JPH04112075A - Pattern transfer method and device - Google Patents

Abstract

PURPOSE:To perform a transferring with high dimensional precision and reproducibility by using a pattern transfer plate whose pattern forming face is curved having an end part and pressing pressure transfer patterns to a work lithography in turn along the curved face. CONSTITUTION:A pattern transfer plate 1 provided with transfer patterns 3 is arranged facing a work lithography 2. The pattern transfer plate 1 is formed by a curved face with a pattern forming face having an end part. The transfer pattern 3 can be formed by using properly, for example, various inks or metallic film having a sticking layer on a contacting face with the work lithography 2. For example, a work surface plate 20 which holds the work lithography 2 is moved in the direction of the pattern transfer plate 2, so that a part of the transfer patterns 3 is pressed with pressure to the work lithography 2 in a state that the part of the transfer patterns 3 is contacted with the work lithography 2. When the transfer patterns 3 are pressed with pressure to the work lithography 2 in turn along the curve of the pattern forming face, the transfer patterns 3 are transferred continuously on the work lithography 2, so that a predetermined pattern can be formed on the work lithography 2.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a pattern transfer method and a pattern transfer device, and more specifically, to accurately transfer a transfer pattern onto a workpiece flat plate with high dimensional accuracy and reproducibility. This invention relates to a pattern transfer method that can be used and is suitable for manufacturing thin film semiconductor devices by, for example, a printing method, and a pattern transfer device that can be used suitably in this pattern transfer method. [Problems to be Solved by the Technology and Invention] For example, in the production of thin film semiconductor devices, it is necessary to accurately form fine patterns for circuits and devices.

In manufacturing this thin film semiconductor element, for example, a resist ink is printed directly on the workpiece, or a photoresist layer is coated in advance, and then a printing ink layer that blocks ultraviolet rays is printed on the workpiece in a predetermined shape. rear,
A possible method is to form a fine pattern by employing a printing method in which exposure and development are performed, followed by etching treatment.

By the way, as a printing method, for example, a pattern transfer flat plate provided with a transfer pattern made of a printing ink layer and a workpiece flat plate to which the transfer pattern is transferred are arranged in parallel, and the transferred pattern is transferred to the workpiece by pressing the plates with both hands. The so-called parallel plate method, in which the transfer pattern is transferred onto the workpiece flat plate by placing it in close contact with a flat plate and then separating both hand plates, or the roller, in which the transfer pattern is provided along the circumferential direction of a rotating drum. However, the so-called rotary transfer method, in which a work plate is placed facing the work plate and the transfer pattern is transferred onto the work plate by rotating the roller while bringing the transfer pattern of the roller into close contact with the work plate and printing is performed. Therefore, in the conventional printing method of the so-called parallel plate method, the transfer pattern formed on the pattern transfer flat plate and the workpiece flat plate are simultaneously pressed together over the entire contact surface between the two, so the alignment operation of the two patterns is easy. Although this method is easy, it is difficult to make the adhesion strength uniform over the entire surface.

In addition, it is difficult to separate the two-hand plates after they are brought into close contact with each other, and the difficulty of peeling increases especially as the plates become larger.

On the other hand, in the conventional transfer method of the so-called rotary transfer method, the pattern alignment operation is complicated and difficult, but by rotating the roller while keeping the transferred pattern of the roller in close contact with the workpiece flat plate, the transferred pattern is transferred onto the workpiece flat plate. Therefore, uniformity of adhesion can be easily maintained, and the pattern transfer operation is easy. However, in order to improve the dimensional accuracy and reproducibility of the pattern transferred onto the flat work plate, it is necessary to precisely align the pattern transferred by the roller and the flat work plate. However, in the conventional so-called rotary transfer printing method,
If a so-called test printing is performed using a test piece and the alignment is good on the test piece, it is common to set a work plate for printing and print, and when printing on the work plate, the above alignment is strictly performed. Not yet. Therefore, even with this method, a pattern that satisfies the dimensional accuracy and reproducibility of a pattern required for, for example, a thin film semiconductor cannot be formed on a workpiece flat plate with a high yield.

In other words, the dimensional accuracy, alignment accuracy, and reproducibility of printed patterns printed on workpieces by conventional printing methods are limited to 20 to 30 μm, which is, for example, the size required for conductive fine patterns of thin film semiconductor devices. It has not yet reached the level of accuracy and reproducibility (for example, 1 to 5 μm).

The present invention has been made based on the above circumstances. That is, the present invention can accurately transfer a transfer pattern onto a workpiece flat plate while maintaining high dimensional accuracy, alignment accuracy, and reproducibility, and can manufacture thin film semiconductor devices by employing, for example, a printing method. A pattern transfer method that can be suitably adopted in this case, and a pattern transfer method that can be suitably used in this pattern transfer method by improving the ease of aligning operation of conventional so-called parallel plate printing and the uniformity of adhesion between rollers and printing. It is an object of the present invention to provide a pattern transfer device that combines the advantages of both methods and eliminates the drawbacks of each individual method.

[Means to solve the problem]

The gist of the present invention for solving the above problems is to press a pattern transfer plate provided with a transfer pattern and a workpiece flat plate held at a position opposite to the transfer plate to apply the transfer pattern onto the workpiece flat plate. In a pattern transfer method for transferring, a pattern transfer plate whose pattern formation surface is a curved surface having an edge is used, and the transfer pattern is pressed onto the workpiece flat plate along the curved surface of the pattern formation surface, thereby transferring the workpiece. A pattern transfer method characterized by continuously transferring the transfer pattern formed on a flat plate from one end side of the pattern forming surface to the other end side, comprising: a pattern transfer plate provided with the transfer pattern; a pattern pressing means for pressing the transferred pattern onto a workpiece flat plate held at a position facing the transfer plate; the pattern forming surface is a curved surface having an end; The pattern transfer device is characterized in that the pattern forming surface can be pressed against the workpiece flat plate along the same direction.

〔Example〕

Hereinafter, a pattern transfer method and a pattern transfer apparatus of the present invention will be explained with reference to the drawings.

FIG. 1 shows the relationship between the pattern transfer plate 1 and the workpiece flat plate 2.

As shown in FIG. 1(a), in the method of the present invention,
First, a pattern transfer plate 1 having a transfer pattern 3 and a workpiece flat plate 2 are placed facing each other.

The pattern transfer plate 1 to be used has a pattern forming surface 4 formed of a curved surface having an end.

Here, as a specific example of a curved surface having an end, for example, a part of a cylindrical surface 10 as shown in FIG.
' The plane cut out from the cylinder by the line 10°).

The transfer pattern 3 can be formed, for example, by suitably using various printing inks or a metal thin film provided with an adhesive layer on the surface in contact with the workpiece flat plate 2.

Next, as shown in FIG. 1(b), for example, a part of the transfer pattern 3 and the workpiece flat plate 2 are brought into contact by moving the workpiece surface plate 20 holding the workpiece flat plate 2 in the direction of the pattern transfer plate 2. In this state, a part of the transfer pattern 3 is pressed onto the workpiece flat plate 2.

Thereafter, as shown in FIGS. 1(c) and 1(d), by sequentially pressing the transferred pattern 3 onto the workpiece flat plate 2 along the curvature of the pattern forming surface 4, the transferred pattern is formed on the workpiece flat plate 2. 3 are continuously transferred to form a predetermined pattern on the workpiece flat plate 2.

In addition, when pressing a part of the transfer pattern 3 onto the workpiece flat plate 2, it is desirable to align the transfer pattern 3 and the workpiece flat plate 2 in advance.

This alignment can be achieved, for example, by providing a pattern-side register mark on the pattern transfer plate 1 and a work-side register mark on the workpiece flat plate 2, and optically observing the positional relationship between the two register marks. This can be done by moving at least one of the register marks to a position where both register marks are observed to overlap.

The transfer pattern 3 transferred onto the workpiece flat plate 2 in the manner described above has excellent reproducibility in dimensional accuracy and alignment accuracy. It satisfies the standards, has excellent reproducibility, and has a high yield.

Next, the pattern transfer device of the present invention will be explained.

As shown in FIG. 3, this pattern transfer device includes a pattern transfer plate 1 and pattern pressing means 30.

The pattern transfer plate 1 has a pattern-forming surface 4 that is a curved surface such as a part of the cylindrical surface 10 shown in FIG. It is made up of surfaces.

The pressing means 30 is a means for pressing the pattern forming surface 4 against the workpiece flat plate 2 along the curvature of the pattern forming surface 4.

The pressing means 30 having such a function, as shown in FIG. It can be configured using Further, as shown in FIG. 4, for example, the pattern transfer plate 1
It is also possible to construct the pattern transfer plate 1 by incorporating a rolling element 32 inside the pattern transfer plate 1 that can be moved along the curvature of the pattern forming surface 4.

Further, it is preferable that this pattern transfer device further includes a function of aligning the workpiece flat plate 2 and the transfer pattern 3.

This alignment mechanism, for example, as shown in FIG. It can be configured using an observation optical system 40 that allows optical observation and a drive means 50 that moves at least one of the transfer plate 1 and the workpiece flat plate 2 based on information obtained by the observation optical system 40. .

Here, 41 in FIG. 5 is an observation hole.

Note that the alignment is performed by a mechanism.In order to perform the transfer while maintaining the alignment state between the transfer pattern 3 and the workpiece flat plate 2, as shown in FIG. After accurately fixing the pattern transfer plate 1 at a predetermined position, the work plate 2 was pressed onto the pattern transfer plate 1 by the pressing means main 1 by rotating the roller 31 or by accurately fixing the center of curvature of the pattern transfer plate 1 at a predetermined position. In this state, the pressing means 30 may be moved along the curve of the pattern transfer plate l.

In order to transfer a pattern using the pattern transfer apparatus of the present invention which requires the above configuration, if the pressing means 30 is configured using, for example, a roller 31, it is necessary to transfer the pattern as shown in FIG.
As shown in (a) to (d), the roller 31 may be moved along the curve of the surface 5 of the pattern transfer plate 1 on the opposite side to the pattern forming surface 4 to sequentially press the transfer pattern 3 onto the workpiece flat plate 2. .

In addition, when the pressing means 30 is configured using rolling elements 32 built into the pattern transfer plate 1, the rolling elements 32 are used to form a pattern, as shown in FIGS. The transfer pattern 3 may be sequentially pressed onto the workpiece flat plate 2 by shifting along the curve of the surface 4.

The alignment device of the present invention can be suitably used in various printing methods including so-called non-rotational transfer methods, and can be particularly suitably used in the pattern transfer method of the present invention.

〔Effect of the invention〕

According to the present invention, a pattern transfer plate whose pattern forming surface is a curved surface having an edge is used, and the transfer pattern is continuously transferred by sequentially pressing the transfer pattern onto the workpiece flat plate along the curved surface. This method combines the features of both the so-called parallel plate printing method and the roller transfer printing method, and allows the transfer pattern to be accurately transferred to the workpiece flat plate with high dimensional accuracy and reproducibility. It is possible to provide a pattern transfer method that can be suitably employed when manufacturing thin film semiconductor devices with high yield by employing the method.

Further, according to the present invention, by using a pattern transfer plate whose pattern forming surface is a curved surface having edges, there is an advantage that inking or transfer pattern formation can be performed in the same way as handling a sheet substrate, and , and a pressing means capable of pressing the transfer pattern onto the workpiece flat plate along the curvature of the pattern forming surface, the transfer pattern can be transferred to the workpiece flat plate with high dimensional accuracy and alignment accuracy with high reproducibility (accurate transfer of the transfer pattern onto the workpiece flat plate). It is possible to provide a pattern transfer device that can be used particularly preferably in the pattern transfer method of the present invention.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram schematically showing the relationship between the printing plate and the work plate in the pattern transfer method of the present invention in the order of steps;
The figure is an explanatory diagram showing an example of the shape of the pattern forming surface of the printing plate used in the pattern transfer method of the present invention, and FIG. 3 is an explanatory diagram schematically showing the operating state of the pressing means in an example of the pattern transfer device of the present invention. FIG. 4 is an explanatory diagram schematically showing the operating state of the pressing means in another example of the pattern transfer device of the present invention, and FIG. 5 is an explanatory diagram showing still another example of the configuration of the pattern transfer device of the present invention. It is. 1... Pattern transfer plate, 2... Work plate, 3...
・Transfer pattern, 4... pattern formation surface, 30...
Pattern pressing means. Applicant Yasushi Ishikawa Figure 4

Claims (2)

[Claims] 1. In a pattern transfer method in which a pattern transfer plate provided with a transfer pattern and a workpiece flat plate held at a position opposite to the transfer plate are pressed together to transfer the transfer pattern onto the workpiece flat plate, the pattern-formed surface has an edge. By using a pattern transfer plate having a curved surface and pressing the transfer pattern against the workpiece flat plate along the curved surface of the pattern formation surface, a transfer pattern is applied onto the workpiece flat plate from one end side of the pattern formation surface to the other end side. A pattern transfer method characterized by continuously transferring the formed transfer pattern. 2. A pattern transfer plate provided with a transfer pattern, and pattern pressing means for pressing the transfer pattern against a workpiece flat plate held at a position facing the transfer plate, and
A pattern transfer device, wherein the pattern forming surface is a curved surface having an end, and the pattern pressing means is capable of pressing the transfer pattern onto the workpiece flat plate along the curved surface.