JPH04106806A - Complex dielectric - Google Patents

Abstract

PURPOSE:To obtain a complex dielectric which can secure a high dielectric constant of a reinforcing material and has small dielectric loss by making at least a part of the glass composing a reinforcing material include cerium oxide whose dielectric constant is 9 or larger 10mol% or less. CONSTITUTION:Glass containing cerium oxide whose dielectric constant is 9 or larger 10mol% or less is used as at least a part of the glass constituting a reinforcement for the resin. As the dielectric constant of a glass reinforcement is high, it is possible to easily keep a high dielectric constant of a complex dielectric, and also as tandelta of the glass reinforcement is small because the cerium oxide is added thereto, the loss characteristic of the glass is low. It is thereby possible to obtain a dielectric having a high dielectric constant with low loss.

Description

[Detailed description of the invention] [Industrial application field] This invention relates to composite dielectrics.

[Conventional technology]

As we enter the advanced information age, information transmission tends to become faster and more frequent. Mobile radios such as car telephones and personal radios, new media such as satellite broadcasting, satellite communications, and CATV are also at the stage of practical application.

On the other hand, in mobile radio and new media, devices are becoming more compact, and along with this, there is a strong demand for smaller microwave circuit elements such as dielectric resonators.

The size of a microwave circuit element is based on the wavelength of the electromagnetic waves used. The wavelength λ of an electromagnetic wave propagating in a dielectric material with relative permittivity εr is the propagation wavelength in vacuum. Then, λ−λ
, /εr05. Therefore, the larger the relative dielectric constant of the printed circuit board substrate used, the smaller the device becomes. Further, when the dielectric constant of the substrate is large, electromagnetic energy is concentrated within the substrate, which is advantageous in that leakage of electromagnetic waves is small.

As the above-mentioned printed circuit board substrate, there is a substrate using a composite dielectric material made of resin (such as PPO resin having excellent high frequency characteristics) reinforced with a reinforcing material made of glass (glass reinforcing material). This printed circuit board substrate is attracting attention because it is superior to A11zOz ceramic substrates in terms of price and post-processing (cutting, hole punching, adhesion, etc.).

[Problem to be solved by the invention]

However, conventional substrates made of composite dielectrics made of resin reinforced with glass reinforcing materials cannot be said to have sufficient dielectric constant.

Since resin has a low dielectric constant, inorganic dielectric powder is used in combination to compensate for this, but even then it is difficult to provide a suitably large dielectric constant. Although increasing the content of the inorganic dielectric powder increases the relative dielectric constant, there are disadvantages such as increased cost and increased likelihood of interface troubles.

The reason why the dielectric constant cannot be increased sufficiently even when an inorganic dielectric is used in combination is because the dielectric constant of the reinforcing material is not high. A glass reinforcing material with a low relative permittivity divides the high permittivity resin region in which inorganic dielectric powder is dispersed, creating a series-coupled state of capacitance internally, resulting in a high relative permittivity of the substrate. This will prevent you from doing so. The reason why the composite dielectric material for the substrate is set to an appropriate size (for example, 10 to several 10) is that if the dielectric constant is too large, processing for forming a circuit becomes difficult.

Furthermore, in addition to a high relative dielectric constant, a low tan δ (reducing dielectric loss) is also strongly desired. If the tan δ is not low, transmission loss will be large and it will be difficult to achieve miniaturization.

In view of the above-mentioned circumstances, it is an object of the present invention to provide a composite dielectric material in which a reinforcing material made of glass does not interfere with ensuring a high relative dielectric constant and has low dielectric loss.

[Means to solve the problem]

In order to solve the above problems, in the composite dielectric material according to the present invention, at least a part of the glass constituting the reinforcing material made of glass for reinforcing the resin has a dielectric constant of 9 or more and 10 mol% or less. The glass is made to contain cerium oxide.

The composite dielectric of the present invention will be explained in more detail below.

Glass containing cerium oxide having a dielectric constant of 9 or more and 10 smol % or less may be lead-based glass or lead-free glass. In the case of the former lead-free glass, the dielectric constant is preferably 12 or more, and in the case of the latter lead-based glass, the dielectric constant is preferably 14 or more.

As the composite (matrix) resin in this invention, an appropriately selected resin is used as required, but in applications in the high frequency range, resins with low high frequency loss (low tan) are used.
δ) Resins are preferred, and examples thereof include PP◯ (polyphenylene oxide) resin, fluororesin (for example, polyfluorinated ethylene resin commonly known as Teflon), polycarbonate, polyethylene, polyethylene terephthalate, polypropylene, polystyrene, and the like. The dielectric constant εr of these resins is usually about 2.0 to 3.2. For other applications, polyester, epoxy, or PV with a high dielectric constant may be used, although the loss is somewhat inferior.
A resin such as DF (polyvinylidene fluoride) may also be used.

Reinforcing materials made of glass include cross-shaped, cloak-shaped,
Fiber-like fibers are exemplified, and these are usually obtained by spinning a melt of a glass raw material to form glass fibers (fiber molding) and then processing the fibers. In the case of cloths and cloaks, those with a thickness of about 15 nm to 1.5 nm and a glass fiber diameter of about 0.5 to 30 nm are usually used. In the case of fiber, the length is usually about 20 to 300 mm, and the glass fiber diameter is 2
~ Use something about 5 On. The entire reinforcing material has a dielectric constant of 9
Although it is preferable that the glass contains cerium oxide, only a part of the glass may have a dielectric constant of 9 or more and contain cerium oxide. For example, a cloth may be used in which only the warp yarns are fibers of glass containing cerium oxide and a dielectric constant of 9 or more, and the weft yarns are fibers of glass other than glass that has a dielectric constant of 9 or more and containing cerium oxide.

When the glass is lead-free glass, for example, as in claim 2, 15 m of silicon oxide (Sin) is added.

1% or more and 60 mol% or less, magnesium oxide (MgO
), calcium oxide (CaO), strontium oxide (
At least one oxide of SrO) and barium oxide (BaO) (hereinafter appropriately referred to as "group A oxide") is 1% or more and 40-01% or less, titanium oxide (T i O,), oxide At least one oxide of zirconium (ZrO,) and tin oxide (SnO,) (hereinafter appropriately referred to as "Group B oxide") is 0II10
Contains at a ratio of 1% to 55wo7%, and these oxides (r!It silicon, A group oxide, and Bl\ oxide)
The total amount is 85no1% or more, and 10m
Examples include those containing cerium oxide (Ce O□) of less than o&%.

Silicon oxide is less than 15 mol%, group A oxide is more than 4011I01%, group B oxide is less than 55 m
o Exceeding 1% or 10m of cerium oxide
If it exceeds ol%, the fiber formability will deteriorate.

When the glass is lead-free glass, further, as in claim 3, the content of silicon oxide is 35 moA% or more 50+
+o#% or less, the content of at least one oxide (group A oxide) of magnesium oxide, calcium oxide, strontium oxide, and barium oxide is 20+wo
f% or more and 40 mol% or less, and the content of at least one oxide (group B oxide) of titanium oxide, zirconium oxide, and tin oxide is 20 mo/% or more 40w+o
The range of I is more preferably 1% or less. this is,
This is because a dielectric constant of 12 or more and good fiber formability can be easily ensured.

When silicon oxide exceeds 50 moJ%, it is difficult to ensure a glass dielectric constant of 12 or more, and when it is less than 35IIIO1%, it becomes difficult to ensure good fiber formability.

Content of group A oxide or group B oxide is 20 mol%
If the content is outside the above range of 40 mol% or less, it becomes difficult to ensure good fiber formability.

The lead-free glass having the composition shown in claim 2.3 is 15mo4
Within a range not exceeding 2%, for example, the following other oxides (hereinafter referred to as "Group 0 oxides"), Li2O, Nano
,K,01ZnO,,Mn01FeO1BzOs,
Alz O! , B j * Os , Fegos, Ge
Ox, Te0z, PzOs, VzOs, NbzOs
, Tax Os, and Lag Os.

Note that if the content of group 0 oxide exceeds 15 mol %, it becomes difficult to ensure a high dielectric constant or fiber formability deteriorates.

On the other hand, when the glass contains lead, the fibers have good formability, so it is easy to obtain a reinforcing material, which is convenient for manufacturing a composite dielectric. In addition, lead-based glass contains lead components,
Since the silicon component, which is better in terms of dielectric constant, can be reduced, it is convenient in terms of increasing the dielectric constant of the reinforcing material. However, it is necessary to take strict measures against pollution when processing composite dielectrics. For example, when the glass is lead-based glass, as in claim 4, silicon oxide (Sift) is added in an amount of 15 mol% or more and 60IIIO 1% or less, oxidized Magnesium (MgO)
, calcium oxide (Cab), strontium oxide (S
rO) and barium oxide (B a O) (hereinafter referred to as ``A' group oxides'') in an amount of 12% or more and 40m.

Ovao 1% or less, at least one oxide of titanium oxide (Tie), zirconium oxide (ZrO, ), and tin oxide (SnO□) (hereinafter appropriately referred to as "B' group oxide") Contains 1% or less of 55IIIO or less, lead oxide (p b o) at a ratio of 8 Onmol% or less, and the total amount of these oxides (silicon oxide, group A' oxide, group B' oxide, and lead oxide) is 85rao1% or more Moreover, 10 mol% or less of cerium oxide (Ce
Silicon oxides including those containing O□) are 6011
When I01% is exceeded, it becomes difficult to ensure a dielectric constant of 9 or more.

When lead oxide exceeds 80 mol %, fiber formability is rather reduced.

Silicon oxide is less than 15mol%, A' group oxide is more than 40mol%, B' group oxide is more than 55mol%.
ol% or cerium oxide exceeds 1On+
If it exceeds % of, the fiber formability will deteriorate.

When the glass is lead-based glass, further, as in claim 5, the content of silicon oxide is 25 mo/% or more and 40 mo/%.
1% or less, at least one oxide of magnesium oxide, calcium oxide, strontium oxide, and barium oxide (the content of A' group acid oxide is 10 mol%)
40 IlloI 1% or less, at least one oxide of titanium oxide, zirconium oxide, and tin oxide (content of B' group acid oxide is 10 moi!% or more) 40
IIIO1% or less, lead oxide content 5 mo 1% or more 55IIIoI! % or less is more preferable. This is because a glass dielectric constant of 14 or more, good fiber formability, and a high glass transition temperature of 450° C. or more can be easily ensured.

If the silicon oxide content exceeds 4(1+oj!%), it is difficult to ensure a dielectric constant of 14 or more, and if it is less than 1% 251Io, it becomes difficult to ensure good fiber formability and a glass transition temperature of 450° C. or higher.

The content of A' group oxide or B' group oxide is 10
If the amount is less than mol %, it becomes difficult to ensure good fiber formability, a dielectric constant of 14 or more, or a glass transition temperature of 450° C. or more.

40 mol% of A' group oxide or B' group oxide
If it exceeds this range, it is difficult to ensure good fiber formability.

If the lead oxide content is less than 5 so 11%, it will be difficult to ensure good fiber formability and a dielectric constant of 14 or more, and 5110
If it exceeds J%, it becomes difficult to achieve a glass transition temperature of 450 or higher.

In addition, in the case of lead-based glass, the glass transition point is low (although it tends to be low, glass fibers are usually coated with warming oil during fiber molding, and appropriate treatment is required, including at the stage after reinforcing material manufacturing. At this stage, cleaning is performed to remove lubricating oil, but it is necessary to prevent softening at the processing temperature at this time, and for this purpose, it is preferable that the glass transition point is 450° C. or higher.

The lead-based glass having the composition shown in claim 4.5 has a content of 15 mol%.
For example, the following other oxides (hereinafter referred to as
Lis OSNag (sometimes referred to as "C' group acid oxide")
O, Kg 01ZnO, MnO, Fe0- Bx Os
5Allx Os, Big Os, Fexos,
Geo*, Te0z, , PxOs, VxOs, Nbz
It may contain at least one of Oa, TaxOs, and LagOs.

It should be noted that if the C' group acid oxide exceeds 15s+oJ%, it becomes difficult to ensure a high specific dielectric constant, or fiber formability deteriorates.

Preferably, inorganic dielectric powder is dispersed in the resin of the composite dielectric of the present invention. As a specific inorganic dielectric powder, for example, f3 a T
i Ox system, 5rTiOy system, pbT i+/2 Z
r l/20s system, P b (M g xis N
b +/, )0. System, Ba (Snx Mgy Taz
)Os system, those with perovskite crystal structure (or composite perovskite crystal structure) such as Ba (Zrx Zny Taz) Ox system, others, TiO□
, Zr0z, SnO□ alone and their composite oxides, and other inorganic compounds are specifically mentioned. Normal, O, OS
An inorganic dielectric powder having a particle size of about 1001 to 1001 is used.

The usual method for dispersing into resin is to impregnate reinforcing material with resin in which inorganic dielectric powder has been previously dispersed. There is also a method in which the inorganic dielectric powder is dispersed in the resin to form a dormant state.

In the composite dielectric material (100vo&%) of the present invention, the blending ratio of the matrix resin, reinforcing material made of glass, and inorganic dielectric powder is 10 to 95v of the resin.

1%, reinforcing material 5-70 voj! %, inorganic dielectric powder 0~
It is about 7ovo1% (usually 0 to 40vo7!%).

Applications of the composite dielectric of the present invention include, but are not limited to, substrates for printed circuit boards.

[For production]

In the composite dielectric material according to claims 1 to 6, since the glass reinforcing material has a high relative permittivity, it is easy to ensure a high relative permittivity of the composite dielectric material itself, and furthermore, by adding cerium oxide, the glass reinforcing material has a high relative permittivity. Since the material has a low tan δ, it has low loss characteristics. If the glass is lead-free glass, there is no fear of lead poisoning and it is safe. When the glass is lead-based glass, it is convenient for producing a composite dielectric because it is easy to obtain a high dielectric constant reinforcing material. In addition, the content of cerium oxide is 10 μι/%
If it exceeds this value, the fiber formability decreases, manufacturing becomes difficult, and practicality is lost.

In the composite dielectric according to claim 2, the reinforcing glass is lead-free glass, and silicon oxide is contained at 15 mo 1%.
60!1lo1% or less, group A oxide Om.

! % or more and 40 mol% or less, Omo 1% of group B oxides
These oxides (
The total amount of silicon oxide, AI\oxide, and B1\oxide) is 85 mol% or more, and 10 mo (1
% or less of cerium oxide, it is possible to secure a dielectric constant of 9 or more and a low tan δ, and to form fibers, which is advantageous in obtaining a reinforcing material with a high dielectric constant and low tan δ.

In the composite dielectric according to claim 3, in the lead-free glass, silicon oxide is contained in an amount of 35III01% or more and 50++.
mol% or less, group A oxide 20n+oJ% or more 40m
ol% or less, group B oxide 2011I01% or more 401
When it is contained in a range of 101% or less, it is easy to ensure a dielectric constant of 12 or more and good fiber formability, which is convenient for obtaining a reinforcing material with a higher dielectric constant.

In the composite dielectric according to claim 4, the reinforcing glass is lead-based glass, silicon oxide is 15 Imol% or more and 60 mol% or less, and the A' group oxide is Os.

1% to 1% of 4011O, group B' oxide
1% or more 55IllOI 1% or less, lead oxide 80so
These oxides (silicon oxide, A
' group oxide, B' group oxide, and lead oxide) is 85 mol % or more and contains 10 mol % or less cerium oxide, the dielectric constant is 9 or more or low t.
Since it is possible to secure an δ and to form fibers, it is convenient for obtaining a reinforcing material with a high dielectric constant and a low tan δ.

In the composite dielectric according to claim 5, in the lead-based glass, silicon oxide is contained in an amount of 25 mol% or more and 40+oI1%.
Below, lead oxide is 5-01% or more and 55++of% or less, A
B
When the ' group oxide is contained in the range of 10++o#% or more and 40% or less, it is easy to ensure a dielectric constant of 14 or more and good fiber formability, so reinforcing materials with a higher voltage dielectric constant are used. It is convenient for obtaining.

When an inorganic dielectric powder is used in combination as in the composite dielectric of claim 6, the high relative dielectric constant property of the inorganic dielectric powder is fully utilized, and the relative permittivity of the composite dielectric itself can be easily increased to 10. That's all.

〔Example〕

Next, the present invention will be explained in detail. Of course, the present invention is not limited to the following embodiments.

First, the dielectric constant for reinforcing materials is 9 or more, which is 10+l1oj! %
The production of glass fiber containing cerium oxide will be described below.

Raw materials such as oxides, carbonates, or hydroxides are blended to obtain a glass containing a predetermined proportion of oxides, placed in a platinum crucible, and heated in an electric furnace (conditions: 1450°C).
, 2 hours) and melt.

Next, the obtained melt was transferred to another platinum crucible with a nozzle that had been heated to a temperature where the melt viscosity was about 10" poise,
The glass fibers are pulled out from the nozzle on the back of the crucible to obtain glass fibers with a diameter of about 5 to 30 nm. Needless to say, the obtained glass fibers are then woven or cut into reinforcing materials such as glass cloth or fibers.

The dielectric constant, tan δ, and difficulty in forming fibers were investigated by changing the glass composition.

The relative dielectric constant, tan δ, was measured using an impedance analyzer (measuring frequency IGHz) after making a bulk glass body. The results are shown in Tables 1-4. Table 1.2 shows the case of lead-free glass composition, and Table 3.4 shows the case of lead-based glass composition.

Regarding the difficulty of fiber molding, after holding the obtained melt in a platinum crucible at a temperature of about 10" poise for 24 hours,
I checked to see if the string could be pulled. When mass producing glass fiber, the melt is usually kept in a platinum crucible for a long time (for example,
(approximately 20 hours). There are limitations to the fiber forming methods, such as forming the fibers immediately after obtaining the melt. Glass samples numbers 14-18 and 32-36 did not form fibers successfully after being held in the crucible for 24 hours.

For comparison, glasses in which cerium oxide was replaced with other oxides (glass sample numbers 1' to 36') were prepared and examined in the same manner as above. The results are shown in Tables 5-8. Section 5.6
Table 7.8 shows the case of lead-free glass composition, and Table 7.8 shows the case of lead-based glass composition.

Composite dielectrics of Examples 1 to 5 were obtained using the lead-free glass fibers obtained above.

Example 1 As a reinforcing material, a glass fiber having the composition of glass sample number 2 in Table 1 <aa fiber diameter 9JIN and having a thickness of 100n was used.
A glass cloth was prepared. On the other hand, after dissolving 45 g of PPO resin in 215 g of toluene at 80°C, the average particle size was 2n.
A varnish was prepared in which 120 g of Ti0- powder was added and dispersed.

The glass cloth was placed in the varnish, impregnated with the varnish, dried (115°C, 90 seconds), then stacked 4 times and heated to a temperature of 1.
A composite dielectric material having a thickness of approximately 0.8 mm was obtained by hot press molding at 80° C., pressure of 50 kg/J, and 120 minutes.

The proportions of PPO resin, inorganic dielectric powder, and reinforcing material in the composite dielectric were 42 voJ% and 28 voJ%, respectively.
%, 30vo1%.

Example 2 - A composite dielectric material was prepared in the same manner as in Example 1, except that a glass cloth with a thickness of 100 nm made of glass fibers (fiber diameter 9 m) having the composition of glass sample number 3 in Table 1 was used as a reinforcing material. I got it.

Example 3 A composite dielectric material was prepared in the same manner as in Example 1, except that a glass cloth with a thickness of 100 nm made of glass fibers (fiber diameter 9 nm) having the composition of glass sample number 5 in Table 1 was used as a reinforcing material. Obtained.

Example 4 A composite dielectric material was prepared in the same manner as in Example 1, except that a glass cloth with a thickness of 100 μm made of glass fibers (fiber diameter 9n) having the composition of glass sample number 11 in Table 2 was used as a reinforcing material. Obtained.

Example 5 - A composite dielectric material was prepared in the same manner as in Example 1, except that a glass cloth with a thickness of 100 nm made of glass fibers (fiber diameter 9 nm) having the composition of glass sample number 14 in Table 2 was used as a reinforcing material. I got it.

Composite dielectrics of Examples 6 to 10 were obtained using the lead-based glass fibers obtained above.

Example 6 A composite dielectric material was prepared in the same manner as in Example 1, except that a glass cloth with a thickness of 100 nm made of glass fibers (fiber diameter 9 nm) having the composition of glass sample number 20 in Table 3 was used as a reinforcing material. I got it.

Example 7 A composite dielectric material was prepared in the same manner as in Example 1, except that a 100 μm thick glass cloth made of glass fibers (fiber diameter 9 μm) having the composition of glass sample number 21 in Table 3 was used as a reinforcing material. Obtained.

Example 8 A composite dielectric material was prepared in the same manner as in Example 1, except that a 100μ thick glass cloth made of glass fibers (fiber diameter 9n) having the composition of glass sample number 25 in Table 3 was used as a reinforcing material. Obtained.

Example 9 - A composite was prepared in the same manner as in Example 1, except that a glass cloth with a thickness of 100μ made of glass fiber (m diameter 9n) having the composition of glass sample number 30 in Table 4 was used as a reinforcing material. A dielectric was obtained.

Example 10 - A composite dielectric material was prepared in the same manner as in Example 1, except that a glass cloth with a thickness of 100 nm made of glass fibers (fiber diameter 9 nm) having the composition of glass sample number 35 in Table 4 was used as a reinforcing material. I got it.

Composite dielectrics of Comparative Examples 1 to 5 were obtained using the lead-free glass fibers obtained above.

Comparative Example 1 A composite dielectric material was prepared in the same manner as in Example 1, except that a 100μ thick glass cloth made of glass fibers (fiber diameter 9n) having the composition of glass sample number 2' in Table 5 was used as a reinforcing material. I got it.

Comparative Example 2 - Composite dielectric was fabricated in the same manner as in Example 1, except that a glass cloth with a thickness of 100 nm made of glass fibers (fiber diameter 9 nm) having the composition of glass sample number 3' in Table 5 was used as a reinforcing material. I got a body.

Comparative Example 3 As a reinforcing material, a glass fiber having a composition of glass sample number 5' in Table 5 <tta fiber diameter diameter) was made with a thickness of 1100 mm.
A composite dielectric was obtained in the same manner as in Example 1, except that Ir glass cloth was used.

Comparative Example 4 - Composite dielectric was fabricated in the same manner as in Example 1, except that a 100μ thick glass cloth made of glass fibers (fiber diameter 9n) having the composition of glass sample number 11' in Table 6 was used as a reinforcing material. I got a body.

- Comparative Example 5 As a reinforcing material, glass fiber having the composition of glass sample number 14' in Table 6 (vh fiber diameter 9n, thickness 100 m) was used.
A composite dielectric material was obtained in the same manner as in Example 1, except that the glass cloth was used.

Composite dielectrics of Comparative Examples 6 to 10 were obtained using the lead-based glass fibers obtained above.

Comparative Example 6 - As a reinforcing material, a glass fiber with a thickness of 100 nm made of glass fiber (fiber diameter 9.W) having the composition of glass sample number 20' in Table 7
A composite dielectric material was obtained in the same manner as in Example 1, except that the glass cloth was used.

- Comparative Example 7 - A composite was prepared in the same manner as in Example 1, except that a glass cloth with a thickness of 100 nm made of glass fibers (fiber diameter 9 nm) having the composition of glass sample number 21' in Table 7 was used as a reinforcing material. A dielectric was obtained.

Comparative Example 8 As a reinforcing material, a glass fiber having the composition of glass sample number 25' in Table 7 <uh fiber diameter 9x and having a thickness of 100μ
A composite dielectric material was obtained in the same manner as in Example 1, except that the glass cloth was used.

- Comparative Example 9 As a reinforcing material, glass fiber having the composition of glass sample number 30' in Table 8 (100 nm thick made with a ta fiber diameter of 9 μm) was used as a reinforcing material.
A composite dielectric material was obtained in the same manner as in Example 1, except that the glass cloth was used.

Comparative Example 10 - As a reinforcing material, glass fiber with the composition of glass sample number 35' in Table 8 (&& fiber diameter 9x, thickness 100n
A composite dielectric material was obtained in the same manner as in Example 1, except that the glass cloth was used.

- Conventional Example - A composite dielectric was obtained in the same manner as in Example 1, except that the glass constituting the glass cloth was E glass with a dielectric constant of 6.7.

Electrodes were provided on the front and back surfaces of each composite dielectric of the example, comparative example, and conventional example, and using an impedance analyzer,
The relative dielectric constant and tan δ were measured (measurement frequency IMHz). The measurement results are shown in Table 9.10.

As shown in Table 1, the composite dielectrics of Examples 1 to 10 were as follows:
All have dielectric constants exceeding 10.

Comparing the dielectric constants of Examples 1 to 10 and the conventional example, it is clear that the high dielectric constant of the reinforcing material is very effective in securing a high dielectric constant. In addition, PPO resin and TiO7
A separate study of the dielectric constant of the part made of powder revealed that 11
．． 0, which clearly proves that in the composite dielectric of the present invention, the reinforcing material does not impede securing a high voltage dielectric constant.

Further, by comparing the tan δ of Examples 1 to 10 and Comparative Examples 1 to IO, it can be clearly seen that the inclusion of cerium oxide is very effective in reducing dielectric loss.

〔Effect of the invention〕

As described above, the composite dielectric material according to claims 1 to 6 is characterized in that the glass reinforcing material has a high dielectric constant and is added with cerium oxide. Due to its low tan δ, it is a very useful dielectric material with high dielectric constant and low loss characteristics.

In addition, the composite dielectric according to the second aspect has the advantage that the reinforcing material having a high dielectric constant can be easily produced, so that the composite dielectric can be easily manufactured.

In addition, the composite dielectric material according to the third aspect has the advantage that it is easy to obtain a reinforcing material with a higher relative dielectric constant, so that it is easy to manufacture an excellent composite dielectric material.

In addition, the composite dielectric according to the fourth aspect has the advantage that the reinforcing material having a high dielectric constant can be easily produced, so that the composite dielectric can be easily manufactured.

In addition, the composite dielectric according to claim 5 has the advantage that it is easy to obtain a reinforcing material with a higher relative dielectric constant, so that it is easy to manufacture an excellent composite dielectric.

In addition, the composite dielectric material according to the sixth aspect of the present invention can easily have a high dielectric constant of 10 or more, and therefore has very high practicality.

Agent: Patent Attorney Takehiko Matsumoto

Claims (1)

[Scope of Claims] 1. In a composite dielectric material in which a resin is reinforced with a reinforcing material made of glass, at least a part of the glass constituting the reinforcing material has a dielectric constant of 9 or more and a volume of 10 mol.
% or less of cerium oxide. 2 The glass is lead-free glass, and 15m of silicon oxide is used.
0 mol% or more and at least one oxide of magnesium oxide, calcium oxide, strontium oxide, and barium oxide, 0 mol% or more and 40 mol% or more and 60 mol% or less
mol% or less, 0 mol% of at least one oxide of titanium oxide, zirconium oxide, and tin oxide
The composite dielectric material according to claim 1, wherein the composite dielectric material contains at least 55 mol% of these oxides, and the total amount of these oxides is 85 mol% or more. 3 Silicon oxide content is 35 mol% or more and 50 mol
% or less, the content of at least one oxide of magnesium oxide, calcium oxide, strontium oxide, and barium oxide is 20 mol% or more and 40 mol% or less, the content of at least one oxide of titanium oxide, zirconium oxide, and tin oxide is Content is 20mol%
3. The composite dielectric material according to claim 2, wherein the amount is in the range of 40 mol% or more. 4 The glass is lead-based glass and contains 15 mo of silicon oxide.
1% or more and 60 mol% or less, and at least one oxide of magnesium oxide, calcium oxide, strontium oxide, and barium oxide at 0 mol% or more and 40 m
contains at least one oxide of titanium oxide, zirconium oxide, and tin oxide in a proportion of 0 mol% to 55 mol%, and contains lead oxide in a proportion of 80 mol% or less, and the total amount of these oxides is 85 mol% or more. The composite dielectric material according to claim 1. 5 Silicon oxide content is 25 mol% or more and 40 mol
% or less, the content of at least one oxide of magnesium oxide, calcium oxide, strontium oxide, and barium oxide is 10 mol% or more and 40 mol% or less, the content of at least one oxide of titanium oxide, zirconium oxide, and tin oxide is Content is 10mol%
5. The composite dielectric material according to claim 4, wherein the content of lead oxide is in the range of 5 mol% to 55 mol%. 6 Claim 1, wherein inorganic dielectric powder is dispersed in the resin.
5. The composite dielectric material according to any one of 5 to 5.