JPH0397897A - Eutectoid plating method of lead or antimony - Google Patents
Eutectoid plating method of lead or antimonyInfo
- Publication number
- JPH0397897A JPH0397897A JP23429389A JP23429389A JPH0397897A JP H0397897 A JPH0397897 A JP H0397897A JP 23429389 A JP23429389 A JP 23429389A JP 23429389 A JP23429389 A JP 23429389A JP H0397897 A JPH0397897 A JP H0397897A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead
- antimony
- anodic oxide
- eutectoid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 23
- 229910052787 antimony Inorganic materials 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 7
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 title claims description 11
- 229920006362 Teflon® Polymers 0.000 claims abstract description 6
- 239000010419 fine particle Substances 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004809 Teflon Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims 1
- 239000010407 anodic oxide Substances 0.000 abstract 5
- 238000000151 deposition Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000005461 lubrication Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、基幹産業での摩擦を生じる部分における潤滑
を容易として耐摩耗性を向上させるための鉛又はアンチ
モン共析メッキ方法に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a lead or antimony eutectoid plating method for facilitating lubrication and improving wear resistance in parts that cause friction in key industries. .
（従来の技術）
産業界においては摩耗対策としてあらゆる分野から色々
な方法が開発されて来ている。そのため多くの新しい潤
滑剤が発売されると共に、近年では特にメッキによって
耐摩耗性を良好ならしめようと、メッキ液或いは添加剤
が開発されて米ている。（例えばニッケルテフロン或い
はアルマイトテフロンがある）
（発明が解決しようとする問題点）
現在の潤滑性を高めるためのメッキによる結果では、技
術進歩の要求がどんどん進んで高度となりそれに対処す
ることが出来なくなり早く新しい技術を開発しておがわ
ばならない状態である。(Prior Art) In industry, various methods have been developed from various fields as wear countermeasures. For this reason, many new lubricants have been put on the market, and in recent years, plating solutions or additives have been developed to improve wear resistance, especially through plating. (For example, there are nickel Teflon and alumite Teflon.) (Problem to be solved by the invention) The current plating used to improve lubricity will no longer be able to meet the demands of technological progress as they become more and more sophisticated. We are in a situation where we must quickly develop new technologies and hold back.
（問題点を解決するための手段）
このような現状を解消し、より耐摩耗性を向上させるこ
とが出来るよう、ニッケルメッキ或いはアルマイト法の
溶液中、又、これ等にテフロンを混合した混合液中に、
鉛の微粒子又は溜水性化合物或いはアンチモンを添加し
た溶液を用いてメッキを行うようにしたものである．（
作 用）
このような鉛或いはアンチモンを添加した溶液を用いる
ことによって、共析反応を起し鉛又はアンチモンの共析
メッキを施すことが出来る。(Means to solve the problem) In order to solve this current situation and further improve wear resistance, we can use nickel plating or alumite solution, or a mixture of these with Teflon. inside,
Plating is performed using a solution containing fine particles of lead, a water-retaining compound, or antimony. (
Function) By using such a solution to which lead or antimony is added, a eutectoid reaction is caused and eutectoid plating of lead or antimony can be performed.
（実施例） 以下本発明の一実施例を説明する。(Example) An embodiment of the present invention will be described below.
即ち、本発明は、ニッケルメッキ又はアルマイト法の溶
液中に、又これ等にテフロンを添加したニッケルテフロ
ン又はアルマイトテフロン等のテフロンを混合添加した
テフロンの分散液中に、鉛の微粒子又は、有機或いは無
磯の溜水性鉛化合物或いはアンチモンを添加した溶液を
用いてメッキ又はアルマイト法を行う。That is, the present invention provides fine particles of lead or organic or Plating or alumite is performed using a solution containing lead compounds or antimony.
このようにした溶液を用いてメッキを行うと共析反応を
起こして鉛又はアンチモンの共析メッキを施すことが出
来る。When plating is performed using such a solution, a eutectoid reaction occurs and eutectoid plating of lead or antimony can be performed.
（発明の効果）
上述の如く本発明は鉛或いはアンチモンの共析メッキを
施すことによって、潤滑性能を増し耐摩耗性に富んだメ
ッキ又はアルマイト層を得ることが出来、回転部はもと
より摺動部にも利用することにより最大の効果を発揮す
ることが出来る等多くの特長を有し産業利用上非常に優
れた発明である。(Effects of the Invention) As described above, the present invention can provide a plating or alumite layer with improved lubrication performance and wear resistance by applying lead or antimony eutectoid plating, and can be applied to not only rotating parts but also sliding parts. This invention has many features such as being able to achieve the maximum effect when used in other areas, making it an extremely excellent invention for industrial use.
以上that's all
Claims (2)
はこれ等にテフロンを混合した混合撹拌液中に、鉛或い
はアンチモンを添加したメッキ溶液を用いてメッキを行
うようにしたことを特徴とする鉛又はアンチモン共析メ
ッキ方法。(1) Plating is carried out using a plating solution in which lead or antimony is added to a nickel plating or alumite solution, or a mixed stirring solution of these mixed with Teflon. Antimony eutectoid plating method.
て添加したことを特徴とする請求項１記載の鉛又はアン
チモン共析メッキ方法。(2) The lead or antimony eutectoid plating method according to claim 1, wherein the lead is added as fine particles or an organic or inorganic water-retaining compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23429389A JPH0397897A (en) | 1989-09-11 | 1989-09-11 | Eutectoid plating method of lead or antimony |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23429389A JPH0397897A (en) | 1989-09-11 | 1989-09-11 | Eutectoid plating method of lead or antimony |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397897A true JPH0397897A (en) | 1991-04-23 |
Family
ID=16968721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23429389A Pending JPH0397897A (en) | 1989-09-11 | 1989-09-11 | Eutectoid plating method of lead or antimony |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397897A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05209297A (en) * | 1991-10-30 | 1993-08-20 | Nippon Alum Co Ltd | Composite coating film forming method on surface of ti and ti alloy |
| CN105088320A (en) * | 2015-08-31 | 2015-11-25 | 安徽大地熊新材料股份有限公司 | Preparation method of electrogalvanizing layer doped with nanometer particles |
-
1989
- 1989-09-11 JP JP23429389A patent/JPH0397897A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05209297A (en) * | 1991-10-30 | 1993-08-20 | Nippon Alum Co Ltd | Composite coating film forming method on surface of ti and ti alloy |
| CN105088320A (en) * | 2015-08-31 | 2015-11-25 | 安徽大地熊新材料股份有限公司 | Preparation method of electrogalvanizing layer doped with nanometer particles |
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