JPH0410066U - - Google Patents
Info
- Publication number
- JPH0410066U JPH0410066U JP5182690U JP5182690U JPH0410066U JP H0410066 U JPH0410066 U JP H0410066U JP 5182690 U JP5182690 U JP 5182690U JP 5182690 U JP5182690 U JP 5182690U JP H0410066 U JPH0410066 U JP H0410066U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- electronic parts
- base tape
- slit
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 claims 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5182690U JPH0410066U (en18) | 1990-05-17 | 1990-05-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5182690U JPH0410066U (en18) | 1990-05-17 | 1990-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0410066U true JPH0410066U (en18) | 1992-01-28 |
Family
ID=31571602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5182690U Pending JPH0410066U (en18) | 1990-05-17 | 1990-05-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410066U (en18) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100492666B1 (ko) * | 2001-01-23 | 2005-06-03 | 가부시키가이샤 도쿄 웰드 | 지제 캐리어 테이프의 제조 방법 |
| JP2016037321A (ja) * | 2014-08-11 | 2016-03-22 | 住友ベークライト株式会社 | 電子部品包装用包材、電子部品包装体、電子部品包装体の製造方法および電子部品の取り出し方法 |
-
1990
- 1990-05-17 JP JP5182690U patent/JPH0410066U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100492666B1 (ko) * | 2001-01-23 | 2005-06-03 | 가부시키가이샤 도쿄 웰드 | 지제 캐리어 테이프의 제조 방법 |
| JP2016037321A (ja) * | 2014-08-11 | 2016-03-22 | 住友ベークライト株式会社 | 電子部品包装用包材、電子部品包装体、電子部品包装体の製造方法および電子部品の取り出し方法 |