JPH0410346U - - Google Patents
Info
- Publication number
- JPH0410346U JPH0410346U JP1990050897U JP5089790U JPH0410346U JP H0410346 U JPH0410346 U JP H0410346U JP 1990050897 U JP1990050897 U JP 1990050897U JP 5089790 U JP5089790 U JP 5089790U JP H0410346 U JPH0410346 U JP H0410346U
- Authority
- JP
- Japan
- Prior art keywords
- joined
- parts
- lead frame
- inner lead
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990050897U JPH0410346U (enExample) | 1990-05-16 | 1990-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990050897U JPH0410346U (enExample) | 1990-05-16 | 1990-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410346U true JPH0410346U (enExample) | 1992-01-29 |
Family
ID=31569846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990050897U Pending JPH0410346U (enExample) | 1990-05-16 | 1990-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410346U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54159532U (enExample) * | 1978-04-27 | 1979-11-07 | ||
| WO2013018485A1 (ja) * | 2011-08-01 | 2013-02-07 | 株式会社三井ハイテック | リードフレーム及びリードフレームの製造方法並びにこれを用いた半導体装置 |
| JP2024515156A (ja) * | 2021-03-10 | 2024-04-05 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | 側壁を有する基板、基板を含むパワー半導体モジュール、および基板の製造方法 |
-
1990
- 1990-05-16 JP JP1990050897U patent/JPH0410346U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54159532U (enExample) * | 1978-04-27 | 1979-11-07 | ||
| WO2013018485A1 (ja) * | 2011-08-01 | 2013-02-07 | 株式会社三井ハイテック | リードフレーム及びリードフレームの製造方法並びにこれを用いた半導体装置 |
| JP2013033822A (ja) * | 2011-08-01 | 2013-02-14 | Mitsui High Tec Inc | リードフレーム及びリードフレームの製造方法並びにこれを用いた半導体装置 |
| CN103718291A (zh) * | 2011-08-01 | 2014-04-09 | 株式会社三井高科技 | 引线框、引线框的制造方法和使用该引线框的半导体装置 |
| JP2024515156A (ja) * | 2021-03-10 | 2024-04-05 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | 側壁を有する基板、基板を含むパワー半導体モジュール、および基板の製造方法 |
| US12568838B2 (en) | 2021-03-10 | 2026-03-03 | Hitachi Energy Ltd | Base plate having sidewall, power semiconductor module comprising the base plate and method for producing the base plate |