JPH0397972U - - Google Patents
Info
- Publication number
- JPH0397972U JPH0397972U JP623290U JP623290U JPH0397972U JP H0397972 U JPH0397972 U JP H0397972U JP 623290 U JP623290 U JP 623290U JP 623290 U JP623290 U JP 623290U JP H0397972 U JPH0397972 U JP H0397972U
- Authority
- JP
- Japan
- Prior art keywords
- landless
- holes
- mounting
- wiring board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623290U JPH0397972U (zh) | 1990-01-26 | 1990-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP623290U JPH0397972U (zh) | 1990-01-26 | 1990-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397972U true JPH0397972U (zh) | 1991-10-09 |
Family
ID=31509910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP623290U Pending JPH0397972U (zh) | 1990-01-26 | 1990-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397972U (zh) |
-
1990
- 1990-01-26 JP JP623290U patent/JPH0397972U/ja active Pending