JPH04109612A - Surface-mounted electronic part - Google Patents
Surface-mounted electronic partInfo
- Publication number
- JPH04109612A JPH04109612A JP22934890A JP22934890A JPH04109612A JP H04109612 A JPH04109612 A JP H04109612A JP 22934890 A JP22934890 A JP 22934890A JP 22934890 A JP22934890 A JP 22934890A JP H04109612 A JPH04109612 A JP H04109612A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- package
- capacitor
- case
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003780 insertion Methods 0.000 claims abstract description 26
- 230000037431 insertion Effects 0.000 claims abstract description 26
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 13
- 239000000057 synthetic resin Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 17
- 238000005452 bending Methods 0.000 abstract description 7
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 58
- 239000003990 capacitor Substances 0.000 description 44
- 238000000465 moulding Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000007547 defect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polybutylene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明はプリント基板へ面実装される電子部品の改良に
関するものである。以下の説明に於いては、コンデンサ
のチップ部品を例にとって詳述する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to improvements in electronic components that are surface-mounted on printed circuit boards. In the following description, a capacitor chip component will be explained in detail as an example.
（ロ）従来の技術
従来、コンデンサ素子をアルミケースに収納したコンデ
ンサ等に於いては、コンデンサのチップ化を実現する為
に、例えば特開昭６０−２４５１１６号（ＨＯＩＧ９１
０８）公報に記載された技術のように、有底の外装枠（
ケース）にコンデンサを収納して、外装枠底面の貫通孔
からリード線を導出し、このリード線を、外装枠の外表
面に設けた凹部に収める様に、折曲げたものが提案され
ている。また特開平２−３４９０４号（ＨＯＩＧ１１０
３５）公報に記載された技術のように、外装枠にコンデ
ンサを収納して外装枠端面に設けられた壁部を越えてリ
ード線を導出し、このり−ｒ線を外装枠の壁部および底
面に沿って折曲げたものが提案されている。(B) Conventional technology Conventionally, for capacitors in which the capacitor element is housed in an aluminum case, in order to realize the chipping of the capacitor, for example, Japanese Patent Laid-Open No. 60-245116 (HOIG91)
08) Like the technology described in the official gazette, an exterior frame with a bottom (
It has been proposed that the capacitor is housed in a case), the lead wire is led out from a through hole on the bottom of the outer frame, and the lead wire is bent so that it fits into a recess provided on the outer surface of the outer frame. . Also, JP-A No. 2-34904 (HOIG110
35) As in the technique described in the publication, a capacitor is housed in an exterior frame, the lead wire is led out beyond the wall provided on the end face of the exterior frame, and this -r wire is connected to the wall of the exterior frame and One that is bent along the bottom has been proposed.
また、特開平２−２８９１２号（ＨＯＩＧＩ／１４）公
報に記載された技術のようにリード線を導出した外装枠
端面と反対側の端面に補助リード線を装着することによ
り、基板実装時の半田熱による浮き上がり防止対策を施
したものが提案されている。In addition, by attaching an auxiliary lead wire to the end surface opposite to the end surface of the exterior frame from which the lead wire is led out, as in the technology described in Japanese Patent Application Laid-Open No. 2-28912 (HOIGI/14), it is possible to avoid soldering during board mounting. A method has been proposed that takes measures to prevent lifting due to heat.
（ハ）発明が解決しようとする課題
従来のチップ形コンデンサはコンデンサの外装枠（ケー
ス）の貫通孔や壁端部を支点としてＩＪ ＋ド線を折曲
げなければならない為、リード線の成形時に外装枠の破
損が発生することがあった。特にモールド樹脂にてコン
デンサ素子を封止したタイプに於いてはリード線の位置
寸法のズレ等によりリード線折曲げ支点が安定せず、リ
ード線成形が困難であった。これらのリード線成形時、
外装枠の半田付は側底面とリード線成形面とが平行にな
らず、リード線端部が浮き上がったいわゆるスプリング
バック状態と同じ成形曲げ不良が発生することがあった
。この曲げ不良は、浮き方向だけでなく、リード線間の
ピッチ不良を引起こすこともある。これらの成形不良は
基板搭載時にリード線とクリームハンダとの接触面積を
少なくし、半田付は不良発生の原因と成っている（第７
図（ａ）参照）。(c) Problems to be Solved by the Invention In conventional chip-type capacitors, the IJ + C wire must be bent using the through hole or wall end of the capacitor's outer frame (case) as a fulcrum, so when forming the lead wire, Damage to the exterior frame could occur. Particularly in the type in which the capacitor element is sealed with a molding resin, the lead wire bending fulcrum is unstable due to deviations in the position and dimensions of the lead wires, making it difficult to mold the lead wires. When forming these lead wires,
When soldering the exterior frame, the side bottom surface and the lead wire molding surface were not parallel to each other, which sometimes caused a molding bending defect similar to a so-called springback state in which the lead wire ends were raised. This bending defect may cause not only a floating direction but also a pitch defect between the lead wires. These molding defects reduce the contact area between the lead wire and the cream solder when mounting the board, and soldering becomes a cause of defects (see No. 7).
(See figure (a)).
別の問題として、リード線を外装枠底面の凹部に収納す
ることによりリード線間ピッチ寸法を規制した場合、半
田付は後の半田浮き等の不良を目視で確認出来ず、発生
を見逃がしてしまう場合がある。Another problem is that when the pitch between the lead wires is regulated by storing the lead wires in a recess on the bottom of the exterior frame, defects such as solder floating cannot be visually confirmed after soldering, and the occurrence may be overlooked. It may be stored away.
更に別の問題として、基板に半田付けされるのが外装枠
の一端より導出したリード線である為、半田熱により本
体が起き上がってしまう不良が発生しく第７図（ｂ）参
照）、その対策として、外装枠のリード線導出端面を延
ばす方法や反対側の端面に補助リード線を装着する方法
が提案されているが、充分な機能を発揮させる為には、
前者は外装枠寸法が必要以上に長くなり、後者は別途補
助リード線の追加、成形が必要となる。Another problem is that since the lead wires that are soldered to the board are led out from one end of the exterior frame, the main body may rise due to solder heat (see Figure 7 (b)), so we have developed a countermeasure. As such, methods have been proposed such as extending the lead wire lead-out end face of the exterior frame and attaching auxiliary lead wires to the opposite end face, but in order to achieve sufficient functionality,
The former requires an unnecessarily long exterior frame, and the latter requires additional auxiliary lead wires and molding.
本発明はリード線折曲げ成形時の寸法安定性および基板
搭載時の半田付は安定性の確保を目的とするものである
。The purpose of the present invention is to ensure dimensional stability during lead wire bending and soldering stability during board mounting.
（ニ） 課題を解決するための手段
本発明では、コンデンサのリード線を予め所定の形状に
折曲げ成形後、外装ケース（枠）に収納し、コンデンサ
と外装枠を接着固定する。この時コンデンサの成形リー
ド線の先端部は外装枠の挿入孔に挿入され、固定される
事を特徴としている。(d) Means for Solving the Problems In the present invention, the lead wires of a capacitor are bent and formed into a predetermined shape in advance, and then stored in an outer case (frame), and the capacitor and the outer frame are fixed by adhesive. At this time, the tip of the molded lead wire of the capacitor is inserted into the insertion hole of the outer frame and fixed.
（ホ）作 用
コンデンサ（５）から延びるリード線（４）（４）は外
装ケース（枠）（６）に影響される事なく、折曲げ成形
されるので、金型治具による成形が容易で寸法精度も向
上する。(e) Function The lead wires (4) (4) extending from the capacitor (5) are bent and molded without being affected by the outer case (frame) (6), so molding with a mold jig is easy. This also improves dimensional accuracy.
一方、リード線のロフト性による多少の寸法バラツキや
スプリングバックがあっても、コンデンサ（５）と外装
枠（６）の組合せ時には、引出リード線先端部（４ｂ）
（＋ｂ）が挿入孔（１２）（１２）に挿入固定されるの
で、外装枠の底面（８）とリード線半田付は部（４ａ）
（４ａ）の平行度は確保される。またリード線間の平行
度も確保される。外装枠の逃がし用凹陥部（１１，）（
１１）は、リード線半田付は部（４ａ）（４ａ）を何ら
規制するものでは無い為、この部分でリード線は半田付
は後の状態を目視で容易に確認出来る。On the other hand, even if there is some dimensional variation or springback due to the loft property of the lead wire, when the capacitor (5) and the exterior frame (6) are combined, the tip of the lead wire (4b)
(+b) is inserted and fixed into the insertion hole (12) (12), so the bottom surface (8) of the exterior frame and the lead wire solder are connected to the part (4a).
The parallelism in (4a) is ensured. Moreover, parallelism between the lead wires is also ensured. Exterior frame relief recess (11,) (
As for 11), since the soldering of the lead wire does not restrict the parts (4a) (4a) in any way, the state of the soldering of the lead wire in this part can be easily confirmed visually.
そして引出リード端子（４）（４）はコンデンサ本体お
よびリード線先端部（４ｂ）（４ｂ）で外装枠と固定さ
れている為、半田熱による起き上りも防止出来る。Since the lead terminals (4) (4) are fixed to the exterior frame by the capacitor body and the lead wire tips (4b) (4b), rising due to solder heat can be prevented.
（へ）実施例
本発明の実施例を図面に従い説明する。第１図は、チッ
プ部品を構成するコンデンサ（５）と合成樹脂製外装ケ
ース（枠）（６）を分離して表した斜視図である。第２
図はチップ部品の正面図（ａ）、部分断面を表した側面
図（ｂ）及び下面図（ｃ）である。(F) Embodiment An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a capacitor (5) and a synthetic resin outer case (frame) (6) separated from each other, which constitute a chip component. Second
The figures are a front view (a), a side view (b) showing a partial cross section, and a bottom view (c) of the chip component.
コンデンサ（５）は、第２図（ｂ）に示すようにアルミ
ケース等から成る、有底円筒状の金属ケース（１）に、
引出リード端子（線）（４）（４）を導出したコンデン
サ素子（２）を収納し、エポキシ等による封口体（３）
で固定したものである。リード線（４）（４）は封口体
（３）により、金属ケース（１）と位置決め保持され、
固定される。このコンデンサ（５）は第１図（ａ）に示
すように、外装ケース（枠）（６）と組合わされた時に
、基板接触面である外装枠の平面状底部（８）と平行で
且つ面接触となるように、リード線（４）（４）の半田
付は部（４ａ）（４ａ）を折曲げ成形し、なおかつ、リ
ード線先端部（４ｂ）（４ｂ）に、図のようなリード線
挿入孔（１２）（１２）に合わせた段差付きの折曲げ成
形を施す。As shown in FIG. 2(b), the capacitor (5) is placed in a bottomed cylindrical metal case (1) made of an aluminum case or the like.
The capacitor element (2) from which the lead terminal (wire) (4) (4) has been drawn out is housed, and the capacitor element (3) is sealed with epoxy or the like.
It is fixed at The lead wires (4) (4) are held in position with the metal case (1) by the sealing body (3),
Fixed. As shown in Fig. 1(a), when this capacitor (5) is combined with the outer case (frame) (6), it is parallel to the planar bottom part (8) of the outer case (8) which is the board contact surface. In order to make contact, the soldering parts (4a) (4a) of the lead wires (4) (4) are bent and formed, and the lead wire tips (4b) (4b) are soldered as shown in the figure. The wire insertion hole (12) is bent and formed with a step to match the wire insertion hole (12) (12).
一方、第１図（ｂ）に示すように、外装枠（６）にはコ
ンデンサ（５）の金属ケース部（１）が収納される円筒
状の空間（１０）が設けられており、コンデンサ（５）
と組合わされた時にリード線半田付は部（４，ａ）（４
，ａ）が位置する所には、凹陥部（１１）（１１）が設
けられている。またリード線先端部（４，ｂ）（４ｂ）
が位置する所にはリード線挿入孔（１２）（１２）が設
けられている。On the other hand, as shown in FIG. 1(b), the exterior frame (6) is provided with a cylindrical space (10) in which the metal case part (1) of the capacitor (5) is housed. 5)
When combined with the lead wire soldering part (4, a) (4
, a) are provided with recessed portions (11) (11). Also, the tip of the lead wire (4, b) (4b)
Lead wire insertion holes (12) (12) are provided where the lead wires are located.
コンデンサ（５）の挿入側の開口端面（７）と反対側の
端面には、第２図（ｂ）に示すように開成壁面（９）が
設けられている。As shown in FIG. 2(b), an open wall surface (9) is provided on the end surface of the capacitor (5) opposite to the open end surface (7) on the insertion side.
今外装枠（６）のコンデンサ収納空間（１０）の内壁、
例えば壁面（９）の内壁にエポキシ等の合成樹脂（１５
）を塗布した後、→輪コンデンサ（５）を押圧挿入する
と同時にリード線先端部（４ｂ）（４ｂ）を挿入孔（１
２）（１２）に挿入する。これによりコンデンサ（５）
の金属ケース（１）と外装ケース（６）の収納空間（１
０）の内壁とは合成樹脂（１５）で固定されることにな
り、リード線（４，）（４）は、その先端部（４ｂ）（
４ｂ）で同じく外装枠（６）に係止固定され、外装枠の
平面状底部（８）とリード線半田付は部（４ａ）（４ａ
）は定間隔で平行に保持される。凹陥部（１１）（１１
）に連接して設けられているリード端子挿入孔（１２）
（１２）の延長上にあるガイド溝（１３）（１３）は、
リード線先端部（４ｂ）（４ｂ）をリード線挿入孔（１
２）（１２）に挿入し易くする為のものであり、コンデ
ンサ（５）と外装枠（６）の組合せ時に別途、挿入用外
部ガイドを設ける等により削除することも可能である。Now the inner wall of the capacitor storage space (10) of the exterior frame (6),
For example, on the inner wall of the wall (9), synthetic resin such as epoxy (15
), press and insert the ring capacitor (5) and at the same time insert the lead wire tip (4b) into the insertion hole (1).
2) Insert into (12). This allows capacitor (5)
Storage space (1) for metal case (1) and exterior case (6)
0) will be fixed with synthetic resin (15), and the lead wire (4,) (4) will be fixed to its tip (4b) (
4b) is similarly locked and fixed to the exterior frame (6), and the planar bottom part (8) of the exterior frame and the lead wire solder are connected to the parts (4a) (4a).
) are held parallel at regular intervals. Recessed portion (11) (11
) Lead terminal insertion hole (12) provided in connection with
The guide groove (13) (13) on the extension of (12) is
Insert the lead wire tip (4b) (4b) into the lead wire insertion hole (1).
2) This is to facilitate insertion into (12), and can be removed by separately providing an external guide for insertion when the capacitor (5) and exterior frame (6) are combined.
また、リード線半田付は部（４ａ）（４ａ）は第６図（
ａ ）（ｂ ）に示すように偏平に加工されたものでも
、丸棒のままの状態でも良い。また、第２図に示すよう
にコンデンサ（５）と外装枠（６）の組合せ時に、リー
ド線（４）（４）が開口端面（７）よりも内側に収納さ
れるように、開口端面（７）をコンデンサの金属ケース
（１）や封口体（３）の端部よりも突出させる事により
、チップマウンタ等による表面実装時、チップ部品位置
決めの為の治具の押圧が外装枠（６）に加わり、コンデ
ンサ（５）およびそのＪ−ド線（４）（４）に加わらな
いようにしている。In addition, the lead wire soldering parts (4a) (4a) are shown in Figure 6 (
It may be processed into a flat shape as shown in a) and (b), or it may be in the state of being a round bar. Further, as shown in FIG. 2, when the capacitor (5) and the exterior frame (6) are combined, the opening end surface ( 7) protrudes beyond the ends of the metal case (1) and sealing body (3) of the capacitor, so that when surface mounting is performed using a chip mounter, etc., the pressure of the jig for positioning the chip components can be applied to the outer frame (6). , and prevents it from being applied to the capacitor (5) and its J-DC wires (4) (4).
第３図には他の実施例を示す。外装枠の開口端面（７）
にリード線（４）（４）の線径Ａよりも小さい溝巾Ｂの
嵌合溝（１４）（１４）を設け、リード線（４）（４）
をリード線嵌合溝（１４）（１４）に押圧挿入し、壁面
（９）に金属ケース（１）を当接する。この時、ノード
線（４）（４）と嵌合溝（１４）（１４）の嵌合、摩擦
力により、コンデンサ（５）と外装枠（６）を係止、固
定する。この場合、第３図（ｂ）に示すようにｌ−ド線
（４）（４）をリード線嵌合溝（１，４）（１４，）の
溝底部（１６）（１６）に当接させる事により、位置決
めを行ない、更に金属ケース（１）の端部とコンデンサ
収納円筒状空間（１０）の内周壁とに塗布された合成樹
脂（１５’）によりコンデンサ（５）と外装ケース（６
）との接着固定を行ない、第２図（ｂ）に示す如き壁面
（９）を不要とする事も可能であり、その分だけ外装枠
（６）の寸法を短くする事が可能となる。FIG. 3 shows another embodiment. Opening end surface of exterior frame (7)
A fitting groove (14) (14) with a groove width B smaller than the wire diameter A of the lead wire (4) (4) is provided in the lead wire (4) (4).
are press-inserted into the lead wire fitting grooves (14) (14), and the metal case (1) is brought into contact with the wall surface (9). At this time, the capacitor (5) and the outer frame (6) are locked and fixed by the fitting between the node wires (4) (4) and the fitting grooves (14) (14) and the frictional force. In this case, as shown in Fig. 3(b), the lead wires (4) (4) are brought into contact with the groove bottoms (16) (16) of the lead wire fitting grooves (1, 4) (14,). The capacitor (5) and the outer case (6) are positioned by the synthetic resin (15') applied to the end of the metal case (1) and the inner peripheral wall of the capacitor storage cylindrical space (10).
), it is possible to eliminate the need for a wall surface (9) as shown in FIG. 2(b), and the dimensions of the exterior frame (6) can be shortened accordingly.
第４図は更に他の実施例を示す。即ち、リード線挿入孔
（１２）に塗布された合成樹脂（１５’）によりフード
線先端部（４ｂ）を接着固定することによりコンデンサ
（５）と外装枠（６）を嵌合固定するものである。この
場合も、リード線嵌合溝（１４）（１４）のリード線嵌
合溝底部（１６）にリード線（４）（４）を当接させる
ことによる位置決めや、リード線挿入孔（１２）の端面
部（１７）にリード線先端部（４ｂ）の段差部を当接す
る事により位置決めを行ない、壁面（９）を削除する事
が可能である。FIG. 4 shows yet another embodiment. That is, the capacitor (5) and the outer frame (6) are fitted and fixed by adhesively fixing the hood wire tip (4b) with a synthetic resin (15') applied to the lead wire insertion hole (12). be. In this case as well, positioning can be performed by contacting the lead wires (4) (4) with the lead wire fitting groove bottoms (16) of the lead wire fitting grooves (14) (14), and by positioning the lead wires (4) (4) in the lead wire insertion holes (12). It is possible to perform positioning by abutting the stepped portion of the lead wire tip (4b) against the end surface (17) of the lead wire, and to remove the wall surface (9).
第５図に示す実施例は、外装枠（６）の成型時の金型強
度のアップを計ったもので、生産性の向上を目的とする
。リード線径（Ａ）よりも小さい溝巾（Ｆ）のリード端
部挿入用開口溝（１８）は外装枠（６）の側面（１９）
に開口部を設ける事により、成型時のビン折れや曲りを
防止する働きをする。そしてコンデンサ（５）を外装枠
（６）に組合せた時、リード線先端部（４ｂ）（４ｂ）
をリード端部挿入用開口溝（１８）（１８）に押圧挿入
する。そして、開口溝（１８）には側面（１９）方向か
ら合成樹脂を塗布してリード線先端部（４ｂ）を外装枠
（６）に接着固定する。The embodiment shown in FIG. 5 is designed to increase the strength of the mold when molding the exterior frame (6), and is intended to improve productivity. The lead end insertion opening groove (18), which has a groove width (F) smaller than the lead wire diameter (A), is located on the side surface (19) of the exterior frame (6).
By providing an opening in the bottle, it works to prevent the bottle from breaking or bending during molding. When the capacitor (5) is assembled to the exterior frame (6), the lead wire tips (4b) (4b)
are pressed into the lead end insertion opening grooves (18) (18). Then, synthetic resin is applied to the opening groove (18) from the side surface (19) direction, and the lead wire tip (4b) is adhesively fixed to the exterior frame (6).
外装枠は耐熱性に優れた材料を用いることが望ましく、
また可撓性の有るものが良い。即ち、エポキシ、フェノ
ール、ポリフェニレンサルファイド、ポリイミド、ポリ
ブチレン、テレフタレイト等の合成樹脂が適当である。It is desirable to use a material with excellent heat resistance for the exterior frame.
It is also good to have flexibility. That is, synthetic resins such as epoxy, phenol, polyphenylene sulfide, polyimide, polybutylene, and terephthalate are suitable.
（ト）発明の効果
このように本発明をコンデンサに適用した場合には、コ
ンデンサは単体でリード線の折曲げ成形が可能な為、精
度の良い成形を行なう事が出来る。そして、コンデンサ
と外装ケースＣ枠）の組合せ時、リード線先端は、外装
枠挿入孔に係止され、一方、コンデンサと外装ケースは
接着固定されるため、外装ケースの平面状底部とリード
線半田付は部は正確に位置決めされる。その為、プリン
ト基板上にチップ部品を搭載した時、リード線とクリー
ムハンダの接触面は一定となり、良好な半田付けが成さ
れる。また、リード線はコンデンサ本体とリード線先端
で外装枠に固定された状態となる為、半田熱による外装
枠の起き上がり等も防止出来る。(G) Effects of the Invention When the present invention is applied to a capacitor as described above, since the capacitor can be molded by bending the lead wire alone, it is possible to mold the capacitor with high precision. When the capacitor and the outer case (frame C) are combined, the tip of the lead wire is locked in the outer frame insertion hole, and on the other hand, since the capacitor and the outer case are fixed with adhesive, the planar bottom of the outer case and the lead wire are soldered. The attached parts are accurately positioned. Therefore, when a chip component is mounted on a printed circuit board, the contact surface between the lead wire and the cream solder is constant, and good soldering is achieved. Furthermore, since the lead wire is fixed to the outer frame at the capacitor body and the tip of the lead wire, it is possible to prevent the outer frame from rising due to soldering heat.
第１図は本発明の面実装電子部品の実施例を示し、その
組立途上の斜視図で同図（ａ）はコンデンサ、（ｂ）は
外装ケースを示す。第２図は本発明の組立完成状態を示
し、同図（ａ）は正面図、（ｂ）は部分断面側面図、（
ｃ）は下面図である。第３図は本発明の他の実施例を示
し、同図（ａ）はその斜視図、（ｂ）は部分断面側面図
である。第４図は、本発明の更に他の実施例を示し、引
出リード端子の挿入断面図である。第５図は本発明の他
の実施例を示す斜視図である。第６図は、リード線半田
付は部（４ａ）の形状を示す実施例であり、同図（ａ）
は偏平形状、（ｂ）は丸形状を示す。第７図は、従来の
実施例によるチップ部品の基板への半田付は状態を示し
、同図（ａ）はリード線半田付は部の成形不良による半
田浮き状態を示し、（ｂ）は半田熱等による本体が起き
上った状態を示す正面図である。
（１）・・・金属ケース、（２）・・・コンデンサ素子
、（３）・・・封口体、（４）・・・引出リード端子、
（４ａ）・・リード線半田付は部、（４ｂ）・・・リー
ド線先端部、（５）・・・コンデンサ、（６）・・・外
装ケース、（７）・・・開口端面、（８）・・・外装ケ
ースの平面状底部、（９）・・・閉成壁面、（１０）・
・・コンデンサ収納円筒状空間、（１１）・・・凹陥部
、（１２）・・・リード線挿入孔、（１３）・・・ガイ
ド溝、（１４）・・・リード線嵌合溝、（１５）（１５
’）・・・合成樹脂、（１６）・・・リード線嵌合溝底
部、（１７）・・・リード線挿入孔端面部、（１８）・
・・リード端部挿入用開口溝、（１９）・・・外装ケー
ス側面、（２ｏ）・・・チップ部品、（２１）・・・プ
リント基板、（２２）・・・クリーム半田。
出願人 三洋電機株式会社外１名
代理人 弁理士 西野卓嗣（外２名）
第１図
第２図
（ａ）
（Ｃ）
（ｂ）
第３図
（ｂ）
（ａ）
（ｂ）
第６図
（ｂ）FIG. 1 shows an embodiment of the surface-mounted electronic component of the present invention, and is a perspective view of the device in the process of being assembled, with (a) showing a capacitor and (b) showing an exterior case. FIG. 2 shows the assembled state of the present invention, in which (a) is a front view, (b) is a partially sectional side view, and (
c) is a bottom view. FIG. 3 shows another embodiment of the present invention, in which FIG. 3(a) is a perspective view and FIG. 3(b) is a partially sectional side view. FIG. 4 shows still another embodiment of the present invention, and is a sectional view of an inserted lead terminal. FIG. 5 is a perspective view showing another embodiment of the present invention. FIG. 6 is an embodiment showing the shape of the lead wire soldering part (4a), and FIG.
shows a flat shape, and (b) shows a round shape. FIG. 7 shows the state of soldering of chip components to the board according to the conventional example, and FIG. FIG. 3 is a front view showing a state in which the main body is raised due to heat or the like. (1)...Metal case, (2)...Capacitor element, (3)...Sealing body, (4)...Output lead terminal,
(4a)...Lead wire soldering part, (4b)...Lead wire tip, (5)...Capacitor, (6)...Exterior case, (7)...Opening end surface, ( 8)...Flat bottom of the exterior case, (9)...Closing wall surface, (10)...
... Capacitor storage cylindrical space, (11) ... Recessed part, (12) ... Lead wire insertion hole, (13) ... Guide groove, (14) ... Lead wire fitting groove, ( 15) (15
')...Synthetic resin, (16)...Lead wire fitting groove bottom, (17)...Lead wire insertion hole end surface, (18)...
... Opening groove for inserting the lead end, (19) ... External case side surface, (2o) ... Chip component, (21) ... Printed circuit board, (22) ... Cream solder. Applicant: Sanyo Electric Co., Ltd. and one other agent Patent attorney: Takuji Nishino (two others) Figure 1 Figure 2 (a) (C) (b) Figure 3 (b) (a) (b) Figure 6 (b)
Claims (3)
部品素子を筒状金属ケース内に収納してなる部品本体と
、外部の平面状底部の一部に凹陥部を設け且つ該凹陥部
に連接して挿入孔を設けると共に筒状内周面の一部或は
該内周面に連接する閉成壁面の一部に合成樹脂を塗布し
た合成樹脂製筒状外装ケースとを備え、前記外装ケース
に前記部品本体の金属ケースを圧入収納すると共に前記
部品本体の引出リード端子を前記外装ケースに沿って折
曲げて前記ケースの凹陥部に嵌入し且つ該引出リード端
子の端縁を前記挿入孔に挿入固定してなる面実装電子部
品。(1) A component body in which a component element from which a pair of lead terminals are drawn out from the same end face is housed in a cylindrical metal case, and a recessed portion is provided in a part of the external planar bottom, and the recessed portion is provided with a recessed portion. A cylindrical outer case made of synthetic resin is provided with an insertion hole connected thereto, and a synthetic resin is applied to a part of the cylindrical inner circumferential surface or a part of the closing wall surface connected to the inner circumferential surface. The metal case of the component body is press-fitted into the case, and the lead terminal of the component body is bent along the outer case and fitted into the recess of the case, and the edge of the lead terminal is inserted into the insertion hole. A surface-mounted electronic component that is inserted and fixed into a device.
分を突出させて、引出リード端子を前記外装ケースに沿
って折曲げ固定した際、引出リード端子が外装ケース端
面より突出しないようにしたことを特徴とする特許請求
の範囲第１項に記載の面実装電子部品。(2) A portion of the outer case that is different from the bent portion of the drawer lead terminal is made to protrude so that when the drawer lead terminal is bent and fixed along the outer case, the drawer lead terminal does not protrude from the end surface of the outer case. A surface-mounted electronic component according to claim 1, characterized in that:
、外装ケースの挿入孔の一部を開口させ、部品本体のリ
ード端子を該開口から挿入孔に圧入し合成樹脂にて接着
固定することを特徴とする特許請求の範囲第１項或は第
２項記載の面実装電子部品。(3) Open a part of the insertion hole of the outer case in a direction perpendicular to the insertion direction of the outer case of the component body, press fit the lead terminal of the component body into the insertion hole through the opening, and fix it with adhesive using synthetic resin. A surface-mounted electronic component according to claim 1 or 2, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2229348A JP2527640B2 (en) | 1990-08-29 | 1990-08-29 | Surface mount electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2229348A JP2527640B2 (en) | 1990-08-29 | 1990-08-29 | Surface mount electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04109612A true JPH04109612A (en) | 1992-04-10 |
| JP2527640B2 JP2527640B2 (en) | 1996-08-28 |
Family
ID=16890759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2229348A Expired - Fee Related JP2527640B2 (en) | 1990-08-29 | 1990-08-29 | Surface mount electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527640B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018108094A1 (en) * | 2016-12-14 | 2018-06-21 | 湖南艾华集团股份有限公司 | Leading wire structure, and leading wire forming device thereof and leading wire forming process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60245115A (en) * | 1984-05-18 | 1985-12-04 | 松下電器産業株式会社 | Electronic part |
| JPS6247121U (en) * | 1985-09-12 | 1987-03-23 | ||
| JPH01278711A (en) * | 1988-04-30 | 1989-11-09 | Nippon Chemicon Corp | Chip type capacitor |
| JPH0258209A (en) * | 1988-08-23 | 1990-02-27 | Nippon Chemicon Corp | Chip type capacitor |
-
1990
- 1990-08-29 JP JP2229348A patent/JP2527640B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60245115A (en) * | 1984-05-18 | 1985-12-04 | 松下電器産業株式会社 | Electronic part |
| JPS6247121U (en) * | 1985-09-12 | 1987-03-23 | ||
| JPH01278711A (en) * | 1988-04-30 | 1989-11-09 | Nippon Chemicon Corp | Chip type capacitor |
| JPH0258209A (en) * | 1988-08-23 | 1990-02-27 | Nippon Chemicon Corp | Chip type capacitor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018108094A1 (en) * | 2016-12-14 | 2018-06-21 | 湖南艾华集团股份有限公司 | Leading wire structure, and leading wire forming device thereof and leading wire forming process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2527640B2 (en) | 1996-08-28 |
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