JPH0397958U - - Google Patents

Info

Publication number
JPH0397958U
JPH0397958U JP740190U JP740190U JPH0397958U JP H0397958 U JPH0397958 U JP H0397958U JP 740190 U JP740190 U JP 740190U JP 740190 U JP740190 U JP 740190U JP H0397958 U JPH0397958 U JP H0397958U
Authority
JP
Japan
Prior art keywords
printed wiring
small diameter
diameter part
wiring board
solder layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP740190U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP740190U priority Critical patent/JPH0397958U/ja
Publication of JPH0397958U publication Critical patent/JPH0397958U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
JP740190U 1990-01-29 1990-01-29 Pending JPH0397958U (US08063081-20111122-C00115.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP740190U JPH0397958U (US08063081-20111122-C00115.png) 1990-01-29 1990-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP740190U JPH0397958U (US08063081-20111122-C00115.png) 1990-01-29 1990-01-29

Publications (1)

Publication Number Publication Date
JPH0397958U true JPH0397958U (US08063081-20111122-C00115.png) 1991-10-09

Family

ID=31511058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP740190U Pending JPH0397958U (US08063081-20111122-C00115.png) 1990-01-29 1990-01-29

Country Status (1)

Country Link
JP (1) JPH0397958U (US08063081-20111122-C00115.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224533A (ja) * 1993-01-27 1994-08-12 Ibiden Co Ltd プリント配線板組立体
JP2002118384A (ja) * 2000-08-01 2002-04-19 Mitsubishi Electric Corp 電子機器
JP2006186144A (ja) * 2004-12-28 2006-07-13 Daikin Ind Ltd パワーモジュールおよび空気調和機
JP2014183126A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 高周波モジュール

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224533A (ja) * 1993-01-27 1994-08-12 Ibiden Co Ltd プリント配線板組立体
JP2002118384A (ja) * 2000-08-01 2002-04-19 Mitsubishi Electric Corp 電子機器
JP2006186144A (ja) * 2004-12-28 2006-07-13 Daikin Ind Ltd パワーモジュールおよび空気調和機
JP4513560B2 (ja) * 2004-12-28 2010-07-28 ダイキン工業株式会社 パワーモジュールおよび空気調和機
JP2014183126A (ja) * 2013-03-18 2014-09-29 Fujitsu Ltd 高周波モジュール

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