第5表に示す。Ketimine-14... Styrene oxide 0.5 mol Ketimine-15... Styrene oxide 0.8 mol Ketimine-16... Styrene oxide 0.9 mol Ketimine-17... Styrene oxide 1.2 mol Examples 20-25 In Example 1, each composition was prepared by using the blending amounts of various components as shown in Table 5, and otherwise processing in the same manner as in Example 1. However, this example shows examples in which various amounts of ketimine were blended. Properties of these compositions were similarly measured. The results are shown in Table 5.
上記実施例1〜25で得られた各組成物についてその接
着性を測定した。この結果を第6表に示す。The adhesive properties of each of the compositions obtained in Examples 1 to 25 above were measured. The results are shown in Table 6.
但しその測定方法は以下の通りである。However, the measurement method is as follows.
接着性
上記組成物をモルタル片、スレート板、ガラス、アクリ
ル板上に50X20X2mに均一に塗布し、20°C1
65%R1(で7日間放置した後に硬化した組成物を手
で剥がして評価した。判定基準は次の通りとした。Adhesiveness: Apply the above composition uniformly on mortar pieces, slate plates, glass, acrylic plates in an area of 50 x 20 x 2 m, and heat at 20°C.
After being left at 65% R1 for 7 days, the cured composition was peeled off by hand and evaluated. The evaluation criteria were as follows.
○・・・硬化した組成物の凝集破壊となったもの×・・
・被着体の界面で破壊したもの
第6表
〔発明の効果〕
本発明組成物は常温での貯蔵安定性が優れ、また得られ
た硬化物の弾力性も優れており、しかも接着性も優れた
ものである。従ってこれ等の特性を生かし各種の分野、
特に接着剤、シール剤、床材、ライニング材、塗料、封
止材に有効に使用される。○... Cohesive failure of the cured composition ×...
- Items broken at the interface of the adherend Table 6 [Effects of the invention] The composition of the present invention has excellent storage stability at room temperature, and the obtained cured product has excellent elasticity, and also has excellent adhesive properties. It is excellent. Therefore, taking advantage of these characteristics, various fields,
It is particularly effectively used in adhesives, sealants, flooring materials, lining materials, paints, and sealants.
(以 上) −1′(that's all) -1'
Claims (2)
たは異なる水素、炭素数1〜6のアルキル基、またはア
ルキル基を有しまたは有しないフェニル基、X_1、X
_2及びX_3は同一または相違なる炭素数2〜6のア
ルキレン基を示し、mは0〜1の整数である〕 で表されるケチミンであって、且つその骨格中のイミノ
基がスチレンオキサイド、ブチルグリシジルエーテル、
アリルグリシジルエーテル、P−tert−ブチルフェ
ニルグリシジルエーテル、P−sec−ブチルフェニル
グリシジルエーテル、m,p,−クレジルグリシジルエ
ーテル、P−クレジルグリシジルエーテル、ビニルシク
ロヘキサンジオキサイド、バーサチック酸グリシジルエ
ステル、カルダノール変性グリシジルエーテル、ダイマ
ー酸グリシジルエステル、1,6−ヘキサンジオールジ
グリシジルエーテル、レゾルシノールジグリシジルエー
テル、エチレングリコールジグリシジルエーテル、プロ
ピレングリコールジグリシジルエーテル、1,4−ブタ
ンジオールジグリシジルエーテル及びネオペンチルグリ
コールジグリシジルエーテルの少なくとも1種と反応し
たもの (ハ)変性シリコーン樹脂、及び (ニ)変性シリコーン樹脂用触媒 を含有して成るエポキシ樹脂組成物。(1) (A) Epoxy resin (B) General formula below ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼... (I) [However, in the formula, R_1, R_2, R_3 and R_4 are the same or different hydrogens, carbon number 1 ~6 alkyl groups, or phenyl groups with or without alkyl groups, X_1, X
_2 and X_3 are the same or different alkylene groups having 2 to 6 carbon atoms, and m is an integer of 0 to 1], and the imino group in the skeleton is styrene oxide, butyl glycidyl ether,
Allyl glycidyl ether, P-tert-butylphenyl glycidyl ether, P-sec-butylphenyl glycidyl ether, m,p,-cresyl glycidyl ether, P-cresyl glycidyl ether, vinyl cyclohexane dioxide, versatic acid glycidyl ester, cardanol Modified glycidyl ether, dimer acid glycidyl ester, 1,6-hexanediol diglycidyl ether, resorcinol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether and neopentyl glycidyl ether An epoxy resin composition comprising (c) a modified silicone resin reacted with at least one glycidyl ether, and (d) a catalyst for the modified silicone resin.
(1)に記載のエポキシ樹脂組成物。(2) The epoxy resin composition according to claim (1), further comprising (e) a silane compound.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21676789 | 1989-08-22 | ||
JP1-216767 | 1989-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH041220A true JPH041220A (en) | 1992-01-06 |
JP3097960B2 JP3097960B2 (en) | 2000-10-10 |
Family
ID=16693588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP02220572A Expired - Fee Related JP3097960B2 (en) | 1989-08-22 | 1990-08-21 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3097960B2 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08183939A (en) * | 1994-11-01 | 1996-07-16 | Sekisui Chem Co Ltd | Room temperature-curable adhesive composition |
KR970042808A (en) * | 1995-12-30 | 1997-07-26 | 김충세 | One component room temperature curable composition |
WO1998058007A1 (en) * | 1997-06-17 | 1998-12-23 | Konishi Co., Ltd. | Process for the preparation of urethane resins and urethane resin compositions |
US5889124A (en) * | 1996-03-04 | 1999-03-30 | Kaneka Corporation | Curable resin composition |
JP2002105173A (en) * | 2000-09-28 | 2002-04-10 | Yokohama Rubber Co Ltd:The | Ketimine compound and curing resin composition containing the same |
WO2002050155A1 (en) * | 2000-12-18 | 2002-06-27 | Konishi Co., Ltd. | One-pack moisture-curing epoxy resin composition |
WO2002050154A1 (en) * | 2000-12-18 | 2002-06-27 | Konishi Co., Ltd. | One-pack moisture-curable epoxy resin composition |
JP2003128756A (en) * | 2001-10-17 | 2003-05-08 | Konishi Co Ltd | One-pack moisture-curable flexible resin composition |
US6737482B1 (en) | 1999-02-05 | 2004-05-18 | Kaneka Corporation | Curable resin composition |
EP1679329A1 (en) | 2005-01-06 | 2006-07-12 | Kaneka Corporation | Curable composition |
JP2008277062A (en) * | 2007-04-27 | 2008-11-13 | Sony Corp | Battery element armoring material, battery pack, and its manufacturing method |
KR101681465B1 (en) | 2016-06-13 | 2016-12-02 | 서선자 | Direct fired baking pan |
JP2017008626A (en) * | 2015-06-24 | 2017-01-12 | 積水化学工業株式会社 | Protective structure and protection method for cement hardened body |
-
1990
- 1990-08-21 JP JP02220572A patent/JP3097960B2/en not_active Expired - Fee Related
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08183939A (en) * | 1994-11-01 | 1996-07-16 | Sekisui Chem Co Ltd | Room temperature-curable adhesive composition |
KR970042808A (en) * | 1995-12-30 | 1997-07-26 | 김충세 | One component room temperature curable composition |
US5889124A (en) * | 1996-03-04 | 1999-03-30 | Kaneka Corporation | Curable resin composition |
WO1998058007A1 (en) * | 1997-06-17 | 1998-12-23 | Konishi Co., Ltd. | Process for the preparation of urethane resins and urethane resin compositions |
US7208560B1 (en) | 1997-06-17 | 2007-04-24 | Konishi Co., Ltd. | Process for the preparation of urethane resins and urethane resin compositions |
US6737482B1 (en) | 1999-02-05 | 2004-05-18 | Kaneka Corporation | Curable resin composition |
JP2002105173A (en) * | 2000-09-28 | 2002-04-10 | Yokohama Rubber Co Ltd:The | Ketimine compound and curing resin composition containing the same |
WO2002050154A1 (en) * | 2000-12-18 | 2002-06-27 | Konishi Co., Ltd. | One-pack moisture-curable epoxy resin composition |
US7022779B2 (en) | 2000-12-18 | 2006-04-04 | Konishi Co., Ltd. | One-pack moisture-curing epoxy resin composition |
WO2002050155A1 (en) * | 2000-12-18 | 2002-06-27 | Konishi Co., Ltd. | One-pack moisture-curing epoxy resin composition |
JP2003128756A (en) * | 2001-10-17 | 2003-05-08 | Konishi Co Ltd | One-pack moisture-curable flexible resin composition |
EP1679329A1 (en) | 2005-01-06 | 2006-07-12 | Kaneka Corporation | Curable composition |
JP2008277062A (en) * | 2007-04-27 | 2008-11-13 | Sony Corp | Battery element armoring material, battery pack, and its manufacturing method |
JP2017008626A (en) * | 2015-06-24 | 2017-01-12 | 積水化学工業株式会社 | Protective structure and protection method for cement hardened body |
KR101681465B1 (en) | 2016-06-13 | 2016-12-02 | 서선자 | Direct fired baking pan |
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