JPH0397929U - - Google Patents

Info

Publication number
JPH0397929U
JPH0397929U JP1990006646U JP664690U JPH0397929U JP H0397929 U JPH0397929 U JP H0397929U JP 1990006646 U JP1990006646 U JP 1990006646U JP 664690 U JP664690 U JP 664690U JP H0397929 U JPH0397929 U JP H0397929U
Authority
JP
Japan
Prior art keywords
chip
circuit board
mounting structure
view
spacer member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990006646U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990006646U priority Critical patent/JPH0397929U/ja
Publication of JPH0397929U publication Critical patent/JPH0397929U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は陽極基板にＩＣチツプが実装された蛍
光表示管の正面図、第２図は第１図の−切断
線における断面図、第３図は第２図におけるＩＣ
チツプ付近の拡大図、第４図は第１図の蛍光表示
管においてＩＣチツプを実装する前の陽極基板の
平面図、第５図ａ，ｂは配線の露出面積によつて
ＩＣチツプと陽極基板の間隔が変化することを示
した断面図、第６図は本考案の一実施例を示す要
部断面図である。 １……回路基板としての陽極基板、１２……Ｉ
Ｃチツプ、１３……ハンダバンプ、１４……樹脂
、１５……スペーサ部材。

Claims (1)

  1. 【実用新案登録請求の範囲】 ハンダバンプを用いて回路基板の表面にＩＣチ
    ツプを実装するＩＣチツプの実装構造において、 回路基板の上面とＩＣチツプの間隔を規制する
    スペーサ部材を回路基板とＩＣチツプの間に設け
    たことを特徴とするＩＣチツプの実装構造。
JP1990006646U 1990-01-27 1990-01-27 Pending JPH0397929U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990006646U JPH0397929U (ja) 1990-01-27 1990-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990006646U JPH0397929U (ja) 1990-01-27 1990-01-27

Publications (1)

Publication Number Publication Date
JPH0397929U true JPH0397929U (ja) 1991-10-09

Family

ID=31510317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990006646U Pending JPH0397929U (ja) 1990-01-27 1990-01-27

Country Status (1)

Country Link
JP (1) JPH0397929U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173953A (en) * 1981-04-21 1982-10-26 Seiko Epson Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173953A (en) * 1981-04-21 1982-10-26 Seiko Epson Corp Semiconductor device

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