JPH0411858B2 - - Google Patents
Info
- Publication number
- JPH0411858B2 JPH0411858B2 JP56171570A JP17157081A JPH0411858B2 JP H0411858 B2 JPH0411858 B2 JP H0411858B2 JP 56171570 A JP56171570 A JP 56171570A JP 17157081 A JP17157081 A JP 17157081A JP H0411858 B2 JPH0411858 B2 JP H0411858B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- ester
- resin composition
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004593 Epoxy Substances 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 20
- 239000011342 resin composition Substances 0.000 claims description 19
- -1 acrylic ester Chemical class 0.000 claims description 15
- 150000002148 esters Chemical class 0.000 claims description 13
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 claims description 10
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 7
- 239000005056 polyisocyanate Substances 0.000 claims description 7
- 229920001228 polyisocyanate Polymers 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 5
- 239000007983 Tris buffer Substances 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 150000005691 triesters Chemical class 0.000 claims description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 6
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 6
- 239000012965 benzophenone Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- 239000013638 trimer Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 2
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 230000002165 photosensitisation Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- HSOOIVBINKDISP-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(CCC)OC(=O)C(C)=C HSOOIVBINKDISP-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- PYSGFFTXMUWEOT-UHFFFAOYSA-N 3-(dimethylamino)propan-1-ol Chemical compound CN(C)CCCO PYSGFFTXMUWEOT-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- RUJLBGCWTMTXND-UHFFFAOYSA-N 4-hydroxy-2,3-bis(hydroxymethyl)but-2-enoic acid Chemical class OCC(CO)=C(CO)C(O)=O RUJLBGCWTMTXND-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- GPDWNEFHGANACG-UHFFFAOYSA-L [dibutyl(2-ethylhexanoyloxy)stannyl] 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)O[Sn](CCCC)(CCCC)OC(=O)C(CC)CCCC GPDWNEFHGANACG-UHFFFAOYSA-L 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 229940024874 benzophenone Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GKGXKPRVOZNVPQ-UHFFFAOYSA-N diisocyanatomethylcyclohexane Chemical compound O=C=NC(N=C=O)C1CCCCC1 GKGXKPRVOZNVPQ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
Description
本発明は光、特に紫外線により容易に硬化する
光硬化性樹脂組成物に関するものである。
近年、熱による塗膜硬化および長時間の常温乾
燥による塗膜硬化の方法に代つて、光照射により
常温でしかも高速に行ないうる塗膜硬化の方法と
して光硬化性樹脂の使用が注目されている。
しかし、光硬化性樹脂に要求される特性のうち
最も重要な特性は光硬化性であり、本発明者らは
鋭意検討の結果、光重合性不飽和基を有するエポ
キシエステル系樹脂と光重合性不飽和基を有する
イソシアヌレート誘導体とを組み合わせた樹脂組
成物において光硬化性のすぐれることを見い出し
た。
すなわち、本発明は、
(A) 一分子中にエポキシ基を2個以上有するエポ
キシ化合物のアクリル酸エステルまたはメタク
リル酸エステル、
(B) (A)のエポキシ化合物のアクリル酸エステルま
たはメタクリル酸エステルをポリイソシアネー
トと反応させて得られるイソシアネート変性エ
ポキシエステル、
(C) トリス(ヒドロキシアルキル)イソシアヌレ
ートのアクリル酸またはメタクリル酸エステル
および
(D) 光重合開始剤
を含有してなる光硬化性樹脂組成物に関する。
本発明において一分子中に2個以上のエポキシ
基を含有するエポキシ化合物は、たとえばビスフ
エノールA等ビスフエノール類またはこれらの水
素添加物とエピクロルヒドリンとの反応により得
られるジグリシジルエーテル、芳香族ジカルボン
酸またはその水素添加物とエピクロルヒドリンと
の反応により得られるジグリシジルエステル、多
価アルカンアルコールとエピクロルヒドリンとの
反応により得られるポリグリシジルエーテルなど
で代表されるエポキシ化合物であり、エポキシ当
量が100〜1500、特に140〜1000のエポキシ化合物
の一種または二種以上を使用するのが好ましい。
本発明の(A)成分であるエポキシ化合物のアクリ
ル酸エステルまたはメタクリル酸エステルは、上
記エポキシ化合物とアクリル酸またはメタクリル
酸とのエステル付加反応により得られるものであ
る。これはエポキシ基/カルボキシル基が当量比
で1/0.5〜1/1、好ましくは1/0.8〜1/1
になるようにエポキシ化合物とアクリル酸または
メタクリル酸を配合し、反応させて得られる。反
応は常法でたとえば、塩基性触媒の存在下、60〜
120℃で酸価0〜20になるまで反応させて得られ
る。また、このようにして得られるエポキシ化合
物のアクリル酸エステルはメタクリル酸エステル
は、ヒドロキシル基を含有してなるポリヒドロキ
シ化合物である。したがつて上記ポリヒドロキシ
化合物とポリイソシアネートを反応させることに
よりイソシアネート変性エポキシエステルが得ら
れる。本発明の(B)成分であるイソシアネート変性
エポキシエステルは、上記の通り、エポキシ化合
物のアクリル酸エステルまたはメタクリル酸エス
テルの各分子間をポリイソシアネートで架橋また
は高分子量化したものである。この場合、ポリイ
ソシアネートの使用量を変動させることにより
種々の分子量分布に調整することができ、塗膜の
可とう性等が調整される。
上記反応は、エポキシ化合物のアクリル酸エス
テルまたはメタクリル酸エステル中のヒドロキシ
ル基(OH基)とポリイソシアネート化合物中の
イソシアネート基(NCO基)がNCO基/OH基
が当量比で1/1以下特に0.7/1以下の割合に
なるように配合されるのが好ましく、反応は、常
法で例えばジブチルチンジラウレート、ジブチル
チンジ−2−エチルヘキソエート、ジブチルチン
ジアセテート等のスズ化合物などの触媒の存在下
または存在下に20〜80℃の温度で行なわれる。
当量比が1/1を越えると遊離のNCO基が残
存し、樹脂組成物の貯蔵安定性に問題がある。
上記ポリイソシアネートとしては、トリレンジ
イソシアネート、キシレンジイソシアネート、ヘ
キサメチレンジイソシアネート、イソホロンジイ
ソシアネート、リジンジイソシアネート、トリメ
チルヘキサメチレンジイソシアネート、シクロヘ
キシルメタンジイソシアネートなどの単量体およ
びトリレンジイソシアネートの環化三量体、イソ
ホロンジイソシアネート環化三量体などのイソシ
アヌレート環を有する三量体や、ヘキサメチレン
ジイソシアネートのビユーレツト型三量体などの
多量体、さらにはこれらのポリイソシアネートと
プロパンジオール、ブタンジオール、ヘキサンジ
オール、ポリエチレングリコール、トリメチロー
ルプロパン、ペンタエリスリトールなどの多価ア
ルコール化合物との反応により、生成する一部に
好ましくは一分子中に2個以上のイソシアネート
基の残存する化合物がある。
本発明の(C)成分としては、トリス(ヒドロキシ
エチル)イソシアヌレート、トリス(ヒドロキシ
プロピル)イソシアヌレート、トリス(ヒドロキ
シブチル)イソシアヌレートの各々のアクリル酸
エステルまたはメタクリル酸エステルがある。こ
こで、エステルとしてはトリエステルが85重量%
以上含まれるのが、本発明の効果を効率的に達成
するために好ましい。ゆえに、該エステルとして
は、ジエステル、モノエステルが含まれていても
よい。
本発明に係る光硬化性樹脂組成物は、必要に応
じて(C)成分以外の光重合性単量体や有機溶剤を併
用することが望ましい。このような単量体として
は、ブチルアクリレート、2−エチルヘキシルア
クリレート、デシルアクリレート、シクロヘキシ
ルアクリレート、エチレングリコールジアクリレ
ート、1,6−ヘキサンジオールジアクリレー
ト、ブタンジオールジアクリレート、ネオペンチ
ルグリコールジアクリレート、トリメチロールプ
ロパントリアクリレート、ポリエチレングリコー
ルジアクリレートなどのアクリル酸エステル類、
およびブチルメタクリレート、2−エチルヘキシ
ルメタクリレート、デシルメタクリレート、シク
ロヘキシルメタクリレート、エチレングリコール
ジメタクリレート、1,6−ヘキサンジオールジ
メタクリレート、ブタンジオールジメタクリレー
ト、ネオペンチルグリコールジメタクリレート、
トリメチロールプロパントリメタクリレート、ポ
リエチレングリコールジメタクリレートなどのメ
タクリル酸エステル類、スチレン、ビニルトルエ
ンなどのビニル化合物などが挙げられる。また有
機溶剤としてはベンゼン、キシレン、トルエン等
の芳香族炭化水素、メタノール、エタノール等の
アルコール系、アセトン、メチルエチルケトン等
のケトン系、酢酸エチル、酢酸ブチル等のエステ
ル系などの溶剤が挙げられる。
以上の光重合成分の中で(C)成分以外の光重合成
分として、特に各々の分子中に光重合性不飽和結
合以外の不飽和二重結合を有しないもの、換言す
れば光重合性不飽和結合以外は飽和の化合物が耐
候性にすぐれるため特に建材用塗料に(特に外装
建材用として)最適である。
本発明の(D)成分である光重合開始剤には、ベン
ゾフエノン、ベンゾイン、ベンゾインメチルエー
テル、ベンゾインエチルエーテル、ベンゾインイ
ソプロピルエーテル、ベンジル、ジアセチル、ア
セトフエノン、2,2−ジメトキシ−2−フエニ
ルアセトフエノン、アントラキノンなどのカルボ
ニル化合物やスルフイド類、ハロゲン化物等があ
る。さらに必要に応じて光増感助剤として効果の
あるトリエチルアミン、2−ジメチルアミノエタ
ノール、N−メチルジエタノールアミン、トリエ
タノールアミン、3−ジメチルアミノ−1−プロ
パノール、2−ジメチルアミノ−2−メチル−1
−プロパノールなどのアルキルおよびアルカノー
ルアミンなどを組合せて使用することができる。
本発明において、(A)成分および(B)成分をあわせ
たもの100重量部に対して、(C)成分は4〜200重量
部、(C)成分以外の光重合性単量体は0〜400重量
部使用されるのが好ましい。(C)成分が(A)成分およ
び(B)成分をあわせたもの100重量部に対して4重
量部未満では、(C)成分を使用したことによる光硬
化性の改善効果が小さく、200重量部を越えると
(A)成分および(B)成分を使用したことによる光硬化
性の改善効果が低下する。また(C)成分以外の光重
合性単量体を(A)成分および(B)成分100重量部に対
し、400重量部を越えて使用した場合、本発明に
係る光硬化性樹脂組成物の光硬化性が低下する。
(C)成分および(C)成分以外の光重合性単量体は
各々、上記配合の範囲内で、それぞれ、光重合成
分〔(A),(B)および(C)成分ならびに(C)成分以外の光
重合性単量体〕総量に対して5〜50重量%、およ
び20〜50重量%になるように使用されるのが好ま
しい。
また、本発明において有機溶剤は、樹脂組成物
の粘度を低下させることを主たる目的として使用
されるためその使用量に制限はないが、光硬化性
成分100重量部に対し、0〜100重量部程度で使用
することが省資源、省エネルギーの点から好まし
い。
(D)成分の光重合開始剤は、光増感助剤と併用さ
れるときは、これらの総量で光重合成分総量に対
して、0.5〜15重量%、好ましくは2〜8重量%
使用され、光増感助剤は光重合開始剤1モルに対
して3モル以下で使用されるのが好ましい。
さらに本発明の樹脂組成物には、必要に応じて
種々の添加剤、たとえばアクリル樹脂、ケトン樹
脂、ポリエステル樹脂、ポリエチレン、ポリプロ
ピレン、ポリ酢酸ビニルなどのポリマー類やチタ
ン白などの顔料、アルミニウム粉、雲母片、タル
ク、カオリンなどの光を反射または透過する球
状、薄片状の充填剤、ジアリルフタレートなどの
可塑剤、染料などが諸性質の向上を目的として添
加できる。
次に実施例および比較例を挙げる。
合成例 1
反応器中に
シヨウダイン540 192重量部
〔昭和電工(株)商品名(ヘキサヒドロフタル酸ジ
グリシジルエステル)、エポキシ当量160〕
DRH−151 188重量部
〔シエル化学(株)商品名(水添ビスフエノールA
型ジグリシジルエーテル)、エポキシ当量235〕
アクリル酸 144重量部
トリエチルアミン 1重量部
および
ハイドロキノン 0.1重量部
を仕込み90〜100℃で約15時間加熱撹拌して酸価
10のエポキシアクリレート(a)を得た。
実施例 1
反応器中に
合成例1のエポキシアクリレート(a) 40重量部
酢酸エチル 20重量部
ジブチルチンジラウレート 0.01重量部
を仕込み均一な溶液にした後、60℃で
トリメチルヘキサメチレンジイソシアネート
7重量部
〔2,2,4−トリメチルヘキサメチレンジイ
ソシアネートと2,4,4−トリメチルヘキサメ
チレンジイソシアネートの混合物、NCO含量40
重量%〕
を添加して約4時間加熱撹拌し、イソシアネート
基が消滅するまで反応を続け、イソシアネート変
性エポキシエステル(b)を得た。
次に
イソシアネート変性エポキシエステル(b)
67重量部
トリスヒドロキシエチルイソシアヌレートのア
クリル酸エステル 25重量部
〔トリエステル93重量%、ジエステル7重量
%〕
1,6−ヘキサンジオールジアクリレート
28重量部
ベンゾフエノン 3重量部
トリエタノールアミン 2重量部
を混合・溶解して光硬化性樹脂組成物を得た。
該樹脂組成物をボンデライト#144処理鋼板に
塗布し、40℃で10分間放置して該樹脂組成物中
の酢酸エチルの50重量%以上が揮発した状態で膜
厚が30〜40μになるように調整して試験板とし
た。試験結果は表1に示す。
比較例 1
合成例1のエポキシアクリレート(a) 50重量部
トリメチロールプロパントリアクリレート
25重量部
1,6−ヘキサンジオールジアクリレート
25重量部
ベンゾフエノン 3重量部
2−ジメチルアミノエタノール 2重量部
を混合・溶解して光硬化性樹脂組成物を得た。
試験は実施例1と同様に行なつた。
比較例 2
合成例1のエポキシアクリレート(a) 50重量部
1,6−ヘキサンジオールジアクリレート
50重量部
ベンゾフエノン 3重量部
2−ジメチルアミノエタノール 2重量部
を混合・溶解して光硬化性樹脂組成物を得た。
試験は実施例1と同様に行なつた。
比較例 3
実施例1のイソシアネート変性エポキシエステ
ル(b) 67重量部
トリメチロールプロパントリアクリレート
25重量部
1,6−ヘキサンジオールジアクリレート
28重量部
ベンゾフエノン 3重量部
トリエタノールアミン 2重量部
を混合・溶解して光硬化性樹脂組成物を得た。
試験は実施例1と同様に行なつた。
比較例 4
反応器中に
ペンタエリスリトール 136重量部
無水フタル酸 296重量部
脱水ヒマシ油脂肪酸 570重量部
キシレン 100重量部
を仕込み、160〜180℃、窒素雰囲気、キシレン還
流下で3時間反応させ約36重量部の縮合水が得ら
れた。この後キシレンを留出させると酸価130の
淡黄色高粘度のアルキド樹脂が得られた。
さらに
上記アルキド樹脂 500重量部
メタクリル酸グリシジルエステル 165重量部
ハイドロキノン 3.4重量部
トリエチルアミン 6.8重量部
を反応器に仕込み、70℃で8〜10時間反応させて
酸価17の光硬化性組成物(c)を得た。
ついで
光硬化性組成物(c) 50重量部
トリス(ヒドロキシエチル)イソシアヌレート
トリアクリル酸エステル 25重量部
1,6−ヘキサンジオールジアクリレート
25重量部
ベンゾフエノン 3重量部
2−ジメチルアミノエタノール 2重量部
を混合・溶解して光硬化性樹脂組成物を得た。
試験は実施例1と同様に行なつた。
The present invention relates to a photocurable resin composition that is easily cured by light, particularly ultraviolet light. In recent years, the use of photocurable resins has been attracting attention as a method of curing paint films that can be done at room temperature and at high speed by irradiation of light, instead of the methods of curing paint films using heat or drying at room temperature for a long time. . However, the most important characteristic required of photocurable resins is photocurability, and as a result of intensive study, the present inventors found that epoxy ester resins having photopolymerizable unsaturated groups and photopolymerizable It has been found that a resin composition in combination with an isocyanurate derivative having an unsaturated group has excellent photocurability. That is, the present invention provides (A) an acrylic ester or methacrylic ester of an epoxy compound having two or more epoxy groups in one molecule, (B) an acrylic ester or methacrylic ester of the epoxy compound of (A) The present invention relates to a photocurable resin composition containing an isocyanate-modified epoxy ester obtained by reacting with an isocyanate, (C) an acrylic or methacrylic ester of tris(hydroxyalkyl)isocyanurate, and (D) a photopolymerization initiator. In the present invention, epoxy compounds containing two or more epoxy groups in one molecule include, for example, diglycidyl ethers obtained by reacting bisphenols such as bisphenol A or hydrogenated products thereof with epichlorohydrin, and aromatic dicarboxylic acids. It is an epoxy compound represented by diglycidyl ester obtained by the reaction of the hydrogenated product and epichlorohydrin, and polyglycidyl ether obtained by the reaction of polyhydric alkane alcohol and epichlorohydrin. Preferably, one or more epoxy compounds of 140 to 1000 are used. The acrylic ester or methacrylic ester of an epoxy compound, which is component (A) of the present invention, is obtained by an ester addition reaction between the above-mentioned epoxy compound and acrylic acid or methacrylic acid. This has an equivalent ratio of epoxy group/carboxyl group of 1/0.5 to 1/1, preferably 1/0.8 to 1/1.
It is obtained by blending an epoxy compound and acrylic acid or methacrylic acid so as to cause a reaction. The reaction is carried out in a conventional manner, for example, in the presence of a basic catalyst at 60 to
It is obtained by reacting at 120°C until the acid value reaches 0 to 20. The acrylic ester and methacrylic ester of the epoxy compound thus obtained are polyhydroxy compounds containing hydroxyl groups. Therefore, an isocyanate-modified epoxy ester can be obtained by reacting the above polyhydroxy compound with a polyisocyanate. As described above, the isocyanate-modified epoxy ester which is the component (B) of the present invention is obtained by crosslinking or increasing the molecular weight of each acrylic ester or methacrylic ester of an epoxy compound with a polyisocyanate. In this case, by varying the amount of polyisocyanate used, various molecular weight distributions can be adjusted, and the flexibility etc. of the coating film can be adjusted. In the above reaction, the hydroxyl group (OH group) in the acrylic ester or methacrylic ester of the epoxy compound and the isocyanate group (NCO group) in the polyisocyanate compound have an equivalent ratio of NCO group/OH group of 1/1 or less, especially 0.7. The reaction is preferably carried out in the presence of a catalyst such as a tin compound such as dibutyltin dilaurate, dibutyltin di-2-ethylhexoate, dibutyltin diacetate, or the like. It is carried out at a temperature of 20-80 °C in the presence of If the equivalent ratio exceeds 1/1, free NCO groups remain, causing problems in the storage stability of the resin composition. Examples of the polyisocyanates include monomers such as tolylene diisocyanate, xylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, lysine diisocyanate, trimethylhexamethylene diisocyanate, and cyclohexylmethane diisocyanate, and cyclized trimers of tolylene diisocyanate and isophorone diisocyanate rings. Trimers with an isocyanurate ring such as trimeric trimers, multimers such as Biuret-type trimers of hexamethylene diisocyanate, and even these polyisocyanates with propanediol, butanediol, hexanediol, polyethylene glycol, By reaction with a polyhydric alcohol compound such as methylolpropane or pentaerythritol, a part of the product preferably contains a compound in which two or more isocyanate groups remain in one molecule. Component (C) of the present invention includes acrylic esters or methacrylic esters of tris(hydroxyethyl)isocyanurate, tris(hydroxypropyl)isocyanurate, and tris(hydroxybutyl)isocyanurate. Here, triesters account for 85% by weight of esters.
It is preferable to include the above in order to efficiently achieve the effects of the present invention. Therefore, the ester may include diester and monoester. In the photocurable resin composition according to the present invention, it is desirable to use a photopolymerizable monomer other than the component (C) and an organic solvent as necessary. Such monomers include butyl acrylate, 2-ethylhexyl acrylate, decyl acrylate, cyclohexyl acrylate, ethylene glycol diacrylate, 1,6-hexanediol diacrylate, butanediol diacrylate, neopentyl glycol diacrylate, trimethylol Acrylic acid esters such as propane triacrylate and polyethylene glycol diacrylate,
and butyl methacrylate, 2-ethylhexyl methacrylate, decyl methacrylate, cyclohexyl methacrylate, ethylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, butanediol dimethacrylate, neopentyl glycol dimethacrylate,
Examples include methacrylic acid esters such as trimethylolpropane trimethacrylate and polyethylene glycol dimethacrylate, and vinyl compounds such as styrene and vinyltoluene. Examples of organic solvents include aromatic hydrocarbons such as benzene, xylene and toluene, alcohols such as methanol and ethanol, ketones such as acetone and methyl ethyl ketone, and esters such as ethyl acetate and butyl acetate. Among the photopolymerizable components mentioned above, photopolymerizable components other than component (C) are particularly those that do not have unsaturated double bonds other than photopolymerizable unsaturated bonds in each molecule, in other words, photopolymerizable unsaturated bonds. Compounds that are saturated except for saturated bonds have excellent weather resistance, so they are especially suitable for paints for building materials (particularly for exterior building materials). The photopolymerization initiator that is component (D) of the present invention includes benzophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl, diacetyl, acetophenone, 2,2-dimethoxy-2-phenylacetophene, etc. These include carbonyl compounds such as non- and anthraquinone, sulfides, and halides. Furthermore, if necessary, triethylamine, 2-dimethylaminoethanol, N-methyldiethanolamine, triethanolamine, 3-dimethylamino-1-propanol, 2-dimethylamino-2-methyl-1, which is effective as a photosensitizing agent.
- Alkyl and alkanolamines such as propanol can be used in combination. In the present invention, the amount of component (C) is 4 to 200 parts by weight, and the amount of photopolymerizable monomers other than component (C) is 0 to 100 parts by weight of the total of components (A) and (B). Preferably, 400 parts by weight are used. If component (C) is less than 4 parts by weight per 100 parts by weight of components (A) and (B) combined, the effect of improving photocurability due to the use of component (C) will be small; Beyond the section
The effect of improving photocurability due to the use of components (A) and (B) is reduced. In addition, if the photopolymerizable monomer other than component (C) is used in an amount exceeding 400 parts by weight per 100 parts by weight of components (A) and (B), the photocurable resin composition according to the present invention may Photocurability decreases.
Each photopolymerizable monomer other than component (C) and component (C) is used within the range of the above formulation. Other photopolymerizable monomers] It is preferable to use the photopolymerizable monomers in an amount of 5 to 50% by weight and 20 to 50% by weight based on the total amount. In addition, in the present invention, the organic solvent is used for the main purpose of reducing the viscosity of the resin composition, so there is no restriction on the amount used, but it is 0 to 100 parts by weight per 100 parts by weight of the photocurable component. From the viewpoint of resource and energy conservation, it is preferable to use it at a certain level. When the photopolymerization initiator (D) component is used in combination with a photosensitizing aid, the total amount thereof is 0.5 to 15% by weight, preferably 2 to 8% by weight, based on the total amount of photopolymerization components.
The photosensitizing aid is preferably used in an amount of 3 mol or less per 1 mol of the photopolymerization initiator. Furthermore, the resin composition of the present invention may contain various additives, such as polymers such as acrylic resin, ketone resin, polyester resin, polyethylene, polypropylene, and polyvinyl acetate, pigments such as titanium white, aluminum powder, Spherical or flaky fillers that reflect or transmit light such as mica flakes, talc, and kaolin, plasticizers such as diallyl phthalate, dyes, and the like can be added for the purpose of improving various properties. Next, Examples and Comparative Examples will be given. Synthesis Example 1 In a reactor: 192 parts by weight of Syodyne 540 [trade name (Showa Denko Co., Ltd. (hexahydrophthalic acid diglycidyl ester), epoxy equivalent: 160]) 188 parts by weight of DRH-151 [trade name (Water) by Ciel Kagaku Co., Ltd. Added bisphenol A
(type diglycidyl ether), epoxy equivalent: 235] 144 parts by weight of acrylic acid, 1 part by weight of triethylamine, and 0.1 part by weight of hydroquinone were heated and stirred at 90 to 100°C for about 15 hours to determine the acid value.
10 epoxy acrylate (a) was obtained. Example 1 40 parts by weight of the epoxy acrylate (a) of Synthesis Example 1, 20 parts by weight of ethyl acetate, and 0.01 part by weight of dibutyltin dilaurate were charged into a reactor to make a homogeneous solution, and then trimethylhexamethylene diisocyanate was added at 60°C.
7 parts by weight [Mixture of 2,2,4-trimethylhexamethylene diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate, NCO content 40
% by weight] was added and stirred under heat for about 4 hours, and the reaction was continued until the isocyanate group disappeared to obtain an isocyanate-modified epoxy ester (b). Next, isocyanate-modified epoxy ester (b)
67 parts by weight Acrylic ester of trishydroxyethyl isocyanurate 25 parts by weight [93% by weight of triester, 7% by weight of diester] 1,6-hexanediol diacrylate
A photocurable resin composition was obtained by mixing and dissolving 28 parts by weight of benzophenone, 3 parts by weight, and 2 parts by weight of triethanolamine.
The resin composition was applied to a Bonderite #144 treated steel plate and left at 40°C for 10 minutes so that the film thickness became 30 to 40μ with 50% by weight or more of the ethyl acetate in the resin composition volatilized. It was adjusted and used as a test plate. The test results are shown in Table 1. Comparative Example 1 Epoxy acrylate (a) of Synthesis Example 1 50 parts by weight Trimethylolpropane triacrylate
25 parts by weight 1,6-hexanediol diacrylate
A photocurable resin composition was obtained by mixing and dissolving 25 parts by weight of benzophenone, 3 parts by weight, and 2-dimethylaminoethanol.
The test was conducted in the same manner as in Example 1. Comparative Example 2 Epoxy acrylate (a) of Synthesis Example 1 50 parts by weight 1,6-hexanediol diacrylate
A photocurable resin composition was obtained by mixing and dissolving 50 parts by weight of benzophenone, 3 parts by weight, and 2-dimethylaminoethanol.
The test was conducted in the same manner as in Example 1. Comparative Example 3 Isocyanate-modified epoxy ester (b) of Example 1 67 parts by weight Trimethylolpropane triacrylate
25 parts by weight 1,6-hexanediol diacrylate
A photocurable resin composition was obtained by mixing and dissolving 28 parts by weight of benzophenone, 3 parts by weight, and 2 parts by weight of triethanolamine.
The test was conducted in the same manner as in Example 1. Comparative Example 4 Pentaerythritol 136 parts by weight phthalic anhydride 296 parts by weight dehydrated castor oil fatty acid 570 parts by weight Parts by weight of water of condensation were obtained. Thereafter, xylene was distilled off to obtain a pale yellow, highly viscous alkyd resin with an acid value of 130. Furthermore, 500 parts by weight of the above alkyd resin, 165 parts by weight of glycidyl methacrylate ester, 3.4 parts by weight of hydroquinone, and 6.8 parts by weight of triethylamine were charged into a reactor and reacted at 70°C for 8 to 10 hours to form a photocurable composition (c) with an acid value of 17. I got it. Next, photocurable composition (c) 50 parts by weight tris(hydroxyethyl)isocyanurate triacrylate 25 parts by weight 1,6-hexanediol diacrylate
A photocurable resin composition was obtained by mixing and dissolving 25 parts by weight of benzophenone, 3 parts by weight, and 2 parts by weight of 2-dimethylaminoethanol.
The test was conducted in the same manner as in Example 1.
【表】【table】
【表】
本発明の光硬化性樹脂組成物は硬化性が優れ
る。[Table] The photocurable resin composition of the present invention has excellent curability.
Claims (1)
エポキシ化合物のアクリル酸エステルまたはメ
タクリル酸エステル、 (B) (A)のエポキシ化合物のアクリル酸エステルま
たはメタクリル酸エステルをポリイソシアネー
トと反応させて得られるイソシアネート変性エ
ポキシエステル、 (C) トリス(ヒドロキシアルキル)イソシアヌレ
ートのアクリル酸またはメタクリル酸エステル および (D) 光重合開始剤 を含有してなる光硬化性樹脂組成物。 2 (A)成分及び(B)成分が光重合性不飽和基以外の
不飽和基を有しない化合物である特許請求の範囲
第1項記載の光硬化性樹脂組成物。 3 (C)成分のうち85重量%以上がトリエステルで
ある特許請求の範囲第1項または第2項記載の光
硬化性樹脂組成物。[Scope of Claims] 1 (A) an acrylic ester or methacrylic ester of an epoxy compound having two or more epoxy groups in one molecule; (B) an acrylic ester or methacrylic ester of the epoxy compound of (A); A photocurable resin composition comprising an isocyanate-modified epoxy ester obtained by reacting with a polyisocyanate, (C) an acrylic or methacrylic ester of tris(hydroxyalkyl)isocyanurate, and (D) a photopolymerization initiator. 2. The photocurable resin composition according to claim 1, wherein component (A) and component (B) are compounds having no unsaturated groups other than photopolymerizable unsaturated groups. 3. The photocurable resin composition according to claim 1 or 2, wherein 85% by weight or more of component (C) is triester.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17157081A JPS5872140A (en) | 1981-10-26 | 1981-10-26 | Photosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17157081A JPS5872140A (en) | 1981-10-26 | 1981-10-26 | Photosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5872140A JPS5872140A (en) | 1983-04-30 |
JPH0411858B2 true JPH0411858B2 (en) | 1992-03-02 |
Family
ID=15925589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17157081A Granted JPS5872140A (en) | 1981-10-26 | 1981-10-26 | Photosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5872140A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5951962A (en) * | 1982-09-20 | 1984-03-26 | Taiyo Ink Seizo Kk | Photocurable ink composition |
JPS61132947A (en) * | 1984-11-30 | 1986-06-20 | Hitachi Chem Co Ltd | Photosensitive resin composition |
JP4218944B2 (en) * | 2003-03-28 | 2009-02-04 | 三菱レイヨン株式会社 | Curable composition and article having cured coating thereof |
KR100522002B1 (en) * | 2003-09-22 | 2005-10-18 | 주식회사 코오롱 | liquid photo solder resist composition and photo solder resist film thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825371A (en) * | 1981-08-06 | 1983-02-15 | Toyobo Co Ltd | Ultraviolet-curing ink composition for printed circuit |
-
1981
- 1981-10-26 JP JP17157081A patent/JPS5872140A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825371A (en) * | 1981-08-06 | 1983-02-15 | Toyobo Co Ltd | Ultraviolet-curing ink composition for printed circuit |
Also Published As
Publication number | Publication date |
---|---|
JPS5872140A (en) | 1983-04-30 |
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