JPH04109691A - Connecting structure of printed wiring board - Google Patents

Connecting structure of printed wiring board

Info

Publication number
JPH04109691A
JPH04109691A JP22892990A JP22892990A JPH04109691A JP H04109691 A JPH04109691 A JP H04109691A JP 22892990 A JP22892990 A JP 22892990A JP 22892990 A JP22892990 A JP 22892990A JP H04109691 A JPH04109691 A JP H04109691A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
soldering
comb
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22892990A
Other languages
Japanese (ja)
Inventor
Yoshinobu Shibayama
義信 柴山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP22892990A priority Critical patent/JPH04109691A/en
Publication of JPH04109691A publication Critical patent/JPH04109691A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To connect by soldering at low cost and improve reliability at a soldering part by a method wherein soldering is performed in such a condition that a comblike part is deformed at a gentle angle of 45 deg. or less and fixed to other printed boards with a elasticity. CONSTITUTION:A tip of a comblike part 3 of a flexible printed board 1 is inserted into a slit 8 provided in the vicinity of a resist eliminating part 7 which is a land for connecting in a rigid printed board 5. Next, the comblike part 3 is deformed at a gentle angle of almost 45 deg. or less so as to project at least in an edge 8a on the lower side within the slit 8 and is fixed to the rigid printed board with elasticity. Then, in these conditions, a soldering swollen part 9 is soldered to connect to patterns 2, 6 electrically. Accordingly, a soldering deposited area can sufficiently be secured and soldering operations become easy. Thus, a connecting structure with high reliability at low costs can be obtained.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、プリント配線基板の接続構造に関するもので
、とくに、フレキシブルプリント基板と他のプリント基
板との半田付けによる接続構造に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connection structure for printed wiring boards, and particularly to a connection structure by soldering between a flexible printed circuit board and another printed circuit board.

[従来の技術] 従来、フレキシブルプリント基板と硬質プリント基板を
半田付は接続する場合、たとえば、第5図ないし′s7
図に示すように、フレキシブルプリント基板30と硬質
プリント基板31とを上下に重ねて、フレキシブルプリ
ント基板30の複数のくし歯形状部32を硬質プリント
基板31のレジスト印刷除去部33に位置決めビン39
で位置合わせし、表面部に半田を盛ることによって半田
盛り部34を形成し、平面上でフレキシブルプリント基
板30と硬質プリント基板31の2枚を電気的に接続さ
せていた。
[Prior Art] Conventionally, when connecting a flexible printed circuit board and a rigid printed circuit board by soldering, for example, Figs.
As shown in the figure, the flexible printed circuit board 30 and the rigid printed circuit board 31 are stacked vertically, and the plurality of comb-tooth-shaped portions 32 of the flexible printed circuit board 30 are positioned in the resist print removal section 33 of the rigid printed circuit board 31 using a pin 39.
The flexible printed circuit board 30 and the rigid printed circuit board 31 are electrically connected on a plane by aligning the printed circuit boards 30 and 31 and forming solder mounds 34 by applying solder to the surface portions.

なお同図において、35はフレキシブルプリント基板上
の銅箔パターン、36はフレキシブルプリント基板上の
カバーフィルム、37は硬質基板上の銅箔パターン、3
8は硬質基板上のレジスト印刷部、40は固定ビスであ
る。
In the same figure, 35 is a copper foil pattern on a flexible printed circuit board, 36 is a cover film on a flexible printed circuit board, 37 is a copper foil pattern on a hard board, 3
8 is a resist printing section on a hard substrate, and 40 is a fixing screw.

[発明が解決しようとする課題] しかしながら、上記従来の技術では、フレキシブルプリ
ント基板30が表面側のみの銅張片面フレキシブル基板
の場合、表面上の半田盛り部のみで電気的接続をとらな
ければならないので、硬質プリント基板31側のレジス
ト印刷除去部33の面積を大きくとらなければ、半田溶
着面積を確保できないという問題点があった。
[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, if the flexible printed circuit board 30 is a copper-clad single-sided flexible board with only the front side, electrical connection must be made only with the solder mounds on the front surface. Therefore, there is a problem in that the solder welding area cannot be secured unless the area of the resist print removal section 33 on the hard printed circuit board 31 side is made large.

またフレキシブルプリント基板30のベースフィルム側
は、銅箔が存在しないので、対向する面同志では半田に
よる接続がされない。これにより、フレキシブルプリン
ト基板30と硬質プリント基Fi31の重なり部分に接
続されないところの間隔の不安定な隙間41が生ずるた
め、環境変化や外部ストレス等により、半田付は部の接
続不良等を起こしやすいという問題点があった。またフ
レキシブルプリント基板30を両面銅張板とし、裏面の
対向する面にも銅箔を設け、硬質プリント基板31側の
レジスト除去部に半田メツキを行なうことにより、2枚
の基板間に生ずる隙間を埋めて半田付けの信頼性を向上
させる方法もあるが、フレキシブルプリント基板30の
両面化と硬質プリント基板31の半田メツキ工程の追加
で、大きなコストアップとなってしまうという別の問題
点が生ずる。
Furthermore, since there is no copper foil on the base film side of the flexible printed circuit board 30, no solder connection is made between the opposing surfaces. As a result, an unstable gap 41 is created between the overlapping parts of the flexible printed circuit board 30 and the rigid printed circuit board Fi 31 where they are not connected, so soldering is likely to cause connection failures in the parts due to environmental changes, external stress, etc. There was a problem. In addition, by making the flexible printed circuit board 30 a double-sided copper-clad board, providing copper foil on the opposite surfaces on the back side, and soldering the resist removed part on the hard printed circuit board 31 side, the gap that occurs between the two boards can be reduced. Although there is a method to improve the reliability of soldering by burying it, another problem arises in that the process of making the flexible printed circuit board 30 double-sided and adding the solder plating process to the hard printed circuit board 31 results in a large increase in cost.

本発明は、上記のような問題点を解決しようとするもの
である。すなわち、本発明は、半田溶着面積を十分に確
保でき、半田付は時の作業性の向上および信頼性の向上
を図ることができて、コストアップにならないようにし
たプリント配線基板の接続構造を提供することを目的と
するものである。
The present invention aims to solve the above problems. That is, the present invention provides a connection structure for a printed wiring board that can secure a sufficient solder welding area, improve workability and reliability during soldering, and avoid an increase in cost. The purpose is to provide

[課題を解決するための手段] 上記目的を達成するために、本発明は、フレキシブルプ
リント基板の一部に複数のくシ歯形状の接続部を有し、
他のプリント基板のパターン面側に該フレキシブルプリ
ント基板のベースフィルム面を対向させて重ねた状態で
くし歯形状部と他のプリント基板の銅箔露出させたラン
ド部を半田接続させる接続構造において、該他のプリン
ト基板のランド部近傍に設けられたスリットを有し、か
つ、該スリットに前記フレキシブルプリント基板のくし
歯形状部が挿入されて該スリット内の少なくとも下面側
エツジ部に当接され、しかも、該くし歯形状部がおおよ
そ45°以下のなだらかな角度で変形して弾性をもって
該他のプリント基板に固定された状態で半田付けが行な
われていて、前記2枚のプリント基板が接続されている
ものとした。
[Means for Solving the Problems] In order to achieve the above object, the present invention has a plurality of comb-shaped connecting portions in a part of a flexible printed circuit board,
In a connection structure in which a comb-shaped portion and an exposed copper foil land portion of another printed circuit board are connected by soldering with the base film surface of the flexible printed circuit board facing the pattern surface side of another printed circuit board and overlapped, The other printed circuit board has a slit provided near the land portion, and the comb-shaped portion of the flexible printed circuit board is inserted into the slit and abuts at least the lower edge portion of the slit, Moreover, the soldering is performed while the comb-shaped portion is deformed at a gentle angle of approximately 45 degrees or less and is elastically fixed to the other printed circuit board, and the two printed circuit boards are connected. It is assumed that

[作   用] 本発明によれば、他のプリント基板のランド部近傍にス
リットを設け、該スリットにフレキシブルプリント基板
のくし歯形状部を挿入し、該スリット内の少なくとも下
面側エツジ部に当接するように、くし歯形状部をおおよ
そ45゜以下のなたらかな角度で変形させ、弾性をもっ
て他のプリント基板に固定された状態で半田付けを行な
っているので、半田溶着面積を十分に確保てき、半田付
は作業が容易となって、低コストで信頼性の高い接続構
造のものが得られる。
[Function] According to the present invention, a slit is provided in the vicinity of the land portion of another printed circuit board, and the comb-shaped portion of the flexible printed circuit board is inserted into the slit and comes into contact with at least the lower edge portion of the slit. As shown, the comb-shaped part is deformed at a gentle angle of approximately 45 degrees or less, and soldering is performed while it is elastically fixed to another printed circuit board, so a sufficient solder welding area is secured. Soldering is an easy process, and a highly reliable connection structure can be obtained at low cost.

[実 施 例] 第1図は本発明の第1実施例を示した平面図であり、第
2図はその拡大断面図である。
[Embodiment] FIG. 1 is a plan view showing a first embodiment of the present invention, and FIG. 2 is an enlarged sectional view thereof.

=X図および第2図において、1は片面銅張フレキシブ
ルプリント基板、2は該基板1上に配線されたパターン
、3はカバーフィルム除去されたくし歯形状部、4はカ
バーフィルム、5は硬質プリント基板、6は該基板5上
に配線されたパターン、7はレジスト除去部、8は後述
するスリット、9は前記パターン2,6を電気的に接続
している半田盛り部、10は前記フレキシプルプリント
基板1のくし歯形状部3と硬質プリント基板5のレジス
ト除去部7の位置合わせを行なうための位置決め用ビン
、11は該フレキシブルプリント基板1と硬質プリント
基板5を位置決め後に固定する固定ビス、12は2枚の
基板1.5が固定される筐体である。
= In Fig. A substrate, 6 is a pattern wired on the substrate 5, 7 is a resist removal section, 8 is a slit to be described later, 9 is a solder mound electrically connecting the patterns 2 and 6, and 10 is the flexible plate. a positioning pin for aligning the comb-shaped portion 3 of the printed circuit board 1 and the resist removal portion 7 of the rigid printed circuit board 5; reference numeral 11 denotes a fixing screw for fixing the flexible printed circuit board 1 and the rigid printed circuit board 5 after positioning; Reference numeral 12 denotes a housing to which two substrates 1.5 are fixed.

そして、前記スリット8は、硬質プリント基板5のラン
ド部近傍に設けられて、くし歯形状部3が挿入されるよ
うになっている。
The slit 8 is provided near the land portion of the hard printed circuit board 5, and the comb-shaped portion 3 is inserted into the slit 8.

上記構成において、フレキシブルプリント基板1の硬質
プリント基板5との接続用端子であるくし歯形状部3の
先端部を硬質プリント基板5の接続用ランドであるレジ
スト除去部7の近傍にあるスリット8に挿入する。そし
て、筐体12に設けられた位置決め用ビン10に、フレ
キシブルプリント基板1の位置決め用穴を合わせ、固定
ビス11で固定する。この状態で、フレキシブルプリン
ト基板1のくし歯形状部3は、第2図に示されるように
、先端部がスリット8の下面エツジ8aにかかるように
することにより、くし歯形状部3が、フレキシブルプリ
ント基板1の弾性により平らに戻ろうとする力と固定ビ
ス11を基板上に固定する力とにより、スリット8のエ
ツジ部8aに弾性をもって突きあたり、なだらかな斜面
を形成して固定される。この接続部を<シ歯形状にする
ことにより、スリット8内のエツジ8aに突きあてた時
、フレキシブルプリント基板1の弾性力を調整し、なだ
らかな斜面形成を容易にする。こうして、フレキシブル
プリント基板1の<シ歯形状部3とレジスト除去部7に
半田を盛って接続させる。
In the above configuration, the tip of the comb-shaped portion 3, which is a terminal for connection to the rigid printed circuit board 5 of the flexible printed circuit board 1, is inserted into the slit 8 near the resist removed portion 7, which is a connection land of the rigid printed circuit board 5. insert. Then, the positioning holes of the flexible printed circuit board 1 are aligned with the positioning bins 10 provided in the casing 12, and the flexible printed circuit board 1 is fixed with the fixing screws 11. In this state, as shown in FIG. 2, the comb-shaped portion 3 of the flexible printed circuit board 1 is arranged so that its tip end touches the lower edge 8a of the slit 8. Due to the elastic force of the printed circuit board 1 to return to a flat surface and the force for fixing the fixing screws 11 onto the substrate, the printed circuit board 1 elastically abuts against the edge portion 8a of the slit 8, forming a gentle slope and being fixed. By forming this connection part into a toothed shape, the elastic force of the flexible printed circuit board 1 is adjusted when it abuts against the edge 8a in the slit 8, making it easier to form a gentle slope. In this way, solder is applied to the tooth-shaped portion 3 and the resist removed portion 7 of the flexible printed circuit board 1 to connect them.

このようにして得られたくし歯形状部3のなだらかな斜
面部とレジスト除去部7の半田接続においては、それぞ
れの基板の半田溶着面積は従来の接続構造に比較して、
大差ない面積を確保し、2枚の基板の表面上の接続部の
面積は小さくできる。またくし歯形状部3を、弾性をも
って硬質プリント基板5に固定するため、フレキシブル
プリント基板1と硬質プリント基板5との半田溶着時に
不安定に残ってしまう隙間をなくすことができ、外部要
因による半田はがれ等の半田付は信頼性の低下を防ぐこ
とができる。
In the solder connection between the gentle slope part of the comb-tooth shaped part 3 and the resist removed part 7 obtained in this way, the solder welding area of each board is smaller than that of the conventional connection structure.
The area of the connecting portion on the surfaces of the two substrates can be made small by ensuring the same area. Furthermore, since the comb-shaped portion 3 is elastically fixed to the hard printed circuit board 5, it is possible to eliminate gaps that may remain unstable during solder welding between the flexible printed circuit board 1 and the hard printed circuit board 5. It is possible to prevent deterioration in reliability due to soldering such as peeling.

第3図は本発明の第2実施例を示した平面図であり、第
4図はその拡大断面図である。
FIG. 3 is a plan view showing a second embodiment of the present invention, and FIG. 4 is an enlarged sectional view thereof.

この第2実施例では、フレキシブルプリント基板のくし
歯形状の接続部を2か所有し、硬質プリント基板側でも
2か所のスリットに挿入することにより、ビス等による
固定手段をなくしたものである。
In this second embodiment, the flexible printed circuit board has two comb-shaped connecting portions, and the rigid printed circuit board side is also inserted into two slits, thereby eliminating the need for fixing means such as screws. .

第3図および第4図において、15はフレキシブルプリ
ント基板、16は配線パターン、17a、17bは2か
所のくし歯形状部、18はカバーフィルム、19は硬質
プリント基板、20は該硬質プリント基板19上のパタ
ーン、21a、21bは前記2か所のくし歯形状部17
a、17bに対応して設けられた硬質プリント基板19
のレジスト除去部、22a。
3 and 4, 15 is a flexible printed circuit board, 16 is a wiring pattern, 17a and 17b are two comb-shaped parts, 18 is a cover film, 19 is a rigid printed circuit board, and 20 is the rigid printed circuit board. The patterns 19, 21a and 21b are the two comb-shaped portions 17.
Rigid printed circuit board 19 provided corresponding to a and 17b
resist removal section 22a.

22bは前記2か所のくし歯形状部17a、17bに対
応した位置に設けられた2か所のスリット、23a、2
3bは前記各くし歯形状部17a、17bでの半田盛り
部、24は位置決め用ビンである。
22b are two slits 23a, 2 provided at positions corresponding to the two comb-shaped portions 17a, 17b;
3b is a solder mound on each of the comb tooth-shaped portions 17a and 17b, and 24 is a positioning bottle.

この第2実施例においても、前述の第1実施例と同様に
、フレキシブルプリント基板15のくし歯形状部17a
、17bを硬質プリント基板19の半田付は用のレジス
ト除去部21a。
In this second embodiment as well, similarly to the first embodiment described above, the comb-shaped portion 17a of the flexible printed circuit board 15 is
, 17b is a resist removal section 21a for soldering the hard printed circuit board 19.

21b近傍に設けられたスリット22a、 22bに挿
入し、位置決め用ビン24で、前記側基板15.19を
位置決めする。この状態で、第4図に示されるように、
くし歯形状部17a。
The side substrates 15 and 19 are inserted into the slits 22a and 22b provided near 21b, and the side substrates 15 and 19 are positioned using the positioning pins 24. In this state, as shown in Figure 4,
Comb tooth shaped portion 17a.

17bはそれぞれスリット22a、22bのエツジ部2
2c、22dに弾性的に当接している。この状態では、
位置決め用ビン24を中心としてほぼ対称に、くし歯形
状部17a、 17bがスリット22a、22bに当接
しているため、フレキシブルプリント基板15は、該基
板工5の弾性力によって硬質プリント基板19に保持さ
れている。したがって、前述の第1実施例のように、フ
レキシブルプリント基板15と硬質プリント基板19を
筐体に固定ブスによって固定しなくても、フレキシブル
プリント基板15のくし歯形状部17a、17bの弾性
保持が可能である。
17b are the edge portions 2 of the slits 22a and 22b, respectively.
2c and 22d elastically. In this state,
Since the comb tooth-shaped portions 17a and 17b are in contact with the slits 22a and 22b almost symmetrically with respect to the positioning pin 24, the flexible printed circuit board 15 is held on the hard printed circuit board 19 by the elastic force of the board work 5. has been done. Therefore, even if the flexible printed circuit board 15 and the rigid printed circuit board 19 are not fixed to the housing by the fixing bus as in the first embodiment described above, the comb-shaped portions 17a and 17b of the flexible printed circuit board 15 can be elastically held. It is possible.

[発明の効果] 以上説明したように、本発明によれば、他のプリント基
板のランド部近傍に設けられたスリットを有し、かつ、
該スリットにフレキシブルプリント基板のくし歯形状部
が挿入されて該スリット内の少なくとも下面側エツジ部
に当接され、しかも、該くし歯形状部がおおよそ45゛
以下のなだらかな角度で変形して弾性をもって該他のプ
リント基板に固定された状態で半田付けが行なわれてい
るので、前記2枚のプリント基板上の半田溶着面積を確
保しながら、半田接続部の基板上でのトータル面積を少
なくできる。また前記くし歯形状部の弾性によって他の
プリント基板のスリット内のエツジ部に弾性をもって固
定させるため、半田付は時の作業性が向上し、低コスト
で半田接続か可能となり、かつ、半田付は部の信頼性が
向上するなどの効果を奏する。
[Effects of the Invention] As explained above, according to the present invention, a slit is provided near the land portion of another printed circuit board, and
The comb-shaped portion of the flexible printed circuit board is inserted into the slit and comes into contact with at least the lower edge portion of the slit, and the comb-shaped portion is deformed at a gentle angle of about 45 degrees or less and becomes elastic. Since soldering is performed while the solder is fixed to the other printed circuit board, the total area of the solder connection portion on the board can be reduced while securing the solder welding area on the two printed circuit boards. . In addition, since the elasticity of the comb-shaped portion allows it to be elastically fixed to the edge portion in the slit of another printed circuit board, the workability during soldering is improved, and solder connection is possible at low cost. This has the effect of improving the reliability of the unit.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の第1実施例を示した平面図、第2図は
第1図の拡大断面図、第3図は本発明の第2実施例を示
した平面図、第4図は第3図の拡大断面図、第5図は従
来の技術の一例を示した平面図、第6図は第5図の拡大
断面図、第7図は第5図の斜視図である。 1・・・フレキシブルプリント基板 3・・・くし歯形状部  5・・・硬質プリント基板7
・・・レジスト除去部 8・・・スリット8a・・・エ
ツジ部   9・・・半田盛り部他4名 第1図 第3図 第2図 第 図 第 図
FIG. 1 is a plan view showing a first embodiment of the present invention, FIG. 2 is an enlarged sectional view of FIG. 1, FIG. 3 is a plan view showing a second embodiment of the present invention, and FIG. 3 is an enlarged sectional view of FIG. 3, FIG. 5 is a plan view showing an example of the conventional technology, FIG. 6 is an enlarged sectional view of FIG. 5, and FIG. 7 is a perspective view of FIG. 5. 1...Flexible printed circuit board 3...Comb tooth shaped part 5... Rigid printed circuit board 7
...Resist removal part 8...Slit 8a...Edge part 9...Solder mound part and 4 others Fig. 1 Fig. 3 Fig. 2 Fig. Fig.

Claims (1)

【特許請求の範囲】 1 フレキシブルプリント基板の一部に複数のくし歯形
状の接続部を有し、他のプリント基板のパターン面側に
該フレキシブルプリント基板のベースフィルム面を対向
させて重ねた状態でくし歯形状部と他のプリント基板の
銅箔露出させたランド部を半田接続させる接続構造にお
いて、該他のプリント基板のランド部近傍に設けられた
スリットを有し、かつ、該スリットに前記フレキシブル
プリント基板のくし歯形状部が挿入されて該スリット内
の少なくとも下面側エッジ部に当接され、しかも、該く
し歯形状部がおおよそ45°以下のなだらかな角度で変
形して弾性をもって該他のプリント基板に固定された状
態で半田付けが行なわれていて、前記2枚のプリント基
板が接続されていることを特徴とするプリント配線基板
の接続構造。 2 他のプリント基板が硬質プリント基板である請求項
1記載のプリント配線基板の接続構造。
[Scope of Claims] 1. A flexible printed circuit board having a plurality of comb-shaped connecting portions in a part thereof, and stacked with the base film surface of the flexible printed circuit board facing the pattern surface side of another printed circuit board. A connection structure in which a comb-tooth-shaped portion and an exposed copper foil land portion of another printed circuit board are connected by soldering includes a slit provided in the vicinity of the land portion of the other printed circuit board, and the slit is provided with the The comb-shaped portion of the flexible printed circuit board is inserted and abuts at least the lower edge portion of the slit, and the comb-shaped portion is deformed at a gentle angle of about 45° or less to elastically move the flexible printed circuit board. A connection structure for a printed wiring board, characterized in that the two printed circuit boards are connected by soldering while being fixed to the printed circuit board. 2. The printed wiring board connection structure according to claim 1, wherein the other printed circuit board is a rigid printed board.
JP22892990A 1990-08-30 1990-08-30 Connecting structure of printed wiring board Pending JPH04109691A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22892990A JPH04109691A (en) 1990-08-30 1990-08-30 Connecting structure of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22892990A JPH04109691A (en) 1990-08-30 1990-08-30 Connecting structure of printed wiring board

Publications (1)

Publication Number Publication Date
JPH04109691A true JPH04109691A (en) 1992-04-10

Family

ID=16884071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22892990A Pending JPH04109691A (en) 1990-08-30 1990-08-30 Connecting structure of printed wiring board

Country Status (1)

Country Link
JP (1) JPH04109691A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071230A (en) * 2009-09-24 2011-04-07 Casio Computer Co Ltd Connection structure of wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071230A (en) * 2009-09-24 2011-04-07 Casio Computer Co Ltd Connection structure of wiring board

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