JPH04108891U - connector - Google Patents

Abstract

(57) [Summary] [Purpose] It is possible to narrow the arrangement pitch of contacts, and furthermore, to enable a high-density arrangement of contacts in a matrix. [Structure] A plurality of electrodes are arranged and formed on one surface 12 of a multilayer wiring board 11, and these are respectively connected to a plurality of terminals 15 formed on the periphery of the other surface 14 via inner layer wiring. A plurality of elastic, spherical conductive contacts 19 are positioned and held on each electrode by a contact holding plate 21 in which a plurality of contact accommodation holes 22 are formed to accommodate and hold them, respectively. Each conductive contact 19 protrudes outward from the contact housing hole 22, forming highly densely arranged contacts.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This idea is a connector that makes it possible to arrange contacts at a narrow pitch and at high density. This is related to data.

0002

[Conventional technology]

Conventional connectors are contours formed by pressing or cutting metal materials. press-fit into an injection-molded insulation body or lance It was of a structure in which it was locked by means such as. Figure 4 shows an example of a connector with such a structure. Shown below. Figure 4 is for connecting the flexible wiring cable (FPC) and the printed circuit board. This figure shows the structure of the connector, and in the figure (A), connector 1 is printed. 2 is a partial cross-sectional view showing the state in which the connector 1 is attached to the board 2; FIG. It is a diagram seen from the insertion side A of the FPC3.

0003 In the connector 1, the contacts 4 are held inside the body 5 made of insulating material. , the FPC 3 inserted from the FPC insertion port 6 of this body 5 is fitted with the body 5, The conductor pattern of the FPC 3 and the contact 4 are brought into elastic contact with each other. contour A terminal 7 integrally formed with the body 5 protrudes from the bottom surface of the body 5, and this end Insert the connector 7 into the designated through hole 8 of the printed circuit board 2 and solder it. As a result, conduction between the contact 4 and the predetermined through hole 8 is achieved, and the connection is established. 1 is fixed to a printed circuit board 2.

0004 By the way, the contacts 4 arranged in the body 5 are connected to predetermined conductor patterns of the FPC 3. Precisely positioned and in contact with adjacent contacts for continuity with turns It must be structured so that it does not. For this reason, each contact 4 is while holding it in place so that it does not move, and between each adjacent contact 4. A partition wall 9 is formed in the body 5 to insulate the body 5.

[0005]

[Problem that the idea aims to solve]

In the conventional connector having the structure as described above, the arrangement of each contact 4 is Narrowing the pitch, for example, 0.5 mm or less, is extremely difficult from a processing and structural standpoint. It is extremely difficult. That is, as the contact pitch becomes narrower, the The wall thickness of the partition wall 9 must be made thinner, but during molding, the resin is applied to this thin partition wall 9. The body 5 becomes unable to be molded. In addition, press processing etc. Contact 4, which is formed by Even if the contact 4 is made smaller, the elastic force will be reduced, and the contact load at the contact point will be reduced. This leads to lower contact and makes it impossible to obtain stable contact.

[0006] The purpose of this invention is to provide a connector that allows the arrangement pitch of contacts to be narrowed. In particular, it is a connector that enables a matrix-like high-density contact arrangement. It provides:

[0007]

[Means to solve the problem]

This idea consists of multiple electrodes arranged at predetermined intervals on one side, and the electrodes on the other side. A plurality of terminals are arranged at intervals larger than the interval between the electrodes and the terminals. A multilayer wiring board with wiring formed inside to connect the corresponding parts, and its multilayer A plurality of elastic spherical conductive contacts are in contact with each electrode of the wiring board, and A contact housing that is attached to one side of the layered wiring board and accommodates and holds each conductive contact. Holes are formed, and the size of the side opposite to the multilayer wiring board of each contact accommodation hole is larger than that of the contact. A contact holding plate that is small in size and has each conductive contact protruding outward from each contact accommodation hole. It is equipped with the following.

[0008]

[Effect]

In this device configured as described above, each conductive contact protrudes from the contact holding plate. Contact each contact of the first connection object to each terminal of the multilayer wiring board. When this is connected to the wiring of the second connection object (for example, a printed circuit board), each component of the first connection object The contacts are elastic spherical conductive contacts and electrodes formed on the multilayer wiring board. The part wiring and the terminal connect it to the corresponding wiring of the second connection object through an electrical path. They are electrically connected. The conductive contacts are accommodated and held in the contact accommodation holes of the contact holding plate. Therefore, it is possible to obtain a connector having narrow pitch contacts.

[0009] Note that the contact load of the contact point is given by the elastic force of the contact point.

0010

【Example】

Next, an embodiment of this invention will be described with reference to the drawings. Figure 1 shows the preferred method of this invention. As an example, a connector for connecting a pad grid array and a circuit board is shown. This is what I did. Figure 2 is an enlarged view of part B in Figure 1, with a portion cut away to show a cross section. There is. In addition, in Figure 2, the right side part and the lower part when facing the figure are cut with a straight line, Illustration of the fractured surface is omitted.

[0011] A plurality of electrodes 1 are provided at the center of one surface 12 of a substantially square ceramic multilayer wiring board 11. 3 are arranged in a matrix at predetermined intervals. On the other hand, multilayer wiring board 1 A plurality of terminals 15 are electrically connected to the other surface 14 of the 1 along each of the four side edges of the approximately square shape. They are arranged at intervals larger than the intervals between the poles 13. These electrodes 13 and terminals 15 The corresponding ones are connected by inner layer wiring of the multilayer wiring board 11. .

0012 This connection is made from the lower surface of the electrode 13 to a predetermined layer of the multilayer wiring board 11 as shown in FIG. Through holes 16 formed up to 17, and the distance between the electrode 13 and the terminal 15 is three-dimensionally as short as possible. It is preferable that the wiring be spaced apart. In addition, as shown in Figure 2, the through hole The hollow portion 18 of the hole 16 is filled with conductive paste or the like as necessary.

[0013] A plurality of elastic spherical conductive contacts are provided on each electrode 13 of the multilayer wiring board 11. 19 are placed. As such a conductive contact 19, for example, the surface is plated with Au. Use a resin ball that has been treated with In addition, in order to improve the adhesion of Au plating, Ni plating may be applied to the base. The conductive contacts 19 are positioned and fixed to each electrode 13 by the contact holding plate 21. It will be done. In other words, the contact holding plate 21 corresponds to each conductive contact 19, and these Contact accommodating holes 22 are formed for accommodating the respective contacts, and the multilayer wiring board 1 of the contact holding plate 21 The size of the contact accommodating hole 22 on the surface opposite to 1 is smaller than that of the conductive contact 19. , from which a conductive contact 19 protrudes. That is, the thickness of the contact holding plate 21 is The diameter of the conductive contact 19 is smaller than that of the conductive contact 19. These contact accommodation holes 22 are made of a conical shape. The shape is preferably a square pyramid in this example. This quadrangular pyramidal tangent The point receiving hole 22 is formed by using, for example, single crystal silicon as the contact holding plate 21. By anisotropic etching of the silicon wafer (100) surface, a fine quadrangular pyramid shape is formed. Holes can be easily formed with high precision. In addition, after the etching process, the contact An oxide film is formed on the surface of the holding plate 21 to provide insulation.

[0014] In this way, each conductive contact 19 is accommodated and held in the contact accommodation hole 22. In this state, the contact holding plate 21 is attached to the multilayer wiring board 11 by, for example, adhesive. . In this state, each conductive contact 19 has a portion external to each contact receiving hole 22. It is in a state where it sticks out. Further, each conductive contact 19 is connected to a contact receiving hole 22. It is not completely fixed, but has some room to move within the contact housing hole 22. It is better to keep it as such.

[0015] A cross section of the conductive contact 19 portion of the connector according to this invention configured as described above. An enlarged view is shown in Figure 3 with the pad grid array 23 connected to this connector. show. In this figure, the conductive contact 19 is located on the surface of an elastic resin ball 24. After applying Ni plating 25, Au plating 26 is used. The pad grid array 23 has a plurality of pads 28 on one side of an electronic component (device). are insulated from each other and formed in a matrix shape, and a plurality of pads 28 The relative arrangement between the conductive contacts 19 and the plurality of conductive contacts 19 are matched. Each pad 28 of the pad grid array 23 is connected to a protruding portion of the conductive contact 19. The pad grid array 23 is connected to this connector by touching the pad grid array 23 with the arrows 3 Press as indicated by 0. At this time, the pad 28 and the electrode 13 of the multilayer wiring board 11 The conductive contact 19 is held in an elastically deformed state between the two. Therefore, conductive contacts The elastic force of pad grid array 23 allows sufficient contact load to be applied to the pad grid array 23. Thus, conduction between the electrode 28 and the electrode 13 of the multilayer wiring board 11 can be obtained. In addition, many For example, each terminal 15 provided on the periphery of the layer wiring board 11 is connected to each conductor pad of the circuit board. By connecting with the pad grid array, the connector of this invention -23 and the circuit board can be electrically connected.

[0016] As mentioned above, the contact accommodating hole 22 is formed in the contact holding plate 21, and the contact accommodating hole 22 is formed in the contact holder plate 21. Since it has a very simple structure in which the elastic conductive contact 19 is housed in the The distance between the conductive contacts 1 can be easily narrowed, especially if etching is used. It is also possible to set the pitch of 9 to 0.5 mm or less. These matrix-like high The densely arranged conductive contacts 19 connect to the corresponding electrodes of the multilayer wiring board 11. 13 and is connected to the terminal 15 via the inner layer wiring, but the arrangement pitch of the terminal 15 is is set larger than the pitch of the conductive contacts 19, so there is no possibility of contact with the circuit board, etc. Connections can be made easily.

[0017] Note that the ceramic multilayer wiring board 11 has a plurality of electrodes 13 formed on one surface 12. and a plurality of terminals 15 formed on the other surface 14, respectively, and three-dimensionally short distance It is possible to separate the wiring, and the wiring delay time can be shortened. Furthermore, in this embodiment, metal plating is applied to the surface as the conductive contact 19. However, the present invention is not limited to this, and for example, metal conductive particles may be dispersed within the resin. Scattered resin balls or resin balls with ultra-fine metal wires embedded in the resin, etc. Any material may be used as long as it has elasticity and conductivity. In addition, conductive contact 1 The shape of 9 does not necessarily have to be spherical. Furthermore, the arrangement of the conductive contacts 19 is Not limited to trix shapes. Similarly, the arrangement of the terminals 15 is not limited to the above example.

[0018]

[Effect of the idea] As explained above, this idea has an elastic spherical shape on the electrode of a multilayer wiring board. The conductive contacts are positioned by a contact holding plate formed with a contact accommodation hole that accommodates and holds the conductive contacts. By positioning and fixing the structure, the contact pitch of the connector can be extremely small. It is easy to manufacture, provides a good electrical connection, is easy to manufacture, and has a high cost. A connector having a dense matrix-like arrangement of contacts can be obtained. This According to Necta, for example, a pad grid array with a dense matrix of electrodes It is possible to easily connect the relay and the circuit board.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the connector according to the invention.

FIG. 2 is an enlarged view of part B in FIG. 1, showing a cross section with a part cut away.

FIG. 3 is an enlarged cross-sectional view of a contact point of the connector according to the invention.

FIG. 4 is a diagram showing a conventional connector. (A) is a partially sectional side view showing a state in which the connector is attached to a printed circuit board. (B) is a front view of the connector.

[Explanation of symbols]

4 Contact 5 Body 9 Partition wall 11 Multilayer wiring board 13 Electrode 15 terminal 19 Conductive contacts 21 Contact holding plate 22 Contact accommodation hole

──────────────────────────────────────────────── ─── Continuation of front page (72) Creator Takayoshi Mitake 1-21-6 Dogenzaka, Shibuya-ku, Tokyo Japan Within Aviation Electronics Industry Co., Ltd. (72) Creator Takeki Naito 1-21-6 Dogenzaka, Shibuya-ku, Tokyo Japan Within Aviation Electronics Industry Co., Ltd.

Claims (1)

[Scope of utility model registration request] Claim 1: A plurality of electrodes are arranged and formed on one side at predetermined intervals, a plurality of terminals are arranged and formed on the other side at intervals larger than the intervals between the electrodes, and the corresponding ones of these electrodes and terminals are connected. a multilayer wiring board having wiring formed therein; a plurality of elastic spherical conductive contacts in contact with each of the electrodes of the multilayer wiring board; Contact accommodation holes are formed to accommodate and hold conductive contacts, and the size of the opposite side of each contact accommodation hole to the multilayer wiring board is smaller than that of the contacts, and each conductive contact is inserted through each contact accommodation hole. A connector comprising: a contact holding plate protruding from the outside;