JPH0399773U - - Google Patents

Info

Publication number
JPH0399773U
JPH0399773U JP856090U JP856090U JPH0399773U JP H0399773 U JPH0399773 U JP H0399773U JP 856090 U JP856090 U JP 856090U JP 856090 U JP856090 U JP 856090U JP H0399773 U JPH0399773 U JP H0399773U
Authority
JP
Japan
Prior art keywords
electrode plate
power supply
supply pipe
plating processing
liquid tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP856090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP856090U priority Critical patent/JPH0399773U/ja
Publication of JPH0399773U publication Critical patent/JPH0399773U/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

添付図面は本考案の実施例を示し、第1図は処
理液槽1の縦断側面図、第2図は同斜視図、第3
図は給電パイプ6の縦断側面図である。 1……処理液槽、2,2……極板、3……フツ
ク、6……給電パイプ、10……直流電源、x…
…結露、y……液滴、w……被処理物。
The accompanying drawings show an embodiment of the present invention, in which Fig. 1 is a longitudinal sectional side view of the processing liquid tank 1, Fig. 2 is a perspective view thereof, and Fig. 3 is a longitudinal side view of the processing liquid tank 1.
The figure is a longitudinal side view of the power supply pipe 6. 1... Processing liquid tank, 2, 2... Electrode plate, 3... Hook, 6... Power supply pipe, 10... DC power supply, x...
...Dew condensation, y...Droplets, w...Object to be treated.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 処理液槽内で被処理物に極板を対設して、該被
処理物にメツキ処理を施すメツキ処理装置にあつ
て、内部に冷却水を通した給電パイプに極板のフ
ツクを吊持し、該給電パイプから極板に通電した
ことを特徴とするメツキ処理装置の極板通電装置
In a plating processing device in which an electrode plate is placed opposite an object to be treated in a treatment liquid tank and the object is plated, the hook of the electrode plate is suspended from a power supply pipe through which cooling water is passed inside. An electrode plate energizing device for a plating processing apparatus, characterized in that the electrode plate is energized from the power supply pipe.
JP856090U 1990-01-30 1990-01-30 Pending JPH0399773U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP856090U JPH0399773U (en) 1990-01-30 1990-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP856090U JPH0399773U (en) 1990-01-30 1990-01-30

Publications (1)

Publication Number Publication Date
JPH0399773U true JPH0399773U (en) 1991-10-18

Family

ID=31512186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP856090U Pending JPH0399773U (en) 1990-01-30 1990-01-30

Country Status (1)

Country Link
JP (1) JPH0399773U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0527497U (en) * 1991-09-25 1993-04-09 日本特殊陶業株式会社 Drain discharge device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0527497U (en) * 1991-09-25 1993-04-09 日本特殊陶業株式会社 Drain discharge device

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