JPH04107853A - External lead correcting method - Google Patents
External lead correcting methodInfo
- Publication number
- JPH04107853A JPH04107853A JP22618290A JP22618290A JPH04107853A JP H04107853 A JPH04107853 A JP H04107853A JP 22618290 A JP22618290 A JP 22618290A JP 22618290 A JP22618290 A JP 22618290A JP H04107853 A JPH04107853 A JP H04107853A
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- lead
- tip
- lowered
- bending punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract description 10
- 238000005452 bending Methods 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は外部リード矯正方法に関し、特に樹脂封止型の
スモールアウトラインパッケージ型ＩＣ（以下５ＯＰ−
ＩＣと記す）やファラドフラットパッケージ型ＩＣ（以
下ＱＦＰ−ＩＣと記す）等の表面実装型ＩＣの外部リー
ド矯正方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an external lead correction method, and particularly to a resin-sealed small outline package type IC (hereinafter referred to as 5OP-
The present invention relates to a method for correcting external leads of surface-mounted ICs such as IC) and farad flat package ICs (hereinafter referred to as QFP-IC).
従来＜７）ＳＯＰ−ＩＣやＱＦＰ−ＩＣ（７）外部リー
ド矯正方法は第３図に示すように、外部リード整形加工
済のＩＣ（以下ＩＣと記す）を下ブロック４の上に位置
決めし、上下動する上ブロック１を下降させ、ＩＣのリ
ード肩部を挟んで固定する。Conventional <7) SOP-IC or QFP-IC (7) As shown in Fig. 3, the external lead correction method positions the external lead-shaped IC (hereinafter referred to as IC) on the lower block 4, The upper block 1, which moves up and down, is lowered and fixed by sandwiching the lead shoulders of the IC.
次に、上ブロック１によりガイドされた曲げポンチ２を
下降させ、ＩＣの外部リード６の先端部を下ブロックに
斤接する事によりＩＣの上下変形した外部リードを上記
１工程で矯正し外部リードの平坦度向上を行なっている
。Next, the bending punch 2 guided by the upper block 1 is lowered and the tip of the external lead 6 of the IC is brought into contact with the lower block, thereby correcting the vertically deformed external lead of the IC in the above 1 step. The flatness is being improved.
この従来のＩＣ用リード矯正方法はＩＣに外部リード整
形加工時と同様な再整形加工を施こし、外部リードの上
下変形を矯正し、リード平坦度を向上させているが、外
部リード肩部を上下ブロックで固定している為外部リー
ドが矯正されにくく、さらに下ブロックを固定し、曲げ
ポンチを上下動させている為、上方向に変形している外
部リードは矯正可能であるが、下方向に変形している外
部リードは矯正されにくいという問題点があった。This conventional IC lead straightening method reshapes the IC in the same way as the external lead shaping process, corrects the vertical deformation of the external lead, and improves the lead flatness. Since the external lead is fixed with the upper and lower blocks, it is difficult to straighten it, and since the lower block is fixed and the bending punch is moved up and down, it is possible to correct the external lead that is deformed upward, but it is difficult to correct the external lead if it is deformed upward. There is a problem in that it is difficult to correct the deformed external lead.
本発明の外部リード矯正方法は、外部リード整形加工済
ＩＣの樹脂封止部を上・下ブロックで挟んで固定して外
部リードの肩部を開放し前記外部リードの先端を曲げポ
ンチにより下方に押下げ外部リードの上方変形を矯正す
る第１の工程と、前記外部リードの先端を曲げポンチに
より上方に押上げ外部リードの下方変形を矯正する第２
の工程とを含んで構成される。In the external lead correction method of the present invention, the resin-sealed part of the external lead-shaped IC is sandwiched and fixed between upper and lower blocks, the shoulder part of the external lead is opened, and the tip of the external lead is bent downward with a punch. A first step of pressing down and correcting the upward deformation of the external lead, and a second step of pushing the tip of the external lead upward with a bending punch to correct the downward deformation of the external lead.
It consists of the following steps.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の第１の実施例を説明す
るための動作順に示したリード矯正機の断面図である。FIGS. 1(a) and 1(b) are sectional views of a lead straightening machine shown in order of operation for explaining a first embodiment of the present invention.
まず、第１図（ａ）に示すように、下ブロック４にＩＣ
を位置決めし、上下動する上ブロック１を下降し、ＩＣ
の樹脂封止部３を挟んで固定し、外部リード６の肩部を
開放する０次に、上プロ・ンク１によりガイドされた曲
げポンチ２を下降させ、肩部を開放した外部リード６の
先端を下方へ、１００〜５００μｍ程度押下げる０次に
、曲げポンチ２及び上ブロック１を順次上昇させてＩＣ
を取はずし、第１の工程を終了する。First, as shown in FIG. 1(a), the IC is placed in the lower block 4.
, lower the upper block 1 that moves up and down, and
Then, the bending punch 2 guided by the upper prong 1 is lowered to open the external lead 6 with the shoulder part open. Push down the tip by about 100 to 500 μm. Next, raise the bending punch 2 and upper block 1 one after another to insert the IC.
is removed to complete the first step.
次に、第１図（ｂ）に示すように、ＩＣを下ブロツク８
上に移し替えて位置決めし、上下動する上ブロック５を
下降し、ＩＣの樹脂封止部３を固定する。次に、下ブロ
ック８によりガイドされた上下動する曲げポンチ７を上
昇させ、外部リード６の先端を上方に１００〜５００μ
ｍ程度押上げる。その後、曲げポンチ７を下降させ、上
ブロック５を上昇させ、第２の工程を終了する。Next, as shown in FIG. 1(b), the IC is placed on the lower block 8.
The upper block 5, which moves up and down, is lowered to fix the resin sealing part 3 of the IC. Next, the vertically moving bending punch 7 guided by the lower block 8 is raised, and the tip of the external lead 6 is bent upward by 100 to 500 μm.
Push up about m. Thereafter, the bending punch 7 is lowered and the upper block 5 is raised, thereby completing the second step.
このように、第１の工程にて、上方向に変形した外部リ
ード６を下方向に矯正し、第２の工程にて、下方向に変
形した外部リード６を上方向に矯正する。In this way, in the first step, the upwardly deformed external lead 6 is corrected downwardly, and in the second step, the downwardly deformed external lead 6 is corrected upwardly.
第２図（ａ）、（ｂ）は本発明の第２の実施例を説明す
るための動作順に示した矯正機の断面図である。FIGS. 2(a) and 2(b) are sectional views of a straightening machine shown in order of operation for explaining a second embodiment of the present invention.
第２図（ａ）に示すように、ＩＣを下ブロック１１の上
に位置決めし、上下動する上ブロック９を下降させＩＣ
の樹脂封止部３を固定する０次に、上下動可能な曲げポ
ンチ１２を下降させＩＣの外部リード６の先端を下方へ
１００〜５００μｍ程度押下げる。As shown in FIG. 2(a), the IC is positioned on the lower block 11, and the upper block 9, which moves up and down, is lowered to remove the IC.
Next, the bending punch 12, which can be moved vertically, is lowered to push down the tips of the external leads 6 of the IC by about 100 to 500 μm.
次に、第２図（ｂ）に示すように、曲げポンチ１２を逆
に１００〜５００μｍ程度上昇させ、リード６の先端を
上方へ押上げる。このように同一ステージにて、矯正が
可能となる為、矯正機の小型化が可能となる。Next, as shown in FIG. 2(b), the bending punch 12 is raised by about 100 to 500 μm to push the tip of the lead 6 upward. In this way, since straightening can be performed on the same stage, it is possible to downsize the straightening machine.
以上説明したように本発明は、ＩＣの封止樹脂部を固定
してリード肩部を開放し、第１の工程で肩部を開放され
た外部リードの先端を下方へ押下げることにより上方向
に変形した外部リードが下方向に矯正され、さらに第２
の工程で外部リードの先端を上方へ押上げることにより
、下方向に変形した外部リードが上方向に矯正される為
リードの上下動全体が矯正され平坦度１００〜２５０μ
ｍ程度のＩＣが従来の方法では５０〜１５０μｍ程度迄
しか矯正できなかったのに対し、本発明の方法の場合Ｏ
〜３０μｍ迄改善される。As explained above, the present invention fixes the sealing resin part of the IC, opens the lead shoulder part, and pushes down the tip of the external lead whose shoulder part has been opened in the first step, thereby moving the external lead upward. The external lead that has been deformed is corrected downward, and the second
By pushing the tip of the external lead upward in the process, the downwardly deformed external lead is corrected upward, so the entire vertical movement of the lead is corrected, resulting in a flatness of 100 to 250μ.
Conventional methods could only correct ICs of about 50 to 150 μm, whereas the method of the present invention
It is improved to ~30 μm.
これにより、リードの平坦性が著しく向上する為、５Ｏ
Ｐ−ＩＣやＱＦＰ−ＩＣなど表面実装型ＩＣの実装時の
接続不良を低減し、信頼性を向上させるという効果を有
する。This significantly improves the flatness of the lead, so 5O
This has the effect of reducing connection failures during mounting of surface-mounted ICs such as P-ICs and QFP-ICs, and improving reliability.
第１図（ａ）、（ｂ）及び第２図（ａ）、（ｂ）は本発
明の第１及び第２の実施例を説明するための動作順に示
したリード矯正機の断面図、第３図は従来の外部リード
矯正方法を説明するためのリード矯正機の断面図である
。
１．５．９・・・上ブロック、２，７．１０・・・曲げ
ポンチ、３・・・樹脂封止部、４，８．１１・・・下ブ
ロ尤
四
党
？
図1(a), (b) and FIG. 2(a), (b) are cross-sectional views of the lead straightening machine shown in the order of operation for explaining the first and second embodiments of the present invention. FIG. 3 is a sectional view of a lead straightening machine for explaining a conventional external lead straightening method. 1.5.9...Upper block, 2,7.10...Bending punch, 3...Resin sealing part, 4,8.11...Lower block? figure
Claims (1)
ックで挟んで固定して外部リードの肩部を開放し前記外
部リードの先端を曲げポンチにより下方に押下げ外部リ
ードの上方変形を矯正する第１の工程と、前記外部リー
ドの先端を曲げポンチにより上方に押上げ外部リードの
下方変形を矯正する第２の工程とを含むことを特徴とす
る外部リード矯正方法。The resin-sealed part of the external lead-shaped IC is sandwiched and fixed between upper and lower blocks, the shoulder part of the external lead is released, and the tip of the external lead is bent and pushed downward with a punch to correct the upward deformation of the external lead. and a second step of pushing the tip of the external lead upward with a bending punch to correct downward deformation of the external lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22618290A JPH04107853A (en) | 1990-08-28 | 1990-08-28 | External lead correcting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22618290A JPH04107853A (en) | 1990-08-28 | 1990-08-28 | External lead correcting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04107853A true JPH04107853A (en) | 1992-04-09 |
Family
ID=16841175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22618290A Pending JPH04107853A (en) | 1990-08-28 | 1990-08-28 | External lead correcting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04107853A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232546B2 (en) * | 1977-05-24 | 1987-07-15 | Nippon Electric Co | |
| JPS6324872B2 (en) * | 1980-11-11 | 1988-05-23 | Ihc Holland Nv | |
| JPH02188950A (en) * | 1989-01-17 | 1990-07-25 | Ikegami Tsushinki Co Ltd | Lead-reforming machine of electronic component |
-
1990
- 1990-08-28 JP JP22618290A patent/JPH04107853A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232546B2 (en) * | 1977-05-24 | 1987-07-15 | Nippon Electric Co | |
| JPS6324872B2 (en) * | 1980-11-11 | 1988-05-23 | Ihc Holland Nv | |
| JPH02188950A (en) * | 1989-01-17 | 1990-07-25 | Ikegami Tsushinki Co Ltd | Lead-reforming machine of electronic component |
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