JPH04107299A - Device for supplying chips - Google Patents

Abstract

PURPOSE:To uniformly charge chips even into a long plating vessel by attaching a chip container, cyclone, blower piping for feeding air, hopper and chute to a carrier and running this carriage along the plating vessel. CONSTITUTION:At the time of starting a plating work, the large quantity of chips 2... must be supplied into the plating vessel 1 (concretely, housing parts 7, 8), and in this case, by making the chip container 10 attachable/detachable to/from the carriage 15, the working efficiency is improved. That is, this is a reason that by preparing plural containers 10 (at least two sets to one set of carriage 15) and supplying the chips 2 in the other container 10 during supplying the chips 2... in the container 10 while attaching one container 10 to the carriage 15, when there is no chip 2 in one side of the container 10, immediately the other side of container 10 is taken out from the carriage 15, and the other container 10 storing the chips 2 can be attached to the carriage 15.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a chip supply device.

(Problems to be solved by conventional technology and invention) Metal wire (
For example, when plating a conductive material (e.g., copper) onto a conductive material (e.g., copper), an anode chip (copper chip) was put into the plating tank. They were working on putting it in.

Therefore, when charging, the plating solution in the plating tank scatters, which is dangerous, and the area near the plating tank is at a high temperature, making the work difficult for the operator. Also,
The chips in the plating tank wear out as plating progresses, so it is necessary to put chips into the plating tank as they wear out, but it takes a lot of skill to put chips in as they wear out. . Furthermore, if the length of the plating tank is large, it is extremely difficult to efficiently and uniformly supply chips into the plating tank.

Therefore, in the present invention, even if the length dimension of the plating tank is large, it is possible to accurately supply chips according to chip wear and provide a high-quality product, and it is also extremely convenient for workers. The purpose is to provide a safe chip feeding device.

(Means for solving one problem) In order to achieve the above-mentioned object, a chip supply device according to the present invention is a chip supply device for supplying anode chips to a plating tank, It is equipped with a trolley that runs on rails laid along the
A chip container in which a large number of anode chips are stored, a cyclone that separates the anode chips from the air, and a blower.
An air conveying pipe for transporting the chips in the chip container into the cyclone by the air flow of the blower, and a tapered part at least at the lower end to receive the chips falling from the cyclone. A hopper and a chute extending in an extending manner to receive chips from a lower opening of the hopper and guide the chips to the spacing tank are attached to the cart.

[Function] The chips in the chip container are transported to a cyclone via an air conveyance pipe, a large number of chips are collected at the bottom of the cyclone, and the chips fall into a hopper. The chips dropped into the hopper fall into the chute from the lower opening of the hopper, but in this case, since the lower end of the hopper is tapered, a large amount of chips does not fall at once, and the chute receives an appropriate amount of chips, and the appropriate amount of chips is guided by the chute and fed into the plating bath. Furthermore, the chip container, cyclone, blower, air conveyance piping, hopper, and chute are attached to a trolley, which runs along the plating tank, so that even long plating layers can be coated with uniform chips. can be invested in.

〔Example〕

Hereinafter, the present invention will be explained in detail based on drawings showing examples.

FIG. 1 shows a chip supply device according to the present invention. This device is for supplying an annotator and knob 2 (tune knob) (see FIG. 2) to a plating tank 1. 1 refers to forming a copper-coated steel wire 5 or the like formed by coating a core member 3 such as a copper wire with a coating layer 4 such as copper, as shown in FIG. 1. As shown in FIG. Chip 2 is supplied.

That is, a plating solution M is stored in the main body 6, and as the long linear core member 3 travels between the chip storage parts 7 and 8 while rotating, a coating layer 4 is formed on the surface of the core member 3. is plated. Note that one chip storage section 7 is made of a perforated plate or a net plate in the shape of a disconnected circuit U, and the other chip storage section 8 is made of a perforated plate or a net plate disposed along the bottom surface 6a of the main body 6. The main body 6 is formed of a storage wall and a bottom surface 6a of the main body 6. That is, the chips 2 . . . are thrown into each storage section 7.8 from the upper openings 7a, 8a of each storage section 7.8.

Two supply devices are provided so as to sandwich the plating tank 1 along the longitudinal direction of the plating tank 1; A chip container 10 includes a cyclone 11 disposed at a position above the cyclone 11, a hopper 2 disposed at a position below the cyclone 11, and a chute 13 for guiding the chips 2 from the hopper 12 to the plating tank 1. and the cyclone 11 are connected by an air conveying pipe 14.

The container 10, cyclone 11, hopper 12, chute 13, and piping 14 are attached to a cart 15 that runs along the plating tank l.

Here, the trolley 15 runs on rails 16 and 16 laid along the plating tank 1. rail 16
．． 16 is laid on a rail laying stand 17 arranged along the plating tank 1, and the trolley 15 is placed on the rail 16.16.
wheels 18.18 roll, and the trolley 15 travels along the plating bath l. In this case, it is also preferable to mount a drive device (not shown) on the trolley 15.

Thus, the chip container 10 has a tapered portion 19 at its lower end that gradually tapers downward, and is detachably attached to the cart 15 via an attachment/detachment mechanism (not shown).

Further, the taper portion 19 is provided with a chip outlet 20,
One end (lower end) of a pipe 14 is connected to the discharge port 20 .

Further, the cyclone 11 is provided at a position above the plating tank l, and has an inlet 21 at its upper end.
1 is connected to the other end (upper end) of the air conveying pipe 14. The cyclone 11 has a blower 22.
A motor (induction motor) 23 and a silencer 24 are attached to the blower 22 . That is, by rotationally driving the motor 23, the blower 22
The cyclone 11 rotates, and the cyclone 11
At the same time, the chips 2 in the chip container 10 are transported into the cyclone 11 via the air conveying pipe 14.

Therefore, inside the cyclone 11, the chips 2... fall into the downwardly tapered portion 27 and accumulate there. Further, a damper 29 that covers the lower opening 28 is attached to the lower end of the cyclone 11, and the amount of chips 2 dropped from the lower opening 28 is adjusted by opening and closing the damper 29. Note that the cyclone 11 is provided with a sensor 30 for detecting the amount of chips. That is, this sensor 30 detects the upper limit level L of the chip 2, and when this upper limit level is below 1, the cyclone 11 is supplied from the chip container 10, and when the upper limit level is above the upper limit level L, the chip is The supply of chips from the container 10 to the cyclone 11 is stopped.

Next, the hopper 12 has a downwardly tapered portion 31 at its lower end.
In addition, the vibrator 40, a sensor 32 that detects the upper limit level L2 of the upper surface of the chip group supplied into the hopper 12, and a sensor 33 that detects the lower limit level L3 of the upper surface
is attached. That is, the upper surface of the chip group is located between the upper limit level L2 and the lower limit level L3.

In addition, the chute 13 receives chips 2 from the cyclone 11.
It consists of a chute main body 34 for receiving the air, and an extension part 35 extending from the chute main body 34, and the cough extension part 35 can be expanded and contracted in its longitudinal direction, and the axis O
Vibration in a horizontal plane centered at 1 is possible. Specifically, as shown in the fourth modification example, the extending portion 35 has a tip holder portion 35a and a tip holder portion 35a.
A sliding part 35b is attached to the sliding part 35b so as to be slidable in the longitudinal direction, and the receiving part 35a can swing within a predetermined range in a horizontal plane about the axis 01. In addition, the fourth
In the figure, the main body 34, the chip holder part 35a, and the sliding part 35b each have a U-shaped cross section with an upper opening and a lower wall and a side wall, and the chip holder is in the part 35a. The proximal end portion has a large dimension between side walls in order to allow the extension portion 35 to swing.

In FIG. 1, a linear feeder 36 is attached to the chute body 34, but in the case of the noute 13 shown in FIG. Feeders 36a and 36b are provided, and the chips 2 that have fallen into the main body 34 through the lower opening 37 of the hopper 12 are spread by the reciprocating movement of the main body 34 in the longitudinal direction by the feeder 36 in FIG. Proceed to section 35,
The chips 2... that have proceeded to the cough extension section 35 are guided to the chip storage sections 7 and 8. In addition, in Fig. 4, the main body 3
Due to the reciprocating movement of the main body 34 in the longitudinal direction by the feeder 36a, the chip receiver of the extension part 35 advances to the part 35a, and the chip receiver advances to the part 35a. . . is the chip receiving portion 35a by the feeder 36.
By reciprocating in the longitudinal direction, it is guided to the chip storage section 7.8 via the sliding portion 35b.

That is, as shown by the solid line in FIG. 4, when the sliding portion 35b is extended, its tip corresponds to the chip storage section 7 in the center, and the chips 2... are supplied to the chip storage section 7. In the contracted state, the tip corresponds to the chip storage section 8 on the outside, and the chips 2 . . . are supplied to the chip storage section 8 on the outside.

As shown in FIG. 1, a duct 38 is provided above the plating tank 1, and the duct 38 is held by support legs 39 that stand up from the plating tank 1.

Therefore, according to the supply device configured as described above, while the cart 15 is traveling along the plating tank 1, the chips 2 in the chip container 10 are sequentially transferred into the cyclone 11 via the air conveying pipe 14. The chips 2... supplied by the cyclone 11L are fed to the hopper 12.
will be dropped on. (In this case, by controlling the damper 29, the amount of chips 2 in the hopper 12 is set to an appropriate amount.) The chips 2 in the hopper 12 are Since the tip is formed as a downwardly tapered portion 31, a large amount of chips 2 do not fall into the chute 13 at once, but fall in an appropriate amount. At this time, by vibrating the hopper 12 with the vibrator 40, it is possible to ensure that the chips 2... fall. The chips 2... that have fallen into the chute 13 are sequentially supplied to each storage section 7, 8 by the vibration of the shoe eyes 3 by the feeder 36. Since the portion 35 is swingable around the axis O5, collision of the support leg portion 39 with the support column 39a can be avoided.

However, at the start of plating work, a large amount of chips 2...
・ must be supplied to the chip tank 1 (specifically, the storage section 78), and in this case, if the chip container 10 is detachable from the trolley I5 as in this embodiment, the work is easy. Improves efficiency.

That is, a plurality of (at least two for one trolley 15)
Prepare the container 10 of , and move the - container 10 to the trolley 15
If you supply chips 2 to another container 10 while supplying the chips 2 in the container 10, when the chips 2 in one container 10 run out, you can immediately One container 10 is removed from the trolley 15, and the other container 10 in which chips 2 are stored is removed from the trolley 15.
This is because it can be attached to 5.

Note that the present invention is not limited to the above-described embodiments, and the design may be changed without departing from the gist of the present invention. For example, in the embodiment, the air flow in the air conveying pipe 14 is Although it is a suction flow, the chip container 10
It is also possible to use a pressure flow that presses the air from the cyclone 11 toward the cyclone 11 side. Further, although the hopper 12 has a downwardly tapered tapered portion 31 in the embodiment, it is also possible to make the entire hopper 12 downwardly tapered, and the position of the lower opening 37 may be changed (in the embodiment). (Although it is said to be closer to plating tank 1), it is also free to position it at the center of the hopper. moreover,
The size, shape, etc. of the trolley 15 can also be changed freely as long as the chip container 10 etc. can be attached thereto.

〔Effect of the invention〕

Since the present invention is configured as described above, it produces the effects described below.

■ The supply of the chips 2 to the thinning tank 1 is carried out smoothly without interruption, and in a moderate amount (an amount corresponding to the amount of consumption of the chips 2 due to the thinning) without being supplied in large quantities at once. , the thickness dimension of the plating layer formed by plating (that is, the coating layer 4 shown in the third panel) can be made uniform, and a high-quality product (for example, copper-coated F4 wire 5) can be provided. can do.

■ Even if the plating tank I is long, the chip container 10, cyclone 11, blower 22, air conveying pipe 14, hopper 12, and chute 13 run along the plating tank 1, The amount of chips 2 supplied can be made uniform even in different parts.

- There is no need for the worker to work near the plating tank 1, making the work safer and lighter for the worker.

■ The entire device can be made compact and simple.

[Brief explanation of the drawing]

Fig. 1 is a simplified diagram of one embodiment of the present invention, Fig. 2 is an enlarged perspective view of a chip, Fig. 3 is an enlarged sectional view of a copper-coated steel wire, and Fig. 4 is an enlarged front view of main parts of a modified example. be. 1... Plating tank, 2... Anode chip, IO...
・Chip container, 11... cyclone, 12... hopper, 13... chute, 14... air conveyance piping,
15... Truck, 16... Rail, 22... Blower 33]... Lower tapered tapered portion, 37... Lower opening.

Claims (1)

[Claims] 1. A chip supply device for supplying anode chips to a plating tank, comprising a cart that runs on a rail laid along the plating tank, and wherein the anode chips are supplied to a plating tank. A chip container in which a large number of chips are stored, a cyclone for separating anode chips from air, a blower, and air conveying piping for transporting the chips in the chip container into the cyclone using the air flow of the blower; a hopper that receives chips falling from the cyclone and has at least a lower end tapered downward; a hopper that receives chips from a lower opening of the hopper and guides the chips to the plating bath; A chip supply device characterized in that a chute provided therein is attached to the cart.