JPH04105362A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To surely protect a semiconductor integrated circuit device from pollution, electrostatic destruction, etc., by performing delivery and reception of at least one of operating power and information with the outside in noncontact state by using light as a medium. CONSTITUTION:A photocell pad 3 for input is irradiated with input light P1 composed of, for example, a laser beam, etc., for which the light quantity, blinking time, etc., are varied and the electric signal generated in the pad 3 is supplied to an integrated circuit section 2 through an internal wiring structure 3a to input desired information from the outside to the section 2 in a noncontact state. In addition, another photocell pad 4 for power supply is irradiated with power supply light P2 composed of, for example, a laser beam, for which a prescribed light quantity is continuously maintained and the electric power continuously generated in the pad 4 is supplied to the integrated circuit section 2 through another internal wiring structure 4a to operate the section 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and particularly to a technique for contactlessly connecting a semiconductor integrated circuit device and the outside.

[Conventional technology]

For example, as described in documents such as "Electronic Communication Note Book" P576, edited by the Institute of Electronics and Communication Engineers, published by Ohmsha Co., Ltd., March 1976, in conventional semiconductor integrated circuit devices, desired functions can be realized. Transfer of operating power and information (operating signals) between the integrated circuit element and the outside is performed by externally connecting a desired conductive foil or wire to an external connection terminal (pad) provided on the integrated circuit element. This is done by

For this reason, for example, in a so-called IC card in which a single integrated circuit element is incorporated into a portable card, the electrical connection with the card reading terminal into which the IC card is loaded is made through a pad on the IC card. This is achieved by directly applying the needle to the pin or pressing the conductor plug.

[Problems to be Solved by the Invention] However, as described above, in the method of ensuring electrical connection by contacting the conductor with the pad of the integrated circuit element, it is necessary to always expose the pad to the outside.
They are susceptible to the adverse effects of static electricity and the like, and there are also problems in that electrical connections between the outside and the integrated circuit element may be inhibited or become unstable due to contamination or abrasion of the pads.

In addition, demands for higher density and multifunctionality of integrated circuit devices, as well as miniaturization of the integrated circuit devices themselves, have led to an increase in the number of required pads and miniaturization of their dimensions, resulting in the above-mentioned problems. , it is becoming increasingly difficult to secure a stable electrical connection by pressing a needle guard or a plug.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a semiconductor integrated circuit capable of accurately transmitting and receiving at least one of operating power and information to and from the outside without being affected by an increase in the number of pads or miniaturization of dimensions. The goal is to provide equipment.

Another object of the present invention is to provide a semiconductor integrated circuit device that can take measures against contamination and static electricity without impairing accurate exchange of at least one of operating power and information with the outside.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the semiconductor integrated circuit device according to the present invention is configured to transfer at least one of operating power and information to and from the outside in a non-contact manner using light as a medium.

[Effect]

According to the semiconductor integrated circuit device of the present invention described above, for example, the first pad is formed of a photovoltaic cell to which at least one of information and operating power is inputted from the outside, and the first pad is formed of a photovoltaic cell to which at least one of external information and operating power is inputted, and the first pad is formed of a photovoltaic cell to which information is outputted by means of potential sensing using a laser. , or a second pad made of a light emitting diode or the like that converts the output signal into light and emits it to the outside.By irradiating the first and second pads with a laser beam, a semiconductor integrated circuit can be produced in a non-contact manner. It is possible to accurately supply operating power to the device and at least send and receive information. For example, when electrical connections are made by suppressing external needles or plugs, it is possible to increase the number of pads or It is no longer affected by miniaturization of dimensions.

Furthermore, the entire area of the semiconductor integrated circuit device including the first and second pads is covered by an insulating material that is transparent to the light irradiated to the first and second pads and the light emitted from the second pad. By uniformly covering the semiconductor integrated circuit device, the semiconductor integrated circuit device can be reliably protected from contamination, electrostatic damage, etc. without impairing the accurate exchange of at least one of operating power and information with the outside.

[Embodiment 1] Hereinafter, an example of a semiconductor integrated circuit device which is an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view schematically showing the appearance of a semiconductor integrated circuit device according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view thereof, and FIG. 3 is an example of its operation. FIG. 2 is a perspective view for explanation.

At the center of the semiconductor integrated circuit device [1], an integrated circuit section 2 is provided that stores desired information and performs arithmetic processing as needed.

In this case, an input photovoltaic cell pad 3 and a power source photovoltaic pad 4 made of, for example, a photovoltaic cell are arranged around the integrated circuit section 2, and are connected to the integrated circuit via an internal wiring structure 3a and an internal wiring structure 4a, respectively. It is electrically connected to section 2.

The input photovoltaic pad 3 is irradiated with input light P1 consisting of, for example, a laser beam whose light intensity and blinking time change depending on the input signal, thereby converting the electric signal generated at the input photovoltaic pad 3 into Internal wiring structure 3a
By transmitting the information to the integrated circuit section 2 via the , desired information (operation signals, etc.) can be input from the outside to the integrated circuit section 2 in a non-contact manner.

Further, the power source photovoltaic pad 4 is irradiated with a power source light P2 consisting of, for example, a laser beam that continuously maintains a predetermined amount of light, and the irradiation of the power source light P2 causes continuous generation of light on the power source photovoltaic cell pad 4. By supplying the power to the integrated circuit section 2 via the internal wiring structure 4a, the power necessary for the operation of the integrated circuit section 2 is provided.

Further, an output pad 5 made of, for example, a mirror-finished conductor is arranged around the integrated circuit section 2, and is electrically connected to the integrated circuit section 2 via an internal wiring structure 5a. .

For example, the output pad 5 is provided with a polarized laser beam P3.
is irradiated, and the polarization direction θ2 of the reflected light P3b from the output pad 5 of this polarized laser beam P3 reflects the change in potential according to the output signal sent from the integrated circuit section 2 to the output band 5, By utilizing the fact that the incident light P3a changes with respect to the polarization direction θ1, it is possible to grasp desired information obtained in the integrated circuit N2 from the outside without contact.

Further, the entire semiconductor integrated circuit device 1 includes the input photovoltaic pad 3. The entire power supply photovoltaic pad 4° including the output pad 5 is connected to input light PI, power light P2. It is uniformly covered and protected by an insulating layer 6 that is transparent to the polarized laser beam P3 and has excellent mechanical and thermal strength.

As described above, according to the semiconductor integrated circuit device 1 of the present embodiment, operating power can be supplied to the integrated circuit section 2 in a non-contact manner using light such as a laser beam that can easily realize a fine spot diameter. Since information is outputted to and from the outside, the input photovoltaic cell pad 3. Photovoltaic pad for power supply 4. Accurate information input/output operations can be realized without being affected by an increase in the number of output pads 5 or miniaturization of dimensions.

Also, due to external contact with the needle guard or plug, etc.
Since there is no need to selectively expose the pad portion, the input photovoltaic cell pad 3. Photovoltaic battery pad for power supply 4. The entire semiconductor integrated circuit device 1 including the output pads 5 and the like can be uniformly covered with the insulating layer 6, and the input photovoltaic pads 3. Photovoltaic pad for power supply 4. It is possible to reliably prevent the output pad 5 and the like from being soiled and worn out, and further protect the integrated circuit section 2 and the like from electrostatic damage.

As a result, products such as IC cards incorporating the semiconductor integrated circuit device of this embodiment can be multi-functionalized, and their lifespan and operability can be improved.

[Embodiment 1] FIG. 4 is a perspective view schematically showing an example of the configuration of a semiconductor integrated circuit device 10 which is another embodiment of the present invention.

In the case of this second embodiment, an output light-emitting diode pad 7 made of a light-emitting diode or the like that emits an output signal sent from the integrated circuit section 2 to the outside as output light P4 is provided as an output pad, but this embodiment is different from the one described above. This is different from case 1.

In the case of the present embodiment 2, the same effects as in the case of the above-mentioned embodiment 1 can be obtained.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, it goes without saying that the position of the pad is not limited to being placed on the entire surface of the semiconductor integrated circuit device, but may be placed on both the front and back surfaces or only on the back surface.

〔Effect of the invention〕

Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

That is, according to the semiconductor integrated circuit device of the present invention,
For example, semiconductor integrated circuit devices can be connected without contact, without being affected by an increase in the number of pads or miniaturization of dimensions, unlike in the conventional case where electrical connections are made by pressing externally with a needle guard or plug. At least one of supplying operating power to the device and exchanging information can be performed accurately.

In addition, by uniformly covering the entire area of the semiconductor integrated circuit device, including the pads, with an insulator that is transparent to the light that acts as a medium, it impairs the accurate exchange of operating power and/or information with the outside. The semiconductor integrated circuit device can be reliably protected from contamination, electrostatic damage, etc., without causing any damage.

[Brief explanation of the drawing]

FIG. 1 is a perspective view schematically showing the appearance of a semiconductor integrated circuit device that is an embodiment of the present invention, FIG. 2 is a schematic sectional view thereof, and FIG. 3 is a perspective view illustrating an example of its operation. 4 are perspective views schematically showing the appearance of a semiconductor integrated circuit device according to another embodiment of the present invention. 1... Semiconductor integrated circuit device, 2... Integrated circuit section, 3
...input photovoltaic pad, 3a...internal wiring structure,
4... Photovoltaic cell pad for power supply, 4a... Internal wiring structure, 5... Output pad, 5a... Internal wiring structure, 6.
...Insulator layer, Pl...Input light, P2...Power light,
P3... Polarized laser beam, P3a... Incident light, P
3b...Reflected light, θ1. θ2...Polarization direction, 1o・
...Semiconductor integrated circuit device, 7...Light emitting diode pad for output, P4...Output light. θIL θ2: Polarization direction Fig. 4 1'4

Claims (1)

[Claims] 1. A semiconductor integrated circuit device characterized in that at least one of operating power and information is exchanged with the outside in a non-contact manner using light as a medium. 2. A claim characterized by comprising a first pad made of a photovoltaic cell to which at least one of external information and operating power is input, and a second pad which outputs information by sensing potential with a laser. The semiconductor integrated circuit device according to item 1. 3. A polarized laser is used as the laser, and the potential at the second pad is sensed by detecting a change in the polarization plane of the polarized laser that reflects a change in the potential at the second pad. A semiconductor integrated circuit device according to claim 1 or 2. 4. A first pad made of a photovoltaic cell to which at least one of external information and operating power is input, and a second pad made of a light emitting diode which converts an output signal into light and radiates it to the outside. The semiconductor integrated circuit device according to claim 1, characterized in that: