JPH0397992U - - Google Patents
Info
- Publication number
- JPH0397992U JPH0397992U JP1990007173U JP717390U JPH0397992U JP H0397992 U JPH0397992 U JP H0397992U JP 1990007173 U JP1990007173 U JP 1990007173U JP 717390 U JP717390 U JP 717390U JP H0397992 U JPH0397992 U JP H0397992U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- integrated circuit
- hybrid integrated
- motherboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990007173U JPH0397992U (fi) | 1990-01-29 | 1990-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990007173U JPH0397992U (fi) | 1990-01-29 | 1990-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397992U true JPH0397992U (fi) | 1991-10-09 |
Family
ID=31510834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990007173U Pending JPH0397992U (fi) | 1990-01-29 | 1990-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397992U (fi) |
-
1990
- 1990-01-29 JP JP1990007173U patent/JPH0397992U/ja active Pending