JPH0399774U - - Google Patents
Info
- Publication number
- JPH0399774U JPH0399774U JP856190U JP856190U JPH0399774U JP H0399774 U JPH0399774 U JP H0399774U JP 856190 U JP856190 U JP 856190U JP 856190 U JP856190 U JP 856190U JP H0399774 U JPH0399774 U JP H0399774U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- supply pipe
- anode plate
- plating processing
- processing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
添付図面は本考案の実施例を示し、第１図は処
理液槽１の縦断側面図、第２図は同斜視図、第３
図は給電パイプ６の縦断側面図である。
１……処理液槽、２，２……陽極板、３……フ
ツク、６……給電パイプ、１０……集滴樋、ｌ…
…メツキ液、ｘ……結露、ｙ……液滴、ｗ……被
処理物。
The accompanying drawings show an embodiment of the present invention, in which Fig. 1 is a longitudinal sectional side view of the processing liquid tank 1, Fig. 2 is a perspective view thereof, and Fig. 3 is a longitudinal side view of the processing liquid tank 1.
The figure is a longitudinal side view of the power supply pipe 6. 1... Processing liquid tank, 2, 2... Anode plate, 3... Hook, 6... Power supply pipe, 10... Drip collection gutter, l...
... plating liquid, x... dew condensation, y... droplet, w... object to be treated.
Claims (1)
被処理物にメツキ処理を施すメツキ処理装置にあ
つて、内部に冷却水を通した給電パイプに陽極板
のフツクを吊持し、該給電パイプから陽極板に通
電すると共に、前記給電パイプの直下に該給電パ
イプに沿つて集滴樋を配設したことを特徴とする
メツキ処理装置。 Place the anode plate opposite to the object to be treated in the processing liquid tank.
In a plating processing device that performs plating processing on a workpiece , the hook of the anode plate is suspended from a power supply pipe through which cooling water is passed, and electricity is applied to the anode plate from the power supply pipe, and the power is supplied directly below the power supply pipe. A plating processing device characterized in that a drip collecting gutter is arranged along the power supply pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP856190U JPH0527497Y2 (en) | 1990-01-30 | 1990-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP856190U JPH0527497Y2 (en) | 1990-01-30 | 1990-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0399774U true JPH0399774U (en) | 1991-10-18 |
| JPH0527497Y2 JPH0527497Y2 (en) | 1993-07-13 |
Family
ID=31512187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP856190U Expired - Lifetime JPH0527497Y2 (en) | 1990-01-30 | 1990-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0527497Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003027292A (en) * | 2001-07-06 | 2003-01-29 | Kida Seiko Kk | Click feed conveyance equipment for continuous electroplating |
| JP2007334811A (en) * | 2006-06-19 | 2007-12-27 | Nakai Meihan Kk | Exhibition sample attaching tool |
-
1990
- 1990-01-30 JP JP856190U patent/JPH0527497Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003027292A (en) * | 2001-07-06 | 2003-01-29 | Kida Seiko Kk | Click feed conveyance equipment for continuous electroplating |
| JP2007334811A (en) * | 2006-06-19 | 2007-12-27 | Nakai Meihan Kk | Exhibition sample attaching tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0527497Y2 (en) | 1993-07-13 |