JPH0410299A - Ic memory card - Google Patents

Abstract

PURPOSE:To prevent the mounting part of a circuit board from being destroyed without protruding an EP-ROM from an armour panel by mounting an ultraviolet erasing EPROM on the circuit board, covering it with a cap to transmit ultraviolet rays so as to constitute a circuit module and fixing it to the window of the armour panel. CONSTITUTION:A chip-shaped ultraviolet erasing EP-ROM 1 is attached to a circuit board 2 by die and the pad of the circuit board 1 is bonded with the pad of the circuit board by a wire bonding method. Then, the cap composed of a transmissive plate 6 and a receiving frame 7 covers then and the circuit module is constituted. The circuit module is fixed to the frame 3 and fixed to the armour panel from the both sides like a sandwich. The window is opened on the armour panel corresponding to the cap, and a written data can be erased by irradiating the panel with ultraviolet rays. Thus, the mounting part can be prevented from being destroyed without protruding the EP-ROM onto the upper face rather than the armour panel.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to an IC memory card with a built-in IC.
: Relates to the structure of an IC memory card that has a built-in E F ROM and can erase data by irradiating it with ultraviolet rays after writing data to the EPROM.

[Conventional technology]

FIG. 2 shows the structure of a conventional IC memory card that incorporates an EPROM and can erase data written in the EPROM by irradiating it with ultraviolet light. 1 is a thin EPROM; 2 is a circuit board on which the EPROM is mounted;
3 is a frame that is the base of the IC memory card, 4 is an exterior panel A with holes made to allow the protrusion of the EPROM to escape, and 5 is a panel B that is provided on the opposite side of the exterior panel A. be.

[Problem to be solved by the invention]

Conventionally, when attempting to make an IC memory card that can be erased by ultraviolet rays, a method has been adopted in which a packaged EPROM 1 is used. Although it is important for IC memory cards to be thin and portable, the packaged EPROM described above requires a thickness of at least 2 mm, and as shown in the figure, it protrudes from the exterior panel A. was.

As a result, when carrying the device, it often got caught in the EPROM and destroyed the mounting part of the circuit board.

Furthermore, unlike DIP type EPROMs conventionally used in the market, packaged EPROMs must be specially manufactured, and therefore cannot be mass-produced, which is a major factor in high costs.

The present invention eliminates such drawbacks, is convenient for portability, and
An object of the present invention is to provide an ultraviolet erasable IC memory card that can reduce manufacturing costs.

[Means to solve the problem]

The IC memory card of the present invention has an internal EPROM.
In the C memory card, the EPROM is mounted on a circuit board by a wire bonding method, and a cap made of a material that at least partially transmits ultraviolet rays connects a circuit module covering the EPROM and a cap of the circuit module. It is characterized by consisting of an exterior panel that corresponds to the cap and has a window hole.

[Embodiment] An embodiment of the present invention is shown in FIG. 1, in which parts with common names are shown with the same numbers. 1 is a chip-shaped EPROM, 2
numeral 3 corresponds to the circuit board on which the EPROM is mounted, numeral 3 represents the frame serving as the base of the IC memory card, numeral 4 corresponds to the exterior panel A having a window hole for irradiating the EPROM with ultraviolet rays, and 5 corresponds to the exterior panel A. The exterior panel B, 6 provided on the opposite side is a transparent plate made of a substance that transmits ultraviolet rays,
7 is a frame for fixing the transparent plate. Incidentally, a structure in which the transmission plate and the receiver are integrated into a frame is called a cap.

To explain the overall configuration of each part, it is a chip-shaped EPROM.
I is die attached to circuit board 2.

Thereafter, the pads of the EPROMI and the pads of the circuit board are connected by wire bonding. If left as is, the wire would be exposed and even a slight touch would result in a defect, so the transmission plate 6 and the receiver are covered with a cap made of a frame 7. The product completed through the steps up to this point is called a circuit module. This circuit module is frame 3
The outer panels A and B are further fixed in a sandwich-like manner from both sides. At this time, on exterior panel A,
A corresponding window hole is made in the cap, and ultraviolet rays are irradiated through this window hole, and the ultraviolet rays hit the active surface of the EPROM, erasing the written data.

FIG. 3 shows another embodiment of the structure in which the transparent plate is molded, the receiver does not have a frame, and an item integrated as a cap is used.

〔Effect of the invention〕

As described above, according to the present invention, firstly, the EPROM
It is possible to make the part very thin.

In our example, it is possible to make it approximately 1 mm above the board. Therefore, it does not protrude above the exterior panel A, making it possible to prevent damage caused by catching as mentioned in the conventional example. Secondly, there is no need for a special package, and the frame and transparent plate for the receiver are inexpensive, so it is possible to produce a product without a large increase in cost.

[Brief explanation of drawings]

FIG. 1 is a diagram showing one embodiment of the present invention. FIG. 2 is a diagram of a conventional embodiment. FIG. 3 is a diagram showing another embodiment of the present invention. 1...EPROM 2...Circuit board 3...Frame 4...Exterior panel A 5...Exterior panel B 6...Transparent plate 7...Uke is a frame that's all Applicant: Seiko Epson Corporation

Claims (1)

[Claims] In an IC memory card incorporating an ultraviolet-eradicable EPROM (hereinafter abbreviated as "EPROM"), the EPR
The OM is mounted on a circuit board using a wire bonding method, and a cap made of a material that at least partially transmits ultraviolet light has a window hole corresponding to the circuit module covering the EPROM and the cap of the circuit module. An IC characterized by comprising an exterior panel provided with
Memory card.