JPH0410362U - - Google Patents
Info
- Publication number
- JPH0410362U JPH0410362U JP5105190U JP5105190U JPH0410362U JP H0410362 U JPH0410362 U JP H0410362U JP 5105190 U JP5105190 U JP 5105190U JP 5105190 U JP5105190 U JP 5105190U JP H0410362 U JPH0410362 U JP H0410362U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- electronic component
- hole
- solder joint
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5105190U JPH0410362U (es) | 1990-05-15 | 1990-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5105190U JPH0410362U (es) | 1990-05-15 | 1990-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410362U true JPH0410362U (es) | 1992-01-29 |
Family
ID=31570140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5105190U Pending JPH0410362U (es) | 1990-05-15 | 1990-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410362U (es) |
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1990
- 1990-05-15 JP JP5105190U patent/JPH0410362U/ja active Pending