JPH0411796Y2 - - Google Patents

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Publication number
JPH0411796Y2
JPH0411796Y2 JP18163685U JP18163685U JPH0411796Y2 JP H0411796 Y2 JPH0411796 Y2 JP H0411796Y2 JP 18163685 U JP18163685 U JP 18163685U JP 18163685 U JP18163685 U JP 18163685U JP H0411796 Y2 JPH0411796 Y2 JP H0411796Y2
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JP
Japan
Prior art keywords
board
external connection
protective cover
head
base board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18163685U
Other languages
Japanese (ja)
Other versions
JPS6290144U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP18163685U priority Critical patent/JPH0411796Y2/ja
Publication of JPS6290144U publication Critical patent/JPS6290144U/ja
Application granted granted Critical
Publication of JPH0411796Y2 publication Critical patent/JPH0411796Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】[Detailed explanation of the idea] 【産業上の利用分野】[Industrial application field]

この考案は、外部接続用基板の接続端子部とヘ
ツド基板側の入力端子部とを容易に接続しうると
ともに、組立精度を安定させ、その作業性を向上
しうるように改良されたサーマルヘツドに関す
る。
This invention relates to an improved thermal head that allows easy connection of the connection terminal section of the external connection board and the input terminal section of the head board side, stabilizes assembly accuracy, and improves workability. .

【従来の技術およびその問題点】 サーマルヘツドの基本構造を、第3図および第
4図に示す。ねじ孔1aを有するベース基板1の
上に、発熱抵抗体2、およびこの発熱抵抗体2の
ドライバ回路3、ならびにこのドライバ回路への
電力あるいは制御信号を供給する櫛歯状の入力端
子部3aを有するヘツド基板4が接着等によつて
所定の位置決めをしつつ取付けられ、これらベー
ス基板1およびヘツド基板4の上には、外部接続
用基板5が重ね合わせられる。この外部接続用基
板5は、裏面一側に上記入力端子部3aと対応す
る櫛歯状の接続端子部6aを有する半透明の合成
樹脂製フイルム7と、このフイルム7の下側に配
される補強板8とを備えており、これらフイルム
7と補強板8とにわたつて上記ベース基板のねじ
孔1aに対応するねじ通し孔5aがあけられてい
る。上記外部接続用基板5側の端子部6aと、ヘ
ツド基板4側の入力端子部3aとは、上記外部接
続用基板5がベース基板1ないしヘツド基板4の
上に重ね合わせられることにより、互いに接触さ
せられる。上記外部接続用基板5の上には、さら
に保護カバー9が重ねられており、この保護カバ
ー9は、一端縁が上記ドライバ回路3を越えてヘ
ツド基板4の上面まで延びる屈曲形状の保護板1
0と、この保護板10の基端縁に先端縁が重合接
続される押さえ板11とを備えている。この押さ
え板11には、上記ベース基板1のねじ孔ないし
外部接続用基板5のねじ通し孔5aに対応するね
じ通し孔11aがあけられている。そして、上記
ベース基板1と外部接続用基板5と保護カバー9
とは、取付けねじ12がそれぞれねじ通し孔11
aないし5aを介してねじ孔1aに螺合されるこ
とにより互いに圧着固定される。なお、図中、符
号13は、サーマルヘツドの入力信号接続回路
部、14aは、押さえ板11と外部接続用基板5
との間に介装されるスペーサ、14bは、上記接
続用端子部6aをヘツド基板上の入力端子部3a
の上に圧接するためのゴム、15は、ドライバ回
路3を保護するためのコーテイング剤、16は感
熱紙、17は感熱紙駆動用のプラテンを、それぞ
れ示している。 ところで、サーマルヘツドの組立において、ま
ず、上面に上記ヘツド基板4を一体的に位置決め
載置したベース基板1の上に、外部接続基板5
が、ドライバ回路入力端子部3aと接続端子部6
aとが対応して重なるように重ねられる。このと
き両者の重合位置を調整するには、半透明のフイ
ルム側から目視により両者の端子部の重なり具合
を確かめながら、手作業で両者間のずれを調整し
なければならなかつた。しかも、このようにして
ベース基板1に対して適当な位置で外部接続用基
板5を重ね合わせたとしても、その上に保護カバ
ー9を取付ける際のねじ締め等に伴う外力によ
り、これら両者の重合位置がすれることが多く、
その場合、ふたたび位置調整をしなければならな
い。 また、ねじ締め作業においても上記ヘツド基板
側端子部3aと外部接続用基板側端子部6aの重
合位置がずれないようにその位置を確認しなが
ら、各部位において均一なねじ締めを行わなけれ
ばならないため、組立作業において非常に熟練を
要するのであり、各作業者の技量の違いから生ず
る微妙な取付け誤差により、製品精度が一定しな
い 従来、上記のようなことが組立の自動化を図る
上で大きな障害となつており、また、作業内容が
煩雑なものであるため、組立を完了するために時
間がかかり、生産効率が低下するという問題があ
つた。 この考案は以上の事情のもとで考えだされたも
のであつて、製品精度を安定させ、かつ、組立の
自動化を図ることを容易にするととともに、組立
時間を短縮しうるサーマルヘツドを提供すること
をその課題としている。
[Prior Art and its Problems] The basic structure of a thermal head is shown in FIGS. 3 and 4. A heat generating resistor 2, a driver circuit 3 for the heat generating resistor 2, and a comb-shaped input terminal portion 3a for supplying power or control signals to the driver circuit are provided on a base substrate 1 having a screw hole 1a. A head board 4 having a head board 4 is attached with predetermined positioning by adhesion or the like, and an external connection board 5 is superimposed on the base board 1 and head board 4. This external connection board 5 includes a translucent synthetic resin film 7 having a comb-shaped connection terminal portion 6a corresponding to the input terminal portion 3a on one side of the back surface, and a translucent synthetic resin film 7 disposed below the film 7. A reinforcing plate 8 is provided, and a screw through hole 5a corresponding to the screw hole 1a of the base substrate is bored across the film 7 and the reinforcing plate 8. The terminal section 6a on the external connection board 5 side and the input terminal section 3a on the head board 4 side are brought into contact with each other by overlapping the external connection board 5 on the base board 1 or the head board 4. I am made to do so. A protective cover 9 is further stacked on the external connection board 5, and this protective cover 9 has a bent protective plate 1 whose one edge extends beyond the driver circuit 3 to the upper surface of the head board 4.
0, and a pressing plate 11 whose distal edge is overlapped and connected to the proximal edge of the protective plate 10. This presser plate 11 has screw holes 11a that correspond to the screw holes of the base substrate 1 or the screw holes 5a of the external connection substrate 5. Then, the base board 1, the external connection board 5, and the protective cover 9.
This means that the mounting screws 12 are connected to each other through the screw holes 11.
By being screwed into the screw hole 1a through holes a to 5a, they are crimped and fixed to each other. In the figure, reference numeral 13 indicates the input signal connection circuit section of the thermal head, and 14a indicates the holding plate 11 and the external connection board 5.
A spacer 14b interposed between the connecting terminal section 6a and the input terminal section 3a on the head board
15 is a coating agent for protecting the driver circuit 3, 16 is thermal paper, and 17 is a platen for driving the thermal paper. By the way, in assembling the thermal head, first, the external connection board 5 is placed on the base board 1 on which the head board 4 is integrally positioned and mounted.
However, the driver circuit input terminal section 3a and the connection terminal section 6
and a are overlapped so that they correspond to each other and overlap. At this time, in order to adjust the overlapping position of the two, it was necessary to visually check the overlapping condition of the terminal portions of both from the translucent film side and manually adjust the misalignment between the two. Moreover, even if the external connection board 5 is superimposed on the base board 1 at an appropriate position in this way, the external force caused by tightening the screws when attaching the protective cover 9 thereon may cause the two to overlap. Often out of position,
In that case, the position must be adjusted again. Also, during screw tightening work, the screws must be tightened uniformly in each part while checking the overlapping position of the head board side terminal part 3a and the external connection board side terminal part 6a so that they do not shift. Therefore, assembly work requires a great deal of skill, and product accuracy varies due to subtle installation errors caused by differences in the skill of each worker. Conventionally, the above-mentioned problems have been a major obstacle in automating assembly. In addition, since the work is complicated, it takes time to complete the assembly, resulting in a reduction in production efficiency. This idea was devised under the above circumstances, and aims to provide a thermal head that can stabilize product accuracy, facilitate automation of assembly, and shorten assembly time. That is the issue.

【問題を解決するための手段】[Means to solve the problem]

上記の問題を解決するために、この考案では次
の技術的手段を採用した。 すなわち、本考案は、表面にドライバ回路およ
びその入力端子部、ならびに発熱抵抗体を有する
ヘツド基板が所定のように位置決めされて接着さ
れるベース基板と、裏面一側に上記入力端子部と
対応する接続端子部を有し、この接続端子部が上
記入力端子部に圧接されるようにして上記ベース
基板上に重合される外部接続用基板と、この外部
接続用基板の上にさらに重合される保護カバーと
を備え、これらベース基板、外部接続用基板、お
よび保護カバーが重合状態において複数本のねじ
によつて互いに固定されるサーマルヘツドにおい
て、 上記ベース基板、外部接続用基板、および保護
カバーに、挿脱可能な別体の棒状位置決め手段が
上記3つの部材間の平面的な相対位置を規定しつ
つ所定のはめあいにおいて連通挿しうる位置決め
孔を、少なくとの各2箇所設けたことを特徴とし
ている。
In order to solve the above problems, this invention adopts the following technical means. That is, the present invention has a base board on which a head board having a driver circuit, its input terminals, and a heat generating resistor is positioned and bonded in a predetermined manner on the front surface, and a back surface corresponding to the input terminal part on one side. an external connection substrate that has a connection terminal portion and is superimposed on the base substrate so that the connection terminal portion is pressed into contact with the input terminal portion; and a protection that is further superposed on the external connection substrate. In the thermal head, the base board, the external connection board, and the protective cover are fixed to each other by a plurality of screws in a superposed state, the base board, the external connection board, and the protective cover, The present invention is characterized in that at least two positioning holes are provided in each of the three members, through which the separate insertable and removable rod-shaped positioning means can be inserted in communication with each other in a predetermined fit while defining the relative position in a plane between the three members. .

【考案の作用および効果】[Functions and effects of the idea]

ベース基板、外部接続用基板、保護カバーに
は、棒状位置決め手段を連通挿したとき、あらか
じめヘツド基板上の入力端子部と外部接続用基板
側の接続端子部とが正確に重なる状態となるとと
もに、保護カバーが適当な位置において上記のよ
うに重なる接続用端子部をその上方から押圧する
ようにして、位置決め孔がそれぞれ形成されてい
る。したがつて、取付けに際しての作業手順は、
次のようにすることができる。 まず、板状の治具等に棒状位置決め手段たるピ
ンを少なくとも2本所定間隔によつて突設してお
き、これらの棒状位置決め手段に各位置決め孔を
嵌め込むようにして、ベース基板、外部接続用基
板、および保護カバーを重ね合わせる。この状態
において、ベース基板と外部接続用基板と保護カ
バーとの間の固定は図られていないが、これら3
つの部材の平面方向の相対位置は、所定の位置に
決定されることになる。すなわち、上記のように
重ねるだけで、ヘツド基板上の入力端子部と、接
続基板側の接続端子部とが、両者がピツチの比較
的細かい櫛歯状となつているにもかかわらず、正
確に所定の端子どうしが重合させられる。そし
て、保護カバーが、接続用基板の上に、適当な押
圧力をもつて接触し、上記両端子部間の適度な圧
接を図ることができるように位置決めされる。 この状態において、たとえば、ねじを保護カバ
ーおよび外部接続用基板のねじ通し孔を通しなが
ら、ベース基板上のねじ孔にねじ込んでいく。も
ちろん、これらのねじ通し孔およびねじ孔の平面
的な位置は、ねじを連通挿ないし螺合しうるよう
に合わせられている。ねじ締め作業をするとき、
ねじ締めの最終段階において、保護カバーをねじ
軸部を中心とした右回りに回転させようとする力
が働くが、本願考案では、上記のごとく各位置決
め孔に連通挿される棒状位置決め手段は、少なく
とも2本用いられることになるので、かかる保護
カバーの回転は発生せず、したがつて、ねじ締め
による重合3部材の位置ずれは起こりえない。こ
のようにして複数本のねじのねじ締めによつて上
記3つの部材、すなわち、ベース基板、外部接続
用基板、および保護カバーの相互の固定が終了す
ると、板状の治具を下方に抜き取り、棒状位置決
め手段を各位置決め孔から抜き去る。 以上のように、本考案においては、ベース基板
に一体的に接着されたヘツド基板上の入力端子部
と、外部接続用基板側端子部との接続のための位
置決めは、棒状位置決め手段を介して自動的に行
われることになるので、従来例における外部接続
用基板のフイルム上から透視しながら、上記両者
の端子部が適当な接続状態におかれるように、外
部接続用基板のベース基板ないしヘツド基板に対
する重なり具合を調整するという面倒な作業が省
略される。また、外部接続用基板に対する保護カ
バーの平面的な位置決めも、上記棒状位置決め部
材を介して自動的に行われる。 そして、ねじ締め作業等における外力の負荷に
伴う上記外部接続用基板および保護カバー間の回
転位置ずれも回避されるため、ねじ締め作業後に
おけるベース基板、外部接続用基板、および保護
カバーの重合位置の確認作業も省略される。以上
の結果、サーマルヘツドの組立作業性が大いに向
上させられ、かつ未熟練者でも容易に組立を行う
ことが可能となる。さらには、各製品間における
取付け誤差の発生も回避され、製品精度が画一的
に安定するとともに組立工程の自動化への対応が
容易となる。 加えて、本考案における上記棒状位置決め手段
は、ベース基板と外部接続用基板と保護カバーと
の相互間をねじで連結する作業の終了後、各部材
の位置決め孔から抜き取られるものであるので、
たとえば、ベース基板と保護カバーとの間の熱膨
張率の差に起因する熱応力の発生を緩和すること
ができる。
When the rod-shaped positioning means is inserted into the base board, the external connection board, and the protective cover in communication, the input terminals on the head board and the connection terminals on the external connection board are accurately overlapped, and Positioning holes are formed in such a manner that the protective cover presses the overlapping connection terminal portions from above at appropriate positions as described above. Therefore, the work procedure for installation is as follows:
It can be done as follows. First, at least two pins, which are rod-shaped positioning means, are provided protruding from a plate-shaped jig or the like at a predetermined interval, and each positioning hole is fitted into each of these rod-shaped positioning means, and the base board and the external connection board are connected. , and overlay the protective cover. In this state, the base board, external connection board, and protective cover are not fixed, but these three
The relative positions of the two members in the plane direction are determined to be predetermined positions. In other words, by simply overlapping the input terminals as described above, the input terminals on the head board and the connection terminals on the connection board can be accurately connected, even though both have a comb-like shape with a relatively fine pitch. Predetermined terminals are polymerized together. The protective cover is positioned so as to come into contact with the connection board with an appropriate pressing force and to achieve appropriate pressure contact between the two terminals. In this state, for example, screw the screw into the screw hole on the base board while passing through the screw through hole of the protective cover and the external connection board. Of course, the planar positions of these screw holes and screw holes are adjusted so that the screws can be inserted or screwed together. When tightening screws,
In the final stage of screw tightening, a force acts to rotate the protective cover clockwise around the screw shaft, but in the present invention, the rod-shaped positioning means inserted in communication with each positioning hole as described above is at least Since two screws are used, such rotation of the protective cover does not occur, and therefore, displacement of the three overlapping members due to screw tightening cannot occur. In this way, when the above three members, that is, the base board, the external connection board, and the protective cover are fixed to each other by tightening the plurality of screws, the plate-shaped jig is pulled out downward. The rod-shaped positioning means is removed from each positioning hole. As described above, in the present invention, positioning for connection between the input terminal section on the head board, which is integrally bonded to the base board, and the terminal section on the external connection board side is performed via the rod-shaped positioning means. This will be done automatically, so while looking through the film of the external connection board in the conventional example, connect the base board or head of the external connection board so that the terminal parts of both of the above are in an appropriate connection state. The troublesome work of adjusting the degree of overlap with the substrate is omitted. Further, the planar positioning of the protective cover with respect to the external connection board is also automatically performed via the rod-shaped positioning member. Furthermore, since the rotational position shift between the external connection board and the protective cover due to the load of external force during screw tightening work etc. is avoided, the overlapping position of the base board, external connection board, and protective cover after the screw tightening work is avoided. The confirmation work is also omitted. As a result of the above, the efficiency of assembling the thermal head is greatly improved, and even an unskilled person can easily assemble it. Furthermore, the occurrence of installation errors between products is also avoided, product accuracy is uniformly stabilized, and the assembly process can be easily automated. In addition, the rod-shaped positioning means in the present invention is removed from the positioning holes of each member after the work of connecting the base board, external connection board, and protective cover with screws is completed.
For example, the occurrence of thermal stress caused by a difference in thermal expansion coefficient between the base substrate and the protective cover can be alleviated.

【実施例の説明】[Explanation of Examples]

以下、この考案の実施例を図面を参照して具体
的に説明する。 この考案の好ましい実施例を第1図および第2
図に示す。第1図から明らかなように、本例のサ
ーマルヘツドは、互いに重合される3つの部材、
すなわち、ベース基板1、外部接続用基板5、お
よび保護カバー9に、それぞれ位置決め孔18,
19,20が設けられている点を除き、その他の
構成は、第3図および第4図に示す従来例と同様
である。なお、これらの位置決め孔18,19,
20のうち、ベース基板1と外部接続用基板5に
設ける位置決め孔18,19は、平面方向の位置
が一致したとき、ベース基板1上のヘツド基板に
設けられた入力端子部3aと外部接続用基板5側
の接続端子部6aとが正確に対応して重なるよう
にあけられている。また、外部接続用基板5と保
護カバー9に設ける位置決め孔19,20は、平
面方向の位置が一致したとき、保護カバー9が、
外部接続用基板5の接続端子部6aの上の好適な
位置においてこれを下方に押圧できるようにあけ
られている。そしてこれらの各位置決め孔18,
19,20は、これに連通挿される位置決め手段
としての案内ピン23と密に嵌合する大きさにし
ておくことが好ましい。なお、本例において各位
置決め孔18,19,20は、それぞれ2箇所設
けている。 上記の構成において、サーマルヘツドの組立
は、次のようにして行うことができる。 第1図に示すように、各部材に設けた2つの位
置決め孔18,19,20のピツチ間隔と対応し
た2本の案内ピン23を上面に突設した板状の治
具22を準備し、この治具22の上に、ベース基
板1、外部接続用基板5、および保護カバー9の
順に、それぞれの部品の位置決め孔18,19,
20を上記案内ピン23,23に嵌め込むように
して重ね合わせる。この状態において、ベース基
板1に対する外部接続用基板5の平面方向の位
置、すなわち、より詳しくはベース基板上のヘツ
ド基板に設けられた入力端子部3aと、外部接続
用基板5に設けられた接続端子部6aとが都合よ
く重なり合うように位置決めされ、外部接続用基
板5と保護カバー9との間は、この保護カバー
が、外部接続用基板の接続端子部6aの上面を、
ヘツド基板の入力端子部3aに対して適当な押圧
を与えることができるように位置決めされること
になる。 こうして上記3つの部材1,5,9がその平面
方向の相対位置が適当かつ正確に位置決めされた
状態において、複数本の取付けねじ12を用い、
これらを保護カバー9のねじ通し孔1a、外部接
続用基板5のねじ通し孔5aを通した上でベース
基板1のねじ孔11aに螺合することにより、上
記3つの部材の相互間の連結を図る。このとき、
第1番目の取付けねじを用いて上記のようなねじ
締め作業をする際、ねじ締めの最終段階におい
て、保護カバー9をねじの軸心を中心として右回
りに回転させようとする外力が作用するが、各部
材に設けるべき位置決め孔が2箇所形成され、こ
れら2箇所の位置決め孔に2本の位置決めピン2
3,23が連通挿されていることから、上記のよ
うに保護カバー9を回転させようとする力が働い
ても、これが不用意に回転することは阻止され、
位置決めピン23,23による上述した正確な位
置決め状態は、すべての取付けねじ12のねじ締
め作業が完了するまで、維持されたままとなる。 上記のようにしてベース基板1、外部接続用基
板5、および保護カバー9が互いに複数本の取付
けねじ12によつて連結固定された後、この組付
け体を上記の治具22から上方に引き上げて各位
置決めピン23,23を各部材の位置決め孔1
8,19,20から抜き去って製品が完成する。
このように、本考案のサーマルヘツドは、簡単な
作業によつてサーマルヘツドを構成する部材間の
平面方向の位置決めを適当な状態に担保しつつ組
立を行うことができ、しかも、各製品間における
取付け誤差の発生も回避されて製品精度が画一的
に安定し、自動組立への対応を容易化することが
できる。 さらに、本考案においては、棒状位置決め手段
は、組立作業後抜き去られるので、かかる棒状位
置決め手段が組立製品内に残留している場合に比
較すると、ベース基板と保護カバーとの間の熱膨
張率の差に起因した熱応力の発生を低減させるこ
とができる。
Hereinafter, embodiments of this invention will be described in detail with reference to the drawings. A preferred embodiment of this invention is shown in FIGS. 1 and 2.
As shown in the figure. As is clear from FIG. 1, the thermal head of this example consists of three members that are superposed on each other:
That is, the base board 1, the external connection board 5, and the protective cover 9 have positioning holes 18,
19 and 20 are provided, the other configuration is the same as the conventional example shown in FIGS. 3 and 4. Note that these positioning holes 18, 19,
20, the positioning holes 18 and 19 provided in the base board 1 and the external connection board 5 are aligned with the input terminal portion 3a provided in the head board on the base board 1 for external connection when the positions in the planar direction match. The openings are made so that the connecting terminal portions 6a on the board 5 side correspond to each other accurately and overlap with each other. Further, when the positioning holes 19 and 20 provided in the external connection board 5 and the protective cover 9 match in the planar direction, the protective cover 9
An opening is provided at a suitable position above the connection terminal portion 6a of the external connection board 5 so that the connection terminal portion 6a can be pressed downward. And each of these positioning holes 18,
Preferably, the guide pins 19 and 20 are sized so as to tightly fit with the guide pin 23 as a positioning means which is inserted in communication with the guide pins 23. In this example, each positioning hole 18, 19, 20 is provided at two locations. In the above configuration, the thermal head can be assembled as follows. As shown in FIG. 1, a plate-shaped jig 22 having two guide pins 23 protruding from its upper surface corresponding to the pitch of the two positioning holes 18, 19, 20 provided in each member is prepared, On this jig 22, positioning holes 18, 19,
20 are fitted into the guide pins 23, 23 and overlapped. In this state, the position of the external connection board 5 in the plane direction with respect to the base board 1, that is, more specifically, the input terminal section 3a provided on the head board on the base board and the connection provided on the external connection board 5. The terminal portions 6a are positioned so that they overlap conveniently, and between the external connection board 5 and the protective cover 9, the protective cover covers the upper surface of the connection terminal portion 6a of the external connection board.
It is positioned so that it can apply appropriate pressure to the input terminal portion 3a of the head board. In this way, with the three members 1, 5, and 9 properly and accurately positioned relative to each other in the planar direction, using a plurality of mounting screws 12,
By passing these through the screw holes 1a of the protective cover 9 and the screw holes 5a of the external connection board 5, and then screwing them into the screw holes 11a of the base board 1, the three members described above are connected to each other. Plan. At this time,
When performing the above-mentioned screw tightening work using the first mounting screw, in the final stage of screw tightening, an external force acts to rotate the protective cover 9 clockwise around the axis of the screw. However, two positioning holes are formed in each member, and two positioning pins 2 are inserted into these two positioning holes.
3 and 23 are inserted in communication with each other, even if a force is applied to rotate the protective cover 9 as described above, it is prevented from inadvertently rotating.
The above-mentioned accurate positioning state by the positioning pins 23, 23 is maintained until all the mounting screws 12 have been tightened. After the base board 1, external connection board 5, and protective cover 9 are connected and fixed to each other by the plurality of mounting screws 12 as described above, this assembled body is pulled upward from the jig 22. and insert each positioning pin 23 into the positioning hole 1 of each member.
The product is completed by removing from 8, 19, and 20.
As described above, the thermal head of the present invention can be assembled by a simple operation while ensuring proper positioning in the planar direction between the members constituting the thermal head. Installation errors are also avoided, product accuracy is uniformly stabilized, and automatic assembly is facilitated. Furthermore, in the present invention, since the bar-shaped positioning means is removed after the assembly operation, the thermal expansion coefficient between the base substrate and the protective cover is lower than that in the case where the bar-shaped positioning means remains in the assembled product. It is possible to reduce the occurrence of thermal stress caused by the difference in the temperature.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、この考案の分解斜視図、第2図は上
記実施例の組立作業の説明図、第3図は、従来例
の拡大断面図、第4図は従来例の分解斜視図であ
る。 1……ベース基板、2……発熱抵抗体、3……
ドライバ回路、3a……ドライバ回路用入力端子
部、5……外部接続用基板、6a……接続端子
部、9……保護カバー、18,19,20……位
置決め孔、23……位置決め手段。
Fig. 1 is an exploded perspective view of this invention, Fig. 2 is an explanatory diagram of the assembly work of the above embodiment, Fig. 3 is an enlarged sectional view of the conventional example, and Fig. 4 is an exploded perspective view of the conventional example. . 1...Base board, 2...Heating resistor, 3...
Driver circuit, 3a... Input terminal section for driver circuit, 5... Board for external connection, 6a... Connection terminal section, 9... Protective cover, 18, 19, 20... Positioning hole, 23... Positioning means.

Claims (1)

【実用新案登録請求の範囲】 表面にドライバ回路およびその入力端子部、な
らびに発熱抵抗体を有するヘツド基板が所定のよ
うに位置決めされて接着されるベース基板と、裏
面一側に上記入力端子部と対応する接続端子部を
有し、この接続端子部が上記入力端子部に圧接さ
れるようにして上記ベース基板上に重合される外
部接続用基板と、この外部接続用基板の上にさら
に重合される保護カバーとを備え、これらベース
基板、外部接続用基板、および保護カバーが重合
状態において複数本のねじによつて互いに固定さ
れるサーマルヘツドにおいて、 上記ベース基板、外部接続用基板、および保護
カバーに、挿脱可能な別体の棒状位置決め手段が
上記3つの部材間の平面的な相対位置を規定しつ
つ所定のはめあいにおいて連通挿しうる位置決め
孔を、少なくとも各2箇所設けたことを特徴とす
る、サーマルヘツド。
[Claims for Utility Model Registration] A base board on which a head board having a driver circuit, its input terminals, and a heat generating resistor is positioned and adhered in a predetermined manner on the front surface, and the above-mentioned input terminal part on one side of the back surface. an external connection substrate having a corresponding connection terminal portion and superimposed on the base substrate so that the connection terminal portion is pressed into contact with the input terminal portion; and an external connection substrate further superposed on the external connection substrate. In a thermal head, the base board, the external connection board, and the protection cover are fixed to each other by a plurality of screws in a superposed state, the base board, the external connection board, and the protection cover The present invention is characterized in that at least two positioning holes are provided in each of the three members, through which the separate insertable and removable rod-shaped positioning means can be inserted in communication with each other in a predetermined fit while defining the relative position in a plane between the three members. , thermal head.
JP18163685U 1985-11-25 1985-11-25 Expired JPH0411796Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18163685U JPH0411796Y2 (en) 1985-11-25 1985-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18163685U JPH0411796Y2 (en) 1985-11-25 1985-11-25

Publications (2)

Publication Number Publication Date
JPS6290144U JPS6290144U (en) 1987-06-09
JPH0411796Y2 true JPH0411796Y2 (en) 1992-03-24

Family

ID=31126686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18163685U Expired JPH0411796Y2 (en) 1985-11-25 1985-11-25

Country Status (1)

Country Link
JP (1) JPH0411796Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1048473B1 (en) * 1998-09-09 2004-11-17 Rohm Co., Ltd. Thermal printhead
JP2002370396A (en) * 2001-06-13 2002-12-24 Sii P & S Inc Thermal head unit and its manufacturing method

Also Published As

Publication number Publication date
JPS6290144U (en) 1987-06-09

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